FEATURES FUNCTIONAL BLOCK DIAGRAM ±0.5°C (typical) threshold accuracy Factory-set trip points from −45°C to +15°C in 10°C increments +35°C to +115°C in 10°C increments No external components required Maximum temperature of 125°C Open-drain output (ADT6501/ADT6503) Push-pull output (ADT6502/ADT6504) Pin-selectable hysteresis of 2°C and 10°C Supply current of 30 µA (typical) Space-saving, 5-lead SOT-23 package VCC 4 ADT6501 Σ-Δ TEMPERATURE-TODIGITAL CONVERTER COMPARATOR 5 TOVER FACTORY PRESET TRIP POINT REGISTER 2ºC/10ºC APPLICATIONS Medical equipment Automotive Cell phones Hard disk drives Personal computers Electronic test equipment Domestic appliances Process control 1 2 3 GND GND HYST 06096-001 Data Sheet Low Cost, 2.7 V to 5.5 V, Micropower Temperature Switches in SOT-23 ADT6501/ADT6502/ADT6503/ADT6504 Figure 1. GENERAL DESCRIPTION The ADT6501/ADT6502/ADT6503/ADT6504 are trip point temperature switches available in a 5-lead SOT-23 package. Each part contains an internal band gap temperature sensor for local temperature sensing. When the temperature crosses the trip point setting, the logic output is activated. The ADT6501/ ADT6503 logic output is active low and open-drain. The ADT6502/ADT6504 logic output is active high and push-pull. The temperature is digitized to a resolution of 0.125°C (11-bit). The factory trip point settings are 10°C apart starting from −45°C to +15°C for the cold threshold models and from +35°C to +115°C for the hot threshold models. These devices require no external components and typically consume 30 μA supply current. Hysteresis is pin-selectable at 2°C and 10°C. The temperature switch is specified to operate over the supply range of 2.7 V to 5.5 V. The ADT6501 and ADT6502 are used for monitoring temperatures from +35°C to +115°C only. Therefore, the logic output pin becomes active when the temperature goes higher than the selected trip point temperature. Rev. B The ADT6503 and ADT6504 are used for monitoring temperatures from −45°C to +15°C only. Therefore, the logic output pin becomes active when the temperature goes lower than the selected trip point temperature. PRODUCT HIGHLIGHTS 1. Σ-Δ based temperature measurement gives high accuracy and noise immunity. 2. Wide operating temperature range from −55°C to +125°C. 3. ±0.5°C typical accuracy from −45°C to +115°C. 4. Factory threshold settings from −45°C to +115°C in 10°C increments. 5. Supply voltage is 2.7 V to 5.5 V. 6. Supply current of 30 μA. 7. Space-saving, 5-lead SOT-23 package. 8. Pin-selectable temperature hysteresis of 2°C or 10°C. 9. Temperature resolution of 0.125°C. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2007–2012 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Converter Details ..........................................................................8 Applications ....................................................................................... 1 Factory-Programmed Threshold Range ....................................8 Functional Block Diagram .............................................................. 1 Hysteresis Input .............................................................................8 General Description ......................................................................... 1 Temperature Conversion ..............................................................8 Product Highlights ........................................................................... 1 Application Information ................................................................ 10 Revision History ............................................................................... 2 Thermal Response Time ........................................................... 10 Specifications..................................................................................... 3 Self-Heating Effects .................................................................... 10 Absolute Maximum Ratings............................................................ 