DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D168 BYG70 series Fast soft-recovery controlled avalanche rectifiers Preliminary specification 1996 Jun 05 Philips Semiconductors Preliminary specification Fast soft-recovery controlled avalanche rectifiers BYG70 series FEATURES DESCRIPTION • Glass passivated DO-214AC surface mountable package with glass passivated chip. • High maximum operating temperature The well-defined void-free case is of a transfer-moulded thermo-setting plastic. • Low leakage current • Excellent stability cathode band handbook, 4 columns • Guaranteed avalanche energy absorption capability k a • UL 94V-O classified plastic package • Shipped in 12 mm embossed tape. Top view Side view MSA474 Fig.1 Simplified outline (DO-214AC; SOD106) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM VR PARAMETER CONDITIONS MAX. UNIT repetitive peak reverse voltage BYG70D − 200 V BYG70G − 400 V BYG70J − 600 V BYG70D − 200 V BYG70G − 400 V continuous reverse voltage − 600 V averaged over any 20 ms period; Ttp = 100 °C; see Fig.2 − 1.00 A averaged over any 20 ms period; Al2O3 PCB mounting (see Fig.7); Tamb = 60 °C; see Fig.3 − 0.53 A averaged over any 20 ms period; epoxy PCB mounting (see Fig.7); Tamb = 60 °C; see Fig.3 − 0.39 A BYG70J IF(AV) MIN. average forward current IFSM non-repetitive peak forward current t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax − 20 A ERSM non-repetitive peak reverse avalanche energy − 10 mJ Tstg storage temperature −65 +175 °C Tj junction temperature −65 +175 °C 1996 Jun 05 L = 120 mH; Tj = Tj max prior to surge; inductive load switched off see Fig.4 2 Philips Semiconductors Preliminary specification Fast soft-recovery controlled avalanche rectifiers BYG70 series ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF forward voltage IF = 1 A; Tj = Tj max; see Fig.5 − − 2.1 V IF = 1 A; see Fig.5 − − 3.6 V V(BR)R reverse avalanche breakdown voltage IR = 0.1 mA BYG70D 300 − − V BYG70G 500 − − V BYG70J 700 − − V VR = VRRMmax; see Fig.6 − − 5 µA VR = VRRMmax; Tj = 165 °C; see Fig.6 − − 100 µA IR reverse current trr reverse recovery time when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig.8 − − 30 ns Cd diode capacitance VR = 0 V; f = 1 MHz − 30 − pF THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth j-tp thermal resistance from junction to tie-point Rth j-a thermal resistance from junction to ambient CONDITIONS VALUE UNIT 25 K/W note 1 100 K/W note 2 150 K/W Notes 1. Device mounted on Al2O3 printed-circuit board, 0.7 mm thick; thickness of copper ≥35 µm, see Fig.7. 2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.7. For more information please refer to the “General Part of associated Handbook”. 1996 Jun 05 3 Philips Semiconductors Preliminary specification Fast soft-recovery controlled avalanche rectifiers BYG70 series GRAPHICAL DATA MGD485 MGD486 2.0 0.8 handbook, halfpage handbook, halfpage IF(AV) (A) IF(AV) (A) 1.5 0.6 1.0 0.4 0.5 0.2 0 0 0 100 Ttp (°C) 200 0 Tamb (°C) Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). Fig.3 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). MGD487 MGD488 200 Tj (°C) 5 handbook, halfpage handbook, halfpage IF (A) 160 4 120 3 80 2 D G J 1 40 0 0 0 400 VR (V) 800 0 Device mounted as shown in Fig.7. Solid line: Al2O3 PCB. Dotted line: epoxy PCB. Fig.4 200 VR = VRRMmax; δ = 0.5; a = 1.57. Device mounted as shown in Fig.7; solid line: Al2O3 PCB; dotted line: epoxy PCB. VR = VRRMmax; δ = 0.5; a = 1.57. Fig.2 100 4 6 VF (V) 8 Solid line: Tj = 25 °C. Dotted line: Tj = 175 °C. Maximum permissible junction temperature as a function of reverse voltage. 1996 Jun 05 2 Fig.5 4 Forward current as a function of forward voltage; maximum values. Philips Semiconductors Preliminary specification Fast soft-recovery controlled avalanche rectifiers BYG70 series MGC532 3 10halfpage handbook, 50 IR (µA) 10 2 4.5 50 2.5 10 1 0 100 o Tj ( C) 1.25 200 VR = VRMMmax. Fig.6 Dimensions in mm. Material: AL2O3 or epoxy-glass. Reverse current as a function of junction temperature; maximum values. handbook, full pagewidth Fig.7 Printed-circuit board for surface mounting. IF (A) DUT + 10 Ω MSB213 0.5 25 V t rr 1Ω 50 Ω 0 t 0.25 0.5 IR (A) 1.0 Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns. Source impedance: 50 Ω; tr ≤ 15 ns. Fig.8 Test circuit and reverse recovery time waveform and definition. 1996 Jun 05 5 MAM057 Philips Semiconductors Preliminary specification Fast soft-recovery controlled avalanche rectifiers BYG70 series PACKAGE OUTLINE 5.5 5.1 4.5 4.3 handbook, full pagewidth 2.3 2.0 0.05 2.8 1.6 2.4 1.4 , , , , 0.2 3.3 2.7 MSA414 Marking band indicates the cathode. Dimensions in mm. Fig.9 DO-214AC; SOD106. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jun 05 6