AIC AIC1190-XXPY3 Ultra ldo 1a linear regulator with adjustable & bypass pin Datasheet

AIC1190
Ultra LDO 1A Linear Regulator With
Adjustable & Bypass Pin
FEATURES
DESCRIPTION
Guaranteed 1A Output Current.
Fast Response in Line/Load Transient
Wide Operating Voltage Ranges: 2.3V to 6.0V.
0.1µA Shutdown Standby Current
Low Quiescent Current: < 60µA.
Fixed: 1.2V, 1.5V, 1.8V, 2.0V, 2.5V, 2.7V, 3.0V,
3.3V, 3.5V, 3.7V, 3.8V Output Voltage.
Adjustable Output Voltage are available from
0.8~4.5V
Low Dropout 440mV at 1A and 2.8V output
voltage.
High PSRR 70dB at 1KHz.
:
:
Active Low or High Shutdown Control. Current
Limit and Thermal Protection.
±
Available in 2% Output Tolerance.
Available in SOT-223 & TO-220 (3 pin) & SOP8 Exposed Pad (Heat Sink) and TO-252 &TO263 (3 & 5 pin) Package.
APPLICATIONS
LCD TV, LCD Monitor, DPF
Networking
STB
DVD, HDD Driver
Portable AV Equipment
PC Peripherals
A low noise, high PSRR and ultra low dropout
linear regulator AIC1190 is optimized for low ESR
ceramic capacitors operation with 1A continuous
current.
The AIC1190 offers high precision output voltage
of ±2% tolerance. Output voltage can also be
adjusted for those other than the preset values.
A noise bypass pin is available for further
reduction of output noise. The bypass pin could
be floating if it’s unnecessary. At 1A load current
and 2.8V output voltage, a 440mV dropout is
performed. The quality of low quiescent current
and low dropout voltage makes this device ideal
for battery power applications. The high ripple
rejection and low noise of the AIC1190 provide
enhanced performances for critical applications
such as cellular phones, and PDAs.
In addition, a logic-level shutdown input is
included, which reduce supply current to less than
0.1µA (typ.) in shutdown mode with fast turn-on
time less than 100µs. The AIC1190’s current limit
and thermal protection provide protection against
any overload condition that would create
excessive junction temperatures.
TYPICAL APPLICATION CIRCUIT
Fixed Linear Regulator
Analog Integrations Corporation
Adjustable Linear Regulator
Si-Soft Research Center
3A1, No.1, Li-Hsin Rd. I, Science Park, Hsinchu 300, Taiwan, R.O.C.
TEL: 886-3-5772500,
FAX: 886-3-5772510
www.analog.com.tw
DS-1190G-01 123008
1
AIC1190
TYPICAL APPLICATION CIRCUIT
(Continued)
Adjustable Linear Regulator in SOP-8 Exposed Pad Package
ORDERING INFORMATION
AIC1190-XXXXX XX
3 PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
PACKAGE TYPE
Y3: SOT-223
E3: TO-252
M3: TO-263
T3: TO-220
P: Lead Free Commercial
G: Green Package
OUTPUT VOLTAGE
12: 1.2V
15: 1.5V
18: 1.8V
20: 2.0V
25: 2.5V
27: 2.7V
30: 3.0V
33: 3.3V
35: 3.5V
37: 3.7V
38: 3.8V
(Of a unit of 0.1V within
0.8~4.5V, additional voltage
versions are available on
demand)
SOT-223 (Y3)
TOP VIEW
1: VIN
2: GND (TAB)
3: VOUT
1
2
3
TO-252 (E3)
TOP VIEW
1: VIN
2: GND (TAB)
3: VOUT
1
2
3
1
2
3
1 2
3
TO-263 (M3)
TOP VIEW
1: VIN
2: GND (TAB)
3: VOUT
TO-220 (T3)
TOP VIEW
1: VIN
2: GND (TAB)
3: VOUT
Example: AIC1190-18PE3TR
1.8V Version, in TO-252 Lead Free
Package & Tape & Reel Packing Type
2
AIC1190
ORDERING INFORMATION
(Continued)
AIC1190XX-XXXXXXX
5 PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
PACKAGE TYPE
E5: TO-252-5
M5: TO-263-5
P: Lead Free Commercial
G: Green Package
OUTPUT VOLTAGE
12: 1.2V
15: 1.5V
18: 1.8V
20: 2.0V
25: 2.5V
27: 2.7V
30: 3.0V
33: 3.3V
35: 3.5V
37: 3.7V
38: 3.8V
TO-252-5 (E5)
TOP VIEW
1: EN / EN
2: VIN
3: GND (TAB)
4: VOUT
5: BP/ ADJ
12345
TO-263-5 (M5)
TOP VIEW
1: EN / EN
2: VIN
3: GND (TAB)
4: VOUT
5: BP/ ADJ
12 3 4 5
(Of a unit of 0.1V within
0.8~4.5V, additional voltage
versions are available on
demand)
ENABLE TYPE
L: Chip Enable Low
H: Chip Enable High
B: Bypass
A: ADJ
Example: AIC1190BH-18PM5TR
With Bypass Pin, Chip Enable High,
1.8V Version, in TO-263-5 Lead Free
Package & Tape & Reel Packing Type
3
AIC1190
ORDERING INFORMATION
(Continued)
AIC1190X-XXXXXXX
8 PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
PACKAGE TYPE
R8: SOP-8
G: Green Package
OUTPUT VOLTAGE
12: 1.2V
15: 1.5V
18: 1.8V
20: 2.0V
25: 2.5V
27: 2.7V
30: 3.0V
33: 3.3V
35: 3.5V
37: 3.7V
38: 3.8V
SOP-8 (R8) Exposed Pad (Heat Sink)
TOP VIEW
1: EN / EN
2: VIN
3: VOUT
4: ADJ
5: GND (TAB)
6: BP
7: GND (TAB)
8: GND (TAB)
1
8
2
7
3
6
4
5
(Of a unit of 0.1V within
0.8~4.5V, additional voltage
versions are available on
demand)
ENABLE TYPE
L: Chip Enable Low
H: Chip Enable High
Example: AIC1190H-18GR8TR
Chip Enable High, 1.8V Version, in
SOP-8 Green Package & Tape & Reel
Packing Type
Marking
Part No
Marking
Part No
Marking
AIC1190-xxPY3
HBxxP
AIC1190-xxGY3
HBxxG
xx represents output voltage. (08=0.8V, 09=0.9V, ….…, 44=4.4V, 45=4.5V)
4
AIC1190
ABSOLUTE MAXIMUM RATINGS
Input Voltage ....................................................................................................................................... 7V
EN Pin Voltage .................................................................................................................................... 7V
Noise Bypass Terminal Voltage .......................................................................................................... 7V
Operating Temperature Range ............................................................................................ -40ºC~85ºC
Maximum Junction Temperature .................................................................................................. 150ºC
Storage Temperature Range ............................................................................................. -65ºC~150ºC
Lead Temperature (Soldering, 10 sec) ......................................................................................... 260ºC
Thermal Resistance (Junction to Case)
SOT-223 ............................................................... 15ºC /W
TO-252 .................................................................... 8ºC /W
TO-263 .................................................................... 3ºC /W
TO-220 .................................................................... 3ºC /W
SOP-8 (Exposed Pad*) ......................................... 15ºC /W
Thermal Resistance (Junction to Ambient) SOT-223 ............................................................. 130ºC /W
(Assume no ambient airflow, no heat sink) TO-252 ................................................................ 100ºC /W
TO-263 .................................................................. 60ºC /W
TO-220 .................................................................. 50ºC /W
(Assume no ambient airflow)
SOP-8 (Exposed Pad*) ........................................ 60ºC /W
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
* The package is placed on a two layers PCB with 2 ounces copper and 2 square inch, connected by 8 vias.
