TI1 BQ20Z80DBTG4 Sbs 1.1-compliant gas gauge enabled with impedance track Datasheet

bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK™
TECHNOLOGY FOR USE WITH THE bq29312A
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Patented Impedance Track™ Technology
Accurately Measures Available Charge in
Li-Ion and Li-Polymer Batteries
Better than 1% Error Over Lifetime of the
Battery
Instant Accuracy – No Learning Cycle
Required
Supports the Smart Battery Specification SBS
V1.1
Works With the TI bq29312A Analog
Front-End (AFE) Protection IC to Provide
Complete Pack Electronics Solution
Full Array of Programmable Voltage, Current,
and Temperature Protection Features
Integrated Time Base Removes Need for
External Crystal with Optional Crystal Input
Electronics for 7.2-V, 10.8-V or 14.4-V Battery
Packs With Few External Components
Based on a Powerful Low-Power RISC CPU
Core With High-Performance Peripherals
Integrated Field Programmable FLASH
Memory Eliminates the Need for External
Configuration Memory
Measures Charge Flow Using a
High-Resolution, 16-Bit Integrating
Delta-Sigma Converter
– Better Than 0.65 nVh of Resolution
– Self-Calibrating
– Offset Error Less Than 1 μV
Uses 16-Bit Delta-Sigma Converter for
Accurate Voltage and Temperature
Measurements
Extensive Data Reporting Options For
Improved System Interaction
Optional Pulse Charging Feature for Improved
Charge Times
Drives 3-, 4- or 5-Segment LED Display for
Remaining Capacity Indication
Supports SHA-1 Authentication
Lifetime Data Logging
•
38-Pin TSSOP (DBT)
APPLICATIONS
•
•
•
Notebook PCs
Medical and Test Equipment
Portable Instrumentation
DESCRIPTION
The bq20z80 SBS-compliant gas gauge IC,
incorporating
patented
Impedance
Track™
technology, is designed for battery-pack or in-system
installation. The bq20z80 measures and maintains
an accurate record of available charge in Li-ion or
Li-polymer
batteries
using
its
integrated
high-performance analog peripherals. The bq20z80
monitors capacity change, battery impedance,
open-circuit voltage, and other critical parameters of
the battery pack, and reports the information to the
system host controller over a serial-communication
bus. It is designed to work with the bq29312A analog
front-end (AFE) protection IC to maximize
functionality and safety, and minimize component
count and cost in smart battery circuits.
The Impedance Track technology continuously
analyzes the battery impedance, resulting in superior
gas-gauging accuracy. This enables remaining
capacity to be calculated with discharge rate,
temperature, and cell aging all accounted for during
each stage of every cycle.
AVAILABLE OPTIONS
PACKAGE (1)
TA
38-PIN TSSOP (DBT)
Tube
38-PIN TSSOP (DBT)
Tape and Reel
–40°C to
85°C
bq20z80ADBT (2)
bq20z80ADBTR (3)
–40°C to
85°C
bq20z80DBT (2)
bq20z80DBTR (3)
(1)
(2)
(3)
For the most current package and ordering information, see
the Package Option Addendum at the end of this document,
or see the TI website at www.ti.com.
A single tube quantity is 50 units.
A single reel quantity is 2000 units
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Impedance Track is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
SYSTEM DIAGRAM
Discharge / Charge /
Precharge FETs
Fuse
Pack +
bq20z80
PCH FET Drive
Supply V oltage
Power Management
LDO, TOUT, and Power Mode control
Temperature Measurement
<1% Error
768 Bytes of
User Flash
SMBus
bq29312A
PF Input
Fail-Safe Protection
TINT
32-kHz Clock
Generator
Precharge
FET Drive
Cell Balancing
Drive
LDO, Therm Output Drive & UVLO
T1
System Watchdog
Delay Counters
System Interface
RAM Registers
32 kHz
Cell Balancing Algorithm and Control
SBS v1.1 Data
I2 C
System Interface
XAlert
bq29312 RAM/Comms Validation
1st Level OC
Protection
1st Level OV and
UV Protection
Pack Undervoltage
Power Mode
Control
Cell and Pack
Voltage
Measurement
Sleep
Power Mode Control
bq294xx
2-Tier Overcurrent Protection
Impedance Track (TM) + Lifetime Data Logging
Voltage Level Translator
Pack Sense Resistor
(5 m - 20 mW typ)
TSSOP (DBT)
(TOP VIEW)
VIN
TS1
TS2
PU
PRES
SCLK
SAFE
VDDD
RBI
SDATA
VSSD
SAFE
NC
NC
SMBC
SMBD
DISP
PFIN
VSSD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
38
37
36
35
34
33
32
31
30
29
28
VSSD
NC
NC
CLKOUT
XCK1 / VSSA
XCK2 / ROSC
FILT
VDDA
VSSA
VSSA
27
SR1
SR2
26
25
24
23
22
21
20
MRST
XALERT
LED1
LED2
LED3
LED4
LED5
NC - No internal connection
2
2 nd Level Overvoltage Protection
Precharge Control
Submit Documentation Feedback
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
TERMINAL FUNCTIONS
TERMINAL
NO.
NAME
I/O (1)
DESCRIPTION
1
VIN
I
Voltage measurement input from the AFE
2
TS1
I
1st Thermistor voltage input connection to monitor temperature
3
TS2
I
2nd Thermistor voltage input connection to monitor temperature
4
PU
O
Output to pull up the PRES pin for system detection
5
PRES
I
Active low input to sense system insertion and typically requires additional ESD protection
6
SCLK
I/OD
7
SAFE
O
Active high output to enforce additional level of safety protection; e.g., fuse blow. (Inverse of pin 12)
8
VDDD
P
Positive supply for digital circuitry and I/O pins
9
RBI
P
Backup power to the bq20z80 data registers during periods of low operating voltage. RBI accepts a
storage capacitor or a battery input.
10
SDATA
I/O
Data transfer to and from the AFE
12
SAFE
O
Active low output to enforce additional level of safety protection; e.g., fuse blow. (Inverse of pin 7)
13
NC
–
Not used— leave floating
Not used— leave floating
Communication clock to the AFE
14
NC
–
15
SMBC
I/OD
SMBus clock open-drain bidirectional pin used to clock the data transfer to and from the bq20z80
16
SMBD
I/OD
SMBus data open-drain bidirectional pin used to transfer address and data to and from the bq20z80
17
DISP
I
Display control for the LEDs. This pin is typically connected to bq29312A REG via a 100-kΩ resistor
and a push-button switch to VSSD.
