CY2308 3.3 V Zero Delay Buffer 3.3 V Zero Delay Buffer Features The CY2308 has two banks of four outputs each that is controlled by the select inputs as shown in the table Select Input Decoding on page 3. If all output clocks are not required, Bank B is three-stated. The input clock is directly applied to the output for chip and system testing purposes by the select inputs. ■ Zero input-output propagation delay, adjustable by capacitive load on FBK input ■ Multiple configurations, see Available CY2308 Configurations on page 4 for more details ■ Multiple low skew outputs ■ Two banks of four outputs, three-stateable by two select inputs ■ 10 MHz to 133 MHz operating range ■ 75 ps typical cycle-to-cycle jitter (15 pF, 66 MHz) ■ Space saving 16-pin 150 mil SOIC package or 16-pin TSSOP ■ 3.3 V operation The CY2308 is available in five different configurations as shown in the table Available CY2308 Configurations on page 4. ■ Industrial temperature available ■ The CY2308-1 is the base part where the output frequencies equal the reference if there is no counter in the feedback path. The CY2308-1H is the high drive version of the -1 and rise and fall times on this device are much faster. ■ The CY2308-2 enables the user to obtain 2x and 1x frequencies on each output bank. The exact configuration and output frequencies depend on the user’s selection of output that drives the feedback pin. ■ The CY2308-3 enables the user to obtain 4x and 2x frequencies on the outputs. ■ The CY2308-4 enables the user to obtain 2x clocks on all outputs. Thus, the part is extremely versatile and is used in a variety of applications. ■ The CY2308-5H is a high drive version with REF/2 on both banks. The CY2308 PLL enters a power down state when there are no rising edges on the REF input. In this mode, all outputs are three-stated and the PLL is turned off resulting in less than 25 A of current draw. The PLL shuts down in two additional cases as shown in the table Select Input Decoding on page 3. Multiple CY2308 devices accept the same input clock and distribute it in a system. In this case, the skew between the outputs of two devices is less than 700 ps. Functional Description The CY2308 is a 3.3 V Zero Delay Buffer designed to distribute high speed clocks in PC, workstation, datacom, telecom, and other high performance applications. The part has an on-chip PLL that locks to an input clock presented on the REF pin. The PLL feedback is driven from external FBK pin, so user has flexibility to choose any one of the outputs as feedback input and connect it to FBK pin. The input-to-output skew is less than 250 ps and output-to-output skew is less than 200 ps. Logic Block Diagram /2 REF PLL FBK MUX /2 CLKA1 CLKA2 Extra Divider (–3, –4) CLKA3 Extra Divider (–5H) CLKA4 S2 Select Input Decoding S1 /2 CLKB1 CLKB2 CLKB3 Extra Divider (–2, –3) Cypress Semiconductor Corporation Document Number: 38-07146 Rev. *M • 198 Champion Court CLKB4 • San Jose, CA 95134-1709 • 408-943-2600 Revised October 11, 2011 [+] Feedback CY2308 Contents Pinouts .............................................................................. 3 Pin Definitions - 16-pin SOIC ........................................... 3 Select Input Decoding ...................................................... 