CYStech Electronics Corp. Spec. No. : C376A3 Issued Date : 2017.07.25 Revised Date : Page No. : 1/6 NPN Digital Transistors (Built-in Resistors) DTC144WBA3 Features • Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors (see equivalent circuit). • The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing of the input. They also have the advantage of almost completely eliminating parasitic effects. • Only the on/off conditions need to be set for operation, making device design easy. • Complements the DTA144WA3 • Pb-free lead plating and Halogen-free package Equivalent Circuit DTC144WBA3 R1=47kΩ , R2=22 kΩ IN(B) : Base OUT(C) : Collector GND(E) : Emitter DTC144WBA3 Outline TO-92 ECB CYStek Product Specification CYStech Electronics Corp. Spec. No. : C376A3 Issued Date : 2017.07.25 Revised Date : Page No. : 2/6 Ordering Information Device DTC144WBA3-0-TB-G DTC144WBA3-0-BK-G Package TO-92 (Pb-free lead plating and halogen-free package) TO-92 (Pb-free lead plating and halogen-free package) Shipping 2000 pcs / Tape & Box 1000 pcs/ bag, 10 bags/box, 10boxes/carton Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, TB :2000 pcs/tape & box; BK: 1000 pcs / bag, 10 bags/box, 10 boxes/carton Product rank, zero for no rank products Product name Absolute Maximum Ratings (Ta=25°C) Parameter Symbol VCC VCBO VCEO VEBO VI IO IO(max.) PD RθJA Tj Tstg Tamb Supply Voltage Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Input Voltage Output Current Power Dissipation @ TA=25°C Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature Operating Ambient Temperature Limits 50 50 50 10 -10~+40 100 100 500 250 150 -65~+150 -65~+150 Unit V V V V V mA mA mW °C/W °C °C °C Electrical Characteristics (Ta=25°C) Parameter Input Voltage Output Voltage Input Current Output Current Collector Base Cutoff Current Collector Emitter Cutoff Current DC Current Gain Input Resistance Resistance Ratio Transition Frequency Symbol VI(off) VI(on) VO(on) II IO(off) Min. 4 - Typ. 1.7 2.4 57 - Max. 1.2 150 0.16 0.5 Unit V V mV mA μA Test Conditions VCC=5V, IO=100μA VO=0.3V, IO=2mA IO=10mA, II=0.5mA VI=5V VCC=50V, VI=0V ICBO - - 100 nA VCB=50V, IE=0A ICEO - - 500 nA VCE=50V, IB=0A HFE R1 R2/R1 fT 60 32.9 0.37 - 47 0.47 250 61.1 0.57 - kΩ MHz VCE=5V, IC=5mA VCE=10V, IC=5mA, f=100MHz * * Transition frequency of the device DTC144WBA3 CYStek Product Specification Spec. No. : C376A3 Issued Date : 2017.07.25 Revised Date : Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics Current Gain vs Output Current Output Voltage vs Output Current 10000 1000 Output Voltage---VO(mV) Current Gain---H FE VCE = 5V 100 10 1000 1 100 10 0.1 1 10 1 100 10 100 Output Current---I O(mA) Output Current---IO(mA) Input Voltage vs Output Current(ON characteristics) Output Current vs Input Voltage(OFF characteristics) 10 10 VCC = 5V Output Current---I O(mA) Input Voltage---V I(ON) (V) VO = 0.3V 1 1 0.1 0.01 0.1 1 Output Current---I O(mA) 10 0 1 2 3 4 Input Voltage---VI(OFF)(V) Power Derating Curve Power Dissipation---P D(mW) 600 500 400 300 200 100 0 0 50 100 150 200 Ambient Temperature---TA(℃) DTC144WBA3 CYStek Product Specification Spec. No. : C376A3 Issued Date : 2017.07.25 Revised Date : Page No. : 4/6 CYStech Electronics Corp. TO-92 Taping Outline H2 H2A H2A H2 D2 A L H3 H4 H L1 H1 D1 F1F2 T2 T T1 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - DTC144WBA3 P1 P Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch W1 W D P2 Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C376A3 Issued Date : 2017.07.25 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 265 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 265 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. DTC144WBA3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C376A3 Issued Date : 2017.07.25 Revised Date : Page No. : 6/6 TO-92 Dimension α2 A Marking: B 1 2 3 C144WB Date Code α3 C □□ D H I G α1 Style: Pin 1.Emitter 2.Collector 3.Base E F 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. DTC144WBA3 CYStek Product Specification