TOSHIBA TLOM1108

TL(RM,RMM,SM,OM,YM)1108(T11)
TOSHIBA LED Lamps
TLRM1108(T11), TLRMM1108(T11), TLSM1108(T11),
TLOM1108(T11), TLYM1108(T11)
Panel Circuit Indicator
Unit: mm
Cathode mark
•
Surface-mount device
•
3.2 (L) mm × 2.9 (W) mm × 1.9 (H) mm
•
InGaAℓP LEDs
•
Colors: red, orange, yellow
•
High luminous intensity
•
Standard embossed tape packing: T11 (2000/reel)
•
High operating temperature
Topr = −40 to 100°C / Tstg=－40 to 100°C
•
Applications: Instrumental panel Backlighting in Automotive
equipment, message signboards, backlighting etc.
Anode index
4-mm tape reel
Color and Material
Part Number
Color
TLRM1108
Red
TLRMM1108
Red
TLSM1108
Red
TLOM1108
Orange
TLYM1108
Yellow
Material
１．Anode
２．Cathode
３．Cathode
４．Cathode
JEDEC
―
JEITA
―
TOSHIBA
4-3X1
Weight: 0.035 g (typ.)
InGaAℓP
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TL(RM,RMM,SM,OM,YM)1108(T11)
Absolute Maximum Ratings (Ta = 25°C)
Product Name
Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
Operation
Temperature
Topr (°C)
Storage
Temperature
Tstg (°C)
70
4
203
−40 to 100
−40 to 100
TLRM1108
TLRMM1108
TLSM1108
TLOM1108
TLYM1108
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
IF – Ta
Allowable forward current
IF (mA)
100
80
60
40
20
0
0
20
40
60
80
100
120
Ambient temperature Ta (°C)
Electrical Characteristics (Ta = 25°C)
Min
Typ.
Max
TLRM1108
2.2
2.5
2.9
TLRMM1108
2.2
2.5
2.9
TLSM1108
2.2
2.5
2.9
TLOM1108
2.2
2.55
2.9
TLYM1108
2.2
2.55
2.9
Unit
Reverse Current
IR
Forward Voltage VF
Product Name
V
IF
Max
VR
50
10
4
mA
μA
V
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TL(RM,RMM,SM,OM,YM)1108(T11)
Optical Characteristics–1 (Ta = 25°C)
Product Name
TLRM1108
Luminous Intensity IV
Available Iv rank
Min
Typ.
Max
IF
Please see Note 2
630
1300
3200
50
VA / WA / XA
TLRMM1108
630
1600
3200
50
VA / WA / XA
TLSM1108
1000
2400
5000
50
WA / XA / YA
TLOM1108
1000
2500
5000
50
WA / XA / YA
TLYM1108
1000
2200
5000
50
WA / XA / YA
Unit
mcd
mcd
mcd
mA
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Rank
Luminous Intensity IV
Min
Max
VA
630
1250
WA
1000
2000
XA
1600
3200
YA
2500
5000
Unit
mcd
mcd
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Peak Emission
Wavelength λp
Product Name
Δλ
Dominant Wavelength λd
Min
Typ.
Max
Typ.
Min
Typ.
Max
TLRM1108
⎯
644
⎯
14
624
630
638
TLRMM1108
⎯
636
⎯
14
620
626
634
TLSM1108
⎯
623
⎯
14
607
613
621
TLOM1108
⎯
612
⎯
14
599
605
613
TLYM1108
⎯
592
⎯
13
583
590
595
Unit
nm
nm
nm
IF
50
mA
Handling precautions
•
This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional
application (ex. Light source for sensor, optical communication and etc) except general display light source.
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TL(RM,RMM,SM,OM,YM)1108(T11)
TLRM1108
IF – V F
IV – IF
(typ.)
Ta = 25°C
Luminous intensity
Forward current
IF
30
10
3
1
1.7
(typ.)