18
PFIN
I
Active low input to detect secondary protector output status and allows the bq20z80 to report the
status of the 2nd level protection output
20
LED5
O
LED5 display segment that drives an external LED depending on the firmware configuration
21
LED4
O
LED4 display segment that drives an external LED depending on the firmware configuration
22
LED3
O
LED3 display segment that drives an external LED depending on the firmware configuration
23
LED2
O
LED2 display segment that drives an external LED depending on the firmware configuration
24
LED1
O
LED1 display segment that drives an external LED depending on the firmware configuration
25
XALERT
I
Input from bq29312A XALERT output.
26
MRST
I
Master reset input that forces the device into reset when held high
27
SR2
IA
Connections for a small-value sense resistor to monitor the battery charge- and discharge-current
flow
28
SR1
IA
Connections for a small-value sense resistor to monitor the battery charge- and discharge-current
flow
31
VDDA
P
Positive supply for analog circuitry
32
FILT
IA
Analog input connected to the external PLL filter components which are a 150-pF capacitor to VSSA,
in parallel with a 61.9-kΩ resistor and a 2200-pF capacitor in series. Place these components as
close as possible to the bq20z80 to ensure optimal performance.
33
XCK2/ROSC
O
32.768-kHz crystal oscillator output pin or connected to a 100-kΩ, 50-ppm or better resistor if the
internal oscillator is used.
34
XCK1/VSSA
I
32.768-kHz crystal oscillator input pin or connected to VSSA if the internal oscillator is used
35
CLKOUT
O
32.768-kHz output for the bq29312. This pin should be directly connected to the AFE.
36, 37
NC
-
Not used— leave floating
11, 19, 38
VSSD
P
Negative supply for digital circuitry
29, 30
VSSA
P
Negative supply for analog circuitry.
(1)
I = Input, IA = Analog input, I/O = Input/output, I/OD = Input/Open-drain output, O = Output, OA = Analog output, P = Power
Submit Documentation Feedback
3
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
RANGE
VDDAand VDDD relative to VSS (2)
Supply voltage range
V(IOD) relative to VSS (2)
Open-drain I/O pins
VI relative to VSS
(2)
–0.3 V to 4.1 V
–0.3 V to 6 V
Input voltage range to all other pins
–0.3 V to VDDA + 0.3 V
TA
Operating free-air temperature range
–40°C to 85°C
Tstg
Storage temperature range
–65°C to 150°C
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
VSS refers to the common node of V(SSA) and V(SSD).
ELECTRICAL CHARACTERISTICS
VDD = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
VDD
IDD
TEST CONDITIONS
Supply voltage
VDDA and VDDD
Operating mode current
TYP
MAX
3.3
3.6
350 (1)
bq20z80 + bq29312A
375
Sleep mode
8 (1)
bq20z80 + bq29312A
Output voltage low SMBC, SMBD, SDATA, SCLK, SAFE,
SAFE, PU
IOL = 0.5 mA
μA
0.1
0.4
LED1 – LED5
IOL = 10 mA
VOH
Output high voltage, SMBC, SMBD, SDATA, SCLK, SAFE,
SAFE, PU
IOH = –1 mA
VIL
Input voltage low SMBC, SMBD, SDATA, SCLK, XALERT,
PRES, PFIN
–0.3
0.8
DISP
VIH
CIN
0.4
VDD – 0.5
–0.3
0.8
2
6
DISP
2
VDD + 0.3
Input capacitance
5
V(AI2) Input voltage range SR1, SR2
V
V
V
Input voltage high SMBC, SMBD, SDATA, SCLK, XALERT,
PRES, PFIN
V(AI1) Input voltage range VIN, TS1, TS2
V
μA
0.1 (1)
bq20z80 + bq29312A
UNIT
μA
28
Shutdown Mode
I(SLP) Shutdown Current
V
V
V
V
pF
VSS– 0.3
0.8 x VDD
VSS– 0.25
0.25
V
Z(AI1) Input impedance SR1, SR2
0 V–1 V
2.5
MΩ
Z(AI2) Input impedance VIN, TS1, TS2
0 V–1 V
8
MΩ
(1)
4
3
No flash programming
I(SLP) Low-power storage mode current
VOL
MIN
This value does not include the bq29312A
Submit Documentation Feedback
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
POWER-ON RESET
VDD = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
TYP
MAX
Negative-going voltage input
PARAMETER
TEST CONDITIONS
2.1
2.3
2.5
V
VHYS
Power-on reset hysteresis
50
150
200
mV
MAX
UNIT
0.25
V
UNIT
POWER ON RESET BEHAVIOR
vs
FREE-AIR TEMPERATURE
2.50
140
2.45
135
2.40
130
VIT-
2.35
125
2.30
120
2.25
115
Vhys
2.20
110
2.15
105
2.10
-20 -10
V hys - Hysterisis Voltage - mV
V IT - Negative Going Input Threshold Voltage - V
MIN
VIT–
100
0
10 20 30 40 50 60 70 80
TA - Free-Air Temperature - °C
INTEGRATING ADC (Coulomb Counter) CHARACTERISTICS
VDD = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
V(SR)
Input voltage range, V(SR2) and V(SR1)
V(SROS)
Input offset
INL
Integral nonlinearity error
TEST CONDITIONS
V(SR) = V(SR2) – V(SR1)
MIN
TYP
–0.25
μV
1
0.004%
0.019%
TYP
MAX
2
5
PLL SWITCHING CHARACTERISTICS
VDD = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
t(SP)
(1)
Start-up time
(1)
TEST CONDITIONS
MIN
0.5% frequency error
UNIT
ms
The frequency error is measured from the trimmed frequency of the internal system clock which is 128 oscillator frequency, nominally
4.194 MHz.
OSCILLATOR
VDD = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
ROSC = 100 kΩ
f(exo)
Frequency error from 32.768 kHz
ROSC = 100 kΩ, VDD = 3.3 V
XCK1 = 12-pF XTAL
f(sxo)
(1)
Start-up time
(1)
TYP
MAX
–2% 0.25%
MIN
2%
–1% 0.25%
–0.25%
UNIT
1%
0.25%
ROSC = 100 kΩ
250
μs
XCK1 = 12-pF XTAL
200
ms
The start-up time is defined as the time it takes for the oscillator output frequency to be within 1% of the specified frequency.
Submit Documentation Feedback
5
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
DATA FLASH MEMORY CHARACTERISTICS
VDD = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Data retention
See
(1)
10
Years
Flash programming write-cycles
See
(1)
20,000
Cycles
t(WORDPROG) Word programming time
See
(1)
I(DDPROG)
See
(1)
tDR
(1)
Flash-write supply current
2
ms
8
15
mA
TYP
MAX
UNIT
10
100
nA
Specified by design. Not production tested
REGISTER BACKUP
VDD = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
I(RBI)
V(RBI)
(1)
6
RBI data-retention input current
RBI data-retention voltage
TEST CONDITIONS
MIN
V(RBI) > 3 V, VDD < VIT
(1)
1.3
Specified by design. Not production tested.
