DS36C278 www.ti.com SNLS096C – JULY 1998 – REVISED APRIL 2013 DS36C278 Low Power Multipoint EIA-RS-485 Transceiver Check for Samples: DS36C278 FEATURES DESCRIPTION • The DS36C278 is a low power differential bus/line transceiver designed to meet the requirements of RS485 standard for multipoint data transmission. In addition it is compatible with TIA/EIA-422-B. 1 2 • • • • • • • • • • • (1) 100% RS-485 Compliant – Guaranteed RS-485 Device Interoperation Low Power CMOS Design: ICC 500 μA Max Built-In Power Up/Down Glitch-Free Circuitry – Permits Live Transceiver Insertion/Displacement PDIP and SOIC Packages Available Industrial Temperature Range: −40°C to +85°C On-Board Thermal Shutdown Circuitry – Prevents Damage to the Device in the Event of Excessive Power Dissipation Wide Common Mode Range: −7V to +12V Receiver Open Input Fail-Safe (1) ¼ Unit Load (DS36C278): ≥12 Nodes ½ Unit Load (DS36C278T): ≥64 Nodes ESD (Human Body Model): ≥2 kV Drop in Replacement for: – LTC485, MAX485, DS75176, DS3695 The CMOS design offers significant power savings over its bipolar and ALS counterparts without sacrificing ruggedness against ESD damage. The device is ideal for use in battery powered or power conscious applications. ICC is specified at 500 μA maximum. The driver and receiver outputs feature TRI-STATE capability. The driver outputs operate over the entire common mode range of −7V to +12V. Bus contention or fault situations that cause excessive power dissipation within the device are handled by a thermal shutdown circuit, which forces the driver outputs into the high impedance state. The receiver incorporates a fail safe circuit which guarantees a high output state when the inputs are left open. (1) The DS36C278T is fully specified over the industrial temperature range (−40°C to +85°C). Non-terminated, open input only Connection Diagram Figure 1. 8-Pin PDIP or SOIC Package Numbers D0008A and P0008E 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS36C278 SNLS096C – JULY 1998 – REVISED APRIL 2013 www.ti.com Pin Descriptions Pin No. Name Description 1 RO Receiver Output: When RE (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥ DO*/RI* by 200 mV, RO will be HIGH. If DO/RI ≤ DO*/RI* by 200 mV, RO will be LOW. Additionally RO will be HIGH for OPEN (Non-terminated) Inputs. 2 RE* Receiver Output Enable: When RE* is LOW the receiver output is enabled. When RE* is HIGH, the receiver output is in TRI-STATE (OFF). 3 DE Driver Output Enable: When DE is HIGH, the driver outputs are enabled. When DE is LOW, the driver outputs are in TRI-STATE (OFF). 4 DI Driver Input: When DE (Driver Enable) is HIGH, the driver is enabled, if DI is LOW, then DO/RI will be LOW and DO*/RI* will be HIGH. If DI is HIGH, then DO/RI is HIGH and DO*/RI* is LOW. 5 GND Ground Connection. 6 DO/RI Driver Output/Receiver Input, 485 Bus Pin. 7 DO*/RI* Driver Output/Receiver Input, 485 Bus Pin. 8 VCC Positive Power Supply Connection: Recommended operating range for VCC is +4.75V to +5.25V. Table 1. Truth Table (1) DRIVER SECTION RE* DE DI DO/RI X H H H DO*/RI* L X H L L H X L X Z Z RECEIVER SECTION (1) RE* DE RI-RI* RO L L ≥+0.2V H L L ≤−0.2V L H L X Z L L OPEN (1) H Non-terminated, open input only These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage (VCC) +12V −0.5V to (VCC +0.5V) Input Voltage (DE, RE*, & DI) Common Mode (VCM) Driver Output/Receiver Input ±15V Input Voltage (DO/RI, DO*/RI*) ±14V −0.5V to (VCC +0.5V) Receiver Output Voltage Maximum Package Power Dissipation @ +25°C D0008A Package 1190 mW, derate 9.5 mW/°C above +25°C P0008E Package 744 mW, derate 6.0 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature (Soldering 4 sec) (1) (2) 2 +260°C “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C278 DS36C278 www.ti.com SNLS096C – JULY 1998 – REVISED APRIL 2013 Recommended Operating Conditions Supply Voltage (VCC) Min Typ Max Units +4.75 +5.0 +5.25 V +12 V −7 Bus Voltage Operating Free-Air Temperature (TA) DS36C278T DS36C278 Electrical Characteristics −40 25 +85 °C 0 25 +70 °C (1) (2) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Parameter Test Conditions Reference Min Typ Max Units 1.5 5.0 V 0 5.0 V 0 5.0 V DIFFERENTIAL DRIVER CHARACTERISTICS VOD1 Differential Output Voltage IO = 0 mA (No Load) (422) (485) VOD0 Output Voltage IO = 0 mA VOD0* Output Voltage (Output to GND) VOD2 Differential Output Voltage RL = 50Ω (422) (Termination Load) RL = 27Ω (485) ΔVOD2 Balance of VOD2 (3) RL = 27Ω or 50Ω |VOD2 − V0D2*| Differential Output Voltage (Full Load) R1 = 54Ω, R2 = 375Ω VTEST = −7V