Ta = 25°C
IV (mcd)
(mA)
100
1.9
2.1
2.3
2.5
Forward voltage
2.7
VF
3000
1000
300
100
30
10
1
2.9
3
(V)
IV – Tc
30
Forward current
IF
100
(mA)
Wavelength characteristic
(typ.)
10
10
1.0
(typ.)
3
Relative luminous intensity
IV
5
Relative luminous intensity
IF = 50 mA
1
0.5
0.3
0.1
−40
−20
0
20
40
Case temperature
60
80
Tc
(°C)
Ta = 25°C
0.8
0.6
0.4
0.2
0
580
100
600
620
640
Wavelength
660
680
700
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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TL(RM,RMM,SM,OM,YM)1108(T11)
TLRMM1108
IF – V F
100
IV – IF
(typ.)
Ta = 25°C
(typ.)
Ta = 25°C
IV (mcd)
(mA)
3000
Luminous intensity
Forward current
IF
30
10
3
1
1.7
1.9
2.1
2.3
2.5
2.7
Forward voltage
VF
1000
100
30
10
1
2.9
10
3
(V)
100
30
Forward current
IF
(mA)
Wavelength characteristic
IV – Tc
(typ.)
10
1.0
(typ.)
IF = 50 mA
Ta = 25°C
5
3
Relative luminous intensity
Relative luminous intensity
IV
0.8
1
0.5
0.3
0.1
−40
−20
0
20
40
Case temperature
60
Tc
80
0.6
0.4
0.2
0
580
100
600
620
640
Wavelength
(°C)
660
680
700
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0.2
0.4
0.6
0.8
90°
1.0
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TL(RM,RMM,SM,OM,YM)1108(T11)
TLSM1108
IF – V F
IV – IF
(typ.)
(typ.)
100
Ta = 25°C
IV (mcd)
30
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
10
3
1
1.7
1.9
2.1
2.3
2.5
Forward voltage
2.7
VF
3000
1000
300
100
30
10
1
2.9
3
(V)
IV – Tc
30
Forward current
IF
100
(mA)
Wavelength characteristic
(typ.)
10
10
1.0
(typ.)
3
Ta = 25°C
Relative luminous intensity
IV
Relative luminous intensity
IF = 50 mA
5
1
0.5
0.3
0.1
−40
−20
0
20
40
Case temperature
60
80
Tc
(°C)
0.8
0.6
0.4
0.2
0
560
100
580
600
620
Wavelength
640
660
680
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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TL(RM,RMM,SM,OM,YM)1108(T11)
TLOM1108
IF – V F
IV – IF
(typ.)
100
Ta = 25°C
IV (mcd)
30
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
10
3
1
1.7
(typ.)
1.9
2.1
2.3
2.5
Forward voltage
2.7
VF
3000
1000
300
100
30
10
1
2.9
10
3
(V)
IV – Tc
Forward current
IF
100
(mA)
Wavelength characteristic
(typ.)
10
30
1.0
(typ.)
3
Relative luminous intensity
IV
Relative luminous intensity
IF = 50 mA
5
1
0.5
0.3
0.1
−40
−20
0
20
40
Case temperature
60
80
Tc
(°C)
Ta = 25°C
0.8
0.6
0.4
0.2
0
540
100
560
580
600
Wavelength
640
620
660
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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TL(RM,RMM,SM,OM,YM)1108(T11)
TLYM1108
IF – V F
IV – IF
(typ.)
100
Ta = 25°C
IV (mcd)
30
Luminous intensity
IF
(mA)
Ta = 25°C
Forward current
(typ.)
10
3
3000
1000
300
100
30
1
1.7
1.9
2.1
2.3
Forward voltage
2.5
VF
2.7
IV – Tc
10
1
2.9
(V)
10
Forward current
IF
30
(mA)
Wavelength characteristic
(typ.)
10
3
1.0
100
(typ.)
