AD ADM1051 Precision dual voltage regulator controller Datasheet

a
Precision Dual Voltage
Regulator Controllers
ADM1051/ADM1051A
GENERAL DESCRIPTION
FEATURES
Two Independent Controllers on One Chip
1.515 V and 1.818 V Outputs
Shutdown Inputs to Control Each Channel
Compatible with PC Motherboard TYPEDET Signal
ⴞ2.5% Accuracy Over, Line, Load, and Temperature
Low Quiescent Current
Low Shutdown Current
Works with External N-Channel MOSFETs for Low Cost
“Hiccup Mode” Fault Protection
No External Voltage or Current Setting Resistors
1.8 V/3.3 V ICH Sequenced Power-Up on ADM1051A
Small, 8-Lead SOIC Package
The ADM1051/ADM1051A are dual, precision, voltage regulator controllers intended for power rail generation and active bus
termination on personal computer motherboards. They contain a
precision 1.2 V bandgap reference and two channels consisting of
control amplifiers driving external power devices. Each channel
has a shutdown input to turn off amplifier output and Hiccup
Mode protection circuitry for the external power device. The
shutdown input on the 1.5 V channel can also be used with the
TYPEDET signal on a PC motherboard to select the output voltage.
The ADM1051/ADM1051A operate from a 12 V supply, which
gives sufficient headroom for the amplifiers to drive external
N-channel MOSFETs, operating as source-followers, as the
external series pass devices. This has the advantage that Nchannel devices are cheaper than P-channel devices of similar
performance, and the circuit is easier to stabilize than one using
P-channel devices in a common-source configuration.
APPLICATIONS
Desktop Computers
Servers
Workstations
FUNCTIONAL BLOCK DIAGRAM
VIN
3.3V
VCC
ADM1051/ADM1051A
CONTROL
AMPLIFIER
BANDGAP
REFERENCE
100␮F
FORCE 1
VCC
SENSE 1
VOUT1
2ⴛ100␮F
50␮A
SHUTDOWN
CONTROL
SHDN1
HICCUP
COMPARATOR
VIN
3.3V
CONTROL
AMPLIFIER
100␮F
FORCE 2
NO CONNECTION
ON ADM1051A
VCC
SENSE 2
VOUT2
2ⴛ100␮F
50␮A
SHUTDOWN
CONTROL
SHDN2
HICCUP
COMPARATOR
VCC
POWER-ON
RESET
CLK/DELAY
GENERATOR
CLOCK
OSCILLATOR
GND
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
World Wide Web Site: http://www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2000
= 12 V ⴞ 6%, V = 3.3 V, T = 0ⴗC to 70ⴗC, both
ADM1051/ADM1051A–SPECIFICATIONS (Vchannels,
unless otherwise noted. See Test Circuit.)
CC
Parameter
Min
OUTPUT VOLTAGE
Channel 1
Channel 2
OUTPUT VOLTAGE ACCURACY
Load Regulation
Line Regulation
5 VSB Supply Voltage Required for
Channel 2 Regulation
Max
1.515
1.818
–2.5
–5
–5
+2.5
+5
+5
4.6
CONTROL AMPLIFIER
Control Amplifier Open-Loop Gain
Control Amplifier Slew Rate
Closed-Loop Settling Time
Turn-On Time
Sense Input Impedance1
Force Output Voltage Swing, VF (High)
Force Output Voltage Swing, VF (Low)
100
3
5
50
10
2
0.5
20
6
SHUTDOWN, SHDN1
Mode 1 (Shutdown)
Mode 2 (1.5 V Out)
Mode 3 (3.3 V Out)
Mode 4 (1.5 V Out)
2
4.3
6.2
30
60
100
1.0
40
90
0.8 × VOUT
2.4
600
Test Conditions/Comments
V
V
SHDN1 Floating
%
mV
mV
V
VIN = 3.0 V to 3.6 V, IOUT = 10 mA to 1 A
VIN = 3.3 V, IOUT = 10 mA to 1 A1
VIN = 3.0 V to 3.6 V, IOUT = 1 A1
Test Circuit as Figure 7.2 ILOAD = 500 mA
1.5
60
9
ms
V
µs
ms
ms
V
0.8
3.9
5.3
12
V
V
V
V
0.8
V
V
mA
µA
2.0
4.0
1000
A
Unit
dB
V/µs
µs
µs
kΩ
V
V
5
HICCUP MODE
Hiccup Mode Hold-Off Time
Hiccup Mode Threshold
Hiccup Comparator Glitch Immunity
Hiccup Mode On-Time
Hiccup Mode Off-Time
Power-On Reset Threshold
SHUTDOWN, SHDN2
Shutdown Input Low Voltage, VIL
Shutdown Input High Voltage, VIH
Supply Current, Normal Operation
Supply Current, Shutdown Mode
Typ
IN
IO = 10 mA to 2 A
To 90% of Force High Output Level (CL = 470 pF)
RL = 10 kΩ to GND
RL = 10 kΩ to VCC
See Figure 4
Shutdown Inputs Floating
Both Channels Shut Down
NOTES
1
Guaranteed by design.
2
5 VSB Supply is connected to, and measured at anode of Schottky Diode.
Specifications subject to change without notice.
–2–
REV. 0
ADM1051/ADM1051A
ABSOLUTE MAXIMUM RATINGS*
PIN FUNCTION DESCRIPTIONS
(TA = 25°C unless otherwise noted)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 V
SHDN1, SHDN2 to GND . . . . . . . . –0.3 V to (VCC + 0.3 V)
SENSE 1, SENSE 2 to GND . . . . . . . . . . . –0.3 V to +5.5 V
FORCE 1, FORCE 2 . . . . . . . Short-Circuit to GND or VCC
Continuous Power Dissipation (TA = 70°C) . . . . . . . 650 mW
8-Lead SOIC (Derate 8.3 mW/°C Above 70°C)
Operating Temperature Range
Commercial (J Version) . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . 300°C
*This is a stress rating only; functional operation of the device at these or any other
conditions above those indicated in the operation sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended
periods of time may affect reliability.
Pin
No.
Mnemonic
Function
1
FORCE 2
2
SENSE 2
3
SHDN2
4
5
GND
SHDN1
6
SENSE 1
Output of Channel 2 control amplifier
to gate of external N-channel MOSFET.
Input from source of external MOSFET
to inverting input of Channel 2 control
amplifier, via output voltage-setting
feedback resistor network.
Digital Input. Active-low shutdown
control with 50 µA internal pull-up. The
output of Channel 2 control amplifier goes
to ground when SHDN2 is taken low.
Device Ground Pin.
Digital Input. Active-low shutdown control with 50 µA internal pull-up. See text for
more details of SHDN1 functionality.
Input from source of external MOSFET to
inverting input of Channel 1 control amplifier, via output voltage-setting feedback
resistor network.
Output of Channel 1 control amplifier to
gate of external N-channel MOSFET.
12 V Supply.
THERMAL CHARACTERISTICS
8-Lead Small Outline Package:
θJA = 150°C/W
ORDERING GUIDE
Model
Temperature
Range
Package
Description
Package
Option
7
FORCE 1
ADM1051JR
ADM1051AJR
0°C to 70°C
0°C to 70°C
8-Lead SOIC
8-Lead SOIC
R-8
R-8
8
VCC
PIN CONFIGURATION
12V
VIN
3.3V
1␮F
VCC
PHD55N03LT
FORCE 2 1
100␮F
FORCE 1
SENSE 2 2
SHDN2 3
SENSE 1
2ⴛ100␮F
VCC
7
FORCE 1
VIN
3.3V
ADM1051/
ADM1051A
SHDN2
8
6 SENSE 1
TOP VIEW
GND 4 (Not to Scale) 5 SHDN1
VOUT1
SHDN1
LEAVE OPEN OR
CONNECT TO
LOGIC SIGNALS
IF SHUTDOWN
REQUIRED
ADM1051/
ADM1051A
MTD3055VL
FORCE 2
SENSE 2
100␮F
VOUT2
2ⴛ100␮F
Figure 1. Test Circuit
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADM1051/ADM1051A features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.
REV. 0
–3–
WARNING!