4 Supply Decoupling ..................................................................... 10 ESD Caution .................................................................................. 4 Temperature Monitoring ........................................................... 10 Pin Configurations and Function Descriptions ........................... 5 Typical Application Circuits ......................................................... 11 Typical Performance Characteristics ............................................. 6 Outline Dimensions ....................................................................... 13 Theory of Operation ........................................................................ 8 Ordering Guide .......................................................................... 13 Circuit Information ...................................................................... 8 REVISION HISTORY 9/12—Rev. A to Rev. B Change to Supply Current Parameter, Table 1 .............................. 3 Updated Outline Dimensions ....................................................... 13 1/08—Rev. 0 to Rev. A Added ADT6503 and ADT6504....................................... Universal Changes to Features.......................................................................... 1 Changes to Product Highlights .......................................................1 Changes to Table 1.............................................................................3 Changes to Typical Performance Characteristics .........................6 Changes to Ordering Guide .......................................................... 13 9/07—Revision 0: Initial Version Rev. B | Page 2 of 16 Data Sheet ADT6501/ADT6502/ADT6503/ADT6504 SPECIFICATIONS TA = −55°C to +125°C, VCC = 2.7 V to 5.5 V, open-drain RPULL-UP = 10 kΩ, unless otherwise noted. Table 1. Parameter TEMPERATURE SENSOR AND ADC Threshold Accuracy Min ADC Resolution Temperature Conversion Time Update Rate Temperature Threshold Hysteresis DIGITAL INPUT (HYST) Input Low Voltage, VIL Input High Voltage, VIH DIGITAL OUTPUT (OPEN-DRAIN) Output High Current, IOH Output Low Voltage, VOL Typ Max Unit Test Conditions/Comments ±0.5 ±0.5 ±0.5 ±0.5 11 30 600 2 10 ±6 ±4 ±4 ±6 °C °C °C °C Bits ms ms °C °C TA = −45°C to −25°C TA = −15°C to +15°C TA = 35°C to 65°C TA = 75°C to 115°C 0.2 × VCC 0.8 × VCC 10 Output High Voltage, VOH Output Capacitance, COUT1 POWER REQUIREMENTS Supply Voltage Supply Current 1 Leakage current, VCC = 2.7 V and VOH = 5.5 V IOL = 1.2 mA, VCC = 2.7 V IOL = 3.2 mA, VCC = 4.5 V RPULL-UP = 10 kΩ IOL = 1.2 mA, VCC = 2.7 V IOL = 3.2 mA, VCC = 4.5 V ISOURCE = 500 µA, VCC = 2.7 V ISOURCE = 800 µA, VCC = 4.5 V 10 V V V V pF 5.5 55 V µA 0.3 0.4 0.8 × VCC VCC − 1.5 2.7 30 V V nA V V pF 0.3 0.4 10 Output Capacitance, COUT 1 DIGITAL OUTPUT (PUSH-PULL) Output Low Voltage, VOL Time necessary to complete a conversion Conversion started every 600 ms HYST pin = 0 V HYST pin = VCC Guaranteed by design and characterization. Rev. B | Page 3 of 16 ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rating −0.3 V to +7 V −0.3 V to VCC + 0.3 V −0.3 V to +7 V −0.3 V to VCC + 0.3 V 20 mA 20 mA −55°C to +125°C −65°C to +160°C 150.7°C 0.9 MAXIMUM POWER DISSIPATION (W) WMAX = (TJMAX − TA 2)/θJA 240°C/W 260°C (+0°C) 20 sec to 40 sec 3°C/sec maximum −6°C/sec maximum 8 minute maximum 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 SOT-23 PD @ 125°C = 0.107W 0 –55 –40 –20 0 20 40 60 80 100 120 –50 –30 –10 10 30 50 70 90 110 125 TEMPERATURE (°C) Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature 1 Values relate to package being used on a standard 2-layer PCB. This gives a worst case θJA. Refer to Figure 2 for a plot of maximum power dissipation vs. ambient temperature (TA). 