ams AS7263-BLGT 6 near-ir channels: 610nm, 680nm, 730nm, 760nm, 810nm and 860nm, each with 20nm fwhm Datasheet

AS7263
6-Channel NIR Spectral_ID Device with
Electronic Shutter and Smart Interface
General Description
The AS7263 is a digital 6-channel spectrometer for spectral
identification in the near IR (NIR) light wavelengths. AS7263
consists of 6 independent optical filters whose spectral response is defined in the NIR wavelengths from approximately
600nm to 870nm with full-width half-max (FWHM) of 20nm. An
integrated LED driver with programmable current is provided
for electronic shutter applications.
The AS7263 integrates Gaussian filters into standard CMOS silicon via Nano-optic deposited interference filter technology
and is packaged an LGA package that provides a built in aperture to control the light entering the sensor array.
Control and Spectral data access is implemented through either
the I²C register set, or with a high level AT Spectral Command
set via a serial UART.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS7263, 6-Channel NIR
Spectral_ID Device with Electronic Shutter and Smart Interface
are listed below:
Figure 1:
Added Value of Using AS7263
Benefits
Features
• Compact 6-channel spectrometry solution
• 6 near-IR channels: 610nm, 680nm, 730nm, 760nm,
810nm and 860nm, each with 20nm FWHM
• Simple text-based command interface via UART,
or direct register read and write with interrupt
on sensor ready option on I²C
• UART or I²C slave digital Interface
• Lifetime-calibrated sensing with no drift over
time or temperature
• NIR filter set realized by silicon interference filters
• No additional signal conditioning required
• 16-bit ADC with digital access
• Electronic shutter control/synchronization
• Programmable LED drivers
• Low voltage operation
• 2.7V to 3.6V with I²C interface
• Small, robust package, with built-in aperture
• 20-pin LGA package 4.5mm x 4.7mm x 2.5mm,
-40°C to 85°C temperature range
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − General Description
Applications
The AS7263 applications include:
• Product authentication
• Bank note/document validation
• Chemical analysis
• Food/beverage safety
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
AS7263 NIR Spectral_ID System
3V
100nF
uP
10uF
VDD1 VDD2
RX / SCL_S
TX / SDA_S
LED_IND
INT
LED_DRV
AS7263
Flash
Memory
MOSI
MISO
SCK
CSN_EE
GND
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6-channel
NIR
Sensor
3V
3V
Light
Source
Light in
Reflective
Surface
ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Pin Assignment
Pin Assignment
The device pin assignments are described below.
Figure 3:
Pin Diagram (Top View)
20
16
1
15
5
11
6
10
Figure 4:
Pin Description
Pin Number
Pin Name
1
NF
2
RESN
Reset, Active LOW
3
SCK
SPI Serial Clock
4
MOSI
SPI Master Out Slave In
5
MISO
SPI Master In Slave Out
6
CSN_EE
Chip Select for External Serial Flash Memory, Active LOW
7
CSN_SD
Chip Select for SD Card Interface, Active LOW
8
I2C_ENB
Select UART (Low) or I²C (High) Operation
9
NF
Not Functional. Do not connect.
10
NF
Not Functional. Do not connect.
11
RX/SCL_S
RX (UART) or SCL_S (I²C Slave) Depending on I²C_ENB
12
TX/SDA_S
TX (UART) or SDA_S (I²C Slave) Depending on I²C_ENB
13
INT
14
VDD2
ams Datasheet
[v1-00] 2016-Nov-25
Description
Not Functional. Do not connect.
Interrupt, Active LOW
Voltage Supply
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AS7263 − Pin Assignment
Pin Number
Pin Name
15
LED_DRV
16
GND
Ground
17
VDD1
Voltage Supply
18
LED_IND
19
NF
Not Functional. Do not connect.
20
NF
Not Functional. Do not connect.
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Description
LED Driver Output for Driving LED, Current Sink
LED Driver Output for Indicator LED, Current Sink
ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under
Electrical Characteristics is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. The device is not designed for high energy UV
(ultraviolet) environments, including upward looking outdoor
applications, which could affect long term optical performance.
Figure 5:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD1_MAX
Supply Voltage VDD1
-0.3
5
V
Pin VDD1 to GND
VDD2_MAX
Supply Voltage VDD2
-0.3
5
V
Pin VDD2 to GND
Input/Output Pin
Voltage
-0.3
VDD+0.3
V
Input/Output Pin to GND
VDD_IO
ISCR
Input Current
(latch-up immunity)
± 100
mA
JESD78D
Electrostatic Discharge
ESDHBM
Electrostatic Discharge
HBM
± 1000
V
JS-001-2014
ESDCDM
Electrostatic Discharge
CDM
± 500
V
JSD22-C101F
Temperature Ranges and Storage Conditions
TSTRG
Storage Temperature
Range
TBODY
Package Body
Temperature
RHNC
Relative Humidity
(non-condensing)
MSL
Moisture Sensitivity
Level
ams Datasheet
[v1-00] 2016-Nov-25
-40
85
5
3
°C
260
°C
85
%
IPC/JEDEC J-STD-020
The reflow peak soldering
temperature (body
temperature) is specified
according to IPC/JEDEC
J-STD-020
“Moisture/Reflow
Sensitivity Classification
for Non-hermetic Solid
State Surface Mount
Devices.”
Maximum floor life time of
168 hours
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AS7263 − Electrical Characteristics
Electrical Characteristics
All limits are guaranteed with VDD = VDD1 = VDD2 = 3.3V,
TAMB=25°C. The parameters with min and max values are
guaranteed with production tests or SQC (Statistical Quality
Control) methods.