3 Available CY2308 Configurations ................................... 4 Zero Delay and Skew Control .......................................... 4 Maximum Ratings ............................................................. 5 Operating Conditions for Commercial Temperature Devices .................................. 5 Electrical Characteristics for Commercial Temperature Devices .................................. 5 Switching Characteristics for Commercial Temperature Devices .................................. 6 Operating Conditions for Industrial Temperature Devices ...................................... 7 Electrical Characteristics for Industrial Temperature Devices ...................................... 7 Switching Characteristics for Industrial Temperature Devices ...................................... 8 Document Number: 38-07146 Rev. *M Switching Waveforms ...................................................... 9 Typical Duty Cycle and IDD Trends .............................. 10 Typical Duty Cycle and IDD Trends .............................. 11 Test Circuits .................................................................... 12 Ordering Information ...................................................... 13 Ordering Code Definitions ......................................... 14 Package Diagrams .......................................................... 15 Acronyms ........................................................................ 16 Document Conventions ................................................. 16 Units of Measure ....................................................... 16 Document History Page ................................................. 17 Sales, Solutions, and Legal Information ...................... 18 Worldwide Sales and Design Support ....................... 18 Products .................................................................... 18 PSoC Solutions ......................................................... 18 Page 2 of 18 [+] Feedback CY2308 Pinouts Figure 1. Pin Diagram - 16-pin SOIC (Top View) REF CLKA1 1 16 2 15 CLKA2 VDD 3 14 4 13 GND CLKB1 CLKB2 S2 5 12 6 11 7 10 8 9 FBK CLKA4 CLKA3 VDD GND CLKB4 CLKB3 S1 Pin Definitions - 16-pin SOIC Pin Signal [1] Description 1 REF 2 CLKA1 [2] Clock output, Bank A 3 CLKA2 [2] Clock output, Bank A 4 VDD 5 GND 6 7 8 9 Input reference frequency Power supply voltage Power supply ground CLKB1 [2] Clock output, Bank B CLKB2 [2] Clock output, Bank B S2 [3] S1 [3] Select input, bit 2 Select input, bit 1 CLKB3 [2] 11 CLKB4 [2] 12 GND Power supply ground 13 VDD Power supply voltage 14 CLKA3 [2] Clock output, Bank A 15 CLKA4 [2] Clock output, Bank A 16 FBK 10 Clock output, Bank B Clock output, Bank B PLL feedback input Select Input Decoding S2 S1 CLOCK A1–A4 CLOCK B1–B4 Output Source PLL Shutdown 0 0 Tri-state Tri-state PLL Y 0 1 Driven Tri-state PLL N 1 0 Driven [4] Driven [4] Reference Y 1 1 Driven Driven PLL N Notes 1. Weak pull down. 2. Weak pull down on all outputs. 3. Weak pull ups on these inputs. 