2 TA = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-mounted components. ESD CAUTION Rev. B | Page 4 of 16 06096-002 Parameter VCC to GND HYST Input Voltage to GND Open-Drain Output Voltage to GND Push-Pull Output Voltage to GND Input Current on All Pins Output Current on All Pins Operating Temperature Range Storage Temperature Range Maximum Junction Temperature, TJMAX 5-Lead SOT-23 (RJ-5) Power Dissipation 1 Thermal Impedance 3 θJA, Junction-to-Ambient (Still Air) IR Reflow Soldering (RoHS Compliant Package) Peak Temperature Time at Peak Temperature Ramp-Up Rate Ramp-Down Rate Time 25°C to Peak Temperature Data Sheet ADT6501/ADT6502/ADT6503/ADT6504 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 5 TOP VIEW (Not to Scale) GND 2 HYST 3 4 GND 1 TOVER/ TOVER VCC GND 2 06096-003 GND 1 HYST 3 Figure 3. ADT6501/ADT6502 Pin Configuration 5 TUNDER/ TUNDER 4 VCC TOP VIEW (Not to Scale) 06096-004 ADT6503/ ADT6504 ADT6501/ ADT6502 Figure 4. ADT6503/ADT6504 Pin Configuration Table 3. Pin Function Descriptions Pin Number ADT6501 1, 2 3 ADT6502 1, 2 3 ADT6503 1, 2 3 ADT6504 1, 2 3 Mnemonic GND HYST 4 5 4 — 4 — 4 — VCC TOVER — 5 — — TOVER — — 5 — TUNDER — — — 5 TUNDER Description Ground. Hysteresis Input. Connects HYST to GND for 2°C hysteresis or connects to VCC for 10°C hysteresis. Supply Input (2.7 V to 5.5 V). Open-Drain, Active Low Output. TOVER goes low when the temperature of the part exceeds the factory-programmed threshold; must use a pull-up resistor. Push-Pull, Active High Output. TOVER goes high when the temperature of the part exceeds the factory-programmed threshold. Open-Drain, Active Low Output. TUNDER goes low when the temperature of the part exceeds the factory-programmed threshold; must use a pull-up resistor. Push-Pull, Active High Output. TUNDER goes high when the temperature of the part exceeds the factory-programmed threshold. Rev. B | Page 5 of 16 ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 35 80 70 OUTPUT SINK RESISTANCE (Ω) 30 25 20 15 10 0 –0.5 –0.4 –0.3 –0.2 –0.1 0.1 0.2 0.3 0.4 60 2.7V 3.3V 50 40 5.5V 30 20 10 06096-018 5 06096-015 PERCENTAGE OF PARTS SAMPLED (%) SAMPLE SIZE = 300 0 –55 0.5 –10 25 TEMPERATURE ACCURACY (°C) 70 100 125 TEMPERATURE (°C) Figure 5. Trip Threshold Accuracy Figure 8. Output Sink Resistance vs. Temperature 120 45 40 5V 100 35 TEMPERATURE (°C) 3.3V ICC (µA) 30 25 20 15 80 60 40 10 0 –40 –10 25 75 06096-019 06096-016 20 5 0 120 0 0.8 1.6 TEMPERATURE (°C) Figure 6. Operating Supply Current vs. Temperature 3.2 4.0 4.8 6.4 8.0 9.6 11.2 12.8 5.6 7.2 8.8 10.4 12.0 TIME (s) Figure 9. Thermal Step Response in Perfluorinated Fluid 180 140 160 120 140 TEMPERATURE (°C) 2.7V 120 3.3V 100 5.5V 80 60 100 80 60 40 40 20 0 –55 –10 25 70 100 06096-020 20 06096-017 OUTPUT SOURCE RESISTANCE (Ω) 2.4 0 125 3.6 0 TEMPERATURE (°C) Figure 7. ADT6502/ADT6504 Output Source Resistance vs. Temperature Rev. B | Page 6 of 16 7.2 10.8 18.0 25.2 32.4 39.6 46.8 54.0 61.2 14.4 21.6 28.8 36.0 43.2 50.4 57.6 TIME (s) Figure 10. Thermal Step Response in Still Air Data Sheet ADT6501/ADT6502/ADT6503/ADT6504 12 10 10°C VCC HYSTERESIS (°C) 8 1 VCC = 3.3V 6 4 TOVER 2 2°C 0 –45 –25 –15 15 25 35 65 75 06096-023 06096-021 2 115 CH1 2.0V TEMPERATURE (°C) Figure 11. Hysteresis vs. Trip Temperature CH2 2.0V M 10.0ms 50.0kS/s A CH1 1.68V 20.0µs/pt Figure 13. ADT6501 Start-Up Delay 45 40 35 VCC 30 ICC (µA) 1 25 20 15 –40ºC –10ºC +25ºC +75ºC +120ºC 10 06096-022 5 CH1 2.0V CH2 2.0V M 10.0µs 50.0MS/s A CH1 1.68V 0 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 20.0ns/pt 06096-024 TOVER 2 VCC (V) Figure 12. ADT6501 Start-Up and Power-Down Figure 14. Operating Supply Current vs. Voltage Over Temperature Rev. B | Page 7 of 16 ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet THEORY OF OPERATION CIRCUIT INFORMATION FACTORY-PROGRAMMED THRESHOLD RANGE The ADT6501/ADT6502/ADT6503/ADT6504 are 11-bit digital temperature sensors with a 12th bit acting as the sign bit. An on-board temperature sensor generates a voltage precisely proportional to absolute temperature, which is compared to an internal voltage reference and input to a precision digital modulator. The 12-bit output from the modulator is input into a digital comparator where it is compared with a factory-set trip level. The output trip pin is activated if the temperature measured