Figure 6:
Electrical Characteristics of AS7263
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
General Operating Conditions
VDD1
/VDD2
Voltage Operating Supply
UART Interface
2.97
3.3
3.6
V
VDD1
/VDD2
Voltage Operating Supply
I2C Interface
2.7
3.3
3.6
V
TAMB
Operating Temperature
-40
25
85
°C
IVDD
Operating Current
5
mA
ISTANDBY(1)
Standby Current
12
μA
Internal RC Oscillator
FOSC
Internal RC Oscillator
Frequency
tJITTER(2)
Internal Clock Jitter
15.7
16
16.3
MHz
1.2
ns
8.5
°C
8
mA
-30
30
%
0.3
VDD
V
12.5
100
mA
-10
10
%
0.3
VDD
V
@25°C
Temperature Sensor
DTEMP
Absolute Accuracy of the
Temperature
Measurement
-8.5
Indicator LED
IIND
LED Current
IACC
Accuracy of Current
VLED
Voltage Range of
Connected LED
1
Vds of current sink
4
LED_DRV
ILED1
LED Current
IACC
Accuracy of Current
VLED
Voltage Range of
Connected LED
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12.5, 25, 50 or 100
Vds of current sink
ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Digital Inputs and Outputs
IIH, IIL
Logic Input Current
Vin=0V or VDD
-1
1
μA
IILRESN
Logic Input Current (RESN
pin)
Vin=0V
-1
-0.2
mA
VIH
CMOS Logic High Input
0.7*
VDD
VDD
V
VIL
CMOS Logic Low Input
0
0.3*
VDD
V
VOH
CMOS Logic High Output
I=1mA
VDD 0.4
V
VOL
CMOS Logic Low Output
I=1mA
0.4
V
tRISE(2)
Current Rise Time
C(Pad)=30pF
5
ns
tFALL(2)
Current Fall Time
C(Pad)=30pF
5
ns
Note(s):
1. 15μA over temperature
2. Guaranteed, not tested in production
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − Timing Characteristics
Timing Characteristics
Figure 7:
AS7263 I²C Slave Timing Characteristics
Symbol
Parameter
Condition
Min
Typ
Max
Unit
400
kHz
I²C Interface
fSCLK
SCL Clock Frequency
0
tBUF
Bus Free Time
Between a STOP and
START
1.3
μs
tHS:STA
Hold Time
(Repeated) START
0.6
μs
tLOW
LOW Period of SCL
Clock
1.3
μs
tHIGH
HIGH Period of SCL
Clock
0.6
μs
tSU:STA
Setup Time for a
Repeated START
0.6
μs
tHS:DAT
Data Hold Time
0
tSU:DAT
Data Setup Time
100
tR
Rise Time of Both
SDA and SCL
20
300
ns
tF
Fall Time of Both SDA
and SCL
20
300
ns
tSU:STO
Setup Time for STOP
Condition
0.6
CB
Capacitive Load for
Each Bus Line
CI/O
I/O Capacitance
(SDA, SCL)
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CB — total capacitance of
one bus line in pF
0.9
μs
ns
μs
400
pF
10
pF
ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Timing Characteristics
Figure 8:
I²C Slave Timing Diagram
tR
tF
tLOW
SCL
P
tHIGH
S
tHD:STA
S
tSU:DAT
tHD:DAT
P
t SU:STA
tSU:STO
VIH
SDA
tBUF
Stop
VIL
Start
Figure 9:
AS7263 SPI Timing Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
16
MHz
SPI Interface
fSCK
Clock Frequency
0
tSCK_H
Clock High Time
40
ns
tSCK_L
Clock Low Time
40
ns
tSCK_RISE
SCK Rise Time
5
ns
tSCK_FALL
SCK Fall Time
5
ns
tCSN_S
CSN Setup Time
Time between CSN high-low
transition to first SCK high
transition
50
ns
tCSN_H
CSN Hold Time
Time between last SCK
falling edge and CSN
low-high transition
100
ns
tCSN_DIS
CSN Disable Time
100
ns
tDO_S
Data-Out Setup Time
5
ns
tDO_H
Data-Out Hold Time
5
ns
tDI_V
Data-In Valid
10
ns
Note(s):
1. Guaranteed, not tested in production
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − Timing Characteristics
Figure 10:
SPI Master Write Timing Diagram
tCSN_DIS
CSN
tSCK_RISE
tCSN_S
tCSN_H
tSCK_FALL
SCK
t DO_S
MOSI
tDO_H
MSB
LSB
HI-Z
HI-Z
MISO
Figure 11:
SPI Master Read Timing Diagram
CSN_xx
tSCK_H
tSCK_L
SCK
tDI_V
Dont care
MOSI
MISO
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MSB
LSB
ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Timing Characteristics
Optical Characteristics
Figure 12:
Optical Characteristics of AS7263 (Pass Band)(1)
Parameter
Test Conditions
Channel
(nm)
R
Channel R
Incandescent (2), (4)
610
35 (3),(4)
counts/
(μW/cm2)
S
Channel S
Incandescent (2), (4)
680
35 (3),(4)
counts/
(μW/cm2)
T
Channel T
Incandescent (2), (4)
730
35 (3),(4)
counts/
(μW/cm2)
U
Channel U
Incandescent (2), (4)
760
35 (3),(4)
counts/
(μW/cm2)
V
Channel V
Incandescent (2), (4)
810
35 (3),(4)
counts/
(μW/cm2)
W
Channel W
Incandescent (2), (4)
860
35 (3),(4)
counts/
(μW/cm2)
FWHM
Full Width
Half Max
20
20
nm
±5
nm
Symbol
Wacc
Wavelength
Accuracy
dark
Dark
Channel
Counts
GAIN=64,
TAMB=25°C
f
Angle of
Incidence
On the sensors
Min
Typ
Max
5
Unit
counts
±20.0
deg
Note(s):
1. Calibration & measurements are made using diffused light.
2. Each channel is tested with GAIN = 16x, Integration Time (INT_T) = 166ms and VDD = VDD1 = VDD2 = 3.3V, TAMB=25°C.
3. The accuracy of the channel counts/μW/cm 2 is ±12%.
4. The light source is an incandescent light with an irradiance of ~1500μW/cm 2 (300-1000nm). The energy at each channel (R, S, T, U,
V, W) is calculated with a ±33nm bandwidth around the center wavelengths (610, 680, 730, 760, 810, 860nm).
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 13:
Spectral Responsivity
AS7263
1
Normalized Responsivity
0.9
0.8
0.7
R
0.6
S
0.5
T
0.4
U
0.3
V
0.2
W
0.1
0
550
600
650
700
750
800
850
900
950
λ - Wavelength (nm)
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ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Detailed Description
Detailed Description
Figure 14:
Internal Block Diagram
VDD1
VDD2
INT
LED_IND
RX / SCL_S
2
UART / I C
TX / SDA_S
I2C_ENB
LED_DRV
°C
Spectral_ID
Engine
MISO
SPI
Master
MOSI
SCK
CSN_SD
Multi
Spectral
Sensor
R S T U V W
SYNC / RESN
RC Osc
16MHz
GND
6-Channel NIR Spectral_ID Detector
The AS7263 6-channel Spectral_ID is a next-generation digital
spectral sensor device. Each channel has a Gaussian filter
characteristic with a full width half maximum (FWHM)
bandwidth of 20nm. The channels are spaced roughly at 50nm
intervals in the NIR spectrum: R, S, T, U, V, W. The sensor contains
analog-to-digital converters (16-bit resolution ADC), which
integrate the current from each channel’s photodiode. Upon
completion of the conversion cycle, the integrated result is
transferred to the corresponding data registers. The transfers
are double-buffered to ensure that the integrity of the data is
maintained.
Interference filters enable high temperature stability and
eliminate lifetime drift. Filter accuracy will be affected by the
angle of incidence, and require 0° angle of incidence ±20.0° for
specified accuracy. Angles of light beyond this will shift the
spectral response of the filters. The LGA package aperture
assists in the control of the light input, helping to maintain the
proper angle of incidence at the sensors.
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − Detailed Description
Data Conversion Description
AS7263 spectral conversion is implemented via two photodiode banks per device. Bank 1 consists of data from the S, T, U,
V photodiodes. Bank 2 consists of data from the R, T, U, W photodiodes. Spectral conversion requires the integration time (IT
in ms) set to complete. If both photodiode banks are required
to complete the conversion, the 2nd bank requires an additional IT ms. Minimum IT for a single bank conversion is 2.8 ms. If
data is required from all 6 photodiodes then the device must
perform 2 full conversions (2 x Integration Time).
The spectral conversion process is controlled with BANK Mode
settings as follows:
BANK Mode 0: Data will be available in registers S, T, U & V (R
and W registers will be zero)
BANK Mode 1: Data will be available in registers R, T, U & W (V
and W registers will be zero)
BANK Mode 2: Data will be available in registers R, S, T, U, V & W
When the bank setting is Mode 0, Mode 1, or Mode 2, the spectral data conversion process operates continuously, with new
data available after each IT ms period. In the continuous modes,
care should be taken to assure prompt interrupt servicing so
that integration values from both banks are all derived from the
same spectral conversion cycle.
BANK Mode 3: Data will be available in registers R, S, T, U, V & W
in One-Shot mode
When the bank setting is Mode 3, the device operates in
One-Shot mode. Spectral conversion occurs only when bit 0 of
the control register (1SHOT) is set to 1. The 1SHOT bit in the
control register is subsequently cleared by hardware at the
same time the DATA_RDY bit is set to 1 indicating the availability
of spectral conversion result data. The One-Shot mode is intended for use when it is critical to ensure that spectral conversion results are obtained contemporaneously.
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ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Detailed Description
Figure 15:
Photo Diode Array
Photo Diode Array
T
U
S
R
V
W
Figure 16:
Bank Mode and Data Conversion
BANK Mode 0
One Conversion
S, T, U, V
Integration Time
BANK Mode 1
One Conversion
R, T, U, W
Integration Time
BANK Mode 2
1st Conversion
Integration Time
S, T, U, V
2nd Conversion
R, T, U, W
Integration Time
RC Oscillator
The timing generation circuit consists of an on-chip 16MHz,
temperature compensated oscillator, which provides the master clock for the AS7263.
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − Detailed Description
Temperature Sensor
The Temperature Sensor is constantly measuring the on-chip
temperature and enables temperature compensation procedures.
Reset
Pulling down the RESN pin for longer than 100ms resets the
AS7263.
Figure 17:
Reset Circuit
RESN
CLE
Reset
AS7263
Push > 100ms
Indicator LED
The LED, connected to pin LED_IND, can be used to indicate
programming progress of the device.
While programming the AS7263 via the external SD card the
indicator LED starts flashing (500ms pulses). When programming is completed the indicator LED is switched off. The LED
(LED0) can be turned ON/OFF via AT commands or via I²C register control. The LED sink current is programmable from 1mA,
2mA, 4mA and 8mA.
Electronic Shutter with LED_DRV Driver Control
There are two LED driver outputs that can be used to control
up to 2 LEDs. This will allow different wavelength light sources
to be used in the same system. The LED output sink currents are
programmable and can drive external LED sources: LED_IND
from 1mA, 2mA, 4mA and 8mA and LED_DRV from 12.5mA,
25mA, 50mA and 100mA. The sources can be turned off and on
via I²C registers control or AT commands and provides the device with an electronic shutter.