5
AIC1190
ELECTRICAL CHARACTERISTICS
(CIN = Cout = 2.2µF, CBP = 22nF, VIN = VOUT + 1V, TJ=25°°C, unless otherwise specified) (Note 1)
PARAMETER
TEST CONDITIONS
Input Voltage
Output Voltage Tolerance
IOUT = 1 mA
Continuous Output Current
Quiescent Current
GND Pin Current
Standby Current
Chip Enable Low, VEN
IOUT = 0 mA
Chip Enable High, VEN
IOUT = 0 mA
Chip Enable Low, VEN
IOUT = 1A
Chip Enable High, VEN
IOUT = 1A
≦0.4V,
≧1.6V,
≦0.4V,
≧1.6V,
=V
Chip Enable High, V = 0
R
= 0.1Ω
Chip Enable Low, VEN
IN
SYMBOL
MIN.
VIN
TYP.
MAX.
UNIT
2.3
6.0
V
VOUT
-2
2
%
IOUT
1.0
A
IQ
60
110
µA
IGND
60
110
µA
ISTBY
0.1
0.5
µA
EN
Output Current Limit
LOAD
IIL
1.1
1.6
IOUT = 1A, 0.8V<VOUT<2V
Dropout Voltage
IOUT = 1A, 2V<VOUT<2.8V
A
1500
VDROP
IOUT = 1A, VOUT>2.8V
500
900
440
700
mV
10
mV
20
mV
Line Regulation
VIN = VOUT + 1V to 6.0V
∆VLIR
Load Regulation
IOUT = 1mA to 1A
∆VLOR
1
Ripple Rejection (Note 2)
f=1KHz, Ripple=0.5Vp-p,
PSRR
70
dB
Output Noise Voltage
CBP = 22nF, f= 10~100KHz
24
µVrms
TC
50
ppm/
TSD
150
∆TSD
20
IADJ
10
100
nA
Temperature Coefficient
Thermal Shutdown
Temperature
VIN = VOUT + 1V
Thermal Shutdown
Hysteresis
℃
℃
ADJ Pin Specifications
ADJ Pin Current
VADJ = VREF
ADJ Pin Threshold
VTH(ADJ)
0.05
0.1
0.2
V
Reference Voltage
Tolerance
VREF
0.784
0.8
0.816
V
6
℃
AIC1190
ELECTRICAL CHARACTERISTICS (Continued)
PARAMETER
TEST CONDITIONS
SYMBOL
Shutdown Pin Current
VEN = VIN or GND
Shutdown Exit Delay Time
IOUT = 30mA
MIN.
TYP.
MAX.
UNIT
IEN
0
100
nA
∆t
100
RDSON_
CLMP
20
Shutdown Pin Specifications
Max Output Discharge
Resistance to GND during
Shutdown
Chip Enable Low, Output OFF,
VIN = 2.3V to 6.0V
Shutdown Input Threshold
Chip Enable High, Output ON,
VIN = 2.3V to 6.0V
Chip Enable Low, Output ON,
VIN = 2.3V to 6.0V
Chip Enable High, Output OFF,
VIN = 2.3V to 6.0V
VENH
µS
100
Ω
1.6
V
VENL
0.4
Note 1: Specifications are production tested at T =25°C. Specifications over the -40°C to 85°C operating
A
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
Note 2: Connecting a 22nF bypass capacitor to BP pin can improve AIC1190 PSRR in High frequency.
7
AIC1190
TYPICAL PERFORMANCE CHARACTERISTICS
2.0000
64
VIN=VOUT+1
VOUT=2.0V
1.9975
62
Output Voltage (V)
Supply Current (uA)
IOUT=90mA
60
VOUT=2.0V
58
56
VOUT=3.3V
54
1.9950
IOUT=10mA
1.9925
IOUT=1mA
1.9900
1.9875
52
1.9850
50
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.5
6.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Input Voltage (V)
Input Voltage (V)
Fig. 1 Supply Current vs. Input Voltage
Fig. 2 Output Voltage vs. Input Voltage
65
64
VIN=VOUT+1
VOUT=2.0V
64
63
VIN=VOUT+1
VOUT=2.0V
62
Quiescent Current (uA)
61
ILOAD=500mA
60
59
58
ILOAD=100mA
57
58
56
54
52
50
48
56
46
55
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
-40
-20
0
20
40
60
80
℃)
100
120
140
Temperature(
Supply Voltage (V)
Fig. 3 Ground Current
Fig. 4 Quiescent Current vs. Temperature
0.4
VIN=VOUT+1
VOUT=2.0V
0.2
Output Voltage Variation (%)
Ground Current (uA)
60
62
Input Voltage
0.0
-0.2
Output Voltage
-0.4
Input Current
-0.6
-40
-20
0
20
40
60
80
℃)
100
120
140
Temperature (
Fig. 5 Output Voltage vs. Temperature
Fig.6 Start-up waveform without bypass capacitance
8
AIC1190
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
CIN=COUT=2.2µF
CIN=COUT=2.2µF
EN
EN
Output Voltage
Output Voltage
VIN=4.5V, VOUT=3.3V and IOUT= 10mA
Fig.7 Shutdown Transient
VIN=4.5V, VOUT=3.3V and IOUT= 10mA
Fig. 8 Start-up waveform without bypass capacitor
CIN=COUT=2.2µF
CIN=COUT=2.2µF
Input Voltage
Output Voltage Ripple
Output Ripple
Output Current
Output Current
IOUT= 1mA to 1A
VIN=2.3~3.3V, VOUT=0.8V, I OUT =1000mA
Fig. 9 Line Transient
Fig.10 Load Transient Response at VIN=4.3V, VOUT=3.3V
CIN=COUT=2.2µF
Output Voltage Ripple
Output Current
CIN=COUT=2.2µF
Output Voltage Ripple
Output Current
IOUT= 1mA to 1A
Fig.11 Load Transient Response at VIN=2.3V, VOUT=0.8V
IOUT= 1mA to 1A
Fig.12 Load Transient Response at VIN=3.0V, VOUT=2.0V
9
AIC1190
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
1.0
Feedback Voltage (V)
0.8
0.6
0.4
0.2
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Foldback Current (A)
Fig. 13 Current Fold back (Vout<0.2V)
Fig. 14 PSRR Curve
10
AIC1190
BLOCK DIAGRAM
PIN DESCRIPTION
VIN
– Power supply input pin. Bypass with a 2.2µF capacitor to GND
GND
– Ground.
VOUT
– Regulator Output pin. Sources up to 1A.
EN (5 Pin and 8 Pin) – Chip Enable (Active Low). This pin isn’t allowed to float.
EN (5 Pin and 8 Pin) – Chip Enable (Active High). This pin isn’t allowed to float.
BP (5 Pin and 8 Pin) – Bypass pin. It can connect to external 22nF capacitor to GND to reduce output noise.
The bypass pin could be floating if it’s unnecessary (Keep floating cannot pull low and
pull high).
ADJ (5 Pin and 8 Pin) – The output voltage can either be set by the internal feedback resistors when this pin is
grounded, or be set by the external feedback resistors when using a resistive divider.
11
AIC1190
APPLICATION INFORMATION
The AIC1190 is a high performance linear regulator
voltage noise. The bypass pin can be floating if it’s
that provides low-dropout voltage and low quiescent-
unnecessary.
current. The device is available in an adjustable
version and fixed output voltages ranging from 1.2V to
3.8V, and the device can supply loads up to 1A.
OUTPUT VOLTAGE PROGRAMMING
The output voltage of AIC1190 linear regulator can be
set by its internal feedback resistors when the ADJ pin
SHUTDOWN
is grounded. In addition, the output voltage of AIC1190
By connecting EN(EN) pin to VIN(ground), the AIC1190
linear regulator can be set by the external feedback
can be shut down to reduce the supply current to
resistors when connecting a resistive divider R1 and R2.
0.1µA(typ.). At this operation mode, the output voltage
While connecting a resistive divider, VOUT can be
of AIC1190 is equal to 0V.
calculated as:
CURRENT LIMIT

R 
VOUT = 0.8 × 1 + 1 
 R2 
The AIC1190 includes a current limiter, which monitors
and controls the maximum output current. If the output
is overloaded or shorted to ground, this can protect the
The resistive divider should sit as close to ADJ pin as
possible.
device from being damaged.
POWER DISSIPATION
THERMAL PROTECTION
The maximum power dissipation of AIC1190 depends
The AIC1190 includes a thermal-limiting circuit, which
is designed to protect the device against overload
condition. When the junction temperature exceeds
TJ=150ºC, the thermal-limiting circuit turns off the pass
transistor and allows the IC to cool. For continuous
load condition, maximum rating of junction temperature
must not be exceeded.
on the thermal resistance of its case and circuit board,
the temperature difference between the die junction
and ambient air, and the rate of airflow. The rate of
temperature rise is greatly affected by the mounting
pad configuration on the PCB, the board material, and
the ambient temperature. When the IC mounting with
good thermal conductivity is used, the junction
temperature will be low even when large power
INPUT-OUTPUT CAPACITORS
dissipation applies.
Linear regulators require input and output capacitors to
The power dissipation across the device is
maintain stability. Input capacitor at 2.2µF with a 2.2µF
P = IOUT (VIN-VOUT)
ceramic output capacitor is recommended. To avoid
The maximum power dissipation is:
oscillation, it is recommended to follow the figure of
“Region of Stable COUT ESR vs. Load Current” to
choose proper capacitor specifications.
When
choosing
the
input
and
output
ceramic
capacitors, X5R and X7R types are recommended
because they retain their capacitance over wider
ranges of voltage and temperature than other types.
PMAX =
(TJ-max - TA )
Rθ JA
Where TJ-max is the maximum allowable junction
temperature
(150°C),
and
TA
is
the
ambient
temperature suitable in application.
As a general rule, the lower temperature is, the better
reliability of the device is. So the PCB mounting pad
NOISE BYPASS CAPACITOR
should provide maximum thermal conductivity to
A 22nF bypass capacitor at BP pin can reduce output
maintain low device temperature.
12
AIC1190
PHYSICAL DIMENSIONS
SOT-223 PACKAGE OUTLINE DRAWING
D
b2
1
E
A
A
E
SEE VIEW B
e
e1
b
WITH PLATING
2
A
A
BASE METAL
1
A
L
VIEW B
c
SECTION A-A
GAUGE PLANE
SEATING PLANE
θ
5
2
.
0
Note: 1. Refer to JEDEC TO-261AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
Y
M
B
O
L
SOT-223
MILLIMETERS
MIN.
MAX.
A
1.80
A1
0.02
0.10
A2
1.55
1.65
b
0.66
0.84
b2
2.90
3.10
c
0.23
0.33
D
6.30
6.70
E
6.70
7.30
E1
3.30
e
e1
L
θ
3.70
2.30 BSC
4.60 BSC
0.90
0°
8°
13
AIC1190
TO-252-3L PACKAGE OUTLINE DRAWING
E
A
c2
b3
3L
D
H
4L
A
A
e
SEE VIEW B
b
WITH PLATING
BASE METAL
c
SECTION A-A
θ
GAUGE PLANE
2L
SEATING PLANE
L
L1
VIEW B
1A
Note: 1. Refer to JEDEC TO-252AA and AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
Y
M
B
O
L
A
A1
b
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
θ
MIN.
2.19
0.00
0.64
4.95
0.46
0.46
5.33
6.35
9.40
1.40
0.89
-0°
TO-252-3L
MILLIMETERS
2.28 BSC
2.67 REF
0.51 BSC
MAX.
2.38
0.13
0.89
5.46
0.61
0.89
6.22
6.73
10.41
1.78
2.03
1.02
8°
14
AIC1190
TO-252-5L PACKAGE OUTLINE DRAWING
E
A
c2
b3
3L
D
e
H
A
A
SEE VIEW B
b
WITH PLATING
c
BASE METAL
SECTION A-A
S
Y
M
B
O
L
θ
GAUGE PLANE
L
2L
SEATING PLANE
L1
VIEW B
1
A
Note: 1. Refer to JEDEC TO-252AD and AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
TO-252-5L
MILLIMETERS
MIN.
MAX.
A
2.19
2.38
A1
0.00
0.13
b
0.51
0.71
b3
4.32
5.46
c
0.46
0.61
c2
0.46
0.89
D
5.33
6.22
E
6.35
e
6.73
1.27 BSC
H
9.40
L
1.40
L1
10.41
1.78
2.67 REF
L2
0.51 BSC
L3
0.89
2.03
q
0°
8°
15
AIC1190
TO-263-3L PIN PACKAGE OUTLINE DRAWING
A
c2
E
1
L
D
H
2
L
A
A
b2
SEE VIEW B
e
b
WITH PLATING
c
BASE METAL
SECTION A-A
θ
S
Y
M
B
O
L
GAUGE PLANE
L
3
L
VIEW B
SEATING PLANE
1
A
Note: 1. Refer to JEDEC TO-263AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
TO-263-3L
MILLIMETERS
MIN.
MAX.
A
4.06
4.83
A1
0.00
0.25
b
0.51
0.99
b2
1.14
1.78
c
0.38
0.74
c2
1.14
1.65
D
8.38
9.65
E
9.65
10.67
e
2.54 BSC
H
14.61
15.88
L
L1
1.78
--
1.68
L2
--
1.78
0.25 BSC
L3
q
2.79
0°
8°
16
AIC1190
TO-263-5L PACKAGE OUTLINE DRAWING
A
c2
E
1L
D
H
A
A
e
SEE VIEW B
b
WITH PLATING
c
BASE METAL
SECTION A-A
θ
GAUGE PLANE
L
3
L
VIEW B
SEATING PLANE
1
A
Note: 1. Refer to JEDEC TO-263BA.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
Y
M
B
O
L
TO-263-5L
MILLIMETERS
MIN.
MAX.
A
4.06
4.83
A1
0.00
0.25
b
0.51
0.99
c
0.38
0.74
c2
1.14
1.65
D
8.38
9.65
E
9.65
10.67
e
1.70 BSC
H
14.61
15.88
L
1.78
--
1.68
L1
0.25 BSC
L3
q
2.79
0°
8°
17
AIC1190
TO-220 PACKAGE OUTLINE DRAWING
A
E
A1
Q
P
1
H
D
1
D
b
WITH PLATING
BASE METAL
1L
c
SECTION A-A
L
A
b2
e
A
A2
S
Y
M
B
O
L
Note: 1. Refer to JEDEC TO-220AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
TO-220
MILLIMETERS
MIN.
MAX.
A
3.56
4.82
A1
0.51
1.39
A2
2.04
2.92
b
0.38
1.01
b2
1.15
1.77
c
0.35
0.61
D
14.23
16.51
D1
8.38
9.02
E
9.66
10.66
2.54 BSC
e
H1
5.85
6.85
L
14.73
L1
12.70
--
P
3.54
4.08
Q
2.54
3.42
6.35
18
AIC1190
SOP-8 Exposed Pad PACKAGE OUTLINE DRAWING
D
D1
E X P O S E D T H E R M A L P A D (H e a t S in k )
(B O T T O M C E N T E R O F P A C K A G E )
E1
e
A
E
H
5°4
X
h
A
S E E V IE W B
A
B
1A
W IT H P L A T IN G
BASE M ETAL
25.
0
S E C T IO N A -A
GAUG E PLAN E
S E A T IN G P L A N E
S
Y
M
B
O
L
θ
L
V IE W B
C
Note : 1. Refer to JEDEC MS-012E.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
SOP-8 Exposed Pad(Heat Sink)
MILLIMETERS
MIN.
MAX.
A
1.35
1.75
A1
0.00
0.15
B
0.31
0.51
C
0.17
0.25
D
4.80
5.00
E
3.80
e
4.00
1.27 BSC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
q
0°
8°
D1
E1
1.5
1.0
3.5
2.55
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry
other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result
from its use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or
systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a
significant injury to the user.
19
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