PRELIMINARY CM1450 LCD & Camera EMI Filter Array with ESD Protection Features Product Description • • The CM1450 comprises a family of inductor-capacitor (L-C) based EMI filter arrays with integrated ESD protection in CSP form factor. The CM1450-06 and CM1450-08 are configured in 6 and 8 channel formats respectively. Each EMI filter channel of the CM1450 is implemented as a 5-pole L-C filter where the component values are 15pF-17nH-15pF-17nF-15pF. The CM1450's roll-off frequency at -10dB attenuation is 300MHz and can be used in applications where the data rates are as high as 120Mbps while providing greater than 35dB over the 800MHz to 2.7GHz frequency range. The parts integrate ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the Level 4 requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • • Six and eight channels of EMI filtering Utilizes Praetorian™ inductor-based design technology for true L-C filter implementation OptiGuard™ coating for improved reliability ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Better than 40dB of attenuation at 1GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm x 1.330mm footprint Chip Scale Package (CM1450-06CS/CP) 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package (CM1450-08CS/CP) Lead-free version available Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data phones in cell phones, PDAs or notebook computersWireless handsets / cell phones Wireless Handsets Handheld PCs/PDAs LCD and camera modules This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs) because of its small package format and easy-to-use pin assignments. In particular, the CM1450 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in wireless handsets. The CM1450 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1450 is available in a space saving, low profile Chip Scale Package with optional lead-free finishing. . Electrical Schematic L1 L2 FILTERn* FILTERn* C C C GND (Pins B1-Bn) 1 of n EMI Filtering + ESD Channels (n = 6 for CM1450-06, 8 for CM1450-08) * See Package/Pinout Diagram for expanded pin information. © 2005 California Micro Devices Corp. All rights reserved. 01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 1 PRELIMINARY CM1450 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 C1 C2 C3 C4 C5 C6 A GND N506 B GND B1 Orientation Marking C GND B2 B3 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 A1 A2 A3 A4 A5 A6 A1 CM1450-06CS/CP 15-Bump CSP Package Orientation Marking (see note 2) 1 2 3 4 5 6 7 8 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 C1 C2 C3 C4 C5 C6 C7 C8 A GND N508 B GND B1 Orientation Marking C GND B2 GND B3 B4 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 A1 A2 A3 A4 A5 A6 A7 A8 A1 Notes: CM1450 -08CS/CP 20-Bump CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS CM1450 CM1450 NAME DESCRIPTION CM1450 CM1450 PIN(s) A1 NAME DESCRIPTION PIN(s) NAME DESCRIPTION PIN(s) A1 FILTER1 Filter Channel 1 C1 PIN(s) NAME DESCRIPTION C1 FILTER1 Filter Channel 1 A2 A2 FILTER2 Filter Channel 2 A3 A3 FILTER3 Filter Channel 3 C2 C2 FILTER2 Filter Channel 2 C3 C3 FILTER3 Filter Channel 3 A4 A4 FILTER4 A5 A5 FILTER5 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5 A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6 - A7 FILTER7 Filter Channel 7 - C7 FILTER7 Filter Channel 7 - A8 FILTER8 Filter Channel 8 - C8 FILTER8 Filter Channel 8 B1-B3 B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 15 CSP CM1450-06CS N506 CM1450-06CP N506 20 CSP CM1450-08CS N508 CM1450-08CP N508 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 01/27/05 PRELIMINARY CM1450 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS LTOT Total Channel Inductance (L1 + L2) 34 nH L1, L2 Inductance 17 nH CTOT Total Channel Capcitance (C1⏐⏐C2 ⏐⏐ C3 ) C1, C2, C3 Capacitance At 2.5V DC, 1MHz, 30mV AC 36 45 54 pF At 2.5V DC, 1MHz, 30mV AC 12 15 18 pF fC Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 137 MHz fC Roll-off Frequency at -10dB Attenuation ZSOURCE=50Ω, ZLOAD=50Ω 300 MHz VDIODE Diode Standoff Voltage IDIODE=10µA ILEAK Diode Leakage Current (reverse bias) VDIODE=+3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 VCL 5.5 V 100 5.6 -1.5 6.8 -0.8 nA 9.0 -0.4 V V ±30 kV ±15 kV +12 -7 V V Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 3 PRELIMINARY CM1450 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1) Figure 2. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2005 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 01/27/05 PRELIMINARY CM1450 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 3. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 5 PRELIMINARY CM1450 Mechanical Details CM1450 devices are supplied in custom Chip Scale Packages (CSP). Dimensions for each of these devices are presented in the following pages. Mechanical Package Diagrams CM1450-06CS/CP Mechanical Specifications BOTTOM VIEW The package dimensions for the CM1450-06CS/CP are presented below. A1 C1 SIDE VIEW B2 B4 B3 B1 C Custom CSP Bumps 15 Dim Millimeters Min Nom Max A 1 Inches Min Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D2 0.355 0.380 0.405 0.0140 0.0150 0.0159 # per tape and reel C2 Package B A2 PACKAGE DIMENSIONS 2 3 4 5 6 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CM1450-06CS/CP Chip Scale Package 3500 pieces Controlling dimension: millimeters © 2005 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 01/27/05 PRELIMINARY CM1450 Mechanical Details (cont’d) CM1450-08CS/CP Mechanical Specifications Mechanical Package Diagrams The package dimensions for the CM1450-08CS/CP are presented below. BOTTOM VIEW A1 C1 20 Dim Millimeters Min Nom Max A Min Nom Max A1 3.955 4.000 4.045 0.1557 0.1575 0.1593 A2 1.413 1.458 1.503 0.0556 0.0574 0.0592 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.200 0.250 0.300 0.0079 0.0098 0.0118 C2 0.244 0.294 0.344 0.0096 0.0116 0.0135 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D2 0.355 0.380 0.405 0.0140 0.0150 0.0159 # per tape and reel A 1 Inches A2 Bumps B C2 Custom CSP B4 B3 C PACKAGE DIMENSIONS Package SIDE VIEW B2 B1 2 3 4 5 6 7 8 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CM1450-08CS/CP Chip Scale Package 3500 pieces Controlling dimension: millimeters © 2005 California Micro Devices Corp. All rights reserved. 01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 7 PRELIMINARY CM1450 Mechanical Details (cont’d) CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B 0 X A0 X K0 CM1450-06 2.96 X 1.33 X 0.6 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm CM1450-08 4.00 X 1.46 X 0.6 4.11 X 1.57 X 0.76 8mm 178mm (7") 3500 4mm 4mm TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 6. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 01/27/05