PHILIPS BYG70J Fast soft-recovery controlled avalanche rectifier Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
M3D168
BYG70 series
Fast soft-recovery
controlled avalanche rectifiers
Preliminary specification
1996 Jun 05
Philips Semiconductors
Preliminary specification
Fast soft-recovery
controlled avalanche rectifiers
BYG70 series
FEATURES
DESCRIPTION
• Glass passivated
DO-214AC surface mountable
package with glass passivated chip.
• High maximum operating
temperature
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic.
• Low leakage current
• Excellent stability
cathode
band
handbook, 4 columns
• Guaranteed avalanche energy
absorption capability
k
a
• UL 94V-O classified plastic
package
• Shipped in 12 mm embossed tape.
Top view
Side view
MSA474
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VRRM
VR
PARAMETER
CONDITIONS
MAX.
UNIT
repetitive peak reverse voltage
BYG70D
−
200
V
BYG70G
−
400
V
BYG70J
−
600
V
BYG70D
−
200
V
BYG70G
−
400
V
continuous reverse voltage
−
600
V
averaged over any 20 ms period;
Ttp = 100 °C; see Fig.2
−
1.00
A
averaged over any 20 ms period;
Al2O3 PCB mounting (see Fig.7);
Tamb = 60 °C; see Fig.3
−
0.53
A
averaged over any 20 ms period;
epoxy PCB mounting (see Fig.7);
Tamb = 60 °C; see Fig.3
−
0.39
A
BYG70J
IF(AV)
MIN.
average forward current
IFSM
non-repetitive peak forward current t = 10 ms half sine wave;
Tj = Tj max prior to surge;
VR = VRRMmax
−
20
A
ERSM
non-repetitive peak reverse
avalanche energy
−
10
mJ
Tstg
storage temperature
−65
+175
°C
Tj
junction temperature
−65
+175
°C
1996 Jun 05
L = 120 mH; Tj = Tj max prior to surge;
inductive load switched off
see Fig.4
2
Philips Semiconductors
Preliminary specification
Fast soft-recovery
controlled avalanche rectifiers
BYG70 series
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VF
forward voltage
IF = 1 A; Tj = Tj max; see Fig.5
−
−
2.1
V
IF = 1 A; see Fig.5
−
−
3.6
V
V(BR)R
reverse avalanche
breakdown voltage
IR = 0.1 mA
BYG70D
300
−
−
V
BYG70G
500
−
−
V
BYG70J
700
−
−
V
VR = VRRMmax;
see Fig.6
−
−
5
µA
VR = VRRMmax; Tj = 165 °C;
see Fig.6
−
−
100
µA
IR
reverse current
trr
reverse recovery time
when switched from IF = 0.5 A to
IR = 1 A; measured at IR = 0.25 A;
see Fig.8
−
−
30
ns
Cd
diode capacitance
VR = 0 V; f = 1 MHz
−
30
−
pF
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-tp
thermal resistance from junction to tie-point
Rth j-a
thermal resistance from junction to ambient
CONDITIONS
VALUE
UNIT
25
K/W
note 1
100
K/W
note 2
150
K/W
Notes
1. Device mounted on Al2O3 printed-circuit board, 0.7 mm thick; thickness of copper ≥35 µm, see Fig.7.
2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.7.
For more information please refer to the “General Part of associated Handbook”.
1996 Jun 05
3
Philips Semiconductors
Preliminary specification
Fast soft-recovery
controlled avalanche rectifiers
BYG70 series
GRAPHICAL DATA
MGD485
MGD486
2.0
0.8
handbook, halfpage
handbook, halfpage
IF(AV)
(A)
IF(AV)
(A)
1.5
0.6
1.0
0.4
0.5
0.2
0
0
0
100
Ttp (°C)
200
0
Tamb (°C)
Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
Fig.3
Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
MGD487
MGD488
200
Tj
(°C)
5
handbook, halfpage
handbook, halfpage
IF
(A)
160
4
120
3
80
2
D
G
J
1
40
0
0
0
400
VR (V)
800
0
Device mounted as shown in Fig.7.
Solid line: Al2O3 PCB.
Dotted line: epoxy PCB.
Fig.4
200
VR = VRRMmax; δ = 0.5; a = 1.57.
Device mounted as shown in Fig.7;
solid line: Al2O3 PCB; dotted line: epoxy PCB.
VR = VRRMmax; δ = 0.5; a = 1.57.
Fig.2
100
4
6
VF (V)
8
Solid line: Tj = 25 °C.
Dotted line: Tj = 175 °C.
Maximum permissible junction temperature
as a function of reverse voltage.
1996 Jun 05
2
Fig.5
4
Forward current as a function of forward
voltage; maximum values.
Philips Semiconductors
Preliminary specification
Fast soft-recovery
controlled avalanche rectifiers
BYG70 series
MGC532
3
10halfpage
handbook,
50
IR
(µA)
10 2
4.5
50
2.5
10
1
0
100
o
Tj ( C)
1.25
200
VR = VRMMmax.
Fig.6
Dimensions in mm.
Material: AL2O3 or epoxy-glass.
Reverse current as a function of junction
temperature; maximum values.
handbook, full pagewidth
Fig.7
Printed-circuit board for surface mounting.
IF
(A)
DUT
+
10 Ω
MSB213
0.5
25 V
t rr
1Ω
50 Ω
0
t
0.25
0.5
IR
(A)
1.0
Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns.
Source impedance: 50 Ω; tr ≤ 15 ns.
Fig.8 Test circuit and reverse recovery time waveform and definition.
1996 Jun 05
5
MAM057
Philips Semiconductors
Preliminary specification
Fast soft-recovery
controlled avalanche rectifiers
BYG70 series
PACKAGE OUTLINE
5.5
5.1
4.5
4.3
handbook, full pagewidth
2.3
2.0
0.05
2.8 1.6
2.4 1.4
,
,
,
,
0.2
3.3
2.7
MSA414
Marking band indicates the cathode.
Dimensions in mm.
Fig.9 DO-214AC; SOD106.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 05
6
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