Rohm BU2098F Serial in/parallel out driver Datasheet

Datasheet
Serial-in / Parallel-out Driver Series
2-input I2C-bus
Serial in/Parallel out Drivers
BU2098F
Key Specifications
Description
BU2098F is an open drain output driver.It incorporates a
built-in shift register and a latch circuit to control a
maximum of 8 outputs by a 2-line interface, linked to a
microcontroller.
An open drain output provides maximum 25mA current.
 Power supply voltage range:
 Output voltage:
 Operating temperature range:
Package
Features




W(Typ) x D(Typ) x H(Max)
10.00mm x 6.20mm x 1.71mm
SOP16
LED can be driven directly
8 Bit parallel output
This product can be operated on low voltage
2
Compatible with I C-bus
2
*I C-bus is a trademark of NXP Semiconductors.
2.7V to 5.5V
0V to 15V
-40℃ to +85℃
Applications
 Drive of LED
 Drive of Solenoid
 Drive of Relay
Pin Configurations
(Top View)
Block Diagrams
Power-On
Reset
A0 1
16 VDD
A1 2
15 SDA
A2 3
14 SCL
SDA
Q0 4
13 N.C.
SCL
Q1 5
12 Q7
Q2 6
11 Q6
Q3 7
10 Q5
VSS 8
9 Q4
2
A0
A1
I C-bus
Shift
Controller
Register
A2
8bit
Latch
Write Buffer
Q0～Q7
○Product structure：Silicon monolithic integrated circuit
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Pin Descriptions
Pin No.
Pin Name
I/O
1
A0
I
2
A1
I
3
A2
I
4
Q0
5
Q1
6
Q2
7
Q3
8
VSS
9
Q4
10
Q5
11
Q6
12
Q7
13
Function
Address input (internally pull-up)
O
Open drain output
-
Ground
O
Open drain output
N.C.
-
Non connected
14
SCL
I
Serial clock input
15
SDA
I/O
16
VDD
-
Serial data input/output
Power supply
Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
Power Supply Voltage
VDD
-0.5 to +7.0
V
Input Voltage
VIN
-0.5 to VDD+0.5
V
Output Voltage
VO
VSS to +18.0
V
Operating Temperature
Topr
-40 to +85
°C
Storage Temperature
Tstg
-55 to +125
°C
Power Dissipation
PD
(Note 1)
W
0.30
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 3.0mW per 1°C above 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions (TA=25℃, VSS=0V)
Parameter
Symbol
Limits
Unit
Power Supply Voltage
VDD
+2.7 to +5.5
V
Output Voltage
VO
0 to +15
V
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Electrical Characteristics
(unless otherwise noted, VDD=5V, VSS=0V, TA =25℃)
Parameter
Limits
Symbol
Min
Typ
Max
Unit
Condition
Input High-level voltage
VIH
0.7VDD
-
-
V
Input Low-level voltage
VIL
-
-
0.3VDD
V
Output Low-level voltage
VOL
-
-
0.4
V
IOUT=10mA
Input Low-level current
IIL
-
-
2.0
μA
VIN=0
Input High-level current
IIH
-
-
-2.0
μA
VIN=VDD
Output leakage current
IOZ
-
-
±5.0
μA
Output=High impedance
VOUT=VDD
Static dissipation current
IDD
-
-
2.0
μA
Timing Characteristics
(Unless otherwise noted, VDD=5V, VSS=0V, TA =25℃)
2
Parameter
Fast mode I C-bus
Symbol
2
Standard mode I C-bus
Min
Max
Min
Max
Unit
SCL clock frequency
fSCL
0
400
0
100
kHz
Bus free time between start-stop condition
tBUS
1.3
-
4.7
-
μs
tHD:STA
0.6
-
4.0
-
μs
Low period of the SCL clock
tLOW
1.3
-
4.7
-
μs
High period of the SCL clock
tHIGH
0.6
-
4.0
-
μs
Set up time Re-start condition
tSU:STA
0.6
-
4.7
-
μs
Data hold time
tHD:DAT
0
-
0
-
μs
Data set up time
tSU:DAT
100
-
250
-
ns
Rise time of SDA and SCL
tR
20+0.1×Cb
300
-
1000
ns
Fall time of SDA and SCL
tF
20+0.1×Cb
300
-
300
ns
Set up time stop condition
tSU:STO
0.6
-
4.0
-
μs
Cb
-
400
-
400
pF
Hold time start condition
Capacitive load for SDA line and SCL line
Waveform of Timing Characteristics
90%
SDA
10%
tBUS
tSU:STA
tHD:STA
tR
tHD:STA
tSU:STO
tF
tLOW
90%
SCL
10%
P
S
S:Start Condition
P:Stop Condition
tHIGH
tHD:DAT
tSU:DAT
S
P
Figure 1. Timing chart (SDA, SCL)
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Test Circuits
VDD
+15V
RL =10kΩ
RL RL RL RL
PatternGenerator
RL RL RL RL
VSS
VIH
VIL
VSS
Figure 2. Test Circuit of Input H/LVoltage
VDD
8
SW
VSS
1
IOUT
VOL
PatternGenerator
VSS
VSS
Figure 3. Test Circuit of Output L Voltage
VDD
IIH IIL
+
A
VIN
VSS
Figure 4. Test Circuit of Input H/LCurrent
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Test Circuit - continued
VDD
VDD
+
IDD A
+
IOZ A
8
SW
1
VSS
PatternGenerator
Figure 5. Test Circuit of Output Leak Current / Static Dissipation Current
VDD
+15V
RL =10kΩ
RL RL RL RL
PatternGenerator
RL RL RL RL
VSS
VDD
VSS
Figure 6. Test Circuit of Timing Characteristics
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Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at T A=25°C(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θ JA (°C/W).The temperature of IC inside the package can be estimated by
this thermal resistance. Figure 11 shows the model of thermal resistance of the package. Thermal resistance θJA, ambient
temperature TA, maximum junction temperature TJmax, and power dissipation PD can be calculated by the equation below:
θJA = (TJmax - TA) / PD
(°C/W)
Derating curve in Figure 12 indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at
certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition.
