DPS-081104 CHIP BEADS Ultra Power Line Series v Features v Dimensions (unit : mm) B • High Current characteristics • Low Rdc characteristics T • Good reliability (Monolithic structure) L • Magnetically shielded W • Fast mounting speed • RoHS compliant v Applications • PDP/LCD Monitor, Digital TV/VCR etc. v General Code 1 2 3 4 5 6 CB 2012 U A 300 T 1 2 3 4 5 6 Series Code CB : Chip Ferrite Beads Dimension Code The first two digits : length(mm) The last two digits : width(mm) Application Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code A: General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 300 = 30 (Ω) Packaging Code T : Reel paper packaging E : Reel embossed tape packaging Size L W T B 1005 1.0±0.10 0.5±0.10 0.5±0.10 0.25±0.1 1608 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 2012 2.0±0.20 1.25±0.2 0.85±0.2 0.5±0.3 3216 3.2±0.20 1.6±0.20 1.1±0.20 0.5±0.3 4516 4.5±0.25 1.6±0.20 1.3±0.20 0.5±0.3 4532 4.5±0.25 3.2±0.25 1.5±0.25 0.5±0.3 v Temperature Range • Operating Temp. -55 ~ +125℃ • Storage Temp. -10 ~ +40 ℃ v Typical Material Characteristics High μ Low μ (Low RXCP) (High RXCP) V M J,K A This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Ultra Power Line v 1608~4532 SIZE Impedance (Ω) ±25% DC Resistance (Ω) max. Rated Current (mA) max. CB1608UA101 100 0.030 4000 CB1608UK500 50 0.025 4000 CB1608UK600 60 0.030 4000 CB2012UA300 30 0.010 5000 CB2012UA600 60 0.015 5000 CB2012UA101 100 0.020 4000 CB2012UA121 120 0.030 4000 CB2012UK121 120 0.030 4000 CB2012UJ121 120 0.030 4000 CB2012UM121 120 0.030 4000 CB3216UA121 120 0.020 6000 CB3216UM600 60 0.010 6000 CB3216UM121 120 0.200 6000 CB4516UM600 60 0.010 6000 CB4532UK121 120 0.030 6000 CB4532UK401 400 0.045 4000 Test Frequency (MHz) 100 ※ Measuring Equipment -. Z : HP4291B / E4991A CHIP BEAD, Ultra Power Line Series Samwha P/N -. Rdc : HP4338B This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Ultra Power Line v 1608~4532 SIZE CB 1608 UK 500 CB 1608 UK 600 100 100 Z Impedance [ O ] R 50 X 25 0 R 75 50 25 X 0 10 100 1000 1 Frequency [MHz] Impedance [Ohm] Impedance [Ohm] Z 30 R 0 X 1 10 100 60 30 X 0 1000 R 90 1 10 Impedance [ Ω ] Impedance [ O ] R 100 X 100 80 X 1 Impedance [ Ω ] Impedance [ O ] X 100 1000 CB 4532 UK 121 280 1000 Frequency [MHz] Z 120 R 80 X 40 0 10 100 Z R 1 10 CB 3216 UM 121 160 90 0 1000 Frequency[MHz] Z 45 100 40 1000 CB 3216 UA 121 135 10 Frequency [MHz] R Frequency [MHz] 180 1 120 0 10 0 1000 X 50 Z Z 1 R 100 CB 2012 UM 121 160 150 0 Z 150 Frequency [MHz] CB 2012 UJ 121 50 100 CB 2012 UK 121 200 Z Frequency [MHz] 200 1000 CB 2012 UA 101 120 45 15 100 CHIP BEAD, Ultra Power Line Series CB 2012 UA 300 60 10 Frequency [MHz] Impedance [Ohm] 1 Impedance [ O ] Impedance [ O ] Z 75 1 10 100 1000 210 R 140 X 70 0 1 10 100 1000 Frequency [MHz] Frequency[MHz] This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Reliability & Test Condition Item Requirements Test Conditions Operating temperature range - 55 ℃ ~ + 125 ℃ - Storage temperature range 40 ℃ max., 70% RH max. at packing condition More than 90% of the terminal electrode shall be covered with new solder Resistance to soldering heat 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than ±30 % Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 270 ± 10 ℃ Soldering time : 10 ± 0.5 sec. More than 50% of the terminal electrode shall be covered with new solder ST ≥ Reflow soldering ST 1 CT 2 CT Preheat temperature : 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 sec. max. (Reflow soldering profile) High temperature resistance Temperature : 125 ± 3 ℃ Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours High temperature load resistance Temperature : 125 ± 3 ℃ Applied current : rated current Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours 1. No mechanical damage 2. Impedance shall not change more than ±30 % CHIP BEAD, Reliability & Test Condition Solderability Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 ± 1 sec. Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity resistance This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Reliability & Test Condition Item Requirements Test Conditions Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Applied current : rated current Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity load resistance 1. No mechanical damage 2. Impedance shall not change more than ±30 % Temperature : -55 ± 3 ℃ Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Thermal shock 1. -55 ± 3℃ for 30 minutes 2.125 ± 3 ℃ for 30 minutes 3. repeat 100 cycle Vibration Frequency : 10 ~ 55 Hz Amplitude : 1.5 mm Direction : X, Y, Z Sweep time : 2 hours for each axis Drop Drop 10 times on a concrete floor from a height of 100 cm W No mechanical damage Flexure strength ITEM 1005 1608 2012 3216 4516 4532 A (mm) 0.7 1.0 1.0 1.3 1.5 1.5 B (mm) 0.5 0.8 1.0 1.5 3.6 3.6 C (mm) 0.7 1.3 1.3 3.0 3.0 3.8 W (kgf) 0.7 2.0 4.0 5.0 5.0 5.0 R0.5 C A 50 B CHIP BEAD, Reliability & Test Condition Low temperature resistance A 20 W Bending strength R340 The terminal electrode shall be neither break off nor the chip damage 2 mm Resistance meter This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Packaging v Standard Quantity Size Q’TY(PCS) 1005 10,000 1608 4,000 2012 4,000 3216 3,000 4516 2,000 4532 1,000 Remarks 0.85 T size (Unit:mm) A B C Φ178±2 Φ50 min. Φ13±0.5 D E W 4±0.8 2±0.2 9±1.5 CHIP BEAD, Packaging v Reel Dimension v Leader & Blank Portion (Unit:mm) Blank Chips 350±50 mm Blank Leader 350±50 mm 150 min 60 Pitch 60 Pitch This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Packaging v Taping Dimensions (Paper tape) T A B S P (Unit:mm) A ±0.1 B ±0.1 P ±0.1 S ±0.1 T (Max.) 1005 1.15 0.65 2.0 1.0 0.8 1608 1.80 1.00 4.0 2.0 1.1 2012 2.30 1.55 4.0 2.0 1.1 v Taping Dimensions (Emboss tape) CHIP BEAD, Packaging Type (Unit:mm) Type A ±0.1 B ±0.1 C ±0.1 D ±0.1 2012 2.25 1.45 1.50 0.23 3216 3.50 1.85 1.25 0.23 4516 4.90 1.90 1.35 0.30 4532 4.85 3.60 1.40 0.30 This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Soldering Profile v Reflow Soldering Pre - heating Soldering Cooling 245±5℃ 230 180 150 10 sec. max. 30~60 sec. 60 sec. min. v Flow Soldering Pre - heating Soldering Cooling 250±5℃ 250 180 150 60 sec. min. 10 sec. max. CHIP BEAD, Soldering Profile 60~120 sec. 60 sec. min. v Manual Soldering 300 Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max. Tc 2 sec. max. This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD