Film Capacitors
Metallized Polypropylene Film Capacitors (MKP)
Series/Type:
B32774 ... B32778
Date:
May 2011
© EPCOS AG 2011. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Metallized polypropylene film capacitors (MKP)
B32774 ... B32778
MKP DC link high density series
Typical applications
For compact design of:
Frequency converters
Industrial and high-end power supplies
Solar inverters
Dimensional drawings
2-pin version
Climatic
Max. operating temperature: 105 °C (case)
Climatic category (IEC 60068-1): 40/85/56
Construction
Dielectric: polypropylene (MKP)
Plastic case (UL 94 V-0)
Epoxy resin sealing (UL 94 V-0)
4-pin version
Features
Capacitance values up to 110 µF
High CV product, compact
Excellent self-healing properties
Overvoltage capability
Low losses with high current capability
High reliability
Long useful life
Terminals
Parallel wire leads, lead-free tinned
2-pin and 4-pin versions
Standard lead lengths: 6 1 mm
Special lead lengths are available on
request
Marking
Manufacturer's logo, lot number,
date code, rated capacitance (coded),
capacitance tolerance (code letter),
rated DC voltage
Dimensions in mm
Version
Lead
spacing
±0.4
Lead
diameter
d1
Type
2-pin
27.5
0.8
B32774D
2-pin
37.5
1.0
B32776E
4-pin
37.5
1.2
B32776G
4-pin
52.5
1.2
B32778G
Delivery mode
Bulk (untaped, lead length 6 1 mm)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 21
B32774 ... B32778
MKP DC link high density series
Overview of available types
Lead spacing 27.5 mm
37.5 mm
52.5 mm
Type
B32774
B32776
B32778
Page
4
5
VR (V DC)
450
800
7
1100 1300 450
800
CR (µF)
1.5
2.0
3.0
5.0
7.0
8.0
10
12
14
15
16
20
22
25
27
30
35
40
45
50
55
60
75
80
100
110
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 21
1100 1300 450
800
1100 1300
B32774
MKP DC link high density series
Ordering codes and packing units (lead spacing 27.5 mm)
CR
Max. dimensions
w×h×l
P1
µF
mm
mm
Ordering code
(composition see
below)
VR,70 °C = 450 V DC, Vop,85 °C = 450 V DC
5.0 11.0 × 21.0 × 31.5 B32774D4505+000
10
15.0 × 24.5 × 31.5 B32774D4106+000
22
22.0 × 36.5 × 31.5 B32774D4226+000
VR,70 °C = 800 V DC, Vop,85 °C = 700 V DC
3.0 11.0 × 21.0 × 31.5 B32774D8305+000
5.0 14.0 × 24.5 × 31.5 B32774D8505+000
12
22.0 × 36.5 × 31.5 B32774D8126+000
VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC
2.0 12.5 × 21.5 × 31.5 B32774D0205+000
5.0 19.0 × 30.0 × 31.5 B32774D0505+000
7.0 22.0 × 36.5 × 31.5 B32774D0705+000
VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC
1.5 12.5 × 21.5 × 31.5 B32774D1155+000
3.0 18.0 × 27.5 × 31.5 B32774D1305+000
5.0 22.0 × 36.5 × 31.5 B32774D1505+000
IRMS,max
70 °C
10 kHz
A
IRMS,max
70 °C
20 kHz
A
5.0
6.5
10.0
4.5
6.0
9.0
8.5
7.5
5.0
2352
1680
784
5.0
5.0
6.0
4.5
4.5
5.5
9.0
7.0
6.5
2352
1848
784
4.0
6.5
7.5
3.5
6.0
7.0
11.0
7.0
5.5
2100
896
784
4.5
6.0
8.0
4.0
5.5
7.0
10.5
7.0
6.0
2100
1428
784
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = ±10%