is greater than, in the case of the ADT6501/ADT6502, or less than, in the case of the ADT6503/ADT6504, the factory-set trip level. Overall accuracy for the ADT650x family is ±6°C (maximum) from −45°C to +115°C. The ADT6501/ADT6502/ADT6503/ADT6504 are available with factory-set threshold levels ranging from −45°C to +115°C in 10°C temperature steps. The ADT6501/ADT6503 outputs are intended to interface to reset inputs of microprocessors. The ADT6502/ADT6504 are intended for driving circuits of applications such as fan control circuits. Table 4 lists the available temperature threshold ranges. The on-board temperature sensor has excellent accuracy and linearity over the entire rated temperature range without needing correction or calibration by the user. The ADT6501/ADT6503 have active low, open-drain output structures that can sink current. The ADT6502/ADT6504 have active high, push-pull output structures that can sink and source current. On powerup, the output becomes active when the first conversion is completed, which typically takes 30 ms. Table 4. Factory-Set Temperature Threshold Ranges Device ADT6501 ADT6502 ADT6503 ADT6504 Threshold (TTH) Range +35°C < TTH < +115°C +35°C < TTH < +115°C −45°C < TTH < +15°C −45°C < TTH < +15°C HYSTERESIS INPUT The sensor output is digitized by a first-order, ∑-∆ modulator, also known as the charge balance type analog-to-digital converter (ADC). This type of converter utilizes time domain oversampling and a high accuracy comparator to deliver 11 bits of effective accuracy in an extremely compact circuit. The HYST pin is used to select a temperature hysteresis of 2°C or 10°C. The digital comparator ensures excellent accuracy for the hysteresis value. If the HYST pin is connected to VCC, a hysteresis of 10°C is selected. If the HYST pin is connected to GND, a hysteresis of 2°C is selected. The HYST pin should not be left floating. Hysteresis prevents oscillation on the output pin when the temperature is approaching the trip point and after the output pin is activated. For example, if the temperature trip is 45°C and the hysteresis selected is 10°C, the temperature would have to go as low as 35°C before the output deactivates. CONVERTER DETAILS TEMPERATURE CONVERSION The Σ-Δ modulator consists of an input sampler, a summing network, an integrator, a comparator, and a 1-bit digital-toanalog converter (DAC). Similar to the voltage-to-frequency converter, this architecture creates a negative feedback loop and minimizes the integrator output by changing the duty cycle of the comparator output in response to input voltage changes. The comparator samples the output of the integrator at a much higher rate than the input sampling frequency; this is called oversampling. Oversampling spreads the quantization noise over a much wider band than that of the input signal, improving overall noise performance and increasing accuracy. The conversion clock for the part is generated internally. No external clock is required. The internal clock oscillator runs an automatic conversion sequence. During this automatic conversion sequence, a conversion is initiated every 600 ms. At this time, the part powers up its analog circuitry and performs a temperature conversion. This temperature conversion typically takes 30 ms, after which the analog circuitry of the part automatically shuts down. The analog circuitry powers up again 570 ms later, when the 600 ms timer times out and the next conversion begins. The result of the most recent temperature conversion is compared with the factory-set trip point value. If the temperature measured is greater than the trip point value, the output is activated. The output is deactivated once the temperature crosses back over the trip point threshold plus whatever temperature hysteresis is selected. Figure 15 to Figure 18 show the transfer function for the output trip pin of each generic model. Rev. B | Page 8 of 16 Data Sheet ADT6501/ADT6502/ADT6503/ADT6504 V V TUNDER TOVER COLD HOT HOT COLD 10°C HYST TEMP 2°C HYST Figure 