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ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Detailed Description
Interrupt Operation
If BANK is set to Mode 0 or Mode 1 then the data is ready after
the 1 st integration time. If BANK is set to Mode 2 or Mode 3 then
the data is ready after two integration times. If the interrupt is
enabled (INT = 1) then when the data is ready, the INT line is
pulled low and DATA_RDY is set to 1. The INT line is released
(returns high) when the control register is read. DATA_RDY is
cleared to 0 when any of the sensor registers R, S, T, U, V, W are
read. Since each sensor value is 2 bytes, after the 1 st byte is read
the 2 nd byte is shadow-protected in case an integration cycle
completes just after the 1 st byte is read.
In continuous spectral conversion mode (BANK setting of Mode
0, Mode 1, or Mode 2), the sensors continue to gather information at the rate of the integration time, hence if the sensor registers are not read when the interrupt line goes low, it will stay
low and the next cycle’s sensor data will be available in the
registers at the end of the next integration cycle. When the control register BANK bits are written with a value of Mode 3,
One-Shot Spectral Conversion mode is entered. When a single
set of contemporaneous sensor readings is desired, writing
BANK Mode 3 to the control register immediately triggers exactly two spectral data conversion cycles. At the end of these
two conversion cycles, the DATA_RDY bit is set as for the other
BANK modes. To perform a new One-Shot sequence, the control
register BANK bits should be written with a value of Mode 3
again. This process may continue until the user writes a different
value into the BANK bits.
I²C Slave Interface
If selected by the I2C_ENB pin setting, interface and control can
be accomplished through an I²C compatible slave interface to
a set of registers that provide access to device control functions
and output data. These registers on the AS7263 are, in reality,
implemented as virtual registers in software. The actual I²C slave
hardware registers number only three and are described in the
table below. The steps necessary to access the virtual registers
defined in the following are explained in pseudocode for external I²C master writes and reads below.
I²C Feature List
• Fast mode (400kHz) and standard mode (100kHz) support.
• 7+1-bit addressing mode.
• Write format: Byte.
• Read format: Byte.
• SDA input delay and SCL spike filtering by integrated
RC-components.
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − Detailed Description
Figure 18:
I²C Slave Device Address and Physical Registers
Entity
Description
Note
8-bit Slave Address
Byte = 1001 001x
x= 1 for Master Read (byte = 93 hex)
x= 0 for Master Write (byte = 92 hex)
STATUS
Register
I²C slave interface STATUS
register.
Read-only.
Register Address = 0x00
Bit 1: TX_VALID
0 -> New data may be written to WRITE register
1 -> WRITE register occupied. Do NOT write.
Bit 0: RX_VALID
0 -> No data is ready to be read in READ register.
1 -> Data byte available in READ register.
WRITE Register
I²C slave interface WRITE
register.
Write-only.
Register Address = 0x01
8-Bits of data written by the I²C Master intended
for receipt by the I²C slave. Used for both virtual
register addresses and write data.
READ Register
I²C slave interface
READ register.
Read-only.
Register Address = 0x02
8-Bits of data to be read by the I²C Master.
Device Slave
Address
I²C Virtual Register Write Access
Figure 19 shows the pseudocode necessary to write virtual
registers on the AS7263. Note that, because the actual registers
of interest are realized as virtual registers, a means of indicating
whether there is a pending read or write operation of a given
virtual register is needed. To convey this information, the most
significant bit of the virtual register address is used as a marker.
If it is 1, then a write is pending, otherwise the slave is expecting
a virtual read operation. The pseudocode illustrates the proper
technique for polling of the I²C slave status register to ensure
the slave is ready for each transaction.
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ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Detailed Description
Figure 19:
I²C Virtual Register Byte Write
Pseudocode
Poll I²C slave STATUS register;
If TX_VALID bit is 0, a write can be performed on the interface;
Send a virtual register address and set the MSB of the register address to 1 to indicate the pending write;
Poll I²C slave STATUS register;
If TX_VALID bit is 0, the virtual register address for the write has been received and the data may now be written;
Write the data.
Sample Code:
#define I2C_AS72XX_SLAVE_STATUS_REG0x00
#define I2C_AS72XX_SLAVE_WRITE_REG0x01
#define I2C_AS72XX_SLAVE_READ_REG0x02
#define I2C_AS72XX_SLAVE_TX_VALID0x02
#define I2C_AS72XX_SLAVE_RX_VALID0x01
void i2cm_AS72xx_write(uint8_t virtualReg, uint8_t d)
{
volatile uint8_tstatus;
while (1)
{
// Read slave I²C status to see if the write buffer is ready.
status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG);
if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0)
// No inbound TX pending at slave. Okay to write now.
break ;
}
// Send the virtual register address (setting bit 7 to indicate a pending write).
i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, (virtualReg | 0x80)) ;
while (1)
{
// Read the slave I2C status to see if the write buffer is ready.
status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG) ;
if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0)
// No inbound TX pending at slave. Okay to write data now.
break;
}
// Send the data to complete the operation.
i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, d);
}
ams Datasheet
[v1-00] 2016-Nov-25
Page 19
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AS7263 − Detailed Description
I²C Virtual Register Read Access
Figure 20 shows the pseudocode necessary to read virtual registers on the AS7263. Note that in this case, reading a virtual
register, the register address is not modified.
Figure 20:
I²C Virtual Register Byte Read
Pseudocode
Poll I²C slave STATUS register;
If TX_VALID bit is 0, the virtual register address for the read may be written;
Send a virtual register address;
Poll I²C slave STATUS register;
If RX_VALID bit is 1, the read data is ready;
Read the data.