Submit Documentation Feedback
V
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
SMBus TIMING SPECIFICATIONS
VDD = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fSMB
SMBus operating frequency
Slave mode, SMBC 50% duty cycle
fMAS
SMBus master clock frequency
Master mode, no clock low slave extend
tBUF
Bus free time between start and stop
tHD:STA
Hold time after (repeated) start
tSU:STA
Repeated start setup time
tSU:STO
Stop setup time
MIN
TYP
10
MAX
100
51.2
kHz
4.7
4
μs
4.7
4
Receive mode
0
Transmit mode
300
tHD:DAT
Data hold time
tSU:DAT
Data setup time
tTIMEOUT
Error signal/detect
tLOW
Clock low period
tHIGH
Clock high period
See
(2)
tLOW:SEXT
Cumulative clock low slave extend time
See
(3)
25
tLOW:MEXT
Cumulative clock low master extend time
See
(4)
10
tF
Clock/data fall time
(VILMAX – 0.15 V) to (VIHMIN + 0.15 V)
tR
Clock/data rise time
0.9 VDD to (VILMAX – 0.15 V)
(1)
(2)
(3)
(4)
UNIT
ns
250
See
(1)
25
35
4.7
4
50
300
1000
ms
μs
ms
ns
The bq20z80 times out when any clock low exceeds tTIMEOUT.
tHIGH:MAX. is minimum bus idle time. SMBC = 1 for t > 50 μs causes reset of any transaction involving the bq20z80 that is in progress.
tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.
tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop.
SMBus TIMING DIAGRAM
Submit Documentation Feedback
7
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
FEATURE SET
NOTE
The bq20z80-V102 is designed to work with the bq29312A AFE. The bq20z80
features are only available with the bq29312A.
.
Primary (1st Level) Safety Features
The bq20z80 supports a wide range of battery and system protection features that care easily configured. The
primary safety features includes:
•
•
•
•
•
•
•
Battery cell over/undervoltage protection
Battery pack over/undervoltage protection
2 independent charge overcurrent protection
3 independent discharge overcurrent protection
Short circuit protection
Overtemperature protection
Host watchdog
Secondary (2nd Level) Safety Features
The secondary safety features of the bq20z80 can be used to indicate more serious faults via the SAFE (pin 7)
and SAFE (pin 12) pins. These pins can be used to blow a in-line fuse to permanently disable the battery pack
from charging or discharging. The secondary safety features includes:
•
•
•
•
•
•
•
•
•
•
•
Safety over voltage
Battery cell imbalance
2nd level protection IC input
Safety overcurrent
Safety overtemperature
Open thermistor
Charge FET and 0 Volt Charge FET fault
Discharge FET fault
Fuse blow failure detection
AFE communication error
Internal flash data error
Charge Control Features
The bq20z80 charge control features includes:
•
•
•
•
•
•
•
8
Report the appropriate charging current needed for constant current charging and the appropriate charging
voltage needed for constant voltage charging to a smart charger using SMBus broadcasts.
Determines the chemical state of charge of each battery cell using Impedance Track™ and can reduce the
charge difference of the battery cells in fully charged state of the battery pack gradually using cell balancing
algorithm during charging. This prevents fully charged cells from overcharging causing excessive degradation
and also increases the usable pack energy by preventing to early charge termination
supports pre-charging/zero-volt charging
support fast charging
supports pulse charging
detects charge termination
report charging faults and also indicate charge status via charge and discharge alarms.
Submit Documentation Feedback
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
FEATURE SET (continued)
Gas Gauging
The bq20z80 uses the Impedance Track™ Technology to measure and calculate the available charge in battery
cells. The achievable accuracy is better than the coulomb counting method over the lifetime of the battery and
there is no full charge discharge learning cycle required.
See Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm application note
(SLUA364) for further details.
LED Display
The bq20z80 can drive 3-, 4-, or 5- segment LED display for remaining capacity indication.
LifeTime Data Logging Features
The bq20z80 offers a lifetime data logging array, where all important measurements are stored for warranty and
analysis purposes. The data monitored includes:
•
•
•
•
•
•
•
•
•
•
•
•
•
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
maximum temperature
minimum temperature
maximum battery cell voltage
minimum battery cell voltage
maximum battery pack voltage
minimum battery pack voltage
maximum charge current
maximum discharge current
maximum charge power
maximum discharge power
maximum average discharge current
maximum average discharge power
average temperature
Authentication
The bq20z80 supports authentication by the host using SHA-1.
Power Modes
The bq20z80 supports 3 different power modes to reduce power consumption:
•
•
•
In Normal Mode, the bq20z80 performs measurements, calculations, protection decision, data update in 1
second intervals. Between these intervals, the bq20z80 is in a reduced power stage.
In Sleep Mode, the bq20z80 performs measurements, calculations, protection decision, data update in
adjustable time intervals. Between these intervals, the bq20z80 is in a reduced power stage.
In Shutdown Mode the bq20z80 is completely disabled.
CONFIGURATION
Oscillator Function
The oscillator of the bq20z80 can be set up for internal or external operation. On power up, the bq20z80
automatically attempts to start the internal oscillator. If a 100-kΩ resistor is not connected to ROSC (pin 33),
then it attempts to start the oscillator using an external 32.768-kHz crystal.
NOTE
Install either the 100-kΩ ROSC resistor or the 12-pF, 32.768-kHz crystal. Do not
install both.
Submit Documentation Feedback
9
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
FEATURE SET (continued)
The performance of the internal oscillator depends on the tolerance of the 100-kΩ resistor between RSOC (pin
33) and VSSA (pin 34). Choose a resistor with a tolerance of ±0.1%, and 50-ppm or better temperature drift.
Place this resistor as close as possible to the bq20z80. If a 12-pF crystal is used, place it as close as possible to
the XCK1 (pin 34) and XCK2 (pin 33) pins. If not properly implemented, the PCB layout in this area can degrade
oscillator performance.
System Present Operation
The bq20z80 pulls the PU pin high periodically (1 s). Connect this pin to the PRES pin of the bq20z80 via a
resistor of approximately 5 kΩ. The bq20z80 measures the PRES input during the PU-active period to determine
its state. If PRES input is pulled to ground by external system, the bq20z80 detects this as system present.
BATTERY PARAMETER MEASUREMENTS
The bq20z80 uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement, and a
second delta-sigma ADC for individual cell and battery voltage, and temperature measurement.
Charge and Discharge Counting
The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltage
drop across a small-value sense resistor between the SR1 and SR2 pins. The integrating ADC measures bipolar
signals from -0.25 V to 0.25 V. The bq20z80 detects charge activity when VSR = V(SR1)-V(SR2)is positive and
discharge activity when VSR = V(SR1)-V(SR2) is negative. The bq20z80 continuously integrates the signal over
time, using an internal counter. The fundamental rate of the counter is 0.65 nVh.
