Ver 201207 Multilayer High Frequency inductor CIH05T Series (1005/ EIA 0402) APPLICATION Mobile communication systems, noise suppression at high frequency and Impedance matching. FEATURES RECOMMENDED LAND PATTERN Lowest value of specific resistivity, good property of Q and high SRF. Possible to use at range above 100MHz Monolithic structure for high reliability. Do not contain lead and support lead-free soldering. RoHS compliant 0.45~ 0.45~0.55mm 0.55mm 1.25~1.55mm DIMENSION Type 05 Dimension [mm] L W t d 1.0±0.05 0.5±0.05 0.5±0.05. 0.25±0.1 DESCRIPTION Inductance Part No. Q (typical.) Q (nH) (min) 500 800 @100MHz 100MHz MHz MHz CIH05T1N0□ 1.0±0.2nH,0.3nH 8 23 29 CIH05T1N2□ 1.2±0.2nH,0.3nH 8 23 29 48 CIH05T1N5□ 1.5±0.2nH,0.3nH 8 23 29 47 CIH05T1N8□ 1.8±0.2nH,0.3nH 8 20 26 41 CIH05T2N0□ 2.0±0.2nH,0.3nH 8 22 27 CIH05T2N2□ 2.2±0.2nH,0.3nH 8 22 SRF (MHz) DC resistance (Ω) Max. Rated current 1.8GHz 2.0GHz 2.4GHz 48 50 56 10000 0.12 300 50 56 10000 0.12 300 50 56 6000 0.13 300 43 49 6000 0.14 300 44 47 52 6000 0.16 300 27 44 47 52 6000 0.16 300 Min (mA) Max. CIH05T2N4□ 2.4±0.2nH,0.3nH 8 22 27 44 47 52 6000 0.16 300 CIH05T2N7□ 2.7±0.2nH,0.3nH 8 22 27 43 45 50 6000 0.17 300 CIH05T3N0□ 3.0± 0.2nH,0.3nH 8 24 30 46 48 53 6000 0.19 300 CIH05T3N3□ 3.3±0.2nH,0.3nH 8 24 30 46 48 53 6000 0.19 300 CIH05T3N6□ 3.6±0.2nH,0.3nH 8 24 30 46 48 53 6000 0.19 300 CIH05T3N9□ 3.9±0.2nH,0.3nH 8 22 28 43 45 50 4000 0.22 300 CIH05T4N3□ 4.3±0.2nH,0.3nH 8 22 28 43 45 50 4000 0.24 300 CIH05T4N7□ 4.7±0.2nH,0.3nH 8 23 30 45 47 50 4000 0.24 300 CIH05T5N1□ 5.1±0.2nH,0.3nH 8 22 28 42 43 45 4000 0.27 300 CIH05T5N6□ 5.6±0.2nH,0.3nH 8 22 28 42 43 45 4000 0.27 300 CIH05T6N2□ 6.2±0.2nH,0.3nH 8 22 28 40 41 41 3900 0.32 300 CIH05T6N8□ 6.8±5%, 10% 8 22 28 40 41 41 3900 0.32 300 CIH05T7N5□ 7.5±5%, 10% 8 22 28 38 38 36 3600 0.37 300 CIH05T8N2□ 8.2±5%, 10% 8 22 28 38 38 36 3600 0.37 300 CIH05T9N1□ 9.1±5%, 10% 8 22 28 37 36 31 3200 0.42 300 CIH05T10N□ 10.0±5%, 10% 8 22 28 37 36 31 3200 0.42 300 Ver 201207 Q (typical.) Inductance Q (nH) (min) 500 800 @100MHz 100MHz MHz MHz CIH05T12N□ 12.0±5%, 10% 8 22 28 33 31 23 2700 0.50 300 CIH05T15N□ 15.0±5%, 10% 8 22 28 29 26 17 2300 0.55 300 CIH05T18N□ 18.0±5%, 10% 8 23 28 26 22 11 2100 0.65 250 CIH05T22N□ 22.0±5%, 10% 8 22 27 21 14 2 1900 0.80 250 CIH05T27N□ 27.0±5%, 10% 8 20 23 10 3 - 1600 0.90 250 CIH05T33N□ 33.0±5%, 10% 8 20 23 3 - - 1300 1.00 250 CIH05T39N□ 39.0±5%, 10% 8 20 21 - - - 1200 1.20 200 CIH05T47N□ 47.0±5%, 10% 8 19 20 - - - 1000 1.30 200 CIH05T56N□ 56.0±5%, 10% 8 19 18 - - - 750 1.40 180 CIH05T68N□ 68.0±5%, 10% 8 17 15 - - - 750 1.40 180 CIH05T82N□ 82.0±5%, 10% 8 16 11 - - - 600 1.60 150 CIH05TR10□ 100.0±5%, 10% 8 15 9 - - - 600 1.60 130 Part No. SRF 1.8GHz 2.0GHz 2.4GHz (MHz) Min DC resistance (Ω) Max. Rated current (mA) Max. *Operating temperature range –55 to +125°C ※Tolerance (C :±0.2nH, S :±0.3nH, J :±5%, K :±10%) ※Measurement equipment & Jig: Agilent E4991A+16192A or Equivalent ※ The Rated Current is either the DC value at witch the internal Ls value is decreased within 5% with the application of DC_Current, or the value of current at which the temperature of the element is increased within 20℃ (Reference ambient temperature:20℃) PRODUCT IDENTIFICATION CI H (1) (2) (1) (3) (5) (7) (8) 05 (3) T (4) 10N (5) J N C (6) (7) (8) Chip Inductor (2) H:High frequency type Dimension (4) Material code(T:Dielectric material) Inductance(4N7:4.7nH, 10N:10nH, R10:100nH) (6) Tolerance(C:±0.2nH, S:±0.3nH, J:±5%, K:±10%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING Ver 201207 PACKAGING Packaging Style Quantity(pcs/reel) Card Board Taping 10,000 ■ NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.