to +12V VOC Driver Common Mode Output Voltage RL = 27Ω (485) RL = 50Ω (422) IOSD 2.0 2.8 1.5 2.3 5.0 V V −0.2 0.1 +0.2 V 1.5 2.0 5.0 V 0 3.0 V 0 3.0 V −0.2 +0.2 V (422, 485) VOD3 ΔVOC Figure 2 Figure 3 Figure 2 (3) Balance of VOC |VOC − VOC*| RL = 27Ω or RL = 50Ω (422, 485) Driver Output Short-Circuit Current VO = +12V (485) 200 +250 mA VO = −7V (485) −190 −250 mA (4) +0.035 +0.2 V RECEIVER CHARACTERISTICS VTH VTL Differential Input High Threshold Voltage VO = VOH, IO = −0.4V −7V ≤ VCM ≤ +12V Differential Input Low Threshold Voltage VO = VOL, IO = 0.4 mA −7V ≤ VCM ≤ +12V Hysteresis VCM = 0V RIN Input Resistance −7V ≤ VCM ≤ +12V RIN Input Resistance −7V ≤ VCM ≤ +12V IIN Line Input Current Other Input = 0V, DS36C278 DE = VIL, RE* = VIL, VCC= 4.75 to 5.25 DS36C278T or 0V IING Line Input Current Glitch (6) Other Input = 0V, DS36C278 DE = VIL, RE* = VIL, VCC = +3.0V or 0V, DS36C278T TA = 25°C IB (1) (2) (3) (4) (5) (6) (7) Input Balance Test −0.2 (5) VHST (6) (422, 485) RS = 500Ω DS36C278T 24 −0.035 V 70 mV 68 kΩ DS36C278 48 68 VIN = +12V 0 0.19 0.25 mA VIN = −7V 0 −0.1 −0.2 mA VIN = +12V 0 0.19 0.5 mA VIN = −7V 0 −0.1 −0.4 mA VIN = +12V 0 0.19 0.25 mA VIN = −7V 0 −0.1 −0.2 mA VIN = +12V 0 0.19 0.5 mA VIN = −7V 0 −0.1 −0.4 mA ±400 mV (422) (7) kΩ Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD1 and VOD2. All typicals are given for: VCC = +5.0V, TA = + 25°C. Delta |VOD2| and Delta |VOC| are changes in magnitude of VOD2 and VOC, respectively, that occur when input changes state. Threshold parameter limits specified as an algebraic value rather than by magnitude. Hysteresis defined as VHST = VTH − VTL. IIN includes the receiver input current and driver TRI-STATE leakage current. For complete details of test, see RS-485. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C278 3 DS36C278 SNLS096C – JULY 1998 – REVISED APRIL 2013 www.ti.com Electrical Characteristics (1) (2) (continued) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Parameter Test Conditions VOH High Level Output Voltage IOH = −4 mA, VID = +0.2V VOL Low Level Output Voltage IOL = +4 mA, VID = −0.2V IOSR Short Circuit Current VO = GND IOZR TRI-STATE Leakage Current VO = 0.4V to 2.4V Reference Min Typ RO Figure 12 3.5 4.6 7 RO Max Units V 0.3 0.5 V 35 85 mA ±1 μA DEVICE CHARACTERISTICS VIH High Level Input Voltage 2.0 VCC V VIL Low Level Input Voltage GND 0.8 V IIH High Level Input Current VIH = VCC IIL Low Level Input Current VCC = 5V DE, RE*, DI VIL = 0V VCC = +3.0V 2 μA −2 μA −2 μA ICC Power Supply Current Driver and Receiver ON 200 500 μA ICCR (No Load) Driver OFF, Receiver ON 200 500 μA 200 500 μA 200 500 μA ICCD Driver ON, Receiver OFF ICCZ Driver and Receiver OFF VCC Switching Characteristics (1) (2) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Parameter Test Conditions Reference Min Typ Max Units 10 39 80 ns 10 40 80 ns 0 1 10 ns 3 25 50 ns DRIVER CHARACTERISTICS tPHLD Differential Propagation Delay High to Low RL = 54Ω, CL = 100 pF tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD − tPLHD| tr Rise Time tf Fall Time tPHZ Disable Time High to Z CL = 15 pF tPLZ Disable Time Low to Z RE * = L tPZH Enable Time Z to High CL = 100 pF tPZL Enable Time Z to Low RE * = L Figure 7 3 25 50 ns Figure 8, Figure 9 — 80 200 ns Figure 10, Figure 11 — 80 200 ns Figure 8, Figure 9 — 50 200 ns Figure 10, Figure 11 — 65 200 ns 30 210 400 ns 30 190 400 ns 0 20 50 ns — 50 150 ns — 55 150 ns — 40 150 ns — 45 150 ns RECEIVER CHARACTERISTICS tPHL Propagation Delay High to Low tPLH Propagation Delay Low to High tSK Skew, |tPHL − tPLH| tPLZ Output Disable Time CL = 15 pF Figure 13, Figure 14 CL = 15 pF tPHZ tPZL Figure 15, Figure 16, Figure 17 Output Enable Time tPZH (1) (2) 4 All typicals are given for: VCC = +5.0V, TA = + 25°C. CL includes probe and jig capacitance. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C278 DS36C278 www.ti.com SNLS096C – JULY 1998 – REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION Figure 2. Driver VOD2 and VOC Figure 3. Driver VOD3 Figure 4. Driver VOH and VOL Vtest = −7V to +12V Figure 5. Driver IOSD Figure 6. Driver Differential Propagation Delay Test Circuit Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C278 5 DS36C278 SNLS096C – JULY 1998 – REVISED APRIL 2013 www.ti.com Figure 7. Driver Differential Propagation Delays and Differential Rise and Fall Times Figure 8. TRI-STATE Test Circuit (tPZH , tPHZ) Figure 9. TRI-STATE Waveforms (tPZH, tPHZ) Figure 10. TRI-STATE Test Circuit (tPZL, tPLZ) 6 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C278 DS36C278 