Voltage
The bq20z80 updates the individual series cell voltages through the bq29312A at one second intervals. The
bq20z80 configures the bq29312A to connect the selected cell, cell offset, or bq29312A VREF to the CELL pin
of the bq29312A, which is required to be connected to VIN of the bq20z80. The internal ADC of the bq20z80
measures the voltage, scales and calibrates it appropriately. This data is also used to calculate the impedance
of the cell for the Impedance Track™ gas-gauging.
Current
The bq20z80 uses the SR1 and SR2 inputs to measure and calculate the battery charge and discharge current
using a 5 mΩ to 20 mΩ (typical) sense resistor.
Auto Calibration
The bq20z80 provides an auto-calibration feature to cancel the voltage offset error across SR1 and SR2 for
maximum charge measurement accuracy. The bq20z80 performs auto-calibration when the SMBus lines stay
low continuously for a minimum of 5 s.
Temperature
The bq20z80 TS1 and TS2 inputs, in conjunction with two identical NTC thermistors (default are Semitec
103AT), measure the battery environmental temperature. The bq20z80 can also be configured to use its internal
temperature sensor.
COMMUNICATIONS
The bq20z80 uses SMBus v1.1 with Master Mode and package error checking (PEC) options per the SBS
specification.
SMBus On and Off State
The bq20z80 detects an SMBus off state when SMBC and SMBD are logic-low greater than an adjustable
period of time. Clearing this state requires either SMBC or SMBD to transition high. Within 1 ms, the
communication bus is available.
10
Submit Documentation Feedback
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
FEATURE SET (continued)
SBS Commands
Table 1. SBS COMMANDS
SBS Cmd
Mode
Name
Format
Size in
Bytes
Min
Value
Max
Value
Default Value
0x00
R/W
ManufacturerAccess
hex
2
0x0000
0xffff
—
0x01
R/W
RemainingCapacityAlarm
unsigned int
2
0
65535
—
mAh or
10mWh
0x02
R/W
RemainingTimeAlarm
unsigned int
2
0
65535
—
min
0x03
R/W
BatteryMode
hex
2
0x0000
0xffff
—
0x04
R/W
AtRate
signed int
2
–32768
32767
—
mA or 10mW
0x05
R
AtRateTimeToFull
unsigned int
2
0
65535
—
min
0x06
R
AtRateTimeToEmpty
unsigned int
2
0
65535
—
min
0x07
R
AtRateOK
unsigned int
2
0
65535
—
0x08
R
Temperature
unsigned int
2
0
65535
—
0.1°K
0x09
R
Voltage
unsigned int
2
0
20000
—
mV
0x0a
R
Current
signed int
2
–32768
32767
—
mA
0x0b
R
AverageCurrent
signed int
2
–32768
32767
—
mA
0x0c
R
MaxError
unsigned int
1
0
100
—
%
0x0d
R
RelativeStateOfCharge
unsigned int
1
0
100
—
%
0x0e
R
AbsoluteStateOfCharge
unsigned int
1
0
100
—
%
0x0f
R
RemainingCapacity
unsigned int
2
0
65535
—
mAh or
10mWh
0x10
R
FullChargeCapacity
unsigned int
2
0
65535
—
mAh or
10mWh
0x11
R
RunTimeToEmpty
unsigned int
2
0
65535
—
min
0x12
R
AverageTimeToEmpty
unsigned int
2
0
65535
—
min
0x13
R
AverageTimeToFull
unsigned int
2
0
65535
—
min
0x14
R
ChargingCurrent
unsigned int
2
0
65535
—
mA
0x15
R
ChargingVoltage
unsigned int
2
0
65535
—
mV
0x16
R
BatteryStatus
unsigned int
2
0x0000
0xffff
—
0x17
R/W
CycleCount
unsigned int
2
0
65535
—
0x18
R/W
DesignCapacity
unsigned int
2
0
65535
0x19
R/W
DesignVoltage
unsigned int
2
7000
16000
14400
0x1a
R/W
SpecificationInfo
unsigned int
2
0x0000
0xffff
0x0031
0x1b
R/W
ManufactureDate
unsigned int
2
0
65535
0
0x1c
R/W
SerialNumber
hex
2
0x0000
0xffff
0x0001
0x20
R/W
ManufacturerName
String
11+1
—
—
Texas Instruments
ASCII
0x21
R/W
DeviceName
String
7+1
—
—
bq20z80
ASCII
0x22
R/W
DeviceChemistry
String
4+1
—
—
LION
ASCII
0x23
R
ManufacturerData
String
14+1
—
—
—
ASCII
0x2f
R/W
Authenticate
String
20+1
—
—
—
ASCII
0x3c
R
CellVoltage4
unsigned int
2
0
65535
mV
0x3d
R
CellVoltage3
unsigned int
2
0
65535
mV
0x3e
R
CellVoltage2
unsigned int
2
0
65535
mV
0x3f
R
CellVoltage1
unsigned int
2
0
65535
mV
Submit Documentation Feedback
Unit
mAh or
10mWh
mV
11
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
Table 2. EXTENDED SBS COMMANDS
SBS
Cmd
Mode
Name
Format
Size in
Bytes
Min Value
Max Value
Default Value
Unit
0x45
R
AFEData
String
11+1
—
—
—
ASCII
0x46
R/W
FETControl
hex
1
0x00
0xff
—
0x4f
R
StateOfHealth
unsigned int
1
0
100
—
0x50
R
SafetyAlert
hex
2
0x0000
0xffff
—
0x51
R
SafetyStatus
hex
2
0x0000
0xffff
—
0x52
R
PFAlert
hex
2
0x0000
0xffff
—
0x53
R
PFStatus
hex
2
0x0000
0xffff
—
0x54
R
OperationStatus
hex
2
0x0000
0xffff
—
0x55
R
ChargingStatus
hex
2
0x0000
0xffff
—
0x57
R
ResetData
hex
2
0x0000
0xffff
—
0x58
R
WDResetData
unsigned int
2
0
65535
—
0x5a
R
PackVoltage
unsigned int
2
0
65535
—
0x5d
R
AverageVoltage
unsigned int
2
0
65535
0x60
R/W
UnSealKey
hex
4
0x00000000 0xffffffff
—
0x62
R/W
PFKey
hex
4
0x00000000 0xffffffff
—
0x63
R/W
AuthenKey3
hex
4
0x00000000 0xffffffff
—
0x64
R/W
AuthenKey2
hex
4
0x00000000 0xffffffff
—
0x65
R/W
AuthenKey1
hex
4
0x00000000 0xffffffff
—
0x66
R/W
AuthenKey0
hex
4
0x00000000 0xffffffff
—
0x70
R/W
ManufacturerInfo
String
8+1
—
—
—
0x71
R/W
SenseResistor
unsigned int
2
0
65535
—
0x77
R/W
DataflashClass
hex
2
0x0000
0xffff
—
0x78
R/W
DataFlashSubClass1
hex
32
—
—
—
0x79
R/W
DataFlashSubClass2
hex
32
—
—
—
0x7a
R/W
DataFlashSubClass3
hex
32
—
—
—
0x7b
R/W
DataFlashSubClass4
hex
32
—
—
—
0x7c
R/W
DataFlashSubClass5
hex
32
—
—
—
0x7d
R/W
DataFlashSubClass6
