Datasheet Power Supply IC Series for TFT-LCD Panels Multi-channel System Power Supply IC + Gamma Buffer BD8162AEKV General Description The BD8162AEKV is a system power supply IC that provides control 6 power supply channels and 4 gamma output channels + VCOM required for TFT-LCD panels on a single chip. All channels have built-in control input and Power-Good output functions, enabling free sequence control setting just by changing channels. In addition, the BD8162AEKV is a user-friendly IC incorporating input switch, short-circuit protection, and protection detection output circuits. Key Specifications Power Supply Voltage 1 Range: 4.2V to 14V Oscillating Frequency: 200kHz to 800kHz(Variable) Operating Temperature Range: -40°C to +105°C Package W(Typ) x D(Typ) x H(Max) Features Step-up DC/DC Converter with Built-in 3A FET Step-down DC/DC Converter with Built-in 2A FET Synchronous Rectification Step-down DC/DC Converter with Built-in 2A FET 3ch LDO Regulator (500mA, 200mA, 20mA) Positive/Negative Charge Pumps 4ch Gamma Buffer Amplifier + VCOM Protection Circuits: Under-Voltage Lockout Protection Circuit Thermal Shutdown Circuit Timer Latch Type Short-Circuit Protection Circuit Controllable Startup Sequence HTQFP64V 12.00mm x 12.00mm x 1.00mm Applications LCD TV power supplies ○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0323AAF00690-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 1/26 TSZ22111・14・001 15.Feb.2016 Rev.001 BD8162AEKV Typical Application Circuit (1) 1. Application used to input VCC12V: BD8162AEKV Figure 1. Typical 12V Input Application Diagram 2. Startup Sequence VCC input VDD3 (Sync rectification) VDD1 (Step-down) VDD2 (LDO2) AVCC (Step-up) VOL (Negative charge pump) LDO3 VOH (Positive charge pump) AMP+VCOM 3. Sequence Image Chart VOH AVCC VCC(12V) LDO3 VDD3 AMP + VCOM VDD1 VDD2 VOL Figure 2. Sequence Chart www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV Typical Application Circuit (2) 1. Application used to input 5V: BD8162AEKV Figure 3. Typical 5V Input Application Circuit Diagram 2. Startup Sequence VCC input VDD3 (Sync rectification) VDD1 (LDO1) VDD2 (LDO2) AVCC (Step-up) VOL (Negative charge pump) LDO3 VOH (Positive charge pump) AMP+VCOM 3. Sequence Image Chart VOH AVCC LDO3 VCC(5V) VDD3 AMP + VCOM VDD1 VDD2 VOL Figure 4. Sequence Chart www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV SW1 PGATE DTC1 COMP1 FB1 VREF CTL1 FAULT SCP VCC 降圧 STEP-DOWN コンバータ CONVERTER SW2 UVLO VREF FB2 COMP2 DTC2 PVCC2 BOOT2 Block Diagram PG1 昇圧 STEP-UP コンバータ CONVERTER PROTECT PGND1 CTL2 PGND1 CPFB1 CPPG PG2 REG 正チャージ POSITIVE CHARGE ポンプ PUMP REG HGND C1 LDFB1 VCP1 LDCTL1 LDO 1 LDPG1 HVCC PVCC2 VCP2 LDO1 NEGATIVE 負チャージ CHARGE PUMP ポンプ GND OSC RT C2 HGND CPCTL LDFB2 CPFB2 LDO 2 HGND LDO 3 LDO2 OUT1 LDVCC2 OUT2 SYNC RECTIFICATION 同期整流 STEP-DOWN 降圧コンバータ CONVERTER CTL3 OUT3 OUT4 SW3 HVCC BOOT3 VCOM IN- IN4 IN+ IN3 IN2 IN1 LDO3 LDFB3 LDCTL3 PVCC3 COMP3 FB3 DTC3 PG3 PGND3 Pin Description PIN NO. 1 Pin name PGND3 Function Ground pin Power Good output 3 pin 2 PG3 3 DTC3 4 COMP3 5 FB3 6 PVCC3 7 LDFB3 8 LDCTL3 9 LDO3 Error amp output 3 pin Feedback input 3 pin Power supply input pin LDO feedback input 3 pin LDO3 control input pin LDO output 3 pin 10 IN1 11 PIN NO. 23 Pin name CPCTL 24 C2 25 VCP2 26 HVCC 27 VCP1 28 C1 29 CPPG 30 CPFB1 31 PGND1 AMP input 1 pin 32 PG1 IN2 AMP input 2 pin 33 SW1 12 IN3 AMP input 3 pin 34 PGATE 13 14 15 16 IN4 IN+ INVCOM AMP input 4 pin COM input + pin COM input pin COM output pin 35 36 37 38 DTC1 COMP1 FB1 CTL1 17 OUT4 AMP output 4 pin 39 FAULT 18 OUT3 AMP output 3 pin 40 SCP 19 OUT2 AMP output 2 pin 41 UVLO 20 OUT1 AMP output 1 pin 42 VCC 21 HGND Ground pin 43 VREF 22 CPFB2 Charge pump feedback 2 pin 44 FB2 Duty limit pin 3 pin www.rohm.com © 2016 ROHM Co., Ltd. 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TSZ22111・15・001 Function CP control input pin Charge pump output 2 pin Charge pump LDO output 2 pin Power supply input pin Charge pump LDO output 1 pin Charge pump output 1 pin CP Power Good output pin Charge pump feedback 1 pin Ground pin Power Good output 1 pin Switching output 1 pin Pch gate drive output pin Duty limit pin 1 pin Error amp output 1 pin Feedback input 1 pin Control input 1 pin Protection detection output pin Short-circuit protection delay pin Under-voltage lockout protection setting pin Power supply input pin Reference voltage output pin PIN NO. 45 Pin name COMP2 Function Error amp output 2 pin 46 DTC2 Duty limit pin 2 pin 47 PVCC2 Power supply input pin 48 BOOT2 Switch boot pin 2 pin 49 SW2 Switching output 2 pin 50 CTL2 Control input 2 pin 51 PG2 Power Good output 2 pin 52 REG Boot LDO output pin 53 LDFB1 LDO feedback 1 pin 54 LDCTL1 LDO1 control input pin 55 LDPG1 LDO1 Power output pin 56 LDO1 LDO output 1 pin 57 58 59 60 GND RT LDFB2 LDO2 Ground pin Frequency setting pin LDO feedback 2 pin LDO output 2 pin 61 LDVCC2 Power supply input pin 62 CTL3 Control input 3 pin 63 SW3 Switching output 3 pin 64 BOOT3 Switch boot pin 3 pin Good Feedback input 2 pin 4/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Rating Unit Power Supply Voltage 1 VCC, VPVCC2, 3 15 V Power Supply Voltage 2 VLDVCC2 7 V Power Supply Voltage 3 VHVCC 20 V SW1 Pin Voltage VSW1 20 V Tjmax 150 °C Pd 5.20 (Note 1) W Operating Temperature Range Topr -40 to +105 °C Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Power Dissipation (Note 1) To use the IC at temperatures over Ta25°C, derate power rating by 41.6mW/°C. When mounted on a four-layer glass epoxy board measuring 70 mm x 70 mm x 1.6 mm (with reverse side of copper foil measuring 70mm x 70 mm). Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta-40°C to +105°C) Parameter Symbol Min Max Unit Power Supply Voltage 1 VCC, VPVCC2, 3 4.2 14 V Power Supply Voltage 2 VLDVCC2 - 5.5 V Power Supply Voltage 3 VHVCC 6 18 V SW1 Pin Voltage VSW1 - 18 V SW1 Pin Current ISW1 - 3 A SW2, 3 Pin Current ISW2,3 - 2 A Fault Detection Pull-up Voltage VFAULT - 5.5 V Power Good Pull-up Voltage VPG - 5.5 V Switching Frequency fSW 200 800 kHz www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV Electrical Characteristics (Unless otherwise noted, Ta25°C, VCC12V, VHVCC15V ) Limit Parameter Symbol Unit Min Typ Max Conditions [DC/DC Converter Controller Block] Step-up Feedback Voltage VFB1 1.230 1.250 1.270 V Step-down Feedback Voltage VFB2 1.225 1.250 1.275 V Sync Rectification Feedback Voltage VFB3 0.882 0.900 0.918 V Input Bias Current IFB -1.2 -0.1 +1.2 µA COMP Source Current ICSO 15 40 65 µA COMP Sink Current ICSI -65 -40 -15 µA MDT 85 92 99 % DTC at 0% Duty VDTCMIN - 0.1 - V VFB=0V DTC at Max Duty VDTCMAX - 0.9 - V VFB=0V DTC Bias Current IDTC -1.2 -0.1 +1.2 µA VDTC=0V DTC Sink Current IDTC 1 2 4 mA SW1 On Resistance RON1 - 0.2 - Ω SW1 Current Limit ISW1OCP 3 - - A SW2 High Level On Resistance RON2H - 0.2 - Ω ISW=1A SW2 Low Level On Resistance RON2L - 2 - Ω ISW=20mA SW3 High Level On Resistance RON3H - 0.2 - Ω ISW=1A SW3 Low Level On Resistance RON3L - 0.2 - Ω ISW=1A SW1, 2, 3 Leak Current ISWLEAK -5 0 +5 µA PGATE Sink Current IPGTSI 4 9 14 µA VPG=5V PGATE Source Current IPGTSO 4 8 15 mA VPG=5V PG On Resistance RONPG 0.5 1.0 1.5 kΩ PG Leak Current IPGLEAK -5 0 +5 µA PG1, 2, 3 On Voltage PGH - 90 - % PG1, 2, 3 Off Voltage PGL - 60 - % Feedback Voltage 1, 2 ,3 VLDFB123 1.231 1.250 1.269 V Input Bias Current ILDFB123 -1.2 -0.1 +1.2 µA LDO1 Output Voltage Range 1 VLDO1 0 - VPVCC2 V LDO1 Output Voltage Range 2 VLDO2 0 - VLDVCC2 V LDO1 Output Voltage Range 3 VLDO3 0 - VHVCC V I/O Voltage Difference 1 VDPLD1 0.3 0.75 1.6 V VLDFB1=0V, IO=500mA I/O Voltage Difference 2 VDPLD2 0.1 0.33 0.75 V VLDFB2=0V, IO=200mA I/O Voltage Difference 3 VDPLD3 0.14 0.3 0.65 V VLDFB3=0V, IO=20mA LDPG1 ON Voltage LDPG1H - 90 - % LDPG1 OFF Voltage LDPG1L - 60 - % SW1, 2, 3 Max Duty Ratio VFB=1.5V ISW=1A [LDO1, 2, 3 Block] www.rohm.com © 2016 ROHM Co., Ltd. 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TSZ22111・15・001 6/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV Electrical Characteristics – continued (Unless otherwise noted, Ta25°C, VCC12V, VHVCC15V ) Limit Parameter Symbol Unit Min Typ Max Conditions [Charge Pump Block] Positive/Negative Feedback Voltage VCPFB12 1.225 1.250 1.275 V Input Bias Current ICPFB12 -1.2 -0.1 +1.2 µA VCP I/O Voltage Difference VDPCP12 0.28 0.7 1.55 V C1, 2 High Level On Resistance RONCH - 3 - Ω C1, 2 Low Level On Resistance RONCL - 3 - Ω CPPG1 On Voltage CPPGH - 80 - % CPPG1 Off Voltage CPPGL - 60 - % Input Offset Voltage VOFF -15 0 +15 mV Input Bias Current IBAMP -1.2 0 +1.2 µA AMP Output Current Capability IAMP 30 50 200 mA VCOMP Output Current Capability ICOM 60 150 400 mA AMP Slew Rate SRAMP - 4 - V/ µs VCOM Slew Rate SRCOM - 4 - V/ µs Load Stability ΔVo -15 0 +15 mV Max Output Voltage VOH - V IO=-1mA, VIN=VHVCC-0.8V Min Output Voltage VOL - 0.1 0.16 V IO=1mA, VIN=0V Reference Output Voltage VVREF 2.44 2.50 2.66 V REG Output Voltage VREG 4.7 5.0 5.3 V Oscillating Frequency fSW 450 550 650 kHz UVLO Pin ON Voltage VUVLOON 0.88 1.00 1.12 V UVLO Pin OFF Voltage IO=100mA [Operation Amplifier Block] VHVCC-1.0 VHVCC-0.8 IO=+1mA to -1mA [Overall] RRT=51kΩ VUVLOOFF 0.93 1.05 1.17 V VCC Under-Voltage Lockout Protection ON/OFF Voltage HVCC Under-Voltage Lockout Protection ON/OFF Voltage VCCUV 3.5 - 4.2 V VHVUV 4.3 - 5.3 V CTL ON Voltage VCTLON 2 - - V CTL OFF Voltage VCTLOF - - 0.2 V CTL Bias Current ICTL -20 -12.5 -5 µA SCP Source Current ISCPSO 2 5 8 µA SCP Sink Current ISCPSI 2 5 10 mA SCP Threshold Voltage VSCP - 1.25 - V RONFLT 0.5 1 1.5 kΩ ICC - 5 11 mA No Switching IHICC - 2.8 6 mA No Switching Fault Detection ON Resistance Average Consumption Current 1 (VCC, PVCC2, 3) Average Consumption Current 2 (HVCC) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/26 VCTLX=0V TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV Description of Operation of Each Block and Procedure for Selecting Application Components VCC (1) Step-up DC/DC Converter Block CI1 M1 PGATE CTL1 CTL PGATE D1 Control PG1 SW1 Power good PWM Power Good VO CO1 DRV PGND1 － ERR DTC ＋ 1.25 FB1 R11 COMP1 DTC1 VREF (2.5V) R13 R15 R14 C11 C12 R12 C13 R16 Figure 5. Step-up DC/DC Converter Block This is a step-up DC/DC converter block that outputs a step-up voltage upon receipt of a signal from CTL1. When the high-level signal is input to CTL1, a current will be pulled up from PGATE to turn ON input switch M1. At the time of startup, since the switching duty is limited by the DTC1 pin voltage, a soft start is operated. When output reaches 90% of the set voltage, the Power Good signal will be output from PG1. (1.1) Selecting input switch M1 Input switch M1 will serve as a switch to block the path from VCC to output when a low-level control signal is input to CTL1. Select the input switch with careful attention paid to the following conditions. Recommended ICs: RSQ and RTQ Series ⊿IL Maximum inductor current: Power supply voltage: Power supply voltage: IINMAX + VCC VCC 2 < Rated current of FET < Rated voltage of FET < ON voltage of FET gate When the CTL1 control input is switched to the high level, a 9µA (Typ) sink current will be pulled from the PGATE pin to turn ON the input switch. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV (1.2) Selecting the output L constant The coil L to be used for output is determined by the rated current ILR and the maximum input current value IINMAX of the coil. Figure 6. Coil Current Waveform (Step-up DC/DC Converter) Make adjustments so that IINMAX + ΔIL / 2 will not reach the rated current ILR. At this time, ΔIL is obtained by the following equation. 1 V VCC 1 ΔI L VCC O [ A] L VO f Where: f = Switching frequency In addition, since the coil L value may have variations in the range of approximately ±30%, set this value with sufficient margin. If the coil current exceeds the rated current ILR, the internal IC element may be damaged. (1.3) Output capacitor setting For capacitor C to be used for output, set it to the permissible value of the ripple voltage VPP or that of the drop voltage at the time of a sudden load change, whichever is larger. The output ripple voltage is obtained by the following equation. 1 V ΔI L ΔVPP I LMAX RESR CC ( I LMAX ) fCO VO 2 Make this setting so that the voltage will fall within the permissible ripple voltage range. For the drop voltage VDR during a sudden load change, estimate the VDR with the following equation. ΔI VDR 10 sec [V ] CO Wherein, 10 μsec is the estimate of DC/DC response speed. Set CO so that these two values will fall within the limit values. Since the DC/DC converter causes a peak current to flow between input and output, capacitors must also be mounted on the input side. For this reason, it is recommended to use low-ESR capacitors above 10µF and below 100mΩ as the input capacitors. Using input capacitors outside of this range may superimpose excess ripple voltage upon the input voltage, causing the IC to malfunction. However, since the aforementioned conditions vary with load current, input voltage, output voltage, inductor value, and switching frequency, be sure to verify the margin using the actual product. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV (1.4) Output rectifier diode setting For the rectifier diodes to be used as the output stage of the DC/DC converter, it is recommended to use Schottky diodes. Select diodes with careful attention paid to the maximum inductance current, maximum output voltage, and power supply voltage. Maximum inductance current: Maximum output voltage: IINMAX ＋ ΔIL 2 VOMAX < Rated current of diode < Rated voltage of diode In addition, since each parameter has variations in current and voltage of 30% to 40%, design systems with sufficient margin. (1.5) Output voltage setting Set output voltage using the following equation with feedback resistance composed of R11 and R12. VO R11 R12 1.25 [V ] R12 Set the maximum output voltage to not more than 18V so that it will not exceed the rating of the SW1 pin. It is recommended to apply a setting range of 10kΩ to 330kΩ. Setting the feedback resistance to not more than 10kΩ will result in degraded voltage efficiency, while setting it to not less than 330kΩ will result in higher offset voltage due to an input bias current of 0.1µA (Typ) of the internal error amplifier. (1.6) Phase compensation setting Phase setting procedure: The following conditions are required to ensure the stability of the negative feedback system. ・When the gain is set to “1” (0 dB), the phase lag should not be more than 150° (i.e., phase margin should not be less than 30°). In addition, since DC/DC converter applications are sampled according to the switching frequency, the overall system GBW should be set to not more than 1/10 of the switching frequency. The targeted characteristics of the applications can be summarized as follows. ・When the gain is set to “1” (0 dB), the phase lag should not be more than 150° (i.e., phase margin should not be less than 30°). ・The GBW at that time (i.e., frequency when the gain is set to “0 dB”) should not be more than 1/10 of the switching frequency. The responsiveness is determined by the GBW limitation. Consequently, to raise the responsiveness, higher switching frequencies are required. To ensure the stability through the phase compensation, it is necessary to cancel the secondary phase delay (-180°) caused by LC resonance with the secondary phase lead (in other words, by adding two phase leads). The GBW (i.e., frequency when the gain is set to “0 dB”) is determined by phase compensation capacitance connected to the error amplifier. If GBW needs to be reduced, increase the capacitance of the capacitor. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV ( i ) Ordinary integrator (Low-pass filter) ( ii ) Open loop characteristics of integrator (a) A ＋ Feedback -20dB/decade Gain 【dB】 COMP GBW(b) A R 0 － F FB 0 C －90° Phase －90 【°】 Phase margin －180° －180 F Figure 7 Po i n at )( fa Figure 8 1 [ Hz] 2RCA Po i n bt) ( fb GBW 1 2RC [ Hz] Since the phase compensation like that shown in (a) and (b) applies to the error amplifier, it will act as a low-pass filter. For DC/DC converter applications, R represents feedback resistors connected in parallel. According to the LC resonance of the output, two phase leads should be added. Vo LC resonant frequency R4 R1 C1 － ＋ COMP Phase lead R3 Phase lead A R2 C2 fp 1 2 LC [ Hz] 1 [ Hz] 2C1R1 1 fz 2 [ Hz] 2C 2 R3 fz1 Figure 9 Set the lead frequency of one of the phases close to the LC resonant frequency for the purpose of canceling the LC resonance. Note: If high-frequency noise occurs in output, it will pass through capacitor C1 and affect the feedback. To avoid this problem, add resistor R4 of approximately 1kΩ in series with capacitor C1. (1.7) Duty cycle limit setting Applying a voltage to the DTC pin makes it possible to fix the maximum duty cycle. Furthermore, since the upper limit value of the maximum duty cycle is fixed within the IC, it will not increase beyond the upper limit value. Figure 10 shows the relationship between the DTC voltage and the maximum duty cycle. Refer to this figure to make the DTC voltage setting. Subsequently, set R15 and R16 so that the DTC voltage will reach the level shown in the figure. 100 Duty[%] 80 60 40 20 0 0 0.2 0.4 0.6 0.8 1 DTC [V] Figure 10. Characteristics of DTC Voltage vs Duty Cycle Set the maximum duty cycle with sufficient margin so that it will not reach the maximum duty cycle for normal use. For step-up converters, the range normally used is as follows. VOMAX - VCCMIN Max On duty cycle = www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VOMAX < Max set duty cycle 11/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV (1.8) Soft-start time setting Adding capacitor C13 to DTC resistive dividers R15 and R16 makes it possible to use the soft-start function. The soft-start function is needed to prevent an excessive increase in coil current and output voltage overshoot at startup. The capacitance and soft-start time are obtained by the following equation. R15 R16 tss C13 ln (1 R15 R16 VO VCC 0.62 0.28 VO ) [sec] R16 2.5 R15 R16 (1.9) Control and Power Good functions When the control pin (CTL) is set to low-level input, the relevant block will stop operation. The control pin voltage is internally pulled up to the reference voltage VREF, whereby operating the relevant block in the open state. The Power Good terminal (PG) is designed in an open-drain pattern to use as the control pin of a different block or an external power-good signal. The PG pin outputs a low-level signal while in the rising mode and, when the output voltage reaches 90% of the set voltage, will enter a high impedance state. At this time, the CTL pin at the destination will be switched to high-level input by the use of a pull-up resistor. In contrast, when the output voltage falls below 60% of the set voltage, the CTL pin will switch to low-level output. To use the PG pin output as an external signal, connect a pull-up resistor. A pull-up resistance ranging from 51kΩ to 200kΩ is recommended. Typical application: Step-up DC/DC Connect LDO3 PG1 LDCTL3 90% Step-up output PG1 (LDCTL3) LOW Switched to HIGH by pull-up resistor LDO3 Output Figure 11. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Typical Application of Control / Power Good Functions 12/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV VCC (2) Step-down DC/DC Converter Block and Sync Rectification Step-down DC/DC Converter Block CI2 PVCC2,3 CTL2,3 BOOT2,3 CTL CTL 5V Control C24 PG2,3 L2 Power good PWM Power Good SW2,3 ERR － VO DRV D2 CO2 DTC ＋ 1.25/0.9V FB2,3 VO COMP2,3 DTC2,3 R23 R21 R25 C21 R24 C22 R22 Figure 12. PGND1,3 VREF (2.5V) C23 R26 Step-down DC/DC Converter Block and Sync Rectification Step-down DC/DC Converter Block The step-down DC/DC converter block and the sync rectification step-down DC/DC converter block differ in the feedback voltage and SW low-level On resistance, but have about the same configuration. While the control signal remains at low level, the low-level SW turns ON to output a low voltage. When the control signal is switched to a high level, output voltage will start rising with the soft start function in operation. When the output voltage reaches 90% of the set voltage, the Power Good signal will be output. (2.1) Selecting the output L constant The inductance L to be used for output is determined by the rated current ILR and the maximum output current value IOMAX of the inductor. IOMAX+ΔIL should not IL 2 reach the rated value level. ILR IOMAX mean current t Figure 13. Coil Current Waveform (Step-down DC/DC Converter) Make adjustments so that IOMAX + ΔIL / 2 will not reach the rated current ILR. At this time, ΔIL is obtained by the following equation. 1 V 1 (VCC VO ) O [ A] L VCC f In addition, since the inductance L value may have variations in the range of approximately ±30%, set this value with sufficient margin. If the coil current exceeds the rated current ILR, the internal IC element may be damaged. ΔI L www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV (2.2) Selecting I/O capacitors To select I/O capacitors, refer to information in Section (1.3). However, the output ripple voltage of the step-down DC/DC converter is obtained by the following equation. ΔVPP ΔI L RESR ΔI L VO 1 2CO VCC f [V ] (2.3) Output rectifier diode setting For the rectifier diodes to be used as the output stage of the DC/DC converter, it is recommended to use Schottky diodes. Select diodes with careful attention paid to the maximum inductance current, maximum output voltage, and power supply voltage. Maximum inductance current: IOMAX + Power supply voltage: VCC ΔIL 2 < Rated current of diode < Rated voltage of diode In addition, since each parameter has variations in current and voltage of 30% to 40%, design systems with sufficient margin. (2.4) Output voltage setting Set output voltage using the following equation with feedback resistance composed of R21 and R22. VO R21 R22 VFB [V ] R22 Where: VFB: Set to 1.25 for the step-down DC/DC converter (FB2) and 0.9 for the sync rectification step-down DC/DC converter (FB3). It is recommended to apply a setting range of 10kΩ to 330kΩ. Setting the feedback resistance to not more than 10kΩ will result in degraded voltage efficiency, while setting it to not less than 330kΩ will result in higher offset voltage due to an input bias current of 0.1µA (Typ) of the internal error amplifier. (2.5) Phase compensation setting For details of phase compensation setting, refer to information in Section (1.6). (2.6) Duty cycle limit setting For details of duty cycle limit setting, refer to information in Section (1.7). For step-down converters, however, the range normally used comes to the following: VOMAX Max On duty cycle = VCCMIN www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 < Max set duty cycle 14/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV (2.7) Soft start time setting Adding the capacitor C23 to the DTC resistive dividers R25 and R26 makes it possible to use the soft start function. The soft start function is needed to prevent an excessive increase in coil current at startup and output voltage overshoot at startup. The capacitance and soft start time are obtained by the following equation: VO 0.62 0.28 R 25 R 26 VCC tss C 23 ln (1 ) [sec] R 26 R 25 R 26 2.5 R 25 R 26 (2.8) Control and Power Good functions For details of the control and Power Good functions, refer to information in Section (1.9). (3) LDO1 to LDO3 blocks VCC LDCTL1 VDD CI2 CI4 CTL Control PVCC2 LDPG1 Power Good LDVCC2 Power good VO LDO1 ERR ERR Co4 ＋ VO LDO2 Co5 ＋ R41 － R51 － 1.25V 1.25V R42 LDFB1 R52 LDFB2 Figure 14. LDO1 Block Figure 15. LDO2 Block HVCC CI5 LDCTL3 HVCC CTL Control VO LDO3 ERR ＋ Co6 R61 － 1.25V R62 LDFB1 Figure 16. LDO3 Block (3.1) Selecting I/O capacitors The LDO1 to LDO3 blocks are ceramic capacitor compatible. Capacitance in the range of 1µF to 100µF is recommended. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV (3.2) Output voltage setting Set output voltage using the following equation with feedback resistance composed of R1 and R2. VO R 1 R 2 1.25 [V ] R2 :4 to 6 It is recommended to apply a setting range of 10kΩ to 330kΩ. Setting the feedback resistance to not more than 10kΩ will result in degraded voltage efficiency, while setting it to not less than 330kΩ will result in higher offset voltage due to an input bias current of 0.1µA (Typ) of the internal error amplifier. The following table shows the output voltage setting ranges and current capabilities. Minimum setting LDO1 1.5V LDO2 1.5V LDO3 1.5V Maximum setting (with maximum output current) VCC (Max 14V) -1.6V LDVCC2 (Max 5.5V) -0.75V Output current capability Up to 500mA Up to 200mA HVCC (Max 18V) -0.65V Up to 20mA (3.3) Control and Power Good functions For details of the control and Power Good functions, refer to information in Section (1.9). For the LDO3 block, however, set output voltage so that the signal will be input into the control pin after HVCC, which serves as a power source, starts up. (4) Charge Pump Block CPFB1 CIN7 HVCC C71 C72 CPCTL CTL VCP1 Control 1.25V CPPG D71 D72 D73 C74 C73 Power Good D74 VoH C75 R71 C1 Power Good R72 C81 HVCC VREF VCP2 C82 1.25V C2 D81 D82 R81 R82 VoL C83 CPFB2 HGND Figure 17. Charge Pump Block www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV When the charge pimp block receives the control input signal, the negative-side charge pump will start operation. The startup sequences are internally fixed. Consequently, when the negative-side charge pump reaches 80% of the set voltage, the positive-side charge pump will start operation. When both negative- and positive-side charge pumps reach 80% of the set voltage, the power-good signal will be output from the CPPG pin. (4.1) Selecting output diodes For diodes D71 to D74, and D81 and D82, select Schottky diodes having a current capability three times (positive side) or two times (negative side) as high as the maximum output current and a withstand voltage higher than the output voltage. Due to the aforementioned requirements, it is recommended to use the RB550EA dual Schottky barrier diode. (4.2) Selecting output capacitors Capacitors C73 and C81 serve as output capacitors for the charge pump regulators; a capacitance in the range of 1μF to 10μF is recommended. Capacitors C71, C72, and C82 serve as flying capacitors; a capacitance in the range of 0.1μF to 1μF is recommended. Capacitors C74, C75, and C83 serve as charge pump output capacitors; a capacitance in the range of 0.1μF to 10μF is recommended. (4.3) Output voltage setting Set output voltage using the following equation with feedback resistance. VO H R71 R72 1.25 [V ] R72 VO L VREF 2.5 R81 R82 R81 VREF 1.25 R81 R82 1.25 [V ] R81 It is recommended to apply a setting range of 10kΩ to 330kΩ. Setting the feedback resistance to not more than 10kΩ will result in degraded voltage efficiency, while setting it to not less than 330kΩ will result in higher offset voltage due to an input bias current of 0.1µA (Typ) of the internal error amplifier. (4.4) Control and Power Good functions Make the sequence setting by inputting the power-good signal output from a different block. However, make this setting so that the signal will be input into the CPCTL control pin after HVCC, which serves as a power source, starts up. For example, to generate HVCC in the step-up DC/DC converter block, do not set the sequence so that the same Power Good pin is connected to CTL1 and CPCTL. Since the sequences of the negative- and positive-side charge pumps are internally fixed, the sequence of the negative-side pump starts up first and is followed by that of the positive-side pump. When both negative- and positive-side charge pumps reach 80% of the set voltage, the power-good signal will be output from the CPPG pin. The power-good signal output pattern is the same as that of different blocks. For details, refer to information in Section (1.9). www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV (5) Common Amplifier + 4ch Buffer Amplifier The AMP and VCOM amplifiers operate in the range of 0.1V to HVCC0.8V (Typ). Normally, use the VCOM amplifier as a buffer type amplifier as shown in (a). Use the output voltage of the LDO3 block for power supply on the reference side. To increase the current drive capability, use the PNP and NPN transistors as shown in (b). When the VCOM amplifier is not used, set the block to the buffer type as shown in (a) and ground the V+ pin. In this case, it is recommended to set the R3 and R4 resistors in the range of 10kΩ to 100kΩ. Setting them to not more than 10kΩ may increase current consumption, thus resulting in degraded power efficiency. Setting them to not less than 100kΩ may result in higher offset voltage due to the input bias current of 0.1µA (Typ). LDO3 (a) (b) LDO3 RCOM1 V+ + IN+ + VCOM VCOM - IN- - V- 30kΩ RCOM1 30kΩ RCOM2 - RCOM2 VCOM 1000pF Vo1 VCOM RCOM3 1kΩ Figure 18 VCOM Block VCOM RCOM 2 LDO3 [V ] RCOM 1 RCOM 2 Resistance of approximately 1kΩ is recommended for RCOM3. (6) Common Block (6.1) UVLO function VCC RU1 UVLO RU2 1.0V Figure 19. UVLO Block Set the UVLO voltage with RU1 and RU2. The UVLO protection function will be implemented when the UVLO pin voltage falls below 1.0V (Typ) and canceled when it exceeds 1.05V (Typ). The VCC voltage at which the UVLO function is activated is expressed by the following equation. VUVLO RU 1 RU 2 [V ] RU 2 It is recommended to set resistance in the range of 10kΩ to 200kΩ. In addition, the VCC pin incorporates a fixed UVLO function. Consequently, when the UVLO pin voltage falls below 3.8V (Typ), the UVLO protection function will be operated even if the external UVLO voltage is set below 3.8V (Typ). (6.2) SCP function 5µA SCP Latch CSCP 1.25V Figure 20. SCP Block www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV The SCP function protects against short-circuits in the outputs of the step-up DC/DC converter, step-down DC/DC converter, sync rectification step-down DC/DC converter, LDO1, and charge pump blocks. When any one of these outputs falls below 60% of the set voltage, it will be regarded as a short-circuit in output, thus activating the short-circuit protection function. If a short-circuit is detected, source current of 5µA (Typ) will be output from the SCP pin. Then, delay time will be set with external capacitance. When the SCP pin voltage exceeds 1.25V (Typ), the state will be latched to shut down all outputs. Once the state has been latched, it will not be canceled unless VCC restarts. The delay time setting is obtained