0.7
θJA =( TJmax - TA)/ PD
(°C/W)
Power Dissipation [W]
0.6
周囲温度
Ta [℃] TA (℃)
Ambient
temperature
0.5
0.4
BU2098F
0.3
0.2
0.1
85℃
0
Chip surface temperature TJ(℃)
チップ 表面温度 Tj [℃]
Power dissipation PD (W)
消費電力 P [W]
50
75
100
125
150
175
Ambient Temperature Ta [°C]
Figure 7. Thermal resistance
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Figure 8. Derating Curve
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Function
1. Serial Interfacce
1.1 Start condition
The start condition is a “HIGH” to “LOW” transition of the SDA line while SCL is “HIGH”.
1.2 Stop condition
The stop condition is a “LOW” to “HIGH” transition of the SDA line while SCL is “HIGH”.
SDA
SCL
S
P
Start
condition
Stop
condition
Figure 9. Start / Stop condition
1.3 Acknowledge
The master (µp) puts a resistive “HIGH” level on the SDA line during the acknowledge clock pulse. The peripheral
(audio processor) that acknowledge has to pull-down (“LOW”) the SDA line during the acknowledge clock pulse, so that
the SDA line is stable “LOW” during this clock pulse.
The slave which has been addressed has to generate an acknowledgement after the reception of each byte, otherwise
the SDA line remains at the “HIGH” level during the ninth clock pulse time. In this case the master transmitter can
generate the STOP information in order to abort the transfer.
clock for acknowledge
SCL
(from master)
8
1
9
SDA
(from master)
not confirm
SDA
(from slave)
S
confirm
ACK signal
Figure 10. Acknowledge
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Function – continued
1.4 Write DATA
Send the stave address from master following the start condition (S). This address consists of 7 bits. The left 1 bit (the
foot bit) is fixed “0”. The stop condition (P) is needed to finish the data transferred. But the re-send starting condition
(Sr) enables to transfer the data without STOP (P).
S
slave address
R/W
ACK
DATA
ACK
P
ACK
Sr
“0” (Write)
S
slave address
R/W
ACK
DATA
slave address
R/W
“0” (Write)
ACK
DATA
ACK
P
“0” (Write)
Figure 11. DATA transmit
1.5 Data format
The format is following.
S
A6
A5
A4
A3
A2
A1
A0
R/W ACK
D7
D6
SLAVE ADDRESS
D5
D4
D3
D2
D1
D0
ACK
P
WRITE DATA
Figure 12. Data format
A0 to A2
A3 to A6
R/W
Slave address
Write Data
A6
0
0
0
0
0
0
0
0
D0 to D7
A5
1
1
1
1
1
1
1
1
Table 2. for (A2, A1, A0) to SLAVE ADDRESS
A4
A3
A2
A1
1
1
0
0
1
1
0
0
1
1
0
1
1
1
0
1
1
1
1
0
1
1
1
0
1
1
1
1
1
1
1
1
Fixed for BU2098F
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Table 1. for WRITE format
Each bit can be defined by the input levels of pins A0 to A3.
These 4 bits are fixed.
“0”
Write “1” to D0 makes Q0 pin High-impedance. And write “0” makes
Q0 pin LOW. D[1:7] and Q[1:7] are same as D0 and Q0.
A0
0
1
0
1
0
1
0
1
Slave address
38H
39H
3AH
3BH
3CH
3DH
3EH
3FH
Defined by external pin A0～A2
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BU2098F
Function – continued
2. Function of Power Supply is turning ON
2.1 Reset Condition
After power on reset, open drain outputs of Q0 to Q7 pins are ON condition.
Then, the outputs becomes Low voltage when pull-up resistor is connected .
2.2 Rising Time of Power Supply
VDD must rise within 10ms. (tSTART)
If the rise time would exceed 10ms, it is afraid not to reset .
90%
10%
t START≤10ms
Figure 13. Rising time of power supply
Timing Chart
Slave address
Device code
SCL
1
2
3
External terminal
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
Start condition
Stop condition
SDA
VDD
A6
A5
A4
A3
A2
A1
A0 RW
ACK
D7 D6
D5
D4
D3
D2
D1
D0
ACK
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Diagram shows a status where a pull-up resistor is connected to open drain output.
Figure 14. Timing chart
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I/O Equivalence Circuits
A0 to A2
VDD
Q0 to Q7
VDD
VDD
Q0 to Q7
A0 to A2
VSS
VSS
VSS
VSS
SDA
SCL
VDD
VDD
SCL
SDA
VSS
VSS
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VSS
VSS
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the PD rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes - continued
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
Ordering Information
B
U
2
0
9
Part Number
8
F
-
Package
F: SOP16
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
SOP16(TOP VIEW)
BU2098F
LOT Number
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
SOP16
(Max 10.35 (include.BURR))
(UNIT : mm)
PKG : SOP16
Drawing No. : EX114-5001
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Revision History
Date
Revision
11.Oct.2013
001
New Release
002
Page.9 Function：2.1 Reset Condition
（Open drain outputs after reset：Hi-z Condition→ON Condition）
Page.9 Timing Chart：Open drain outputs after VDD is ON
（Outputs condition：All High → All Low）
01.Sep.2015
Changes
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BU2098F - Web Page
Buy
Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BU2098F
SOP16
2500
2500
Taping
inquiry
Yes