hex
32
—
—
—
0x7e
R/W
DataFlashSubClass7
hex
32
—
—
—
0x7f
R/W
DataFlashSubClass8
hex
32
—
—
—
%
mV
mV
μΩ
Firmware Version Changes
bq20z80-V102 to bq20z80-V110 Changes
Table 3. CHANGE DETAILS
CHANGE
Allows alarm based on
remaining battery energy
bq0z80-V110
bq20z80-V102
COMMENTS
Feature not available
make bq20z80 compatible to
bq20z90
Permanent fail fuse blow can [PRE_ZT_PF_En] in
be disabled, if IT not enabled DF.Operation Cfg C added
Feature not available
prevents accidental fuse blow
during production and testing
changed max time the LED
stays on after display is
activated
DF.LED Hold Time max time is
16s
DF.LED Hold Time max time is 255s reliable LED display timings
Prevent false detection of
AFE_C
Reset AFE comm and clear the
afe_fail count in case AFE in
unknown comm state at reset
12
DF.Remaining Energy Alarm
added
Submit Documentation Feedback
Prevents a AFE_C during a WD
Reset
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
Table 3. CHANGE DETAILS (continued)
CHANGE
Proper FET operation in
presence of partial resets
bq0z80-V110
bq20z80-V102
COMMENTS
Clear sleep mode flag (and all
CHG_off flag set while in SLEEP but
Sbscc_control flags) with partial
a partial reset would incorrectly clear
and full resets to correct condition this flag
where charge FET can remain
off.
Prevent false detection of PF Force full reset for attempted
shutdown (prevent PF_SHUT
from causing a PF condition if
shutdown does not occur)
Shutdown does cause a PF
Allow shutdown to work
correctly when the part is in
sleep
Fix shutdown when in sleep
A race condition was occurring
between sleep and shutdown that
was not allowing the device to
shutdown when in sleep mode.
Change default charger
present voltage from 12000
to 3000 mv
Change default charger present
voltage from 12000 to 3000 mv
bq29312 will not reliably shutdown
until pack+ voltage is below 3000
mv. Prevents failed shutdown
attempts
Meet SBS specification
Change default DF:Rem Cap
Alarm for mWh mode to 10% of
DF:Design Capacity per SBS
spec from 0
Meet SBS specification
Correct
SBS.AbsoluteStateOfCharge( ) to
allow for values >100% per SBS
the spec
Correct cell balance time
when number of cells < 4
cell balance duty cycle now 0.4
For persistent SC conditions
Change Default AFE OC Dsg
Recovery from 100 mA to 5 ma
"Cell balancing time per cell has
been changed to be based on the
number of cells configured for use in
Operation Cfg A, as below. Each
number indicates the duty cycle, or
the amount of time the cell
balancing FET is on as opposed to
being off. For example, if the duty
cycle is 0.4, and the cycle time is
250 ms, the cell balancing FET will
be on for 100 ms and off for 150
ms.CC1:CC0 = 3 -> 0.4CC1:CC0 =
2 -> 0.3CC1:CC0 = 1 -> 0.224"
Set SBS.BatteryMode Alarm and
charger bits default to on if
master broadcasts disabled.
Convenient setup to have
BatteryMode Alarm accurately
indicate broadcast state.
Make RemainingCapacity
writeable
Add State of Health parameter
unused data flash
Remove unused FastCharge
OverVoltage
double dataflash value
Faster wakeup response
Check sleep wakeup every 250
ms, change from 1000 ms
Check sleep wakeup every 1000 ms
bq20z80-V101 to bq20z80-V102 Changes
Table 4. CHANGE DETAILS
CHANGE
Corrected to allow display to
turn off when charging and
button pushed.
bq0z80-V102
LED display operates correctly
during charging.
bq20z80-V101
COMMENTS
LED display would stay on until
Correct operation of the LED
charging terminated after the button display under all conditions
was pushed. Only occurs when LED
display not configured to be always
on during charging.
Submit Documentation Feedback
13
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
Table 4. CHANGE DETAILS (continued)
CHANGE
Allow negative LED
thresholds to permit LED
alarms to be disabled
bq0z80-V102
COMMENTS
Feature not available
Allow better customization
Allow zero values for ALARM Configuring zero value for the
and CHARGING LED blink
LED blink rates disables them.
rates to disable them
Feature not available
Allow better customization
Restore initialization of
dodcharge initialized to the
dodcharge in relaxed state
correct value
so that the correct dodcharge
value is used in capacity
estimation
dodcharge value set to zero
Improved gauging accuracy with
correct initialization of dodcharge
value.
Only clear offset calibration
flag when SMBus lines go
high.
Prevents offset calibration
occurring just because a safety
condition occurs and then clears
when the SMBus lines are low.
Offset calibration occurs multiple
times if safety condition occurs
when SMBus lines are low.
More appropriate period between
offset calibrations when SMBus
lines are low.
Change so that setting AFE
Fail Limit to zero disables
PF_AFE_C
Configurable option to allow
disabling PF_AFE_C trigger
Feature not available.
Allow better customization
Enable LED display to turn
off after charge termination
and if SMBus lines are
detected low and LEDs
enabled during charging.
LED display turns off after charge LED display stays on when charging Correct operation of the LED
termination.
terminates after SMBus lines are
display under all conditions
detected low.