J = ±5%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 21
ESRtyp
70 °C
10 kHz
mΩ
Untaped
pcs./MOQ
B32776
MKP DC link high density series
Ordering codes and packing units (lead spacing 37.5 mm)
CR
Max. dimensions
w×h×l
P1
µF
mm
mm
Ordering code
(composition see
below)
VR,70 °C = 450 V DC, Vop,85 °C = 450 V DC
30
20.0 × 39.5 × 41.5 10.2 B32776G4306+000
30
20.0 × 39.5 × 41.5 B32776E4306+000
35
28.0 × 37.0 × 42.0 10.2 B32776G4356+000
35
28.0 × 37.0 × 42.0 B32776E4356+000
40
28.0 × 37.0 × 42.0 10.2 B32776G4406+000
40
28.0 × 37.0 × 42.0 B32776E4406+000
50
28.0 × 42.5 × 41.5 10.2 B32776G4506+000
50
28.0 × 42.5 × 41.5 B32776E4506+000
60
30.0 × 45.0 × 42.0 B32776E4606+000
VR,70 °C = 800 V DC, Vop,85 °C = 700 V DC
14
18.0 × 32.5 × 41.5 B32776E8146+000
15
20.0 × 39.5 × 41.5 10.2 B32776G8156+000
20
28.0 × 37.0 × 42.0 10.2 B32776G8206+000
20
28.0 × 37.0 × 42.0 B32776E8206+000
22
28.0 × 37.0 × 42.0 10.2 B32776G8226+000
25
28.0 × 42.5 × 41.5 B32776E8256+000
30
30.0 × 45.0 × 42.0 20.3 B32776G8306+000
30
30.0 × 45.0 × 42.0 B32776E8306+000
VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC
12
20.0 × 39.5 × 41.5 10.2 B32776G0126+000
12
20.0 × 39.5 × 41.5 B32776E0126+000
14
28.0 × 37.0 × 42.0 10.2 B32776G0146+000
14
28.0 × 37.0 × 42.0 B32776E0146+000
16
28.0 × 42.5 × 41.5 10.2 B32776G0166+000
16
28.0 × 42.5 × 41.5 B32776E0166+000
20
30.0 × 45.0 × 42.0 20.3 B32776G0206+000
20
30.0 × 45.0 × 42.0 B32776E0206+000
IRMS,max
70 °C
10 kHz
A
IRMS,max
70 °C
20 kHz
A
ESRtyp Untaped
70 °C
10 kHz
mΩ
pcs./MOQ
12.5
11.5
13.5
12.5
14.5
13.5
16.0
15.0
16.5
11.5
10.5
12.5
11.5
13.5
12.5
15.0
14.0
15.0
8.0
9.0
8.0
9.0
5.0
5.5
4.0
4.0
3.0
640
640
440
440
440
440
440
440
400
10.0
10.5
12.0
11.5
13.0
13.5
15.0
14.0
9.0
9.5
11.0
10.5
12.0
12.5
14.0
13.0
7.5
7.0
5.5
6.5
5.0
4.5
3.5
5.0
720
640
440
440
440
440
400
400
11.0
10.0
13.0
12.0
13.0
12.0
15.0
13.0
10.0
9.0
12.0
11.0
12.0
11.0
13.0
12.0
6.5
7.0
5.5
6.0
5.0
5.5
3.0
3.5
640
640
440
440
440
440
400
400
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = ±10%
J = ±5%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 21
B32776
MKP DC link high density series
Ordering codes and packing units (lead spacing 37.5 mm)
CR
Max. dimensions
w×h×l
P1
µF
mm
mm
Ordering code
(composition see
below)
VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC
8.0 20.0 × 39.5 × 41.5 10.2 B32776G1805+000
10
28.0 × 37.0 × 42.0 10.2 B32776G1106+000
10
28.0 × 37.0 × 42.0 B32776E1106+000
12
28.0 × 42.5 × 41.5 10.2 B32776G1126+000
14
30.0 × 45.0 × 42.0 B32776E1146+000
IRMS,max
70 °C
10 kHz
A
IRMS,max
70 °C
20 kHz
A
ESRtyp Untaped
70 °C
10 kHz
mΩ
pcs./MOQ
9.0
12.0
11.0
13.0
13.0
8.0
11.0
10.0
12.0
12.0
8.0
6.5
7.0
5.5
5.0
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = ±10%
J = ±5%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 21
640
440
440
440
400
B32778
MKP DC link high density series
Ordering codes and packing units (lead spacing 52.5 mm)
CR
Max. dimensions
w×h×l
P1
µF
mm
mm
Ordering code
(composition see
below)
VR,70 °C = 450 V DC, Vop,85 °C = 450 V DC
75
30.0 × 45.0 × 57.5 20.3 B32778G4756+000
80
30.0 × 45.0 × 57.5 20.3 B32778G4806+000
100
35.0 × 50.0 × 57.5 20.3 B32778G4107+000
110
35.0 × 50.0 × 57.5 20.3 B32778G4117+000
VR,70 °C = 800 V DC, Vop,85 °C = 700 V DC
45
30.0 × 45.0 × 57.5 20.3 B32778G8456+000
55
35.0 × 50.0 × 57.5 20.3 B32778G8556+000
60
35.0 × 50.0 × 57.5 20.3 B32778G8606+000
VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC
30
30.0 × 45.0 × 57.5 20.3 B32778G0306+000
40
35.0 × 50.0 × 57.5 20.3 B32778G0406+000
VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC
20
30.0 × 45.0 × 57.5 20.3 B32778G1206+000
25
35.0 × 50.0 × 57.5 20.3 B32778G1256+000
27
35.0 × 50.0 × 57.5 20.3 B32778G1276+000
IRMS,max
70 °C
10 kHz
A
IRMS,max
70 °C
20 kHz
A
ESRtyp Untaped
70 °C
10 kHz
mΩ
pcs./MOQ
16.0
16.5
18.0
19.0
15.5
16.0
18.0
19.0
5.5
5.0
4.0
4.0
280
280
108
108
16.0
17.0
19.0
15.0
16.0
18.0
4.0
3.5
3.0
280
108
108
16.0
20.0
14.0
20.0
5.0
3.5
280
108
14.0
17.0
17.5
13.0
16.0
16.0
5.5
4.5
4.5
280
108
108
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = ±10%
J = ±5%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 21
B32774 ... B32778
MKP DC link high density series
Technical data
Reference standard: IEC 61071. All data given at T = 20 °C, unless otherwise specified.
Max. operating temperature, Top,max +105 °C
Operating temperature range (case)
Upper category temperature Tmax
+85 °C
Lower category temperature Tmin
–40 °C
LS 27.5
< 3.0 ESRtyp
ESR (at 10 kHz)
LS 37.5
< 2.5 ESRtyp
LS 52.5
< 2.0 ESRtyp
Insulation Resistance Rins
30 000 s
given as time constant
τ = CR Rins, rel. humidity ≤ 65%
(minimum as-delivered values)
DC test voltage between terminals (10 s) 1.5 VR
DC test voltage terminal to case (10 s)
2110 V AC, 50 Hz
Maximum peak current (A)
Damp heat test
Limit values after damp heat test
Reliability:
Failure rate λ
Service life tSL
VR (V DC)
Continuous operation voltage
Vop (V DC) at 70 °C
Continuous operation voltage
Vop (V DC) at 85 °C
For temperatures between
70 °C and 85 °C
Please read Cautions and warnings and
Important notes at the end of this document.
56 days/40 °C/93% relative humidity
Capacitance change | ∆C/C |
≤ 5%
Dissipation factor change ∆ tan δ ≤ 1.5 · 10-3 (at 1 kHz)
≥ 50% of minimum
Insulation resistance Rins
as-delivered values
50 fit (≤ 1 10-9/h) at 0.5 VR, 40 °C
100 000 h at VR and 70 °C
For conversion to other operating conditions, refer to
chapter "Quality, 2 Reliability".
450
800
1100
1300
450
800
1100
1300
450
700
920
1100
1%/°C of derating respect Vop at 70 °C
(no derating at 450 V DC series)
Page 8 of 21
B32774 ... B32778
MKP DC link high density series
Pulse handling capability
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/µs.
Note:
The values of dV/dt provided below must not be exceeded in order to avoid damaging the
capacitor.
dV/dt values
Lead spacing
27.5 mm
37.5 mm
52.5 mm
Type
B32774
B32776
B32778
VR (V DC)
CR (µF)
1.5
2.0
450
800 1100 1300
75
100
40
100
5.0
30
40
75
100
7.0
75
10
30
12
14
15
16
800 1100 1300
450
800 1100 1300
dV/dt in V/µs
3.0
8.0
450
20
22
30
25
27
30
35
40
45
50
55
60
75
80
100
110
40
Please read Cautions and warnings and
Important notes at the end of this document.
21
21
21
21
21
73
73
54
73
22
54
73
22
54
22
54
22
22
22
Page 9 of 21
14
14
14
14
15
15
15
50
35
35
50
50
B32774 ... B32778
MKP DC link high density series
ESL values
ESL
2-pin
4-pin
B32774D
25 nH
B32776E
10 nH
B32776G
15 nH
B32778G
15 nH
Typical waveforms
Restrictions:
VR: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which
the capacitor has been designed for continuous operation.
AC ≤ 0.2 VR
VP,max: Maximum permissible recurrent voltage that may appear for 2% of the period.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 21
B32774 ... B32778
MKP DC link high density series
Mounting guidelines
1
Soldering
1.1
Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
235 ±5 °C
Soldering time
2.0 ±0.5 s
Immersion depth
2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Visual inspection
Wetting of wire surface by new solder ≥90%, free-flowing solder
1.2
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Series
Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ±5 °C
coated
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
MKP (lead spacing ≤ 7.5 mm)
MKT uncoated (lead spacing ≤ 10 mm)
insulated (B32559)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 21
10 ±1 s
5 ±1 s
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
B32774 ... B32778
MKP DC link high density series
Immersion depth
2.0 +0/0.5 mm from capacitor body or seating plane
Shield
Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor
body and liquid solder
Evaluation criteria:
Visual inspection
∆C/C0
tan δ
Please read Cautions and warnings and
Important notes at the end of this document.
No visible damage
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
As specified in sectional specification
Page 12 of 21
B32774 ... B32778
MKP DC link high density series
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper category temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable countermeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 °C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 °C
MKT 160 °C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following measures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 21
B32774 ... B32778
MKP DC link high density series
2
Cleaning
To determine whether the following solvents, often used to remove flux residues and other substances, are suitable for the capacitors described, refer to the table below:
Type
Ethanol,
isopropanol,
n-propanol
MKT
(uncoated)
MKT, MKP, MFP
(coated/boxed)
Suitable
n-propanol-water
mixtures,
water with surface
tension-reducing
tensides (neutral)
Unsuitable
Solvent from
table A (see
next page)
Suitable
Suitable
Solvent from
table B (see
next page)
In part suitable Unsuitable
Even when suitable solvents are used, a reversible change of the electrical characteristics may
occur in uncoated capacitors immediately after they are washed. Thus it is always recommended
to dry the components (e.g. 4 h at 70 °C) before they are subjected to subsequent electrical testing.
Table A
Manufacturers' designations for trifluoro-trichloro-ethane-based cleaning solvents (selection)
Trifluoro-trichloroethane
Freon TF
Frigen 113 TR
Arklone P
Kaltron 113 MDR
Flugene 113
Mixtures of trifluoro-trichloro-ethane with ethanol and
isopropanol
Freon TE 35; Freon TP 35; Freon TES
Frigen 113 TR-E; Frigen 113 TR-P; Frigen TR-E 35
Arklone A; Arklone L; Arklone K
Kaltron 113 MDA; Kaltron 113 MDI; Kaltron 113 MDI 35
Flugene 113 E; Flugene 113 IPA
Manufacturer
Du Pont
Hoechst
ICI
Kali-Chemie
Rhone-Progil
Table B (worldwide banned substances)
Manufacturers' designations for unsuitable cleaning solvents (selection)
Mixtures of chlorinated hydrocarbons and ketones with fluorated hydrocarbons
Freon TMC; Freon TA; Freon TC
Arklone E
Kaltron 113 MDD; Kaltron 113 MDK
Flugene 113 CM
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 21
Manufacturer
Du Pont
ICI
Kali-Chemie
Rhone-Progil
B32774 ... B32778
MKP DC link high density series
3
Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 °C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 21
B32774 ... B32778
MKP DC link high density series
Cautions and warnings
Do not exceed the upper category temperature (UCT).
Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
The table below summarizes the safety instructions that must always be observed. A detailed description can be found in the relevant sections of the chapters "General technical information" and
"Mounting guidelines".
Topic
Storage conditions
Flammability
Resistance to
vibration
Safety information
Reference chapter
"General technical
information"
Make sure that capacitors are stored within the
4.5
specified range of time, temperature and humidity "Storage conditions"
conditions.
Avoid external energy, such as fire or electricity
5.3
(passive flammability), avoid overload of the
"Flammability"
capacitors (active flammability) and consider the
flammability of materials.
Do not exceed the tested ability to withstand
5.2
vibration. The capacitors are tested to
"Resistance to vibration"
IEC 60068-2-6.
EPCOS offers film capacitors specially designed
for operation under more severe vibration regimes
such as those found in automotive applications.
Consult our catalog "Film Capacitors for
Automotive Electronics".
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 21
B32774 ... B32778
MKP DC link high density series
Topic
Safety information
Soldering
Do not exceed the specified time or temperature
limits during soldering.
Cleaning
Use only suitable solvents for cleaning capacitors.
Embedding of
When embedding finished circuit assemblies in
capacitors in
plastic resins, chemical and thermal influences
finished assemblies must be taken into account.
Caution: Consult us first, if you also wish to
embed other uncoated component types!
Please read Cautions and warnings and
Important notes at the end of this document.
Page 17 of 21
Reference chapter
"Mounting guidelines"
1 "Soldering"
2 "Cleaning"
3 "Embedding of
capacitors in finished
assemblies"
B32774 ... B32778
MKP DC link high density series
Symbols and terms
Symbol
α
αC
A
βC
C
CR
∆C
∆C/C
∆C/CR
dt
∆t
∆T
∆tan δ
∆V
dV/dt
∆V/∆t
E
ESL
ESR
f
f1
f2
fr
FD
FT
i
IC
English
Heat transfer coefficient
Temperature coefficient of capacitance
Capacitor surface area
Humidity coefficient of capacitance
Capacitance
Rated capacitance
Absolute capacitance change
Relative capacitance change (relative
deviation of actual value)
Capacitance tolerance (relative deviation
from rated capacitance)
Time differential
Time interval
Absolute temperature change
(self-heating)
Absolute change of dissipation factor
Absolute voltage change
Time differential of voltage function (rate
of voltage rise)
Voltage change per time interval
Activation energy for diffusion
Self-inductance
Equivalent series resistance
Frequency
Frequency limit for reducing permissible
AC voltage due to thermal limits
German
Wärmeübergangszahl
Temperaturkoeffizient der Kapazität
Kondensatoroberfläche
Feuchtekoeffizient der Kapazität
Kapazität
Nennkapazität
Absolute Kapazitätsänderung
Relative Kapazitätsänderung (relative
Abweichung vom Ist-Wert)
Kapazitätstoleranz (relative Abweichung
vom Nennwert)
Differentielle Zeit
Zeitintervall
Absolute Temperaturänderung
(Selbsterwärmung)
Absolute Änderung des Verlustfaktors
Absolute Spannungsänderung
Differentielle Spannungsänderung
(Spannungsflankensteilheit)
Spannungsänderung pro Zeitintervall
Aktivierungsenergie zur Diffusion
Eigeninduktivität
Ersatz-Serienwiderstand
Frequenz
Grenzfrequenz für thermisch bedingte
Reduzierung der zulässigen
Wechselspannung
Frequency limit for reducing permissible Grenzfrequenz für strombedingte
AC voltage due to current limit
Reduzierung der zulässigen
Wechselspannung
Resonant frequency
Resonanzfrequenz
Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
Derating factor
Deratingfaktor
Current (peak)
Stromspitze
Category current (max. continuous
Kategoriestrom (max. Dauerstrom)
current)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 18 of 21
B32774 ... B32778
MKP DC link high density series
Symbol
IRMS
iz
k0
LS
λ
λ0
λtest
Pdiss
Pgen
Q
ρ
R
R
Ri
Rins
RP
RS
S
t
T
τ
tan δ
tan δD
tan δP
tan δS
TA
Tmax
Tmin
tOL
Top
TR
Tref
tSL
VAC
English
(Sinusoidal) alternating current,
root-mean-square value
Capacitance drift
Pulse characteristic
Series inductance
Failure rate
Constant failure rate during useful
service life
Failure rate, determined by tests
Dissipated power
Generated power
Heat energy
Density of water vapor in air
Universal molar constant for gases
Ohmic resistance of discharge circuit
Internal resistance
Insulation resistance
Parallel resistance
Series resistance
severity (humidity test)
Time
Temperature
Time constant
Dissipation factor
Dielectric component of dissipation
factor
Parallel component of dissipation factor
Series component of dissipation factor
Ambient temperature
Upper category temperature
Lower category temperature
Operating life at operating temperature
and voltage
Operating temperature
Rated temperature
Reference temperature
Reference service life
AC voltage
Please read Cautions and warnings and
Important notes at the end of this document.
German
(Sinusförmiger) Wechselstrom
Inkonstanz der Kapazität
Impulskennwert
Serieninduktivität
Ausfallrate
Konstante Ausfallrate in der
Nutzungsphase
Experimentell ermittelte Ausfallrate
Abgegebene Verlustleistung
Erzeugte Verlustleistung
Wärmeenergie
Dichte von Wasserdampf in Luft
Allg. Molarkonstante für Gas
Ohmscher Widerstand des
Entladekreises
Innenwiderstand
Isolationswiderstand
Parallelwiderstand
Serienwiderstand
Schärfegrad (Feuchtetest)
Zeit
Temperatur
Zeitkonstante
Verlustfaktor
Dielektrischer Anteil des Verlustfaktors
Parallelanteil des Verlfustfaktors
Serienanteil des Verlustfaktors
Umgebungstemperatur
Obere Kategorietemperatur
Untere Kategorietemperatur
Betriebszeit bei Betriebstemperatur und
-spannung
Beriebstemperatur
Nenntemperatur
Referenztemperatur
Referenz-Lebensdauer
Wechselspannung
Page 19 of 21
B32774 ... B32778
MKP DC link high density series
Symbol
VC
VC,RMS
English
Category voltage
Category AC voltage
VCD
Vch
VDC
VFB
Vi
Vo
Vop
Vp
Vpp
VR
Corona-discharge onset voltage
Charging voltage
DC voltage
Fly-back capacitor voltage
Input voltage
Output voltage
Operating voltage
Peak pulse voltage
Peak-to-peak voltage Impedance
Rated voltage
Amplitude of rated AC voltage
R
VRMS
German
Kategoriespannung
(Sinusförmige)
Kategorie-Wechselspannung
Teilentlade-Einsatzspannung
Ladespannung
Gleichspannung
Spannung (Flyback)
Eingangsspannung
Ausgangssspannung
Betriebsspannung
Impuls-Spitzenspannung
Spannungshub
Nennspannung
Amplitude der Nenn-Wechselspannung
VSC
Vsn
(Sinusoidal) alternating voltage,
root-mean-square value
S-correction voltage
Snubber capacitor voltage
Z
Impedance
Spannung bei Anwendung "S-correction"
Spannung bei Anwendung
"Beschaltung"
Scheinwiderstand
Lead spacing
Rastermaß
Please read Cautions and warnings and
Important notes at the end of this document.
(Sinusförmige) Wechselspannung
Page 20 of 21
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association
(ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DeltaCap,
DigiSiMic, DSSP, FormFit, MiniBlue, MiniCell, MKK, MKD, MLSC, MotorCap, PCC,
PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap,
SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be
found on the Internet at www.epcos.com/trademarks.
Page 21 of 21