4. Outputs inverted and PLL bypass mode for 2308-2 and 2308-3, S2 = 1 and S1 = 0. Document Number: 38-07146 Rev. *M Page 3 of 18 [+] Feedback CY2308 Available CY2308 Configurations Feedback From [5] Device Bank A Frequency Bank B Frequency CY2308-1 Bank A or Bank B Reference Reference CY2308-1H Bank A or Bank B Reference Reference CY2308-2 Bank A Reference Reference / 2 CY2308-2 Bank B 2 × Reference Reference CY2308-3 Bank A 2 × Reference Reference [6] CY2308-3 Bank B 4 × Reference 2 × Reference CY2308-4 Bank A or Bank B 2 × Reference 2 × Reference CY2308-5H Bank A or Bank B Reference / 2 Reference / 2 Zero Delay and Skew Control Figure 2. REF. Input to CLKA/CLKB Delay Versus Difference in Loading between FBK Pin and CLKA/CLKB Pins To close the feedback loop of the CY2308, the user has to connect any one of the eight available output pins to FBK pin. The output driving the FBK pin drives a total load of 7 pF plus any additional load that it drives. The relative loading of this output to the remaining outputs adjusts the input-output delay as shown in the Figure 2. For applications requiring zero input-output delay, all outputs including the one providing feedback is equally loaded. If input-output delay adjustments are required, use the Zero Delay and Skew Control graph to calculate loading differences between the feedback output and remaining outputs. For zero output-output skew, outputs are loaded equally. For further information on using CY2308, refer to the application note CY2308: Zero Delay Buffer-AN1234. Notes 5. User has to select one of the available outputs that drive the feedback pin and need to connect selected output pin to FBK pin externally. 6. Output phase is indeterminant (0 ° or 180 ° from input clock). If phase integrity is required, use CY2308-2. Document Number: 38-07146 Rev. *M Page 4 of 18 [+] Feedback CY2308 Maximum Ratings DC input voltage REF .......................................–0.5 V to 7 V Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Supply voltage to ground potential ..............–0.5 V to +7.0 V DC input voltage (except REF) ........... –0.5 V to VDD + 0.5 V Storage temperature ................................ –65 °C to +150 °C Junction temperature ................................................. 150 °C Static discharge voltage (MIL-STD-883, Method 3015) .................................. >2000 V Operating Conditions for Commercial Temperature Devices Parameter Description Min Max Unit 3.0 3.6 V VDD Supply voltage TA Operating temperature (ambient temperature) 0 70 °C CL Load capacitance, below 100 MHz – 30 pF Load capacitance, from 100 MHz to 133 MHz – 15 pF CIN Input capacitance [7] – 7 pF tPU Power up time for all VDD’s to reach minimum specified voltage (power ramps must be monotonic) 0.05 50 ms Min Max Unit – 0.8 V Electrical Characteristics for Commercial Temperature Devices Parameter Description VIL Input LOW voltage VIH Input HIGH voltage IIL Input LOW current IIH VOL VOH Test Conditions 2.0 – V VIN = 0 V – 50.0 A Input HIGH current VIN = VDD – 100.0 A Output LOW voltage [8] IOL = 8 mA (-1, -2, -3, -4) IOL = 12 mA (-1H, -5H) – 0.4 V Output HIGH voltage [8] IOH = –8 mA (-1, -2, -3, -4) IOH = –12 mA (-1H, -5H) 2.4 – V 12.0 A IDD (PD mode) Power down supply current REF = 0 MHz – IDD Unloaded outputs, 100 MHz REF, select inputs at VDD or GND – 45.0 mA – 70.0 (-1H, -5H) mA Unloaded outputs, 66 MHz REF (-1, -2, -3, -4) – 32.0 mA Unloaded outputs, 33 MHz REF (-1, -2, -3, -4) – 18.0 mA Supply current Notes 7. Applies to both Ref clock and FBK. 8. Parameter is guaranteed by design and characterization. Not 100% tested in production. Document Number: 38-07146 Rev. *M Page 5 of 18 [+] Feedback CY2308 Switching Characteristics for Commercial Temperature Devices Parameter [9] Min Typ Max Unit Fin Input frequency – 10 – 133.3 MHz t1 Output frequency 30 pF load 10 – t1 Output frequency 20 pF load, -1H, -5H devices 10 – 133.3 (-1H) 66.67 (-5H) MHz t1 Output frequency 15 pF load, -1, -2, -3, -4 devices 10 – 133.3 MHz tPD Duty cycle [9] = t2 t1 (-1, -2, -3, -4, -1H, -5H) Measured at 1.4 V, FOUT = 66.66 MHz, 30 pF load 40.0 50.0 60.0 % tPD Duty cycle [9] = t2 t1 (-1, -2, -3, -4, -1H, -5H) Measured at 1.4 V, FOUT < 50 MHz, 15 pF load 45.0 50.0 55.0 % t3 Rise time [9] (-1, -2, -3, -4) Measured between 0.8 V and 2.0 V, 30 pF load – – 2.20 ns t3 Rise time [9] (-1, Measured between 0.8 V and 2.0 V, 15 pF load – – 1.50 ns Rise time [9] (-1H, t3 t4 Name Test Conditions -2, -3, -4) 100 (-1, -2, -3, -4) MHz 66.67 (-5H) -5H) Measured between 0.8 V and 2.0 V, 30 pF load – – 1.50 ns Fall time [9] (-1, -2, -3, -4) Measured between 0.8 V and 2.0 V, 30 pF load – – 2.20 ns -2, -3, -4) Measured between 0.8 V and 2.0 V, 15 pF load – – 1.50 ns Measured between 0.8 V and 2.0 V, 30 pF load – – 1.25 ns Fall time [9] (-1, t4 Fall time [9] (-1H, t5 Output to output skew on same Bank [9] (-1, -2, -3, -4) All outputs equally loaded – – 200 ps Output to output skew (-1H, -5H) All outputs equally loaded – – 200 ps Output Bank A to output Bank All outputs equally loaded B skew (-1, -4, -5H) – – 200 ps Output Bank A to output Bank All outputs equally loaded B skew (-2, -3) – – 400 ps t6 Delay, REF rising edge to FBK rising edge [9] Measured at VDD/2 – 0 ±250 ps t7 Device to device skew [9] Measured at VDD/2 on the FBK pins of devices – 0 700 ps Measured between 0.8 V and 2.0 V on -1H, -5H device using Test Circuit 2 1 – – V/ns Measured at 66.67 MHz, loaded outputs, 15 pF load – 75 200 ps Measured at 66.67 MHz, loaded outputs, 30 pF load – – 200 ps Measured at 133.3 MHz, loaded outputs, 15 pF load – – 100 ps Cycle to cycle Jitter [9] (-2, -3) Measured at 66.67 MHz, loaded outputs, 30 pF load – – 400 ps Measured at 66.67 MHz, loaded outputs, 15 pF load – – 400 ps Stable power supply, valid clocks presented on REF and FBK pins – – 1.0 ms t4 -5H) [9] t8 Output slew rate tJ Cycle to cycle Jitter [9] (-1, -1H, -4, -5H) tJ tLOCK PLL lock time [9] Note 9. All parameters are specified with loaded outputs. Document Number: 38-07146 Rev. *M Page 6 of 18 [+] Feedback CY2308 Operating Conditions for Industrial Temperature Devices Min Max Unit VDD Parameter Supply voltage Description 3.0 3.6 V TA Operating temperature (ambient temperature) –40 85 °C CL Load capacitance, below 100 MHz – 30 pF Load capacitance, from 100 MHz to 133 MHz – 15 pF – 7 pF 0.05 50 ms Min Max Unit [10] CIN Input capacitance tPU Power up time for all VDDs to reach minimum specified voltage (power ramps must be monotonic) Electrical Characteristics for Industrial Temperature Devices Parameter Description Test Conditions VIL Input LOW voltage – 0.8 V VIH Input HIGH voltage 2.0 – V IIL Input LOW current VIN = 0 V – 50.0 A IIH Input HIGH current VIN = VDD – 100.0 A IOL = 8 mA (-1, -2, -3, -4) IOL = 12 mA (-1H, -5H) – 0.4 V 2.4 – V [11, 12] VOL Output LOW voltage VOH Output HIGH voltage [11, 12] IOH = –8 mA (-1, -2, -3, -4) IOH = –12 mA (-1H, -5H) IDD (PD mode) Power down supply current REF = 0 MHz – 25.0 A IDD Unloaded outputs, 100 MHz, Select inputs at VDD or GND – 45.0 mA – 70 (-1H, -5H) mA Unloaded outputs, 66 MHz REF (-1, -2, -3, -4) – 35.0 mA Unloaded outputs, 66 MHz REF (-1, -2, -3, -4) – 20.0 mA Supply current Notes 10. Applies to both Ref clock and FBK. 11. Parameter is guaranteed by design and characterization. Not 100% tested in production. 12. All parameters are specified with loaded outputs. Document Number: 38-07146 Rev. *M Page 7 of 18 [+] Feedback CY2308 Switching Characteristics for Industrial Temperature Devices Parameter [13] Name Test Conditions Min Typ Max Unit 133.3 MHz Fin Input frequency – 10 – t1 Output frequency 30 pF load 10 – t1 Output frequency 20 pF load, -1H, -5H devices 10 – 133.3 (-1H) 66.67 (-5H) MHz t1 Output frequency 15 pF load, -1, -2, -3, -4 devices 10 – 100 (-1,-2,-3,-4) MHz 66.67 (-5H) 133.3 MHz Duty cycle = t2 t1 (-1, -2, -3, -4, -1H, -5H) Measured at 1.4 V, FOUT = 66.66 MHz, 30 pF load 40.0 50.0 60.0 % tPD Duty cycle [13, 14] = t2 t1 (-1, -2, -3, -4, -1H, -5H) Measured at 1.4 V, FOUT < 50 MHz, 15 pF load 45.0 50.0 55.0 % t3 Rise time [13, 14] (-1, -2, -3, -4) Measured between 0.8 V and 2.0 V, 30 pF load – – 2.50 ns t3 Rise time [13, 14] (-1, Measured between 0.8 V and 2.0 V, 15 pF load – – 1.50 ns Rise time [13, 14] (-1H, – – 1.50 ns tPD t3 t4 t4 [13, 14] -2, -3, -4) -5H) Measured between 0.8 V and 2.0 V, 30 pF load Fall time [13, 14] (-1, -2, -3, -4) Measured between 0.8 V and 2.0 V, 30 pF load – – 2.50 ns Fall time [13, 14] (-1, -2, -3, -4) Measured between 0.8 V and 2.0 V, 15 pF load – – 1.50 ns Fall time [13, 14] (-1H, Measured between 0.8 V and 2.0 V, 30 pF load – – 1.25 ns All outputs equally loaded – – 200 ps Output to output skew (-1H, -5H) All outputs equally loaded – – 200 ps Output Bank A to output Bank B All outputs equally loaded skew (-1, -4, -5H) – – 200 ps Output Bank A to output Bank B All outputs equally loaded skew (-2, -3) – – 400 ps t6 Delay, REF rising edge to FBK Measured at VDD/2 rising edge [13, 14] – 0 250 ps t7 Device to device skew [13, 14] Measured at VDD/2 on the FBK pins of devices – 0 700 ps Measured between 0.8 V and 2.0 V on -1H, -5H device using Test Circuit 2 1 – – V/ns Measured at 66.67 MHz, loaded outputs, 15 pF load – 75 200 ps Measured at 66.67 MHz, loaded outputs, 30 pF load – – 200 ps Measured at 133.3 MHz, loaded outputs, 15 pF load – – 100 ps Measured at 66.67 MHz, loaded outputs, 30 pF load – – 400 ps Measured at 66.67 MHz, loaded outputs, 15 pF load – – 400 ps Stable power supply, valid clocks presented on REF and FBK pins – – 1.0 ms t4 t5 -5H) Output to output skew on same Bank [13, 14] (-1, -2, -3, -4) [13, 14] t8 Output slew rate tJ Cycle to cycle Jitter [13, 14] (-1, -1H, -4, -5H) tJ tLOCK Cycle to cycle Jitter [13, 14] (-2, -3) PLL lock time [13, 14] Notes 13. All parameters are specified with loaded outputs. 