Set charge FET state
immediately when entering
sleep
Charge FET state set correctly,
immediately after entering sleep
Change DF:Operation Cfg B
[CCT = 0], so that
SBS.CycleCount( ) threshold
is in mAH, not in % of FCC
Data flash default bases
DF:Operation Cfg B [CCT = 1],
SBS.CycleCount( ) calculation on making the default
mAh and not % of FCC
SBS.CycleCount( ) calculation to be
based on % of FCC
Data flash default changed to
reflect common customer usage
When DF:Operation Cfg B
[CCT = 1], so that
SBS.CycleCount( ) threshold
is % of FCC, then DF:CC
Threshold is used as a
minimum for the
SBS.CycleCount( ) threshold
Use DF:CC Threshold as the
Small or negative SBS.Full Charge
minimum to prevent rapid
Capacity( ) values (should not occur
incrementing of the
under normal operation) from
SBS.Cyclecount( ), damaging the causing the SBS.CycleCount( )
data flash
incrementing rapidly, potentially
damaging the data flash
Improved system reliability
When exiting the relaxed
state to sleep, the initial
charge capacity is correctly
calculated
Corrected initial charge capacity
calculation to be accurate when
exiting relaxed state to sleep
If the relaxed state was exited to
sleep after a valid DOD
measurement (30-minute default
value), then the initial charge
capacity would not be recalculated
and would result in an incorrect FCC
value if the sleep state was exited
before another valid DOD
measurement (30-minute default
value)
More reliable
SBS:FullChargeCapacity( )
calculation under all system
conditions
Correct update of Remcap in
relaxed state to use passed
charge
Charge or discharge current
accumulated in a relaxed state
used to update Remcap
If the relaxed state was exited after
the accumulation of significant
charge or discharge current (over at
most 100 seconds with default
values), the RemCap and FCC
would be in error by this charge.
This is only significant if the relaxed
state can exist with significant
current as determined by application
settings.
More reliable
SBS:FullChargeCapacity( )
SBS:RemainingCapacity( )
calculation under all system
conditions
14
Configuring negative LED alarm
threshold disables LED alarm
functionality.
bq20z80-V101
The CHG FET would not get set to
the correct state for sleep until the
first voltage measurement.
Submit Documentation Feedback
Quicker transition of FET to the
correct state in sleep
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
Table 4. CHANGE DETAILS (continued)
CHANGE
bq0z80-V102
bq20z80-V101
COMMENTS
Implement disable of
Prevent invalid soc values from
resistance update based on
causing incorrect resistance
accumulative scale. If the
updates
product of 15 consecutive
(default value) resistance
scale factors is less than 0.5
or more than 1.5, then
resistance update is disabled
until the next valid soc
measurement. Sets bit 2 of
Operation Status to indicate
resistance update disabled.
Incorrect resistance updates that
could result from invalid soc values
More reliable resistance updates
under all system conditions
Implement disable of
Prevent invalid soc values from
resistance update based on
causing incorrect resistance
estimated capacity error.
updates
Sets bit 2 of Operation Status
to indicate resistance update
disabled.
Incorrect resistance updates that
could result from invalid soc values
More reliable resistance updates
under all system conditions
Disable Qmax increment if
due to Grid 14 and exit of
discharge
Prevent unnecessary Qmax
increments
Qmax increments can occur due to
Grid 14 and exit of discharge
Improved Qmax data reliability
under all system conditions.
Drive all unused pins low
Provides better ESD immunity
Not all unused pins driven low
Improved ESD immunity
Initial charge capacity
calculation when dod0 is
measured in the
overdischarged state is
corrected
Overdischarged state does not
affect the accuracy of FCC
calculations
An incorrect initial charge capacity
affects FCC that is calculated during
discharge or a Qmax update. If FCC
is not changed by a Qmax update,
then reported RemainingCapacity
could be negative after 5 hours of
relaxation
More reliable
SBS:FullChargeCapacity( )
SBS:RemainingCapacity( )
calculation under all system
conditions
Correct calculation of FCC
and RemCap when dod0 is
taken when the battery is
overdischarged or
overcharged. This allows
RemCap to go negative, or
greater than FCC (though is
only reported from 0 - FCC).
Overcharged/Overdischarged
does not affect the accuracy of
FCC and RemCap calculations
The RemainingCapacity will
increment (or decrement) during
charging (discharging) even when
the battery is in an overdischarged
(overcharged) state.
More reliable
SBS:FullChargeCapacity( )
SBS:RemainingCapacity( )
calculation under all system
conditions
Change cell imbalance
DF:Battery Rest Time from 1
byte to 2 bytes and set the
default value to 1800
seconds
New feature providing improved
customization
Feature not available
Improved customization for Cell
Imbalance detection
Use upper and lower limit for
resistance accumulative
scale. Set default values to
300% and 30%.
More reliable resistance updates
under all system conditions
Add DF:CF MaxError limit for New feature providing improved
setting SBS.BatteryMode( )
customization
[CONDITION FLAG]. Set
default value to 100%.
Feature not available
Use SBS.AtRate( ),
UserRate and C/5 rate for
relaxed capacity calculation,
respectively, if set by Load
Select; otherwise, use
previous rate.
Correct Host Watchdog from
being reset by broadcasts
Improved customization
More reliable
SBS:FullChargeCapacity( )
SBS:RemainingCapacity( )
calculation under all system
conditions
Host Watchdog functionality not
affected by alarm or charger
broadcasts
Host Watchdog reset by alarm or
charger broadcasts
Submit Documentation Feedback
Reliable Host Watchdog
functionality under all system
conditions
15
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
Table 4. CHANGE DETAILS (continued)
CHANGE
bq0z80-V102
bq20z80-V101
COMMENTS
The voltage table chemistry
ID can be read by writing
0x0008 to
ManufacturerAccess and
then reading from
ManufacturerAccess. The
default chemistry ID is
0x0100
New feature providing more
information
Feature not available
Improved information access
SBS.BatteryMode( ) is
initialized on high transition
of the SMBus lines to DF:Init
BatteryMode, instead of
always clearing
SBS.BatteryMode( ) defined
bits on high transition of the
SMBus lines.
Customization allows for
preserving SBS.BatteryMode( )
settings through SMBus line
transitions
Feature not available
Improved customization
Broadcast timers are set
correctly on high transition of
SMBus lines. The timers are
set to 10 seconds on high
transition of SMBus lines.
Broadcast timer accurate
regardless of CC offset
calibration or entry to sleep
Broadcast timer accuracy required a Improved broadcast timing
CC offset calibration and entry to
accuracy to meet Smart Battery
sleep.
Data spec
bq20z80 to bq20z80-V101 Changes
CHANGE
bq20z80
bq20z80-V101
COMMENTS
Added authentication (optional SBS
command 0x2f)
Command 0x2f has no function and is Command 0x2f is the
not acknowledged.
SBS.Authenticate( ) command to the
bq20z80 to begin the SHA1
authentication.
Additional feature to enable host to
authenticate the battery
Added Cell Balancing
Cell balancing not available
Added State of Charge cell balancing
algorithm
Additional feature to enable longer
lifetime of battery
Added charge fault FET Enable
register
When charge faults occur, FET action
is taken.
When charge faults occur, FET action
is taken if enabled in DF:FET Enable
register.
Adds flexibility to system interaction
Added pulse compensation for end of
discharge
Applications with pulsed current loads
and minimum voltage requirements
can have less RemainingCapacity
than reported.
The voltage pulses caused by pulsed Added additional feature to improve
current loads are measured and used capacity prediction
to better estimate RemainingCapacity.