15. ADT6501 TOVER Transfer Function 10°C HYST 06096-008 2°C HYST TEMP TTH 06096-006 TTH Figure 17. ADT6503 TUNDER Transfer Function V V TOVER TUNDER TTH 10°C HYST HOT COLD TEMP 2°C HYST TEMP TTH 2°C HYST Figure 16. ADT6502 TOVER Transfer Function 10°C HYST Figure 18. ADT6504 TUNDER Transfer Function Rev. B | Page 9 of 16 06096-009 HOT 06096-007 COLD ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet APPLICATION INFORMATION The time required for a temperature sensor to settle to a specified accuracy is a function of the sensor’s thermal mass and the thermal conductivity between the sensor and the object being sensed. Thermal mass is often considered equivalent to capacitance. Thermal conductivity is commonly specified using the symbol Q and can be thought of as thermal resistance. It is commonly specified in units of degrees per watt of power transferred across the thermal joint. Thus, the time required for the ADT650x to settle to the desired accuracy is dependent on the characteristics of the SOT-23 package, the thermal contact established in that particular application, and the equivalent power of the heat source. In most applications, the settling time is best determined empirically. If possible, the ADT650x should be powered directly from the system power supply. This arrangement, shown in Figure 19, isolates the analog section from the logic switching transients. Even if a separate power supply trace is not available, generous supply bypassing reduces supply line induced errors. Local supply bypassing consisting of a 0.1 µF ceramic capacitor is advisable to achieve the temperature accuracy specifications. This decoupling capacitor must be placed as close as possible to the ADT650x VCC pin. TTL/CMOS LOGIC CIRCUITS SELF-HEATING EFFECTS 0.1µF ADT650x POWER SUPPLY The temperature measurement accuracy of the ADT6501/ ADT6502/ADT6503/ADT6504 can be degraded in some applications due to self-heating. Errors can be introduced from the quiescent dissipation and power dissipated when converting. The magnitude of these temperature errors depends on the thermal conductivity of the ADT650x package, the mounting technique, and the effects of airflow. At 25°C, static dissipation in the ADT650x is typically 99 µW operating at 3.3 V. In the 5-lead SOT-23 package mounted in free air, this accounts for a temperature increase due to self-heating of ΔT = PDISS × θJA = 99 µW × 240°C/W = 0.024°C It is recommended that current dissipated through the device be kept to a minimum because it has a proportional effect on the temperature error. SUPPLY DECOUPLING The ADT6501/ADT6502/ADT6503/ADT6504 should be decoupled with a 0.1 µF ceramic capacitor between VCC and GND. This is particularly important when the ADT650x are mounted remotely from the power supply. Precision analog products such as the ADT650x require well filtered power sources. Because the ADT650x operate from a single supply, it may seem convenient to tap into the digital logic power supply. Unfortunately, the logic supply is often a switch-mode design, which generates noise in the 20 kHz to 1 MHz range. In addition, fast logic gates can generate glitches that are hundreds of mV in amplitude due to wiring resistance and inductance. 06096-010 THERMAL RESPONSE TIME Figure 19. Separate Traces Used to Reduce Power Supply Noise TEMPERATURE MONITORING The ADT6501/ADT6502/ADT6503/ADT6504 are ideal for monitoring the thermal environment within electronic equipment. For example, the surface-mount package accurately reflects the exact thermal conditions that affect nearby integrated circuits. The ADT650x measure and convert the temperature at the surface of its own semiconductor chip. When the ADT650x are used to measure the temperature of a nearby heat source, the thermal impedance between the heat source and the ADT650x must be as low as possible. As much as 60% of the heat transferred from the heat source to the thermal sensor on the ADT650x die is discharged via the copper tracks, package pins, and bond pads. Of the pins on the