ESD SENSITIVE DEVICE
ADM1051/ADM1051A –Typical Performance Characteristics
Tek STOP : Single Seq 50.0MS/S
1.55
OUTPUT – V
1.54
1.53
1.52
1.51
2
1
Ch 1 500mV
Ch2
Ch4
500mV
500mV
M 1.00␮s Ch1
1.50
3.46 V
0
1
CURRENT – A
TPC 4. Load Regulation, Channel 1
TPC 1. Line Transient Response, Channel 1 and
Channel 2
1.825
1.514
25ⴗC
1.512
1.820
1.510
OUTPUT – V
VOUT – V
1.815
1.508
85ⴗC
1.506
1.810
1.805
1.504
1.800
1.502
1.500
3.0
3.1
3.2
3.3
VIN – V
3.4
3.5
1.795
3.6
1
CURRENT – A
TPC 5. Load Regulation, Channel 2
TPC 2. Line Regulation, Channel 1
1.8205
10
IL = 10mA
1.8200
0
25ⴗC
RIPPLE REJECTION – dB
1.8195
1.8190
VOUT – V
0
1.8185
1.8180
85ⴗC
1.8175
1.8170
–10
–20
–30
–40
CHANNEL 1
–50
1.8165
–60
1.8160
1.8155
3.0
3.1
3.2
3.3
VIN – V
3.4
3.5
–70
3.6
TPC 3. Line Regulation, Channel 2
CHANNEL 2
10
100
1k
10k
100k
FREQUENCY – Hz
1M
10M
TPC 6. VCC Supply Ripple Rejection
–4–
REV. 0
ADM1051/ADM1051A
Tek
1.85
Single Seq 50.0ms/S
1.8V CHANNEL
1.80
1.75
OUTPUT – V
1.70
1.65
1.60
1.55
1.50
1.5V CHANNEL
1.45
1.40
25
0
Ch2 20.0mV
85
BW
M 1.00␮s Ch2
–16.8 mV
TEMPERATURE – ⴗC
TPC 7. Regulator Output Voltage vs. Temperature
TPC 10. Transient Response Channel 2, 10 mA to 2 A
Output Load Step
Tek STOP : Single Seq 50.0ms/S
20.0mV
Tek
BW
M 1.00␮s Ch2
Ch2 20.0mV
–13.6 mV
TPC 8. Transient Response Channel 1, 10 mA to 2 A
Output Load Step
Tek
Tek
BW
M 1.00␮s Ch2
14.8 mV
10.0kS/S
Ch1
TPC 9. Transient Response Channel 1, 2 A to 10 mA
Output Load Step
REV. 0
BW
M 1.00␮s Ch2
10.4 mV
TPC 11. Transient Response Channel 2, 2 A to 10 mA
Output Load Step
Single Seq 50.0ms/S
Ch2 20.0mV
Single Seq 50.0ms/S
10.0 V
4 Acqs
M 5.00ms Ch1
1.0 V
TPC 12. Force Output in Hiccup Mode, Channel 1
–5–
ADM1051/ADM1051A
VCH2 V's 5VSB ILOADⴝ500m
1.855
1.805
1.805
1.755
1.755
70ⴗC
70ⴗC
1.705
CHANNEL 2O/P – V
1.705
CHANNEL 2O/P – V
VCH2 V's 5VSB ILOADⴝ1
1.855
1.655
0ⴗC
1.605
25ⴗC
1.555
1.505
1.655
25ⴗC
1.505
1.455
1.455
1.405
1.405
1.355
1.355
1.305
0ⴗC
1.605
1.555
1.305
3.7
3.9
4.1
4.3
4.5
4.7
4.9
5.1
3.7
5.3
3.9
4.1
4.3
5VSB – V
4.5
4.7
4.9
5.1
5.3
5VSB – V
TPC 13. ADM1051A Channel 2 Output Voltage vs. 5 VSB
Voltage. Test Circuit as Figure 7, ILOAD = 500 mA
TPC 14. ADM1051A Channel 2 Output Voltage vs. 5 VSB
Voltage. Test Circuit as Figure 7, ILOAD = 1 A
GENERAL DESCRIPTION
CIRCUIT DESCRIPTION
The ADM1051/ADM1051A are dual, precision, voltage regulator
controllers intended for power rail generation and active bus termination in AGP and ICH applications on personal computer
motherboards. They contain a precision 1.2 V bandgap reference and two almost identical channels consisting of control
amplifiers driving external power devices. The main difference
between the two channels is the regulated output voltage, defined
by the resistor ratios on the voltage sense inputs of each channel.