Added SBS.BatteryStatus( ) [TDA,
FD] voltage thresholds
SBS.BatteryStatus( ) [TDA, FD] are
only set on SBS.RSOC, detection of
charge termination or faults
SBS.BatteryStatus( ) [TDA, FD] are
now set and cleared based on
SBS.Voltage( )
Adds flexibility to system interaction
Added option for LEDs in series with
current source
LED display is only in parallel.
LED display is available in series
(with current source) or parallel.
Adds capability for higher brightness
LEDs
Configured pin 7 as active high fuse
blow
Pin 7 is not connected.
Pin 7 is now an active high reflection
of SAFE (pin 12).
Adds flexibility to choose different
circuits driven by the permanent
failure signal
Added State of Health calculation
(command 0x4f)
Command 0x4f has no function and is Command 0x4f is the
not acknowledged.
SBS.StateOfHealth( ) command
where SOH is the ratio of
SBS.DesignCapacity( ) to
SBS.FullChargeCapacity( ).
Additional feature to allow host to
easily determine health of the battery
Added Synchronization of
SBS.RemainingCapacity( ) to
SBS.FullChargeCapcity( ) at charge
taper termination.
SBS.RemainingCapacity( ) is not
affected and could be < 100% at
charge termination.
If DF:Operation Cfg [RMFCC] is set
then SBS.RemainingCapacity( ) is
updated to the value of
SBS.FullChargeCapcity( ) at charge
termination.
Adds option to enable charge
synchronization in order to display
RelativeStateOfCharge as 100% at
charge termination
Improved thermal model
A preliminary thermal mode was
used.
An updated thermal model is used.
Improved thermal compensation of
Impedance Track™ algorithm
Improved cell capacity measurement
by limiting valid temperature ranges
Valid voltage measurements for cell
capacity estimation can occur at any
temperature.
Valid voltage measurements for cell
capacity estimation must occur within
a defined temperature range.
Improves capacity estimation
Improved cell capacity measurement
After a full reset, it may take several
minutes for voltage reading to settle
to the most accurate reading.
Settling time of voltage
measurements after a full reset is
reduced.
Improves initial voltage reading
accuracy
Improved default resistance tables
A preliminary default resistance mode
was used.
An updated default resistance mode
is used.
Improved thermal accuracy of
Impedance Track™ algorithm
16
Submit Documentation Feedback
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
CHANGE
bq20z80
bq20z80-V101
COMMENTS
Prevented lifetime updates until IT is
enabled
Data flash lifetime data is updated
under all conditions.
Data flash lifetime data is not updated
until Impedance Track™ is enabled.
Improves suitability of lifetime data
Aligned SBS.RemainingCapacity( )
with DF:Terminate Voltage
SBS.RemainingCapacity( ) could be
above zero when SBS.Voltage( )
reaches DF:Terminate Voltage.
Forces SBS.RemainingCapacity( ) to
zero when SBS.Voltage( ) is below
terminate voltage
Improves alignment between
reporting and system status
Disabled LEDs for undervoltage
conditions
When SBS.OperationStatus( ) [CUV
or PUV] is set, then the LED display
could be activated.
When SBS.OperationStatus( ) [CUV
or PUV] is set, the LED display is
disabled.
Reduces risk of deeply discharging
the battery
Clear SBS.BatteryStatus( ) [RCA]
when not SBS.BatteryStatus( ) [DSG]
SBS.BatteryStatus( ) [RCA] is not
cleared when SBS.BatteryStatus( )
[DSG] is cleared.
SBS.BatteryStatus( ) [RCA] is now
cleared when SBS.BatteryStatus( )
[DSG] is cleared.
Corrected to meet SBS specification
Allowed sleep mode for undervoltage
conditions
When SBS.OperationStatus( ) [CUV
or PUV] is set, then entry to sleep
mode is disabled.
When SBS.OperationStatus( ) [CUV
or PUV] is set, then entry to sleep
mode is allowed.
Reduces risk of deeply discharging
the battery
Improvements made to Lifetime data
Does not save maximum and
minimum lifetime AverageCurrent or
AveragePower. Only saves lifetime
data when new values exceed old
values by defined delta values
Saves maximum and minimum
lifetime AverageCurrent and
AveragePower. Lifetime data is saved
after a defined period of time even if
new values do not exceed old values
by defined delta values
Improves lifetime data
Changes made to pulse charging
Voltages for pulse charging are
sampled once a second.
Voltages for pulse charging are
sampled 4 times a second.
Improves pulse charging
Changes made to charging timeouts
The precharge timeout timer runs
when the charging current is below a
defined threshold; so, it is possible
that the precharge timer will run
during charging taper current and
cause an undesired precharge
timeout during charging taper.
The fast charge and precharge
timeout timers only run when
precharging or charging, as indicated
by FCHG and PCHG bits in
ChargingStatus.
Improves operation of fast charge and
precharge timeout timers
Changes made to discharge faults
Discharging fault is indicated
whenever BatteryStatus [TDA] is set.
Current discharging fault is not
indicated for current faults detect by
AFE. Separate discharging faults are
indicated for voltage and temperature.
Discharging fault is indicated for any
safety condition resulting in turning off
the discharge FET. Current
discharging fault is indicated for all
detected overcurrent conditions,
including overcurrent detected by
AFE. Temperature and voltage
discharge faults are not indicated
separately.
Improves indication of discharging
fault conditions
Improvements made to calibration
functions
Voltage calibration functions may
cause error in voltage calibration of
several millivolts.
Voltage calibration functions are
capable of accuracy within 1 millivolt.
Improved voltage calibration accuracy
Protect against simultaneous writes to A SMBus-initiated data flash write
A SMBus-initiated data flash write
data flash
may occur at the same time as a data cannot occur at the same time as any
flash write initiated by the AGG, which other data flash write.
my cause a data flash write error.
Increased robustness of data flash
writes
Corrected
SBS.ManufacturerAccess( ) access of
SBS.ManufacturerAccess( ) access of silicon revision is not functional.
silicon revision
SBS.ManufacturerAccess( ) access of Allows host to determine bq20z80
silicon revision is functional.
silicon revision
Corrected data flash checksum
operation
The data flash checksum includes
non-accessible portions of the data
flash that change when writing the
data flash checksum, invalidating the
checksum.
The data flash checksum only
includes data flash that does not
change when writing an updated data
flash checksum.
Data flash checksum operation works
correctly.
Corrections made to LED display
Fixed LED thresholds cannot be
selected.
Fixed LED thresholds can be
selected.
Correct operation of LED threshold
settings
Erroneous readings are corrected that Erroneous SBS voltage, current, and
occurred after offset calibration when temperature readings occur after
sleep mode is not entered.
current offset calibration if sleep mode
is not entered, corrupting the lifetime
data.
No erroneous SBS voltage, current,
Improve reliability of lifetime data
and temperature readings occur after
current offset calibration if sleep mode
is not entered.