14. Parameter is guaranteed by design and characterization. Not 100% tested in production. Document Number: 38-07146 Rev. *M Page 8 of 18 [+] Feedback CY2308 Switching Waveforms Figure 3. Duty Cycle Timing t1 t2 1.4V 1.4V 1.4V Figure 4. All Outputs Rise/Fall Time OUTPUT 2.0V 0.8V 2.0V 0.8V 3.3V 0V t4 t3 Figure 5. Output-Output Skew 1.4V OUTPUT 1.4V OUTPUT t5 Figure 6. Input-Output Propagation Delay VDD/2 INPUT VDD/2 FBK t6 Figure 7. Device-Device Skew VDD/2 FBK, Device 1 VDD/2 FBK, Device 2 t7 Document Number: 38-07146 Rev. *M Page 9 of 18 [+] Feedback CY2308 Typical Duty Cycle and IDD Trends For CY2308-1, 2, 3, 4 [15, 16] Duty Cycle Vs VDD (for 15 pF Loads over Frequency - 3.3V, 25C) 60 60 58 58 56 56 54 52 33 MHz 50 66 MHz 48 100 MHz 46 Duty Cycle (% ) Duty Cycle (% ) Duty Cycle Vs VD D (for 30 pF Loads over Frequency - 3.3V, 25C) 54 66 MHz 50 100 MHz 48 133 MHz 46 44 44 42 42 40 33 MHz 52 40 3 3.1 3.2 3.3 3.4 3.5 3.6 3 3.1 3.2 VDD (V) 3.4 3.5 3.6 Duty C ycle Vs Fre que ncy (for 15 pF Loads ov e r T e mpe rature - 3.3V) Duty Cycle Vs Fre que ncy (for 30 pF Loads ov e r T e mpe rature - 3.3V) 60 60 58 58 56 54 -40C 52 0C 50 25C 48 70C 46 85C Duty Cycle (%) 56 Duty Cycle (%) 3.3 VDD (V) 54 -40C 52 0C 50 25C 48 70C 46 85C 44 44 42 42 40 40 20 40 60 80 100 120 140 20 40 60 Fre que ncy (M Hz) 80 100 120 140 Fre que ncy (M Hz) IDD vs Number of Loaded Outputs (for 30 pF Loads over Frequency - 3.3V, 25C) IDD vs Number of Loaded Outputs (for 15 pF Loads over Frequency - 3.3V, 25C) 140 140 120 120 100 100 80 33 M Hz 66 M Hz 60 80 33 M Hz 60 66 M Hz 100 M Hz 40 40 20 20 100 M Hz 0 0 0 2 4 6 N umb er o f Lo ad ed Out p ut s 8 0 2 4 6 8 N umb er o f Lo ad ed Out p ut s Notes 15. Duty cycle is taken from typical chip measured at 1.4 V. 16. IDD data is calculated from IDD = ICORE + nCVf, where ICORE is the unloaded current. (n = number of outputs; C = Capacitance load per output (F); V = Voltage supply (V); f = frequency (Hz). Document Number: 38-07146 Rev. *M Page 10 of 18 [+] Feedback CY2308 Typical Duty Cycle and IDD Trends For CY2308-1H, 5H [17, 18] Duty Cycle Vs VDD (for 15 pF Loads over Frequency - 3.3V, 25C) 60 60 58 58 56 56 54 52 33 MHz 50 66 MHz 48 100 MHz 46 Duty Cycle (% ) Duty Cycle (% ) Duty Cycle Vs VD D (for 30 pF Loads over Frequency - 3.3V, 25C) 54 33 MHz 52 66 MHz 50 100 MHz 48 133 MHz 46 44 44 42 42 40 40 3 3.1 3.2 3.3 3.4 3.5 3 3.6 3.1 3.2 Duty C ycle Vs Fre que ncy (for 30 pF Loads ov e r T e mpe rature - 3.3V) 3.4 3.5 3.6 Duty Cycle Vs Fre que ncy (for 15 pF Loads ov e r T e mpe rature - 3.3V) 60 60 58 58 56 56 54 -40C 52 0C 50 25C 48 70C 46 85C Duty Cycle (%) Duty Cycle (%) 3.3 VDD (V) VDD (V) 54 -40C 52 0C 50 25C 48 70C 46 85C 44 44 42 42 40 40 20 40 60 80 100 120 140 20 40 60 Fre que ncy (M Hz) 80 100 120 140 Fre que ncy (M Hz ) IDD vs Number of Loaded Outputs (for 30 pF Loads over Frequency - 3.3V, 25C) IDD vs Number of Loaded Outputs (for 15 pF Loads over Frequency - 3.3V, 25C) 140 140 120 120 100 100 80 60 33 MHz 80 66 MHz 60 100 MHz 40 33 MHz 66 MHz 100 MHz 40 20 20 0 0 0 2 4 6 N u m b e r o f L o a d e d Ou t p u t s 8 0 2 4 6 8 N u m b e r o f L o a d e d Ou t p u t s Notes 17. Duty cycle is taken from typical chip measured at 1.4 V. 18. IDD data is calculated from IDD = ICORE + nCVf, where ICORE is the unloaded current. (n = number of outputs; C = Capacitance load per output (F); V = Voltage supply (V); f = frequency (Hz). Document Number: 38-07146 Rev. *M Page 11 of 18 [+] Feedback CY2308 Test Circuits Test Circuit 1 Test Circuit 2 VDD V DD 0.1 F Outputs CLK OUT 0.1 F GND Test Circuit for all parameters except t8 Document Number: 38-07146 Rev. *M CLK out 10 pF V DD V DD GND