3
Ta = 25°C
Relative luminous intensity
IV
5
Relative luminous intensity
IF = 50 mA
1
0.5
0.3
0.1
−40
−20
0
20
40
Case temperature
60
80
Tc
(°C)
0.8
0.6
0.4
0.2
0
540
100
560
580
600
Wavelength
620
640
660
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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TL(RM,RMM,SM,OM,YM)1108(T11)
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 4weeks in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
5 s max(*)
10 s max (*)
(*)
(*)
140 to 160°C max(*)
(*)
4°C/s max(*)
4°C/s max
60 to 120 s max(*)
Time
•
•
•
•
•
260°C max
Package surface
temperature (°C)
Package surface
temperature (°C)
240°C max
4°C/s max(*)
max(*)
150 to 180°C 230°C
4°C/s max(*)
60 to 120 s
Time
(s)
max(*)
30 to 50 s max(*)
(s)
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 4weeks of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: 25 W
Temperature: 350°C or less
Time:
within 3 s
If the products need to be performed by other soldering method (ex. wave soldering), please contact Toshiba
sales representative.
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TL(RM,RMM,SM,OM,YM)1108(T11)
Recommended soldering pattern
Cu area > 16 mm2
Unit: mm
1.5
4.0
Do not use this area for
electrical contact.
4.0
Cathode
4.0
2.3
0.7
0.8
Anode
Do not use this area for
electrical contact.
1.1
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TL(RM,RMM,SM,OM,YM)1108(T11)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES:
KAO CLEAN THROUGH 750HS:
PINE ALPHA ST-100S:
(made by ASAHI GLASS)
(made by KAO)
(made by ARAKAWA CHEMICAL)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (this method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications)
(1) Tape Type: T11 (4-mm pitch)
(2) Example
TLSM1108
(T11)
Tape type
Toshiba product No.
2.
Handling precautions
Tape material protected against static electricity. However, static electricity may occur depending on
quantity of charged static electricity and a device may attach to a tape, or a device may be unstable
when peeling a tape cover.
(a)In process, taping materials may sustain an electrostatic charge, use an ionizer to
neutralize the ions.
(b)For transport and temporary storage of devices, use containers(boxes, jigs, and bags) that
are made of anti-static materials or of materials that dissipate electrostatic electricity.
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TL(RM,RMM,SM,OM,YM)1108(T11)
3. Tape dimensions
Unit: mm
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
1.5
+0.1/−0
P2
2.0
±0.05
E
1.75
±0.1
W
8.0
±0.3
P0
4.0
±0.1
P
4.0
±0.1
t
0.3
±0.05
A0
2.9
±0.1
F
3.5
±0.05
B0
3.7
±0.1
D1
1.5
±0.1
K0
2.3
±0.1
K0
P0
D
t
P2
E
F
W
B0
P
D1
Polarity
A0
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TL(RM,RMM,SM,OM,YM)1108(T11)
4.
Reel dimensions
Unit: mm
9 +1/ −0
5.
φ60
2 ± 0.5
φ13
φ44
180 +0
−4
11.4 ± 1.0
Leader and trailer sections of tape
40 mm or more
40 mm or more
(Note 1)
(Note 2)
Leading part: 190 mm (min)
Note 1: Empty trailer section
Note 2: Empty leader section
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TL(RM,RMM,SM,OM,YM)1108(T11)
6. Packing form
(1) Packing quantity
Reel
2,000 pcs
Carton
10,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
7. Label format
(1) Example: TLSM1108 (T11)
P/N:
TOSHIBA
TYPE
TLSM1108
ADDC
(T11)
Q’TY
Lot Number
Key code for TSB
(RANK SYMBOL)
32C
2,000 pcs
2000
Use under 5-30degC/60%RH in 4weeks
SEALED:
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y380xxxxxxxxxxxxxxxxxx*
(2) Label location
• Reel
• Carton
Tape feel direction
Label position
Label position
• The aluminum package in which the reel is supplied also has the label attached to
center of one side.
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TL(RM,RMM,SM,OM,YM)1108(T11)
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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