Corrected the length of
SBS.ManufacturerData( ) command
SBS.ManufactureData( ) returned
additional data not specified in the
data sheet.
Only returns the appropriate data
Correct data set made available to
host
Changed DF:Charger Present default
voltage to 12000 mV
DF:Charger Present default was
16800 mV.
Default changed to 12000 mV.
More realistic default for most
applications
Corrected LED display lock-up fault
when exiting sleep with LEDs on
LED display locks up if LEDs are ON
as the bq20z80 exits sleep mode.
LED display operates normally
regardless of power state transitions.
Correct operation of the LED display
under all conditions
Submit Documentation Feedback
17
bq20z80
bq20z80A
www.ti.com
SLUS782 – JULY 2007
CHANGE
bq20z80
Added report of any inability to write
DFF as flash write error in calibration
mode
If writing the data flash is not allowed
either due to a permanent failure or
low voltage, then no indication is
given when attempting to write data
flash in calibration mode.
bq20z80-V101
COMMENTS
The inability to write data flash in
Improved calibration system
calibration mode is reported as a flash interaction
write error.
Corrected issue of improperly clearing AFE faults were detected and the
AFE faults
pack protected but the fault would be
cleared up to three times at an
interval of 250 milliseconds before the
defined recovery requirements would
apply.
AFE faults are correctly handled,
including the flags.
Modified code to save open-circuit
OCV data was saved after a full reset
voltage (OCV) data on IT enable only, which could have disturbed the OCV
not a full reset
measurements if the battery was not
in a completely relaxed state.
OCV tables are only updated when IT Improved OCV data reliability under
enabled, or the IT enable command is all system conditions
resent.
Corrected range check for calibration
of analog-to-digital converter (ADC)
offset
In calibration mode, if the
measurement ADC offset was out of
range, no error would be reported.
In calibration mode, if the
measurement ADC offset is out of
range, an error is reported.
Improved calibration system
interaction
Implemented a validation time for
DOD0
There is a possibility of erroneous
DOD0 measurement if charge or
discharge current occurs at the same
time.
DOD0 measurement is not saved
unless the battery remains in the
relaxed state for a defined time after
the DOD0 measurement is made.
More reliable
SBS.FullChargeCapacity( ) and
SBS.RemainingCapacity under all
system conditions
Implemented a bounds limit to a
QMAX change
QMAX changes are not limited to
filter-bad readings.
QMAX changes are bounds limited to
filter-bad readings.
More reliable
SBS.FullChargeCapacity( ) and
SBS.RemainingCapacity under all
system conditions
Implemented a double hit for dv/dt
detection for QMAX qualification
The dv/dt qualification for QMAX
update requires only one sample to
be valid.
The dv/dt qualification for QMAX
update requires two samples to be
valid.
More reliable
SBS.FullChargeCapacity( ) and
SBS.RemainingCapacity( ) under all
system conditions
Corrected parameter update issue
caused by exiting sleep mode during
current measurement
If bq20z80 exits sleep during a
current measurement, the SBS
parameters do not update again until
the pack enters and exits sleep mode
again.
SBS parameter updates operate
normally regardless of power state
transitions.
Improved system interaction for sleep
mode transitions
Implemented an option to leave
charge FET on for a nonremovable
pack in sleep mode, enabled by
DF:Operation Cfg B [NRCHG].
When DF:Operation Cfg B [NR] is set, When DF:Operation Cfg B [NR,
then the CHG is turned off at entry to NRCHG] are set, then the CHG
sleep mode.
remains on at entry to sleep mode.
Improved system interaction options
Modified code such that if QMAX has
not been updated, old valid OCV
readings are discarded when a new
valid OCV reading is detected and the
conditions for QMAX update do not
exist.
Valid OCV is only discarded when all
conditions for QMAX update are
satisfied, but the accumulated error in
the measured capacity exceeds 1%
(default value).
If QMAX has been updated, the same
conditions for discarding an OCV
reading are the same as for the
bq20z80. Otherwise, old OCV
readings are discarded and new OCV
readings are used when the
conditions for a valid OCV reading
exist, but the conditions for QMAX
update do not exist.
Enables QMAX measurement for full
charge or discharge for the first
QMAX update, even if initial OCV
measurement is made when battery is
only partially charged.
Modified code such that if QMAX has
not been updated, then for QMAX
update to occur, the measured
capacity must be greater than or
equal to 90% (default value) of design
capacity.
The measured capacity must be
greater than 20% (default value) or a
value as determined from the QMAX
update filter constant for a QMAX
update to occur.
For the first QMAX, the measured
capacity must be greater than 90%
(default value) for a QMAX update to
occur. If QMAX update has occurred
the conditions for measured capacity
are the same as for the bq20z80.
Improved QMAX data reliability for the
first update of QMAX
Default minimum passed charge for
QMAX update has been changed
from 20% to 37%
Internal flash value of Min Passed
Charge is 20%. The default setting for
the QMAX update filter constant of 64
means actual Min Passed Charge for
QMAX update is 25%.
Internal flash value of Min Passed
Charge is 37%. This 37% is
consistent with the QMAX update
filter constant of 96.
Improved QMAX data reliability under
all system conditions.
Default QMAX update filter constant
has been changed from 64 to 94.
Internal flash value of QMAX update
filter is 64.
Internal flash value of QMAX update
filter is 94.
Improved QMAX data reliability under
all system conditions.
DF:Qmax Cell 2..4 are updated to =
DF:Design Capacity if not used when
QMAX is updated.
Ensure all QMAX values are
reasonable, even if not used
QMAX values for nonexistent cells will DF:Qmax Cell 2..4 written with
be updated to Design Capacity.
random values if not used when
QMAX is updated
18
Submit Documentation Feedback
Improved system interaction when
faults occur
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
BQ20Z80ADBT-V110
ACTIVE
TSSOP
DBT
38
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ20Z80ADBT-V110G4
ACTIVE
TSSOP
DBT
38
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ20Z80ADBTR-V110
ACTIVE
TSSOP
DBT
38
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ20Z80ADBTRV110G4
ACTIVE
TSSOP
DBT
38
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ20Z80DBT
NRND
TSSOP
DBT
38
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ20Z80DBT-V110
NRND
TSSOP
DBT
38
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ20Z80DBT-V110G4
NRND
TSSOP
DBT
38
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ20Z80DBTG4
NRND
TSSOP
DBT
38
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ20Z80DBTR-V110
NRND
TSSOP
DBT
38
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ20Z80DBTR-V110G4
NRND
TSSOP
DBT
38
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
BQ20Z80ADBTR-V110
Package Package Pins
Type Drawing
TSSOP
DBT
38
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
6.9
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.2
1.8
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ20Z80ADBTR-V110
TSSOP
DBT
38
2000
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
Similar pages