Outputs 1 k C LOAD 0.1 F 1 k 0.1 F GND GND Test Circuit for t8, Output slew rate on -1H, -5H device Page 12 of 18 [+] Feedback CY2308 Ordering Information Ordering Code Package Type Operating Range CY2308SI-1T [19] 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308ZI-1H [19] 16-pin 4.4 mm TSSOP Industrial 16-pin 4.4 mm TSSOP - Tape and Reel Industrial 16-pin 150 mil SOIC Industrial 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308ZI-1HT CY2308SI-2 [19] [19] CY2308SI-2T [19] Pb-free CY2308SXC-1 16-pin 150 mil SOIC Commercial CY2308SXC-1T 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI-1 16-pin 150 mil SOIC Industrial CY2308SXI-1T 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308SXC-1H 16-pin 150 mil SOIC Commercial CY2308SXC-1HT 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI-1H 16-pin 150 mil SOIC Industrial CY2308SXI-1HT 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308ZXC-1H 16-pin 4.4 mm TSSOP Commercial CY2308ZXC-1HT 16-pin 4.4 mm TSSOP - Tape and Reel Commercial CY2308ZXI-1H 16-pin 4.4 mm TSSOP Industrial CY2308ZXI-1HT 16-pin 4.4 mm TSSOP - Tape and Reel Industrial CY2308SXC-2 16-pin 150 mil SOIC Commercial CY2308SXC-2T 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI-2 16-pin 150 mil SOIC Industrial CY2308SXI-2T 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308SXC-3 16-pin 150 mil SOIC Commercial CY2308SXC-3T 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI-3 16-pin 150 mil SOIC Industrial CY2308SXI-3T 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308SXC-4 16-pin 150 mil SOIC Commercia CY2308SXC-4T 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI-4 16-pin 150 mil SOIC Industrial CY2308SXI-4T 16-pin 150 mil SOIC - Tape and Reel Industrial Note 19. Not recommended for new designs. Document Number: 38-07146 Rev. *M Page 13 of 18 [+] Feedback CY2308 Ordering Code Definitions CY 2308 X X X - X X X = T or blank T = Tape and Reel; blank = Tube Dash or Variant Code Temperature Range: X = C or I C = Commercial = 0 °C to +70 °C; I = Industrial = –40 °C to +85 °C X = Pb-free, blank = leaded Package Type: X = S or Z S = 16-pin SOIC, Z = 16-pin TSSOP Part Identifier Company ID: CY = Cypress Document Number: 38-07146 Rev. *M Page 14 of 18 [+] Feedback CY2308 Package Diagrams Figure 8. 16-pin SOIC (150 Mil) S16.15 Package Outline, 51-85068 51-85068 *D Figure 9. 16-pin TSSOP 4.40 mm Body Z16.173 Package Outline, 51-85091 51-85091 *D Document Number: 38-07146 Rev. *M Page 15 of 18 [+] Feedback CY2308 Acronyms Table 1. Acronyms Used in this Document Acronym Description FBK feedback PLL phase locked loop MUX multiplexer Document Conventions Units of Measure Table 2. Units of Measure Symbol °C Unit of Measure Symbol Unit of Measure degrees Celsius µW microwatt dB decibels mA milliampere fC femtocoulomb mm millimeter fF femtofarad ms millisecond Hz hertz mV millivolt KB 1024 bytes nA nanoampere Kbit 1024 bits ns nanosecond kHz kilohertz nV nanovolt k kilohm ohm MHz megahertz pA picoampere M megaohm pF picofarad µA microampere pp peak-to-peak µF microfarad ppm parts per million µH microhenry ps picosecond µs microsecond sps samples per second µV microvolt sigma: one standard deviation µVrms microvolts root-mean-square Document Number: 38-07146 Rev. *M Page 16 of 18 [+] Feedback CY2308 