www.ti.com SNLS096C – JULY 1998 – REVISED APRIL 2013 Figure 11. TRI-STATE Waveforms (tPZL, tPLZ) Figure 12. Receiver VOH and VOL Figure 13. Receiver Differential Propagation Delay Test Circuit Figure 14. Receiver Differential Propagation Delay Waveforms Figure 15. Receiver TRI-STATE Test Circuit Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C278 7 DS36C278 SNLS096C – JULY 1998 – REVISED APRIL 2013 www.ti.com Figure 16. Receiver Enable and Disable Waveforms (tPLZ, tPZL) Figure 17. Receiver Enable and Disable Waveforms (tPHZ, tPZH) Typical Application Information Figure 18. Typical RS-485 Bus Interface Unit Load A unit load for an RS-485 receiver is defined by the input current versus the input voltage curve. The gray shaded region is the defined operating range from −7V to +12V. The top border extending from −3V at 0 mA to +12V at +1 mA is defined as one unit load. Likewise, the bottom border extending from +5V at 0 mA to −7V at −0.8 mA is also defined as one unit load (see Figure 19). An RS-485 driver is capable of driving up to 32 unit loads. This allows up to 32 nodes on a single bus. Although sufficient for many applications, it is sometimes desirable to have even more nodes. For example, an aircraft that has 32 rows with 4 seats per row would benefit from having 128 nodes on one bus. This would allow signals to be transferred to and from each individual seat to 1 main station. Usually there is one or two less seats in the last row of the aircraft near the restrooms and food storage area. This frees the node for the main station. The DS36C278, the DS36C279, and the DS36C280 all have ½ unit load and ¼ unit load (UL) options available. These devices will allow up to 64 nodes or 128 nodes guaranteed over temperature depending upon which option is selected. The ½ UL option is available in industrial temperature and the ¼ UL is available in commercial temperature. 8 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C278 DS36C278 www.ti.com SNLS096C – JULY 1998 – REVISED APRIL 2013 First, for a ½ UL device the top and bottom borders shown in Figure 19 are scaled. Both 0 mA reference points at +5V and −3V stay the same. The other reference points are +12V at +0.5 mA for the top border and −7V at −0.4 mA for the bottom border (see Figure 19). Second, for a ¼ UL device the top and bottom borders shown in Figure 19 are scaled also. Again, both 0 mA reference points at +5V and −3V stay the same. The other reference points are +12V at +0.25 mA for the top border and −7V at −0.2 mA for the bottom border (see Figure 19). The advantage of the ½ UL and ¼ UL devices is the increased number of nodes on one bus. In a single master multi-slave type of application where the number of slaves exceeds 32, the DS36C278/279/280 may save in the cost of extra devices like repeaters, extra media like cable, and/or extra components like resistors. The DS36C279 and DS36C280 have an additional feature which offers more advantages. The DS36C279 has an automatic sleep mode function for power conscious applications. The DS36C280 has a slew rate control for EMI conscious applications. Refer to the sleep mode and slew rate control portion of the application information section in the corresponding datasheet for more information on these features. Figure 19. Input Current vs Input Voltage Operating Range Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C278 9 DS36C278 SNLS096C – JULY 1998 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 9 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C278 PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS36C278M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS36C 278M DS36C278MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS36C 278M DS36C278TM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 36C27 8TM DS36C278TM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 36C27 8TM DS36C278TMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 36C27 8TM DS36C278TMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 36C27 8TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2014 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS36C278MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS36C278TMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS36C278TMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS36C278MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 DS36C278TMX SOIC D 8 2500 367.0 367.0 35.0 DS36C278TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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