Channel 1 has an output of nominally 1.515 V, but can be
switched to a 3.3 V output, while Channel 2 has a nominal
output of 1.818 V. Channel 1 is also optimized for driving
MOSFETs with lower on-resistance and higher gate capacitance, as explained later.
CONTROL AMPLIFIERS
The reference voltage is amplified and buffered by the control
amplifiers and external MOSFETs, the output voltage of each
channel being determined by the feedback resistor network
between the sense input and the inverting input of the control
amplifier.
The two control amplifiers in the ADM1051/ADM1051A are
almost identical, apart, from the ratios of the feedback resistor
networks on the sense inputs. A power-on reset circuit disables
the amplifier output until VCC has risen above the reset threshold (not Channel 2 of ADM1051A).
Each amplifier output drives the gate of an N-channel power
MOSFET, whose drain is connected to the unregulated supply
input and whose source is the regulated output voltage, which is
also fed back to the appropriate sense input of the ADM1051/
ADM1051A. The control amplifiers have high current-drive
capability so they can quickly charge and discharge the gate
capacitance of the external MOSFET, thus giving good transient
response to changes in load or input voltage. In particular,
Channel 1 is optimized to drive MOSFETs with very low on
resistance and correspondingly higher gate capacitance such as
the PHD55N03LT from Philips. This is to minimize voltage
drop across the MOSFET when Channel 1 is used in 3.3 V
mode, as explained later.
Each channel has a shutdown input to turn off amplifier output
and protection circuitry for the external power device. The
shutdown input of Channel 1 has additional functionality as
described later.
The ADM1051A has some minor differences from the ADM1051
to support power-supply sequencing and voltage requirements
of some I/O control hub chipsets, which dictate that the 1.818 V
rail must never be more than 2 V below the 3.3 V rail.
The ADM1051/ADM1051A operates from a 12 V VCC supply.
The outputs are disabled until VCC climbs above the Power-On
Reset threshold (6 V–9 V). POR does not apply to Channel 2 of
the ADM1051A. This output will begin to rise as soon as there
is sufficient gate drive to turn on the external MOSFET.
SHUTDOWN INPUTS AND TYPEDET COMPATIBILITY
Each channel has a separate shutdown input, which may be
controlled by a logic signal, and allows the output of the regulator to be turned on or off. If the shutdown input is held high or
not connected, the regulator operates normally. If the shutdown
input is held low, the enable input of the control amplifier is turned
off and the amplifier output goes low, turning off the regulator.
The outputs from the ADM1051/ADM1051A are used to drive
external N-channel MOSFETs, operating as source-followers.
This has the advantage that N-channel devices are cheaper than
P-channel devices of similar performance, and the circuit is easier
to stabilize than one using P-channel devices in a commonsource configuration.
The SHDN1 input on Channel 1 has additional functionality that
can be controlled by the TYPEDET signal on PC motherboards.
The external power devices are protected by a “Hiccup Mode”
circuit that operates if the circuit goes out of regulation due to
an output short-circuit. In this case the power device is pulsed
on/off with a 1:40 duty-cycle to limit the power dissipation until
the fault condition is removed. Again, to prevent Channel 2
falling more than 2 V below Channel 1, Hiccup Mode does not
operate on Channel 2 of the ADM1051A.
The AGP bus on a PC motherboard can have two different modes
of operation, requiring different regulated voltages of 3.3 V or
1.5 V. These two modes are signaled by the TYPEDET signal on
the PC motherboard, as follows:
TYPEDET = 0 V – Regulated Voltage 1.5 V (4× AGP Graphics)
TYPEDET Floating – Regulated Voltage 3.3 V (2× AGP Graphics)
–6–
REV. 0
ADM1051/ADM1051A
For compatibility with the TYPEDET signal, the regulator output
voltage of Channel 1 may be selected using the Shutdown pin.
This is a multilevel, dual-function input that allows selection of
the regulator output voltage as well as shutdown of the regulator.
PC 5V SUPPLY
3k⍀
TYPEDET
By setting SHDN1 to different voltages, the regulator can be put
into four different operating modes.
Table I. Shutdown Functionality for 1.5 V Channel
SHDN1 Voltage
Mode
Function
< 0.8 V
1
Force Output Low, Regulator
Shutdown
1.5 V Output
Force Output High, VOUT = 3.3 V
1.5 V Output
2 V–3.9 V
4.3 V–5.3 V
>6.2 V or Floating
2
3
4
Figure 2. Using SHDN1 with TYPEDET Signal
A shutdown function can be added by connecting an open-drain/
open-collector logic output to SHDN1, or by using a totem-pole
logic output with a Schottky diode, as shown in Figure 3.
PC 5V SUPPLY
COMPLEMENTARY
OR TOTEM-POLE
OUTPUT
EN
If the SHDN1 pin is connected to a voltage less than 0.8 V, the
FORCE output will go low and the regulator will be shut down.
SCHOTTKY
DIODE
TYPEDET
SHDN1
ADM1051/
ADM1051A
SHDN1
ADM1051/
ADM1051A
3k⍀
PC 5V SUPPLY
3k⍀
EN
3k⍀
TYPEDET
If the SHDN1 pin is connected to a voltage between 2 V and 3.9 V,
the regulator will also operate normally and provide 1.5 V out.
The latter two modes allow the regulator to be controlled by the
TYPEDET signal simply by using potential divider, as shown in
Figure 2.
3k⍀
OPEN-DRAIN OR
OPEN-COLLECTOR
OUTPUT
If the SHDN1 pin is connected to a voltage greater than 6.2 V,
or simply left open-circuit, the regulator will operate normally
and provide 1.5 V out. This allows the regulator to operate
normally with no external connection to SHDN1.
If the SHDN1 pin is connected to a voltage between 4.3 V and
5.3 V, the FORCE output will be high and the external MOSFET
will be turned hard on, making the output voltage equal to the 3.3 V
input (less any small drop due to the on-resistance of the MOSFET).
In this mode it is not actually regulating, but simply acting as a
switch for the 3.3 V supply. The voltage drop across the Channel 1
MOSFET in Mode 3 can be minimized by using a MOSFET
with very low on resistance, for which Channel 1 is optimized,
such as the PHD55N03LT.
SHDN1
3k⍀
Figure 3. TYPEDET Voltage Selection Combined with
Shutdown Function
When the logic output is high or turned off, the regulator mode
will be controlled by TYPEDET. When the logic output is low,
the regulator will be shut down.
Table II. TYPEDET and Shutdown Truth Table
TYPEDET
EN
Regulator Mode
X
0
1
0
1
1
Shutdown
1.5 V
3.3 V
X = Don’t care.
Note that when Channel 1 of the ADM1051 is set to 3.3 V,
Channel 2 should not be shut down while Channel 1 is active.
POR THRESHOLD
4V – 7V
VREF TURN-ON
THRESHOLD
12V SUPPLY
3.3V SUPPLY
TO EXTERNAL
MOSFET DRAIN
GATE DRIVE TO
EXTERNAL
MOSFET
CHANNEL 1
OR CHANNEL 2
OUTPUT VOLTAGE
CHANNEL 1
OR CHANNEL 2
OUTPUT CURRENT
MOSFET GATE
THRESHOLD
NORMAL
OUTPUT VOLTAGE
OUTPUT < 0.8 ⴛ VREG
DEVICE ENTERS HICCUP MODE
FAULT CURRENT
HICCUP MODE
HOLD-OFF TIME
2 AMPS
OFF
ON
1:40 DUTY CYCLE
Figure 4. Power-On Reset and Hiccup Mode
REV. 0
–7–
FAULT
REMOVED
ADM1051/ADM1051A
HICCUP MODE FAULT PROTECTION
APPLICATIONS INFORMATION
Hiccup Mode Fault Protection is a simple method of protecting
the external power device without the added cost of external sense
resistors or a current sense pin on the ADM1051/ADM1051A. In
the event of a short-circuit condition at the output, the output
voltage will fall. When the output voltage of a channel falls
20% below the nominal voltage, this is sensed by the hiccup comparator and the channel will go into Hiccup Mode, where the
enable signal to the control amplifier is pulsed on and off
with a 1:40 duty cycle. As mentioned earlier, Hiccup Mode
does not operate on Channel 2 of the ADM1051A.
PCB LAYOUT
For optimum voltage regulation, the loads should be placed as
close as possible to the source of the output MOSFETs and
feedback to the sense inputs should be taken from a point as
close to the loads as possible. The PCB tracks from the loads
back to the sense inputs should be separate from the output
tracks and not carry any load current.
Similarly, the ground connection to the ADM1051/ADM1051A
should be made as close as possible to the ground of the loads, and
the ground track from the loads to the ADM1051/ADM1051A
should not carry load current. Good and bad layout practice is
illustrated in Figure 5.
To prevent the device inadvertently going into Hiccup Mode during power-up or during channel enabling, the Hiccup Mode is
held off for approximately 60 ms on both channels. By this time
the output voltage should have reached its correct value. In the
case of power-up, the hold-off period starts when VCC reaches
the power-on reset threshold of 6 V–9 V. In the case of channel
enabling, the hold-off period starts when SHDN is taken high.
Note that the hold-off timeout applies to both channels even if
only one channel is disabled/enabled.
GOOD
12V
VCC
FORCE 1
VIN
3.3V
As the 3.3 V input to the drain of the MOSFET is not monitored,
it should ideally rise at the same or a faster rate than VCC. At the
very least it must be available in time for VOUT to reach its final
value before the end of the power-on delay. If the output voltage
is still less than 80% of the correct value after the power-on delay,
the device will go into Hiccup Mode until the output voltage
exceeds 80% of the correct value during a Hiccup Mode onperiod. Of course, if there is a fault condition at the output
during power-up, the device will go into Hiccup Mode after the
power-up delay and remain there until the fault condition is
removed.
SENSE 1
FORCE 2
SENSE 2
GND
I1
I2
VOUT1
VOUT2
LOAD 1
LOAD 2
BAD
12V
VCC
FORCE 1
VIN
3.3V
The effect of power-on delay is illustrated in Figure 4. This shows
an ADM1051/ADM1051A being powered up with a fault
condition. The output current rises to a very high value during the power-on delay, then the device goes into Hiccup Mode
and the output is pulsed on and off at 1:40 duty cycle. When the
fault condition is removed, the output voltage recovers to its
normal value at the end of the Hiccup Mode off period.
VOUT1
SENSE 1
FORCE 2
VOUT2
SENSE 2
I1
GND
LOAD 1
I2
VOLTAGE DROP
BETWEEN OUTPUT
AND LOAD
LOAD 2
I1 ⴙ I2
VOLTAGE DROP
IN GROUND LEAD
The load current at which the ADM1051/ADM1051A will go
into Hiccup Mode is determined by three factors:
Figure 5. Good and Bad Layout Practice
• the input voltage to the drain of the MOSFET, VIN
• the output voltage VOUT (–20%)
• the on-resistance of the MOSFET, RON
IHICCUP = (VIN – (0.8 × VOUT))/RON
It should be emphasized that the Hiccup Mode is not intended
as a precise current limit but as a simple method of protecting
the external MOSFET against catastrophic fault conditions such
as output short-circuits.
–8–
REV. 0
ADM1051/ADM1051A
SUPPLY DECOUPLING
POWERING SUPPLY SEQUENCING
The supply to the drain of an external MOSFET should be
decoupled as close as possible to the drain pin of the device, with
at least 100 µF to ground. The output from the source of the
MOSFET should be decoupled as close as possible to the source
pin of the device. Decoupling capacitors should be chosen to have
a low Equivalent Series Resistance (ESR), typically 50 mΩ or
lower. With the MOSFETs specified, and two 100 µF capacitors
in parallel, the circuit will be stable for load currents up to 2 A.
The VCC pin of the ADM1051/ADM1051A should be decoupled
with at least 1 µF to ground, connected as close as possible to
the VCC and GND pins.