Sample Code:
uint8_t i2cm_AS72xx_read(uint8_t virtualReg)
{
volatile uint8_t status, d ;
while (1)
{
// Read slave I2C status to see if the read buffer is ready.
status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG) ;
if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0)
// No inbound TX pending at slave. Okay to write now.
break ;
}
// Send the virtual register address (setting bit 7 to indicate a pending write).
i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, virtualReg) ;
while (1)
{
// Read the slave I²C status to see if our read data is available.
status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG) ;
if ((status & I2C_AS72XX_SLAVE_RX_VALID) != 0)
// Read data is ready.
break ;
}
// Read the data to complete the operation.
d = i2cm_read(I2C_AS72XX_SLAVE_READ_REG) ;
return d ;s
}
The details of the i2cm_read() and i2cm_write() functions in
previous Figures are dependent upon the nature and implementation of the external I²C master device.
Page 20
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ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Detailed Description
I²C Virtual Register Set
The figure below provides a summary of the AS7263 I²C register
set. Figures after that provide additional details. All register
data is hex or, where noted, 32-bit floating point, and all
multi-byte entities are Big Endian (most significant byte is
situated at the lowest register address).
Figure 21:
I²C Register Set Overview
Addr
Name
<D7>
<D6>
<D5>
<D4>
<D3>
<D2>
<D1>
<D0>
DATA_
RDY
RSVD
Version Registers
0x00:
0x01
HW_Version
Hardware Version
0x02:
0x03
FW_Version
Firmware Version
Control Registers
0x04
Control_Setup
RST
INT
0x05
INT_T
Integration Time
0x06
Device_Temp
Device Temperature
0x07
LED_Control
RSVD
GAIN
Bank
ICL_DRV
LED_
DRV
ICL_IND
LED_IND
Sensor Raw Data Registers
0x08
R_High
Channel R High Data Byte
0x09
R_Low
Channel R Low Data Byte
0x0A
S_High
Channel S High Data Byte
0x0B
S_Low
Channel S Low Data Byte
0x0C
T_High
Channel T High Data Byte
0x0D
T_Low
Channel T Low Data Byte
0x0E
U_High
Channel U High Data Byte
0x0F
U_Low
Channel U Low Data Byte
0x10
V_High
Channel V High Data Byte
0x11
V_Low
Channel V Low Data Byte
0x12
W_High
Channel W High Data Byte
0x13
W_Low
Channel W Low Data Byte
ams Datasheet
[v1-00] 2016-Nov-25
Page 21
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AS7263 − Detailed Description
Addr
Name
<D7>
<D6>
<D5>
<D4>
<D3>
<D2>
<D1>
<D0>
Sensor Calibrated Data Registers
0x14:
0x17
R_Cal
Channel R Calibrated Data (float)
0x18:
0x1B
S_Cal
Channel S Calibrated Data (float)
0x1C:
0x1F
T_Cal
Channel T Calibrated Data (float)
0x20:
0x23
U_Cal
Channel U Calibrated Data (float)
0x24:
0x27
V_Cal
Channel V Calibrated Data (float)
0x28:
0x2B
W_Cal
Channel W Calibrated Data (float)
Detailed Register Description
Figure 22:
HW Version Registers
Addr: 0x00
HW_Version
Bit
Bit Name
Default
Access
7:0
Device Type
0100000
R
Addr: 0x01
Device type number
HW_Version
Bit
Bit Name
Default
Access
7:0
HW Version
00111111
R
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Document Feedback
Bit Description
Bit Description
Hardware version
ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Detailed Description
Figure 23:
FW Version Registers
Addr: 0x02
FW_Version
Bit
Bit Name
Default
Access
7:6
Minor
Version
R
Minor Version [1:0]
5:0
Sub Version
R
Sub Version
Addr: 0x03
Bit Description
FW_Version
Bit
Bit Name
Default
Access
Bit Description
7:4
Major
Version
R
Major Version
3:0
Minor
Version
R
Minor Version [5:2]
Figure 24:
Control Setup Register
Addr: 0x04/0x84
Control_Setup
Bit
Bit Name
Default
Access
Bit Description
7
RST
0
R/W
Soft Reset, Set to 1 for soft reset, goes
to 0 automatically after the reset
6
INT
0
R/W
Enable interrupt pin output (INT),
1: Enable, 0: Disable
5:4
GAIN
0
R/W
Sensor Channel Gain Setting (all
channels)
‘b00=1x; ‘b01=3.7x; ‘b10=16x;
‘b11=64x
3:2
BANK
10
R/W
Data Conversion Type (continuous)
‘b00=Mode 0; ‘b01=Mode 1;
‘b10=Mode 2; ‘b11=Mode 3 One-Shot
1
DATA_RDY
0
R/W
1: Data Ready to Read, sets INT active
if interrupt is enabled.
Can be polled if not using INT.