by using the following equation. TL [s] (CSCP 1.25) /(5 106 ) Even if none of the output startup sequences is complete at startup of the IC, short-circuits will be detected and the SCP function activated. For this reason, set the delay time substantially longer than the startup time. (6.3) Fault detection function This IC has the built-in fault detection function that alerts the operating status of protection circuits. If any of the protection circuits turns ON, the FAULT pin will be pulled up to output low voltage. In stable operating status, the pin outputs high voltage. In this case, resistance ranging from 10kΩ to 220kΩ is recommended. Setting resistance to not more than 10kΩ may generate offset voltage due to the internal On resistance, thus disabling proper output of low voltage. In contrast, setting it to not less than 220kΩ may not output proper high-level voltage due to leak current. The FAULT pin is switched to low voltage output under any of the following conditions. ・ When the UVLO (under-voltage protection) function is activated; ・ When the TSD (thermal shutdown circuit) function is activated; ・ When the OCP (overcurrent protection circuit) function is activated, or; ・ When the SCP (short-circuit protection) function is activated. (6.4) Variable oscillator Changing the timing resistance RT enables switching frequency adjustment. Set resistance referring to Figure 21. Set frequency in the range of 200kHz to 800kHz. Frequency [khZ] Frequency [khZ] 1000 100 10 100 1000 RT [kΩ] Figure 21. RT vs Switching Frequency www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV I/O Equivalent Circuits 2.PG3 3.DTC3 VPVCC3 5.FB3 22.CPFB2 44.FB2 53.LDFB1 VVREF 8.LDCTL3 23.CPCTL VHVCC 10.IN1 13.IN4 VHVCC 27.VCP1 VHVCC 11.IN2 12.IN3 14.IN+ 15.IN- 51.PG2 55.LDPG1 VHVCC 30.CPFB1 VHVCC VHVCC 33.SW1 34.PGATE VCC www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VVREF 16.VCOM 17.OUT4 18.OUT3 19.OUT2 20.OUT1 24.C2 28.C1 VHVCC 29.CPPG VHVCC 32.PG1 7.LDFB3 59.LDFB2 9.LDO3 25.VCP2 36.COMP1 45.COMP2 VPVCC3 4.COMP3 40.SCP VVREF VCC 20/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV I/O Equivalent Circuits - Continued 35.DTC1 46.DTC2 37.FB1 VCC VVREF 39.FAULT 41.UVLO 64.BOOT3 50.CTL2 54.LDCTL1 VVREF 43.VREF VCC 48.BOOT2 38.CTL1 62.CTL3 VCC VVREF 49.SW2 63.SW3 VCC 52.REG VPVCC2 VREG 56.LDO1 58.RT VPVCC2 VPVCC2 60.LDO2 VCC 61.LDVCC2 VCC www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 22. Example of monolithic IC structure 13. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 14. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 15. Discontinuous mode The step-up and step-down DC/DC converters used in this IC have been designed on the assumption that the converters are used in continuous mode. Using the IC constantly while in discontinuous mode may result in malfunctions. To avoid this problem, make coil adjustments or insert a resistor between output and GND to prevent the IC from entering discontinuous mode while in use. 16. PCB layout for open-drain pin (SW1) of step-up DC/DC converter Connect the open-drain pin of the FET built in the step-up DC/DC converter to the coil / diode with as thick and short of a line as possible. Particularly, making the line distance between the open-drain pin and the external diode longer or routing it with the use of a through-hole may form parasitic impedance due to patterns and cause the open-drain pin to generate a high surge voltage, thus leading to IC destruction. For this reason, ensure that the open-drain pin voltage (direct mounting to IC pin) will never exceed the absolute maximum ratings in practical applications of this IC. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV Ordering Information B D 8 1 6 2 Part number A E K V Package EKV：HTQFP64V Packaging and forming specification None: Tray Marking Diagram HTQFP64V (TOP VIEW) Part Number Marking BD8162EKV A LOT Number 1PIN MARK www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HTQFP64V 25/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 BD8162AEKV Revision History Date Revision 15.Feb.2016 001 Changes New Release www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/26 TSZ02201-0323AAF00690-1-2 15.Feb.2016 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD8162AEKV - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD8162AEKV HTQFP64V 1000 1000 Tray inquiry Yes