Some I/O control hub chipsets have power-supply sequencing
requirements, which dictate that the 1.818 V supply must never
be more than 2 V below the 3.3 V supply. This requirement can
be met using the ADM1051A, as shown in Figure 7. In this
circuit, VCC is supplied from the 5 V standby rail (5 VSB) and
from the 12 V rail via Schottky diodes. 5 VSB is always present
when ac power is supplied to the system, so the ADM1051A is
powered up, but VCC is below the POR threshold. When the main
power supplies are turned on, the Channel 2 output will rise at
the same rate as the 3.3 V rail until it regulates at 1.818 V. The
12 V supply will take over from 5 VSB when it exceeds the 5 VSB
rail, and Channel 1 will then be subject to the POR delay. This
ensures that Channel 2 can never be more than 2 V below
Channel 1.
In practice, the amount of decoupling required will depend on
the application. PC motherboards are notoriously noisy environments, and it may be necessary to employ distributed decoupling
to achieve acceptable noise levels on the supply rails.
BAT45C
12V
12V
VIN
3.3V
1␮F
VCC
5VSB
BAT45C
VCC
VIN
3.3V
0.1␮
F
PHD55N03LT
100␮F
FORCE 1
PHD55N03LT
100␮F
FORCE 1
SENSE 1
SENSE 1
VOUT1
SHDN1
LEAVE OPEN OR
CONNECT TO
LOGIC SIGNALS
IF SHUTDOWN
REQUIRED
SHDN1
2ⴛ100␮F
SHDN2
10k⍀
MTD3055VL
FORCE 2
VIN
3.3V
ADM1051A
3.3V
VIN
3.3V
ADM1051
SHDN2
MTD3055VL
FORCE 2
100␮F
SENSE 2
SENSE 2
VOUT1
2ⴛ100␮F
VOUT2
100␮F
VOUT2
2ⴛ100␮F
2ⴛ100␮F
Figure 7. Typical ADM1051A Application Circuit
Figure 6. Typical ADM1051 Application Circuit
CHOICE OF MOSFET
As previously discussed, the load current at which an output goes
into Hiccup Mode depends on the on resistance of the external
MOSFET. If the on resistance is too low, this current may be
very high; if the on resistance is high, the trip current may be
lower than the maximum required load current. For the primary
application of AGP and ICH power supplies and bus termination on personal computer motherboards, devices with very
low on resistance, such as the PHD55N03LT from Philips,
or the SUB60N06-18 from Siliconix, are suitable. For Channel 2,
suitable devices are the MTD3055VL from Motorola and the
PHB11N06LT from Philips.
THERMAL CONSIDERATIONS
Heat generated in the external MOSFET must be dissipated
and the junction temperature of the device kept within acceptable limits. The power dissipated in the device is, of course, the
drain-source voltage multiplied by the load current. The required
thermal resistance to ambient is given by
␪JA = TJ(MAX) – TAMB(MAX)/(VDS(MAX) × IOUT(MAX))
Surface-mount MOSFETs, such as those specified, must rely on
heat conduction through the device leads and the PCB. One
square inch of copper (645 sq. mm) gives a thermal resistance
of around 60°C/W for an SOT-223 surface-mount package and
80°C/W for an SO-8 surface-mount package.
For high power dissipation that can be accommodated by a
surface-mount package, D2PAK or TO-220 devices are recommended. These should be mounted on a heat sink with a
thermal resistance low enough to maintain the required maximum junction temperature.
REV. 0
–9–
ADM1051/ADM1051A
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
C00400–2.5–7/00 (rev. 0)
8-Lead Small Outline Package (Narrow Body)
(R-8)
0.1968 (5.00)
0.1890 (4.80)
0.1574 (4.00)
0.1497 (3.80)
8
5
1
4
0.2440 (6.20)
0.2284 (5.80)
PIN 1
0.0196 (0.50)
ⴛ 45ⴗ
0.0099 (0.25)
0.0500 (1.27)
BSC
SEATING
PLANE
0.102 (2.59)
0.094 (2.39)
8ⴗ
0.0098 (0.25) 0ⴗ 0.0500 (1.27)
0.0160 (0.41)
0.0075 (0.19)
0.0192 (0.49)
0.0138 (0.35)
PRINTED IN U.S.A.
0.0098 (0.25)
0.0040 (0.10)
–10–
REV. 0
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