0
RSVD
0
R
ams Datasheet
[v1-00] 2016-Nov-25
Reserved; Unused
Page 23
Document Feedback
AS7263 − Detailed Description
Figure 25:
Integration Time Register
Addr: 0x05/0x85
INT_T
Bit
Bit Name
Default
Access
7:0
INT_T
0xFF
R/W
Bit Description
Integration time =
<value> * 2.8ms
Figure 26:
Device Temperature Register
Addr: 0x06
Bit
Bit Name
7:0
Device_Temp
Device_Temp
Default
Access
Bit Description
Device temperature
data byte (°C)
R
Figure 27:
LED Control Register
Addr: 0x07/0x87
LED Control
Bit
Bit Name
Default
Access
7:6
RSVD
0
R
5:4
ICL_DRV
00
R/W
LED_DRV current limit
‘b00=12.5mA; ‘b01=25mA;
‘b10=50mA; ‘b11=100mA
3
LED_DRV
0
R/W
Enable LED_DRV
1: Enabled; 0: Disabled
2:1
ICL_IND
00
R/W
LED_IND current limit
‘b00=1mA; ‘b01=2mA; ‘b10=4mA;
‘b11=8mA
0
LED_IND
0
R/W
Enable LED_IND
1: Enabled; 0: Disabled
Page 24
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Bit Description
Reserved
ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Detailed Description
Figure 28:
Sensor Raw Data Registers
Addr: 0x08
Bit
Bit Name
7:0
R_High
R_High
Default
Access
R
Addr: 0x09
Bit
Bit Name
7:0
R_Low
Bit Name
7:0
S_High
Default
Access
R
Bit Name
7:0
S_Low
Default
Bit Name
7:0
T_High
R
Bit Name
7:0
T_Low
Default
Bit Name
7:0
U_High
R
Bit Name
7:0
U_Low
ams Datasheet
[v1-00] 2016-Nov-25
Bit Description
Channel S Low Data Byte
T_High
Default
Access
R
Bit Description
Channel T High Data Byte
T_Low
Default
Access
R
Bit Description
Channel T Low Data Byte
U_High
Default
Access
R
Addr: 0x0F
Bit
Channel S High Data Byte
Access
Addr: 0x0E
Bit
Bit Description
S_Low
Addr: 0x0D
Bit
Channel R Low Data Byte
Access
Addr: 0x0C
Bit
Bit Description
S_High
Addr: 0x0B
Bit
Channel R High Data Byte
R_Low
Addr: 0x0A
Bit
Bit Description
Bit Description
Channel U High Data Byte
U_Low
Default
Access
R
Bit Description
Channel U Low Data Byte
Page 25
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AS7263 − Detailed Description
Addr: 0x10
Bit
Bit Name
7:0
V_High
V_High
Default
Access
R
Addr: 0x11
Bit
Bit Name
7:0
V_Low
Bit Name
7:0
W_High
Default
Access
R
Bit Name
7:0
W_Low
Bit Description
Channel V Low Data Byte
W_High
Default
Access
R
Addr: 0x13
Bit
Channel V High Data Byte
V_Low
Addr: 0x12
Bit
Bit Description
Bit Description
Channel W High Data Byte
W_Low
Default
Access
R
Bit Description
Channel W Low Data Byte
Figure 29:
Sensor Calibrated Data Registers
Addr: 0x14:0x17
Bit
Bit Name
31:0
R_Cal
R_Cal
Default
Access
R
Addr: 0x18:0x1B
Bit
Bit Name
31:0
S_Cal
Bit Name
31:0
T_Cal
Default
Access
R
Bit Name
31:0
U_Cal
Page 26
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Bit Description
Channel S Calibrated Data (float)
T_Cal
Default
Access
R
Addr: 0x20:0x23
Bit
Channel R Calibrated Data (float)
S_Cal
Addr: 0x1C:0x1F
Bit
Bit Description
Bit Description
Channel T Calibrated Data (float)
U_Cal
Default
Access
R
Bit Description
Channel U Calibrated Data (float)
ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Detailed Description
Addr: 0x24:0x27
Bit
Bit Name
31:0
V_Cal
V_Cal
Default
Access
R
Channel V Calibrated Data (float)
Addr: 0x28:0x2B
Bit
Bit Name
31:0
W_Cal
Bit Description
W_Cal
Default
Access
Bit Description
R
Channel W Calibrated Data (float)
4-Byte Floating-Point (FP) Registers
Several 4-byte registers (hex) are shown in the tables. Here is
an example of how the registers are used to represent floating
point data (based on the IEEE 754 standard):
Figure 30:
Example of the IEEE 754 Standard
The floating point (FP) value assumed by 32 bit binary32 data
with a biased exponent e (the 8 bit unsigned integer) and a 23
bit fraction is (for the above example).
23

FPvalue = ( – 1 )

–i 
( e – 127 )
1
+
(
b
)
(
2
)
23
–
i


 x2


i=1
sign 

23

–i
( 124 – 127 )
FPvalue = ( – 1 )  1 +  ( b 23 – i ) ( 2 ) x2


i=1
0
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − Detailed Description
–2
FPvalue = ( 1 )x ( 1 + 2 )x2
( –3 )
= 0.15625
UART Interface
If selected by the I2C_ENB pin setting, the UART module implements the TX and RX signals as defined in the RS-232 / V.24
standard communication protocol.
It has on both, receive and transmit path, a 16 entry deep FIFO.
It can generate interrupts as required.
UART Feature List 1
• Full Duplex Operation (Independent Serial Receive and
Transmit Registers) with FIFO buffer of 8 byte for each.
• At a clock rate of 16MHz it supports communication at
115200Baud.
• Supports Serial Frames with 8 Data Bits, 1 Parity Bit and 1
Stop Bit.
• High Resolution Baud Rate Generator.
Theory of Operation
Transmission
If data is available in the transmit FIFO, it will be moved into the
output shift register and the data will be transmitted at the
configured Baud Rate, starting with a Start Bit (logic zero) and
followed by a Stop Bit (logic one).
Reception
At any time, with the receiver being idle, if a falling edge of a
start bit is detected on the input, a byte will be received and
stored in the receive FIFO. The following Stop Bit will be checked
to be logic one.
1. With UART operation, min VDD of 2.97V is required as shown in Electrical Characteristics Figures.
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AS7263 − Detailed Description
Figure 31:
UART Protocol
Data Bits
TX
D0
D1
Start Bit
D2
D3
D4
D5
D6
D7
D0
Parity Bit Stop Bit
Tbit=1/Baude Rate
Always Low
RX
P
Next Start
Even or odd Always High
D0
D1
D2
D3
D4
D5
D6
D7
P
D0
Start Bit detected
After Tbit/2: Sampling of Start Bit
After Tbit: Sampling of Data
Sample Points
AT Command Interface
The microprocessor interface to control the NIR Spectral_ID
Sensor is via the UART, using the AT Commands across the UART
interface.
The 6-channel Spectral _ID sensor provides a text-based serial
command interface borrowed from the “AT Command” model
used in early Hayes modems.
For example:
• Read DATA value: ATDATA → <data>OK
• Set the gain of the sensor to 1x: ATGAIN =0 → OK
The “AT Command Interface Block Diagram”, shown below between the network interface and the core of the system, provides access to the Spectral_ID engine’s control and configuration functions.
Figure 32:
AT Command Interface Block Diagram
RX
uP
AT Commands
TX
AT
Command
Interface
Spectral_ID
Engine
AT Command Interface
AS726x
ams Datasheet
[v1-00] 2016-Nov-25
Page 29
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AS7263 − Detailed Description
In the Figure below, numeric values may be specified with no
leading prefix, in which case they will be interpreted as
decimals, or with a leading “0x” to indicate that they are
hexadecimal numbers, or with a leading “‘b” to indicate that
they are binary numbers. The commands are loosely grouped
into functional areas. Texts appearing between angle brackets
(‘<‘ and ‘>‘) are commands or response arguments. A carriage
return character, a linefeed character, or both may terminate
commands and responses. Note that any command that
encounters an error will generate the “ERROR” response shown,
for example, in the NOP command at the top of the first table,
but has been omitted elsewhere in the interest of readability
and clarity.
Figure 33:
AT Commands
Command
Response
Description / Parameters
Spectral Data per Channel
ATDATA
<R_value>,
<S_value>,
<T_value>,
<U_value>,
<V_value>,
<W_value> OK
Read R, S, T, U, V & W data. Returns comma-separated 16-bit
integers.
ATCDATA
<Cal_R_value>,
<Cal_S_value>,
<Cal_T_value>,
<Cal_U_value>,
<Cal_V_value>,
<Cal_W_value> OK
Read calibrated R, S, T, U, V & W data. Returns comma-separated
32-bit floating point values.
Sensor Configuration
OK
Set sensor integration time. Values should be in the range [1...
255], with
integration time = <value> * 2.8ms.
<value> OK
Read sensor integration time, with
integration time = <value> * 2.8ms.
OK
Set sensor gain: 0=1X, 1=3.7x, 2=16x, 3=64x
ATGAIN
<value>OK
Read sensor gain setting, returning 0, 1, 2, or 3 as defined
immediately above.
ATTEMP
<value>OK
Read temperature of chip in degree Celsius
ATINTTIME=<value>
ATINTTIME
ATGAIN=<value>
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ams Datasheet
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AS7263 − Detailed Description
Command
ATTCSMD=<value>
ATTCSMD
ATBURST=<value>
Response
Description / Parameters
OK
Set Sensor Mode
0 = BANK Mode 0;
1 = BANK Mode 1;
2 = BANK Mode 2;
3 = BANK Mode 3 One-Shot;
4 = Sensors OFF
In One-Shot mode, each ATTCSMD=3 command triggers a
One-Shot reading
<value> OK
Read Sensor Mode, see above
OK
<value>= # of samples
(ATBURST=1 means run until ATBURST=0 is received (a special
case for continuous output)
LED Driver Controls
ATLED0=<value>
ATLED0
ATLED1=<value>
ATLED1
ATLEDC=<value>
ATLEDC
OK
Sets LED_IND: 100=ON, 0=OFF
<100|0>OK
Reads LED_IND setting: 100=ON, 0=OFF
OK
Sets LED_DRV: 100=ON, 0=OFF
<100|0>OK
Reads LED_DRV setting: 100=ON, 0=OFF
OK
Sets LED_IND and LED_DRV current
LED_IND: bits 3:0; LED_DRV: 7:4 bits
LED_IND: ‘b00=1mA; ‘b01=2mA; ‘b10=4mA; ‘b11=8ma
LED_DRV: ‘b00=12.5mA; ‘b01=25mA; ‘b10=50mA; ‘b11=100mA
<value>OK
Reads LED_IND and LED_DRV current settings as shown above
NOP, Version Access, System Reset
OK → Success
ERROR → Failure
NOP
None
Software Reset – no response
ATVERSW
<SWversion#>→OK
ERROR → Failure
Returns the system software version number
ATVERHW
<HWversion#>→ OK
ERROR → Failure
Returns the system hardware revision and product ID, with bits
7:4 containing the part ID, and bits 3:0 yielding the chip revision
value.
AT
ATRST
Firmware Update
OK
<value>= 16-bit checksum. Initial the firmware update process.
Bytes that follow is always 56k bytes
ATFW=<value>
OK
Download new firmware
Up to 7 Bytes represented as hex chars with no leading or
trailing 0x.