ADT650x, the GND pins transfer most of the heat. Therefore, to monitor the temperature of a heat source, it is recommended that the thermal resistance between the ADT650x GND pins and the GND of the heat source be reduced as much as possible. For example, the unique properties of the ADT650x can be used to monitor a high power dissipation microprocessor. The ADT650x device in its SOT-23 package is mounted directly beneath the microprocessor’s pin grid array (PGA) package. The ADT650x requires no external characterization. Rev. B | Page 10 of 16 Data Sheet ADT6501/ADT6502/ADT6503/ADT6504 TYPICAL APPLICATION CIRCUITS 3.3V 3.3V 12V 0.1µF 0.1µF 100kΩ VCC VCC VCC ADT6501 MICROPROCESSOR ADT6502 TOVER HYST INT TOVER GND GND GND 06096-012 GND Figure 20. Microprocessor Alarm Figure 21. Overtemperature Fan Control 3.3V 0.1µF VCC ADT6502 ... P075 TOVER GND HYST OVER TEMPERATURE GND OUT OF RANGE 0.1µF VCC ADT6504 ... N015 TUNDER GND HYST UNDER TEMPERATURE GND 06096-013 HYST 06096-011 GND Figure 22. Temperature Window Alarms Rev. B | Page 11 of 16 ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet 3.3V 0.1µF 100kΩ VCC VCC ADT6501 ... P075 MICROPROCESSOR TOVER GND HYST INT GND GND 12V 0.1µF VCC ADT6502 ... P045 TOVER HYST GND 06096-014 GND Figure 23. Fail-Safe Temperature Monitor Rev. B | Page 12 of 16 Data Sheet ADT6501/ADT6502/ADT6503/ADT6504 OUTLINE DIMENSIONS 3.00 2.90 2.80 1.70 1.60 1.50 5 1 4 2 3.00 2.80 2.60 3 0.95 BSC 1.90 BSC 1.45 MAX 0.95 MIN 0.15 MAX 0.05 MIN 0.50 MAX 0.35 MIN 0.20 MAX 0.08 MIN SEATING PLANE 10° 5° 0° 0.60 BSC COMPLIANT TO JEDEC STANDARDS MO-178-AA 0.55 0.45 0.35 11-01-2010-A 1.30 1.15 0.90 Figure 24. 5-Lead Small Outline Transistor Package [SOT-23] (RJ-5) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADT6501SRJZP035RL7 ADT6501SRJZP045RL7 ADT6501SRJZP055RL7 ADT6501SRJZP065RL7 ADT6501SRJZP075RL7 ADT6501SRJZP085RL7 ADT6501SRJZP085-RL ADT6501SRJZP095RL7 ADT6501SRJZP105RL7 ADT6501SRJZP105-RL ADT6501SRJZP115RL7 ADT6502SRJZP035RL7 ADT6502SRJZP045RL7 ADT6502SRJZP055RL7 ADT6502SRJZP065RL7 ADT6502SRJZP075RL7 ADT6502SRJZP085RL7 ADT6502SRJZP095RL7 ADT6502SRJZP105RL7 ADT6502SRJZP115RL7 ADT6503SRJZN045RL7 ADT6503SRJZN035RL7 ADT6503SRJZN025RL7 ADT6503SRJZN015RL7 ADT6503SRJZN005RL7 Threshold Temperature 35°C 45°C 55°C 65°C 75°C 85°C 85°C 95°C 105°C 105°C 115°C 35°C 45°C 55°C 65°C 75°C 85°C 95°C 105°C 115°C −45°C −35°C −25°C −15°C −5°C Accuracy @ Threshold Temperature ±4°C ±4°C ±4°C ±4°C ±6°C ±6°C ±6°C ±6°C ±6°C ±6°C ±6°C ±4°C ±4°C ±4°C ±4°C ±6°C ±6°C ±6°C ±6°C ±6°C ±6°C ±6°C ±6°C ±4°C ±4°C Temperature Range −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C Rev. B | Page 13 of 16 Package Description 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 Package Option RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 Ordering Quantity 3,000 3,000 3,000 3,000 3,000 3,000 10,000 3,000 3,000 10,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 Branding T1U T1V T0B T1W T1X T0W T0W T1Y T15 T15 T1Z T25 T26 T27 T28 T17 T29 T2B T2C T2D T2E T2F T19 T2J T2M ADT6501/ADT6502/ADT6503/ADT6504 Model 1 ADT6503SRJZP005RL7 ADT6503SRJZP015RL7 ADT6504SRJZN045RL7 ADT6504SRJZN035RL7 ADT6504SRJZN025RL7 ADT6504SRJZN015RL7 ADT6504SRJZN005RL7 ADT6504SRJZP005RL7 ADT6504SRJZP015RL7 1 Threshold Temperature +5°C +15°C −45°C −35°C −25°C −15°C −5°C +5°C +15°C Accuracy @ Threshold Temperature ±4°C ±4°C ±6°C ±6°C ±6°C ±4°C ±4°C ±4°C ±4°C Data Sheet Temperature Range −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C −55°C to +125°C Z = RoHS Compliant Part. Rev. B | Page 14 of 16 Package Description 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 Package Option RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 RJ-5 Ordering Quantity 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 Branding T2N T2P T2K T2L T2Q T2R T2T T2H T2U Data Sheet ADT6501/ADT6502/ADT6503/ADT6504 NOTES Rev. B | Page 15 of 16 ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet NOTES ©2007–2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06096-0-10/12(B) Rev. B | Page 16 of 16