TI CD74HC42E High speed cmos logic bcd to decimal decoder 1 of 10 Datasheet

[ /Title
(CD74H
C42,
CD74H
CT42)
/Subject
(High
Speed
CMOS
Logic
BCD To
Deci-
CD74HC42,
CD74HCT42
Data sheet acquired from Harris Semiconductor
SCHS133
High Speed CMOS Logic
BCD To Decimal Decoder (1 of 10)
August 1997
Features
Description
• Buffered Inputs and Outputs
The Harris CD74HC42, CH74HCT42 BCD-to-Decimal
Decoders utilize silicon-gate CMOS technology to achieve
operating speeds similar to LSTTL decoders with the low
power consumption of standard CMOS integrated circuits.
These devices have the capability of driving 10 LSTLL loads
and are compatible with the standard 74LS logic family. One
of ten outputs (low on select) is selected in accordance with
the BCD input. Non-valid BCD inputs result in none of the
outputs being selected (all outputs are high).
• Typical Propagation Delay: 12ns at VCC = 5V,
CL = 15pF, TA = 25oC
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55oC to 125oC
• Balanced Propagation Delay and Transition Times
Ordering Information
• Significant Power Reduction Compared to LSTTL
Logic ICs
PART NUMBER
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
TEMP. RANGE (oC)
PKG.
NO.
PACKAGE
CD74HC42E
-55 to 125
16 Ld PDIP
E16.3
CD74HCT42E
-55 to 125
16 Ld PDIP
E16.3
CD74HC42M
-55 to 125
16 Ld SOIC
M16.15
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Die for this part number is available which meets all electrical
specifications. Please contact your local sales office or Harris
customer service for ordering information.
Pinout
CD74HC42, CD74HCT42
(PDIP, SOIC)
TOP VIEW
Y0 1
16 VCC
Y1 2
15 A0
Y2 3
14 A1
Y3 4
13 A2
Y4 5
12 A3
Y5 6
11 Y9
Y6 7
10 Y8
GND 8
9 Y7
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© Harris Corporation 1997
1
File Number
1689.1
CD74HC42, CD74HCT42
Functional Diagram
1
A0
A1
A2
A3
15
2
14
3
13
4
12
5
6
7
9
10
11
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
TRUTH TABLE
INPUTS
OUTPUTS
A3
A2
A1
A0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
L
L
L
L
L
H
H
H
H
H
H
H
H
H
L
L
L
H
H
L
H
H
H
H
H
H
H
H
L
L
H
L
H
H
L
H
H
H
H
H
H
H
L
L
H
H
H
H
H
L
H
H
H
H
H
H
L
H
L
L
H
H
H
H
L
H
H
H
H
H
L
H
L
H
H
H
H
H
H
L
H
H
H
H
L
H
H
L
H
H
H
H
H
H
L
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
L
L
L
H
H
H
H
H
H
H
H
L
H
H
L
L
H
H
H
H
H
H
H
H
H
H
L
H
L
H
L
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
NOTE: H = High Voltage Level, L = Low Voltage Level
2
CD74HC42, CD74HCT42
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical, Note 3)
θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
190
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
VIH
-
-
2
1.5
-
-
1.5
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
-
1.5
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
3
CD74HC42, CD74HCT42
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
IO (mA)
High Level Input
Voltage
VIH
-
-
Low Level Input
Voltage
VIL
-
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
PARAMETER
25oC
VCC
(V)
-40oC TO 85oC -55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
4.5 to
5.5
2
-
-
2
-
2
-
V
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
II
VCC and
GND
0
5.5
-
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTE: For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
All
1
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.
360µA max at 25oC.
Switching Specifications Input tr, tf = 6ns
PARAMETER
-40oC TO
85oC
25oC
-55oC TO
125oC
SYMBOL
TEST
CONDITIONS
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tPLH, tPHL
CL = 50pF
2
-
-
150
-
190
-
225
ns
4.5
-
-
30
-
38
-
45
ns
6
-
-
26
-
33
-
38
ns
HC TYPES
Propagation Delay,
Input to Y (Figure 1)
Any Input to Y
tPLH, tPHL
CL = 15pF
5
-
12
-
-
-
-
-
ns
Output Transition Time
(Figure 1)
tTLH, tTHL
CL = 50pF
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
-
-
-
10
-
10
-
10
pF
Input Capacitance
CIN
-
4
CD74HC42, CD74HCT42
Switching Specifications Input tr, tf = 6ns
(Continued)
-40oC TO
85oC
25oC
-55oC TO
125oC
PARAMETER
SYMBOL
TEST
CONDITIONS
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
Power Dissipation Capacitance
(Notes 4, 5)
CPD
-
5
-
65
-
-
-
-
-
pF
Propagation Delay,
Input to Y (Figure 2)
tPLH, tPHL
CL = 50pF
4.5
-
-
35
-
44
-
53
ns
Any Input to Y
tPLH, tPHL
CL = 15pF
5
-
14
-
-
-
-
-
ns
Output Transition Time
(Figure 2)
tTLH, tTHL
CL = 50pF
4.5
-
-
15
-
19
-
22
ns
Input Capacitance
CIN
-
-
-
-
10
-
10
-
10
pF
Power Dissipation Capacitance
(Notes 4, 5)
CPD
-
5
-
70
-
-
-
-
-
pF
HCT TYPES
NOTES:
4. CPD is used to determine the dynamic power consumption, per package.
5. PD = VCC2 fi (CPD + CL) where: fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
Test Circuits and Waveforms
tr = 6ns
tf = 6ns
90%
50%
10%
INPUT
GND
tTLH
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
tPHL
tf = 6ns
tr = 6ns
VCC
tTLH
90%
1.3V
10%
INVERTING
OUTPUT
tPLH
tPHL
FIGURE 4. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 5. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
5
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  1998, Texas Instruments Incorporated
Similar pages