Repeat command till all 56k bytes of firmware are downloaded
ATFWS
OK
Causes the active image to switch between the two possible
current images and then resets the IC
ATFWU=<value>
ams Datasheet
[v1-00] 2016-Nov-25
Page 31
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AS7263 − Application Information
Application Information
Figure 34:
AS7263 Typical Application Circuit
3V3
3V3
CSN_SD
7
VDD2
CSN_EE
6
1
2
RESN
MISO
5
2
DO
16
GND
MOSI
4
5
DI
SCK
3
6
8
3
/WP
7
/HOLD
3V3 Vled
15
LED_DRV
18
LED_IND
11
RX/SCL_S
12
TX/SDA_S
13
INT
AS7263
I2C_ENB
DNP
RX
TX
INT
Page 32
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NC
NC
NC
NC
NC
19
20
1
10
9
/CS
1uF
VCC
8
VDD1
14
Flash
Memory
CLK
GND
10K
RST
17
4
100nF 10uF
0R
ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Package Drawings & Markings
Package Drawings & Markings
Figure 35:
Package Drawing LGA
RoHS
Green
Note(s):
1. XXXXX = tracecode
ams Datasheet
[v1-00] 2016-Nov-25
Page 33
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AS7263 − PCB Pad Layout
PCB Pad Layout
Suggested PCB pad layout guidelines for the LGA device are
shown.
Figure 36:
Recommended PCB Pad Layout
Unit: mm
0.30
1.10
0.65
4.60
1
4.40
Page 34
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ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Mechanical Data
Mechanical Data
Figure 37:
Tape & Reel Information
Note(s):
1. Each reel contains 2000 parts.
2. Measured from centreline of sprocket hole to centreline of pocket.
3. Cumulative tolerance of 10 sprocket holes is ±0.20.
4. Other material available.
5. All dimensions in millimeters unless otherwise stated.
ams Datasheet
[v1-00] 2016-Nov-25
Page 35
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AS7263 − Storage & Soldering Information
Storage & Soldering
Information
Soldering Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate. The solder reflow
profile describes the expected maximum heat exposure of
components during the solder reflow process of product on a
PCB. Temperature is measured on top of component. The
components should be limited to a maximum of three passes
through this solder reflow profile.
Figure 38:
Solder Reflow Profile
Parameter
Reference
Device
Average temperature gradient in preheating
2.5°C/s
tsoak
2 to 3 minutes
Time above 217°C
t1
Max 60 s
Time above 230°C
t2
Max 50 s
Time above Tpeak -10°C
t3
Max 10 s
Tpeak
260° C
Soak time
Peak temperature in reflow
Temperature gradient in cooling
Max -5°C/s
Figure 39:
Solder Reflow Profile Graph
Tpeak
Not to scale — for reference only
T3
T2
Temperature (5C)
T1
Time (s)
t3
t2
tsoak
t1
Note(s):
1. Not to scale - for reference only.
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ams Datasheet
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AS7263 − Storage & Soldering Information
Manufacturing Process Considerations
The AS7263 package is compatible with standard reflow
no-clean and cleaning processes including aqueous, solvent or
ultrasonic techniques. However, as an open-aperture device,
precautions must be taken to avoid particulate or solvent
contamination as a result of any manufacturing processes,
including pick and place, reflow, cleaning, integration assembly
and/or testing. Temporary covering of the aperture is allowed.
To avoid degradation of accuracy or performance in the end
product, care should be taken that any temporary covering and
associated sealants/debris are thoroughly removed prior to any
optical testing or final packaging.
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called
a moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: <40°C
• Relative Humidity: <90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − Storage & Soldering Information
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
• Floor Life: 168 hours
• Ambient Temperature: <30°C
• Relative Humidity: <60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
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ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Ordering & Contact Information
Ordering & Contact Information
Figure 40:
Ordering Information (1) (2)
Ordering
Code
Package
Marking
Description
Delivery
Form
Delivery
Quantity
AS7263-BLGT
20-pin LGA
AS7263
6-Channel NIR Spectral_ID
Device with Electronic
Shutter & Smart Interface
Tape & Reel
2000 pcs/reel
Note(s):
1. Required companion serial flash memory (must be ams verified) is ordered from the flash memory supplier (e.g. AT25SF041-SSHD-B
from Adesto Technologies)
2. AS7263 flash memory software is available from ams.
Online product information is available at
www.ams.com/AS7263
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-00] 2016-Nov-25
Page 39
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AS7263 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
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ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
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Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-00] 2016-Nov-25
AS7263 − Revision Information
Revision Information
Changes from 0-90 (2016-Nov-04) to current revision 1-00 (2016-Nov-25)
Page
Initial production version for release
Completely revised version
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
ams Datasheet
[v1-00] 2016-Nov-25
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AS7263 − Content Guide
Content Guide
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1
1
2
2
General Description
Key Benefits & Features
Applications
Block Diagram
3
5
6
Pin Assignment
Absolute Maximum Ratings
Electrical Characteristics
8
11
Timing Characteristics
Optical Characteristics
12
Typical Operating Characteristics
13
13
14
15
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Detailed Description
6-Channel NIR Spectral_ID Detector
Data Conversion Description
RC Oscillator
Temperature Sensor
Reset
Indicator LED
Electronic Shutter with LED_DRV Driver Control
Interrupt Operation
I²C Slave Interface
I²C Feature List
I²C Virtual Register Write Access
I²C Virtual Register Read Access
I²C Virtual Register Set
Detailed Register Description
4-Byte Floating-Point (FP) Registers
UART Interface
UART Feature List
Theory of Operation
Transmission
Reception
AT Command Interface
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35
Application Information
Package Drawings & Markings
PCB Pad Layout
Mechanical Data
36
36
37
37
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37
38
38
Storage & Soldering Information
Soldering Information
Manufacturing Process Considerations
Storage Information
Moisture Sensitivity
Shelf Life
Floor Life
Rebaking Instructions
39
Ordering & Contact Information
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[v1-00] 2016-Nov-25
AS7263 − Content Guide
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ams Datasheet
[v1-00] 2016-Nov-25
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
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