Document History Page Document Title: CY2308, 3.3 V Zero Delay Buffer Document Number: 38-07146 Rev. ECN Orig. of Change Submission Date Description of Change ** 110255 SZV 12/17/01 Changed from Specification number: 38-00528 to 38-07146 *A 118722 RGL 10/31/02 Added Note 4. *B 121832 RBI 12/14/02 Power up requirements added to Operating Conditions Information *C 235854 RGL 06/24/04 Added Pb-free Devices *D 310594 RGL 02/09/05 Removed obsolete parts in the ordering information table Specified typical value for cycle-to-cycle jitter *E 1344343 KVM / VED 08/20/07 Brought the Ordering Information Table up to date: removed three obsolete parts and added two parts Changed titles to tables that are specific to commercial and industrial temperature ranges *F 2568575 AESA 09/19/08 Updated template. Added Note 19 “Not recommended for new designs.” Changed IDD (PD mode) from 12.0 to 25.0 A for Commercial and Industrial Temperature Devices Deleted Duty Cycle parameters for Fout <50 MHz Removed CY2308SI-4, CY2308SI-4T and CY2308SC-5HT. *G 2632364 KVM 01/08/09 Corrected TSSOP package size (from 150 mil to 4.4 mm) in Ordering Information table *H 2673353 KVM / PYRS 03/13/09 Reverted IDD (PD mode) and Duty Cycle parameters back to the values in revision *E: Changed IDD (PD mode) from 25 to 12 A for commercial temperature devices Added Duty Cycle parameters for Fout <50 MHz for commercial and industrial devices. *I 2897373 CXQ 03/22/10 Updated Ordering Information. Updated Package Diagrams. Updated copyright section. *J 2971365 BASH 07/06/10 Updated input to output skew and power down current number in Functional Description, page 1 Update pin descriptions in ‘Pin Description’ column, Table1, page 2 Added ‘Input Frequency’ parameter and output frequency for -1H and -5H in ‘Switching Characteristics Table’ and removed footnote, page 4, 5, and 7. Modified Description on page 1 and page 3 to make clear that user has to select one of the outputs to drive feedback. Added footnote in ‘Available CY2308 Configurations’ Table, page 3, for clarification. *K 3047133 CXQ 10/04/2010 Sunset Review. No change to data sheet from last revision. *L 3055192 CXQ 10/11/2010 Updated Ordering Information (Removed part CY2308SXI-5H and CY2308SXI-5HI). *M 3402187 BASH 10/11/2011 Updated Ordering Information (Removed prune part numbers CY2308SI-1H and CY2308SI-1HT). Updated Package Diagrams. Updated in new template. Document Number: 38-07146 Rev. *M Page 17 of 18 [+] Feedback CY2308 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products Automotive Clocks & Buffers Interface Lighting & Power Control PSoC Solutions cypress.com/go/automotive cypress.com/go/clocks psoc.cypress.com/solutions cypress.com/go/interface PSoC 1 | PSoC 3 | PSoC 5 cypress.com/go/powerpsoc cypress.com/go/plc Memory Optical & Image Sensing cypress.com/go/memory cypress.com/go/image PSoC Touch Sensing cypress.com/go/psoc cypress.com/go/touch USB Controllers Wireless/RF cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2001-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. 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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 38-07146 Rev. *M Revised October 11, 2011 Page 18 of 18 All products and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback