AVAGO AFBR-57R6AEZ Rohs compliant optical transceiver with rate select Datasheet

AFBR-57R6AEZ
Digital Diagnostic SFP, 850 nm, Low Voltage (3.3 V)
4.25/2.125/1.0625 and 1.25 GBd Ethernet, RoHS Compliant Optical Transceiver with Rate Select
5APZ
-57RSER PROD
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AFBR
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21CR APORE CD1C
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Data Sheet
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Description
Features
Avago’s AFBR-57R6AEZ optical transceiver supports
high-speed serial links over multimode optical fiber at
signal-ing rates up to 4.25 Gb/s. Compliant with Small
Form Pluggable (SFP) Multi Source Agreement (MSA)
mechanical and electrical specifications for LC Duplex
transceivers, ANSI Fibre Channel FC-PI, FC-PI-2 and compliant with IEEE 802.3 for gigabit applications. The part is
electrically interoperable with SFP conformant devices.
• Compliant to Restriction on Hazardous Substances
(RoHS) directive
• Diagnostic features per SFF-8472 “Diagnostic
Monitoring Interface for Optical Transceivers”
• Real time monitoring of:
– Transmitted optical power
– Received optical power
– Laser bias current
– Temperature
– Supply voltage
• Rate select functionality per SFF 8079 (revision 1.7)
• Wide temperature and supply voltage operation
(-10°C to 85°C) (3.3 V ± 10%)
• Transceiver specifications per SFP (SFF-8074i) MultiSource Agreement and SFF-8472 (revision 9.3)
– 4.25 GBd Fibre Channel operation for FC-PI 400-M5SN-I and 400-M6-SN-I
– 2.125 GBd Fibre Channel operation for FC-PI
200-M5-SN-I and 200-M6-SN-I
– 1.0625 GBd Fibre Channel operation for FC-PI
100-M5-SN-I and 100-M6-SN-I
– 1.25 GBd operation for IEEE 802.3 Gigabit Ethernet
1000Base-SX
• Link lengths at 4.25 GBd:
– 150 m with 50 µm MMF, 70 m with 62.5 µm MMF
• Link lengths at 2.125 GBd:
– 300 m with 50 µm MMF, 150 m with 62.5 µm MMF
• Link lengths at 1.0625 GBd:
– 500 m with 50 µm MMF, 300 m with 62.5 µm MMF
• Link lengths at 1.25 GBd:
– 2 to 550 m with 50 µm MMF, 2 to 275 m with
62.5 µm MMF
• LC Duplex optical connector interface conforming to
ANSI TIA/EIA604-10 (FOCIS 10A)
• 850 nm Vertical Cavity Surface Emitting Laser (VCSEL)
source technology
• IEC 60825-1 Class 1/CDRH Class 1 laser eye safe
• Compliant with Gigabit Ethernet
• Enhanced EMI performance for high port density
applications
The AFBR-57R6AEZ is a “Quad Rate” 850 nm SFP which
ensures compliance to 4G/2G/1G Fibre Channel and 1G
Ethernet specifications. Using the product’s Rate_Select
input, the user sets the desired SFP compliance point.
In high rate position, the product is equivalent to the
4G/2G/1G Fibre Channel based AFBR-57R5AEZ. In the
low rate position, the product moves to a 2G/1G Fibre
Channel 1G Ethernet operating mode.
As an enhancement to the conventional SFP interface
defined in SFF-8074i, the AFBR-57R6AEZ is compliant to
SFF-8472 (digital diagnostic interface for optical transceivers). Using the 2-wire serial interface defined in the
SFF-8472 MSA, the AFBR-57R6AEZ provides real time
temperature, supply voltage, laser bias current, laser average output power and received input power. This information is in addition to conventional SFP base data.
The digital diagnostic interface also adds the ability to
disable the transmitter (TX_DISABLE), monitor for Transmitter Faults (TX_FAULT), and monitor for Receiver Loss
of Signal (RX_LOS).
Related Products
• AFBR-59R5LZ: 850 nm +3.3 V LC SFF 2x7
for 4.25/2.125/1.0625 GBd Fibre Channel
Patent - www.avagotech.com/patents
Installation
Compliance Prediction
The AFBR-57R6AEZ can be installed in any SFF-8074i
compliant Small Form Pluggable (SFP) port regardless of
host equipment operating status. The AFBR-57R6AEZ is
hot-pluggable, allowing the module to be installed while
the host system is operating and on-line. Upon insertion,
the transceiver housing makes initial contact with the
host board SFP cage, mitigating potential damage due
to Electro-Static Discharge (ESD).
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-57R6AEZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify potential component compliance issues. Received optical
power is also available to assess compliance of a cable
plant and remote transmitter. When operating out of requirements, the link cannot guarantee error free transmission.
Digital Diagnostic Interface and Serial Identification
The 2-wire serial interface is based on ATMEL AT24C01A
series EEPROM protocol and signaling detail. Conventional EEPROM memory, bytes 0-255 at memory address
0xA0, is organized in compliance with SFF-8074i. New
digital diag­nostic information, bytes 0-255 at memory
address 0xA2, is compliant to SFF-8472. The new diagnostic information provides the opportunity for Predictive Failure Identification, Com­pliance Prediction, Fault
Isolation and Component Monitoring.
The I2C accessible memory page address 0xB0 is used internally by SFP for the test and diagnostic purposes and
it is reserved.
Predictive Failure Identification
The AFBR-57R6AEZ predictive failure feature allows a
host to identify potential link problems before system
performance is impacted. Prior identification of link
problems enables a host to service an application via
“fail over” to a redundant link or replace a suspect device,
maintaining system uptime in the process. For applications where ultra-high system uptime is required, a digital SFP provides a means to monitor two real-time laser
metrics asso­ciated with observing laser degradation and
predicting failure: average laser bias current (Tx_Bias)
and average laser optical power (Tx_Power).
2
Fault Isolation
The fault isolation feature allows a host to quickly pinpoint the location of a link failure, minimizing downtime.
For optical links, the ability to identify a fault at a local
device, remote device or cable plant is crucial to speeding service of an installation. AFBR-57R6AEZ real-time
monitors of Tx_Bias, Tx_Power, Vcc, Temperature and
Rx_Power can be used to assess local transceiver current
operating conditions. In addition, status flags Tx_Disable
and Rx Loss of Signal (LOS) are mirrored in memory and
available via the two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the AFBR57R6AEZ real-time monitors of Tx_Bias, Tx_Power, Vcc,
Temperature and Rx_Power. Potential uses are as debugging aids for system installation and design, and transceiver parametric evaluation for factory or field qualification. For example, temperature per module can be
observed in high density applications to facilitate thermal evaluation of blades, PCI cards and systems.
OPTICAL INTERFACE
ELECTRICAL INTERFACE
RECEIVER
LIGHT FROM FIBER
AMPLIFICATION
& QUANTIZATION
PHOTO-DETECTOR
RD+ (RECEIVE DATA)
RDÐ (RECEIVE DATA)
Rx LOSS OF SIGNAL
RATE SELECT
CONTROLLER & MEMORY
MOD-DEF2 (SDA)
MOD-DEF1 (SCL)
MOD-DEF0
TRANSMITTER
LIGHT TO FIBER
VCSEL
TX_DISABLE
LASER
DRIVER &
SAFETY
CIRCUITRY
TD+ (TRANSMIT DATA)
TDÐ (TRANSMIT DATA)
TX_FAULT
Figure 1. Transceiver functional diagram
Transmitter Section
Transmit Fault (Tx_Fault)
The transmitter section includes the Transmitter Optical SubAssembly (TOSA) and laser driver circuitry. The
TOSA, containing an 850 nm VCSEL (Vertical Cavity Surface Emitting Laser) light source, is located at the optical
interface and mates with the LC optical connector. The
TOSA is driven by a custom IC which uses the incoming
differential high speed logic signal to modulate the laser diode driver current. This Tx laser driver circuit regulates the optical power at a constant level provided the
incoming data pattern is dc balanced (8B/10B code, for
example).
A catastrophic laser fault will activate the transmitter signal, TX_FAULT, and disable the laser. This signal is an open
collector output (pull-up required on the host board). A
low signal indicates normal laser operation and a high
signal indicates a fault. The TX_FAULT will be latched
high when a laser fault occurs and is cleared by toggling
the TX_DISABLE input or power cycling the transceiver.
The transmitter fault condition can also be monitored via
the two-wire serial interface (address A2, byte 110, bit 2).
Transmit Disable (Tx_Disable)
The AFBR-57R6AEZ provides Class 1 (single fault tolerant) eye safety by design and has been tested for compliance with the requirements listed in Table 1. The eye
safety circuit continuously monitors the optical output
power level and will disable the transmitter upon detecting an unsafe condition beyond the scope of Class 1 certification. Such unsafe conditions can be due to inputs
from the host board (Vcc fluctuation, unbalanced code)
or a fault within the transceiver.
The AFBR-57R6AEZ accepts a TTL and CMOS compatible transmit disable control signal input (pin 3) which
shuts down the transmitter optical output. A high signal
implements this function while a low signal allows normal transceiver operation. In the event of a fault (e.g. eye
safety circuit activated), cycling this control signal resets
the module as depicted in Figure 4. An internal pull up
resistor disables the transceiver transmitter until the host
pulls the input low. Host systems should allow a 10 ms
interval between successive assertions of this control
signal. Tx_Disable can also be asserted via the two-wire
serial interface (address A2h, byte 110, bit 6) and monitored (address A2h, byte 110, bit 7).
The contents of A2h, byte 110, bit 6 are logic OR’d with
hardware Tx_Disable (pin 3) to control transmitter operation.
3
Eye Safety Circuit
Receiver Section
The receiver section includes the Receiver Optical SubAssembly (ROSA) and the amplification/quantization circuitry. The ROSA, containing a PIN photodiode and custom transimpedance amplifier, is located at the optical
interface and mates with the LC optical connector. The
ROSA output is fed to a custom IC that provides postamplification and quantization.
Fibre Channel Rate Select (Rate_Select)
The AFBR-57R6AEZ transceiver contains a parametric
optimization circuit to ensure compliant performance
for 1.0625 Gb/s, 1.25 Gb/s, 2.125 Gb/s and 4.25 Gb/s data
rates. When Rate_Select (pin 7) is high, the transceiver is
optimized for 4.25G/2.125G/1.0625 G Fibre Channel performance as defined in document SFF-8079 and ANSI FCPI-2. When Rate_Select is low (or open), the transceiver is
optimized for 2.125G/1.0625G Fibre Channel and 1.25G
Ethernet performance as defined in document SFF-8079
and INF-8074. Rate_Select can also be asserted via the
two-wire serial interface (address A2h, byte 110, bit 3)
and monitored (address A2h, byte 110, bit 4).
The contents of A2h, byte 110, bit 3 are logic OR’d with hardware Rate_Select (pin 7) to control transmitter operation.
Receiver Loss of Signal (Rx_LOS)
The post-amplification IC also includes transition detection circuitry which monitors the ac level of incoming
optical signals and provides a TTL/CMOS compatible
status signal to the host (pin 8). An adequate optical input results in a low Rx_LOS output while a high Rx_LOS
output indicates an unusable optical input. The Rx_LOS
thresholds are factory set so that a high output indicates
a definite optical fault has occurred. Rx_LOS can also be
monitored via the two-wire serial interface (address A2h,
byte 110, bit 1).
Functional Data I/O
The AFBR-57R6AEZ interfaces with the host circuit board
through twenty I/O pins (SFP electrical connector) identified by function in Table 2. The board layout for this interface is depicted in Figure 6.
The AFBR-57R6AEZ high speed transmit and receive interfaces require SFP MSA compliant signal lines on the
host board. To simplify board requirements, biasing resistors and ac coupling capacitors are incorporated into
the SFP transceiver module (per SFF-8074i) and hence
are not required on the host board. The Tx_Disable, Tx_
Fault, Rx_LOS, and Rate_Select lines require TTL lines on
the host board (per SFF-8074i) if used. If an application
chooses not to take advantage of the functionality of
these pins, care must be taken to ground Tx_Disable (for
normal operation).
4
Figure 2 depicts the recom­mended interface circuit to
link the AFBR-57R6AEZ to supporting physical layer ICs.
Timing for MSA compliant control signals implemented
in the transceiver are listed in Figure 4.
Application Support
An Evaluation Kit and Reference Designs are available to
assist in evaluation of the AFBR-57R6AEZ. Please contact
your local Field Sales representative for availability and
ordering details.
Caution
There are no user serviceable parts nor maintenance
requirements for the AFBR-57R6AEZ. All mechanical
adjustments are made at the factory prior to shipment.
Tampering with, modifying, misusing or improperly handling the AFBR-57R6AEZ will void the product warranty.
It may also result in improper operation and possibly
overstress the laser source. Performance degrada­tion
or device failure may result. Connection of the AFBR57R6AEZ to a light source not compliant with ANSI FC-PI
or IEEE 802.3 specifications, operating above maximum
operating conditions or in a manner inconsistent with it’s
design and function may result in exposure to hazardous
light radiation and may constitute an act of modifying or
manufacturing a laser product. Persons performing such
an act are required by law to re-certify and re-identify the
laser product under the provisions of U.S. 21 CFR (Subchapter J) and TUV.
Ordering Information
Please contact your local field sales engineer or one of
Avago Technologies franchised distributors for ordering information. For technical information, please visit
Avago Technologies’ WEB page at www.avagotech.com or
contact Avago Technologies Semicon-ductor Products
Customer Response Center at 1-800-235-0312. For information related to SFF Committee documentation visit
www.sffcommittee.org.
Regulatory Compliance
The AFBR-57R6AEZ complies with all applicable laws and
regulations as detailed in Table 1. Certification level is dependent on the overall configuration of the host equipment. The transceiver performance is offered as a figure
of merit to assist the designer.
Electrostatic Discharge (ESD)
system level ESD requirements.
The AFBR-57R6AEZ is compatible with ESD levels found
in typical manufacturing and operating environments as
described in Table 1. In the normal handling and operation of optical transceivers, ESD is of concern in two circumstances.
Electromagnetic Interference (EMI)
The first case is during handling of the transceiver prior to
insertion into an SFP compliant cage. To protect the device,
it’s important to use normal ESD handling pre-cautions.
These include use of grounded wrist straps, work-benches
and floor wherever a transceiver is handled.
The second case to consider is static discharges to the
exterior of the host equipment chassis after installation.
If the optical interface is exposed to the exterior of host
equipment cabinet, the transceiver may be subject to
Equipment incorporating gigabit transceivers is typically
subject to regulation by the FCC in the United States,
CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan.
The AFBR-57R6AEZ’s compliance to these standards is
detailed in Table 1. The metal housing and shielded design
of the AFBR-57R6AEZ minimizes the EMI challenge facing
the equipment designer.
EMI Immunity (Susceptibility)
Due to its shielded design, the EMI immunity of the AFBR57R6AEZ exceeds typical industry standards.
Flammability
The AFBR-57R6AEZ optical transceiver is made of metal
and high strength, heat resistant, chemical resistant and
UL 94V-0 flame retardant plastic.
Table 1. Regulatory Compliance
Feature
Test Method
Electrostatic Discharge (ESD)
MIL-STD-883C
to the Electrical Pins
Method 3015.4
Electrostatic Discharge (ESD)
Variation of IEC 61000-4-2
to the Duplex LC Receptacle
GR1089
Electrostatic Discharge (ESD)
Variation of IEC 801-2
to the Optical Connector
Electromagnetic Interference
FCC Class B
(EMI)
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class 1
Immunity
Variation of IEC 61000-4-3
Laser Eye Safety and
US FDA CDRH AEL Class 1
Equipment Type Testing
US21 CFR, Subchapter J per
Paragraphs 1002.10
and 1002.12
BAUART
Performance
Class 1 (>2000 Volts)
Typically, no damage occurs with 25 kV
when the duplex LC connector receptacle
is contacted by a Human Body Model
probe.
10 contacts of 8 kV on the electrical faceplate
with device inserted into a panel.
Air discharge of 15 kV (min.) contact to
connector without damage.
System margins are dependent on customer
board and chassis design.
Typically shows no measurable effect from a
10 V/m field swept from 10 MHz to 1 GHz.
CDRH certification # 9720151-48
TUV file # R72102088.01
¬
GEPRUFT
¬
TUV
Rheinland
Product Safety
TYPE
APPROVED
Component Recognition
(IEC) EN60825-1: 2007
(IEC) EN60825-2: 2004+A1
(IEC) EN60950-1: 2006+A11
Underwriters Laboratories and
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment including Electrical
Business Equipment
RoHS Compliance
5
UL File # E173874
Less than 1000 ppm of cadmium, lead,
mercury, hexavalent chromium, polybrominated
biphenyls, and polybrominated biphenyl ethers.
V CC ,T
GND,T
6.8 kΩ
Tx DIS
Tx_DISABLE
Tx FAULT
Tx_FAULT
TD+
0.01 µF
100 Ω
TD0.01 µF
4.7 k to 10 kΩ
1 µH
LASER DRIVER
V CC ,T
0.1 µF
3.3 V
10 µF
SERDES IC
PROTOCOL IC
0.1 µF
1 µH
V CC ,R
10 µF
0.1 µF
V CC ,R
50 Ω
V CC ,R
4.7 k to
10 kΩ
RD+
100 Ω
RD−
Rx LOS
LOSS OF SIGNAL
RATE SELECT
GND,R
POST AMPLIFIER
4.7 k to 10 kΩ
MOD_DEF0
4.7 k to 10 kΩ
MODULE DETECT
SCL
SDA
Figure 2. Typical application configuration
1 µH
V CC T
0.1 µF
1 µH
V CC R
0.1 µF
SFP MODULE
10 µF
3.3 V
0.1 µF
10 µF
HOST BOARD
NOTE: INDUCTORS MUST HAVE LESS THAN 1 Ω SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFP MODULE.
Figure 3. Recommended power supply filter
6
0.01 µF
40 kΩ
3.3 V
4.7 k to 10 kΩ
50 Ω
0.01 µF
MOD_DEF1
MOD_DEF2
Table 2. Pin Description
Pin
Name
Function/Description
Notes
1
VeeT
Transmitter Ground
2
TX_FAULT
Transmitter Fault Indication – High indicates a fault condition
Note 1
3
TX_DISABLE
Transmitter Disable – Module electrical input disables on high or open
Note 2
4
MOD-DEF2
Module Definition 2 – Two wire serial ID interface data line (SDA)
Note 3
5
MOD-DEF1
Module Definition 1 – Two wire serial ID interface clock line (SCL)
Note 3
6
MOD-DEF0
Module Definition 0 – Grounded in module (module present indicator)
Note 3
7
Rate Select
Bit Rate Parametric Optimization
Note 4
8
RX_LOS
Loss of Signal – High indicates loss of received optical signal
Note 5
9
VeeR
Receiver Ground
10
VeeR
Receiver Ground
11
VeeR
Receiver Ground
12
RD-
Inverse Received Data Out
Note 6
13
RD+
Received Data Out
Note 6
14
VeeR
Receiver Ground
15
VccR
Receiver Power + 3.3 V
Note 7
16
VccT
Transmitter Power + 3.3 V
Note 7
17
VeeT
Transmitter Ground
18
TD+
Transmitter Data In
Note 8
19
TD-
Inverse Transmitter Data In
Note 8
20
VeeT
Transmitter Ground
Notes:
1. TX_FAULT is an open collector/drain output, which must be pulled up with a 4.7 k – 10 kΩ resistor on the host board. When high, this output
indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8 V.
2. TX_DISABLE is an input that is used to shut down the transmitter optical output. It is internally pulled up (within the transceiver) with a 6.8 kΩ
resistor.
Low (0 – 0.8 V): Transmitter on
Between (0.8 V and 2.0 V):
Undefined
High (2.0 – Vcc max) or OPEN:
Transmitter Disabled
3. The signals Mod-Def 0, 1, 2 designate the two wire serial interface pins. They must be pulled up with a 4.7 k – 10 kΩ resistor on the host board.
Mod-Def 0 is grounded by the module to indicate the module is present
Mod-Def 1 is serial clock line (SCL) of two wire serial interface
Mod-Def 2 is serial data line (SDA) of two wire serial interface
4. RATE_SELECT is an input used to control transceiver compatiility for multiple rates. It is internally pulled down with a >30 kΩ resistor.
Low (0 - 0.8 V) or OPEN:
Low Bit Rate Compatibility per SFF-8074i (1.0625 Gb/s, 1.25 Gb/s and 2.125 Gb/s per SFF-8079)
Between (0.8 V and 2.0 V)
Undefined per SFF-8074i
High (2.0 – Vcc max):
(1.0625 Gb/s, 2.125 Gb/s, and 4.25 Gb/s per SFF-8079)
5. RX_LOS (Rx Loss of Signal) is an open collector/drain output that must be pulled up with a 4.7 k – 10 kΩ resistor on the host board. When high,
this output indicates the received optical power is below the worst case receiver sensitivity (as defined by the standard in use). Low indicates
normal operation. In the low state, the output will be pulled to < 0.8 V.
6. RD-/+ designate the differential receiver outputs. They are AC coupled 100 Ω differential lines which should be terminated with 100 Ω differential
at the host SERDES input. AC coupling is done inside the transceiver and is not required on the host board. The voltage swing on these lines will
be between 600 and 1600 mV differential (300 – 800 mV single ended) when properly terminated.
7. VccR and VccT are the receiver and transmitter power supplies. They are defined at the SFP connector pin. The maximum supply current is 300
mA and the associated in-rush current will typically be no more than 30 mA above steady state after 2 microseconds.
8. TD-/+ designate the differential transmitter inputs. They are AC coupled differential lines with 100 Ω differential termination inside the module.
The AC coupling is done inside the module and is not required on the host board. The inputs will accept differential swings of 400 – 2400 mV
(200 – 1200 mV single ended), though it is recommended that values between 500 and 1200 mV differential (250 – 600 mV single ended) be
used for best EMI performance.
7
Table 3. Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Unit
Notes
Storage Temperature
TS
-40
100
C
Note 1, 2
Case Operating Temperature
TC
-40
100
C
Note 1, 2
Relative Humidity
RH
5
95
%
Note 1
Supply Voltage
VccT, R
-0.5
3.8
V
Note 1, 2, 3
Low Speed Input Voltage
VIN
-0.5
Vcc + 0.5
V
Note 1
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short
period of time. See Reliability Data Sheet for specific reliability performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability is
not implied, and damage to the device may occur over an extended period of time.
3. The module supply voltages, VCCT and VCCR must not differ by more than 0.5 V or damage to the device may occur.
Table 4. Recommended Operating Conditions
Parameter
Symbol
Minimum
Maximum
Unit
Notes
Case Operating Temperature
TC
-10
85
°C
Note 1, 2
Supply Voltage
VccT, R
2.97
3.63
V
Note 2
1.0625
4.25
Gb/s
Note 2
Data Rate Notes:
1. The Ambient Operating Temperature limitations are based on the Case Operating Temperature limitations and are subject to the host system
thermal design.
2. Recommended Operating Conditions are those values for which functional performance and device reliability is implied.
Table 5. Transceiver Electrical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ± 10%)
Parameter
Symbol
Minimum
Typical
Maximum
PSNR
100
Unit
Notes
AC Electrical Characteristics
Power Supply Noise Rejection (peak-peak)
mV
Note 1
DC Electrical Characteristics
Module Supply Current
ICC 210
mA
Power Dissipation
PDISS
765
mW
Low Speed Outputs:
Transmit Fault (TX_FAULT), Loss of Signal
(RX_LOS), MOD-DEF 2
VOH
2.0
VccT, R+0.3
V
VOL
0.8
V
VIH
2.0
Vcc
V
VIL
0
0.8
V
Low Speed Inputs:
Transmit Disable (TX_DIS), MOD-DEF 1,
MOD-DEF2, Rate Select (RATE_SELECT)
Notes:
1. Filter per SFP specification is required on host board to remove 10 Hz to 2 MHz content.
2. Pulled up externally with a 4.7 k – 10 kΩ resistor on the host board to 3.3 V.
3. Mod-Def1, Mod-Def2 and RATE_SELECT must be pulled up externally with a 4.7 k – 10 kΩ resistor on the host board to 3.3 V.
8
Note 2
Note 3
Table 6. Transmitter and Receiver Electrical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ± 10%)
Parameter
Symbol
Minimum
High Speed Data Input:
Transmitter Differential Input Voltage (TD +/-)
VI
High Speed Data Output:
Receiver Differential Output Voltage (RD +/-)
Vo
Typical
Maximum
Unit
Notes
400
2400
mV
Note 1
600
1600
mV
Note 2
Receiver Contributed Total Jitter
TJ
0.26
(4.25 Gb/s)
62
UI
Note 3
Receiver Contributed Total Jitter
TJ
0.26
(2.125 Gb/s)
124
UI
Receiver Contributed Total Jitter
TJ
0.22
(1.0625 Gb/s)
205
Receiver Contributed Total Jitter
TJ
0.332
(1.25 Gb/s)
266
Receiver Electrical Output Rise & Fall Times
(20-80%)
tr, tf
50
150
ps
Note 3
ps
UI
Note 3
ps
UI
Note 3
ps
ps
Note 4
Notes:
1. Internally AC coupled and terminated (100 Ohm differential).
2. Internally AC coupled but requires an external load termination (100 Ohm differential).
3. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern. Contributed TJ is the sum of contributed
RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter (measured on a single rise or fall edge) from
the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is allowed to increase above its limit if the actual
contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their specified FC-PI maximum limits with
the worst case specified component jitter input.
4. 20%-80% electrical rise & fall times measured with a 500 MHz signal utilizing a 1010 data pattern.
9
Table 7. Transmitter Optical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3V ±10%)
Parameter
Symbol
Minimum
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 4.25 Gb/s
Tx,OMA
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 2.125 Gb/s
Typical
Unit
Notes
247
µW
Note 1
Tx,OMA
196
µW
Note 2
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 1.0625 Gb/s
Tx,OMA
156
µW
Note 3
Optical Extinction Ratio
ER
9
dB
Note 4
Average Optical Output Power
Pout
-9.0
dBm
Note 5, 6
Center Wavelength
lC
830
860
nm
Spectral Width – rms
s,rms
0.85
nm
Optical Rise/Fall Time (4.25 Gb/s)
tr, tf
90
ps
RIN 12 (OMA)
RIN
-118
dB/Hz
Transmitter Contributed Total Jitter
TJ
0.25
UI
(4.25 Gb/s)
60
ps
Transmitter Contributed Total Jitter
TJ
(2.125 Gb/s)
0.25
UI
120
ps
0.27
UI
252
ps
Transmitter Contributed Total Jitter
TJ
(1.0625 Gb/s)
Maximum
20% -80%
Note 7
Note 7
Note 7
Transmitter Contributed Total Jitter
TJ
0.284
(1.25 Gb/s) 227
ps
Pout TX_DISABLE Asserted
dBm
POFF
-35
UI
Notes:
1. An OMA of 247 µW is approximately equal to an average power of –8 dBm, avg assuming an Extinction Ratio of 9 dB.
2. An OMA of 196 µW is approximately equal to an average power of –9 dBm, avg assuming an Extinction Ratio of 9 dB.
3. An OMA of 156 µW is approximately equal to an average power of –10 dBm, avg assuming an Extinction Ratio of 9 dB.
4. Extinction ratio of 9 dB valid when RATE_SELECT signal is driven low.
5. Max Pout is the lesser of Class 1 safety limits (CDRH and EN 60825) or receiver power, max.
6. Into 50/125 µm (0.2 NA) multi-mode optical fiber.
7. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern. Contributed TJ is the sum of contributed
RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter (measured on a single rise or fall edge) from
the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is allowed to increase above its limit if the actual
contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their specified FC-PI maximum limits with
the worst case specified component jitter input.
10
Table 8. Receiver Optical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter
Symbol
Input Optical Power [Overdrive]
PIN0
dBm, avg
Input Optical Modulation Amplitude
(Peak-to-Peak) 4.25 Gb/s [Sensitivity]
OMA
61
µW, OMA
Notes 1, 2
Input Optical Modulation Amplitude
(Peak-to-Peak) 2.125 Gb/s [Sensitivity]
OMA
49
µW, OMA
Notes 1, 3
Input Optical Modulation Amplitude
(Peak-to-Peak) 1.0625 Gb/s [Sensitivity]
OMA
31
µW, OMA
Notes 1, 4
Receiver Sensitivity (Optical Input Power)
PRMIN
-17
dBm
138
µW, OMA
50/125 µm fiber, Note 5
148
µW, OMA
62.5/125 µm fiber, Note 5
96
µW, OMA
50/125 µm fiber, Note 6
109
µW, OMA
62.5/125 µm fiber, Note 6
Stressed Receiver Sensitivity
(OMA) 4.25 Gb/s
Stressed Receiver Sensitivity
(OMA) 2.125 Gb/s
Min.
Typ.
Max.
Unit
Notes
Stressed Receiver Sensitivity
(OMA) 1.0625 Gb/s
55
µW, OMA
50/125 µm fiber, Note 7
67
µW, OMA
62.5/125 µm fiber, Note 7
Stressed Receiver Sensitivity 1.25 Gb/s
-13.5
dBm
50/125 µm fiber
-12.5
dBm
62.5/125 µm fiber
Return Loss
12
dB
Loss of Signal – Assert
PA27.5
-30
Loss of Signal - De-Assert
31
µW, OMA
-17.0
dBm, avg
Loss of Signal Hysteresis
0.5
dB
PD
PD - PA
-17.5
µW, OMA
dBm, avg
Note 8
Note 8
Notes:
1. Input Optical Modulation Amplitude (commonly known as sensitivity) requires a valid 8B/10B encoded input.
2. An OMA of 61 µW is approximately equal to an average power of –14 dBm, avg with an Extinction Ratio of 9 dB.
3. An OMA of 49 µW is approximately equal to an average power of –15 dBm, avg with an Extinction Ratio of 9 dB.
4. An OMA of 31 µW is approximately equal to an average power of –17 dBm, avg with an Extinction Ratio of 9 dB.
5. 4.25 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 1.67 dB for 50 µm fiber and 2.14 dB for 62.5 µm fiber. Stressed receiver DCD
component min. (at TX) is 20 ps.
6. 2.125 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 1.26 dB for 50 µm fiber and 2.03 dB for 62.5 µm fiber. Stressed receiver DCD
component min. (at TX) is 40 ps.
7. 1.0625 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 0.96 dB for 50 µm fiber and 2.18 dB for 62.5 µm fiber. Stressed receiver DCD
component min. (at TX) is 80 ps.
8. These average power values are specified with an Extinction Ratio of 9 dB. The loss of signal circuitry responds to valid 8B/10B encoded peak to
peak input optical power, not average power.
11
Table 9. Transceiver SOFT DIAGNOSTIC Timing Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ± 10%)
Parameter
Symbol
Hardware TX_DISABLE Assert Time
Minimum
Maximum
Unit
Notes
t_off
10
µs
Note 1
Hardware TX_DISABLE Negate Time
t_on
1
ms
Note 2
Time to initialize, including reset of TX_FAULT
t_init
300
ms
Note 3
Hardware TX_FAULT Assert Time
t_fault
100
µs
Note 4
Hardware TX_DISABLE to Reset
t_reset
µs
Note 5
Hardware RX_LOS Deassert Time
t_loss_on
100
µs
Note 6
Hardware RX_LOS Assert Time
t_loss_off
100
µs
Note 7
Hardware RATE_SELECT Assert Time
t_rate_high
10
ms
Note 8
Hardware RATE_SELECT Deassert Time
t_rate_low
10
ms
Note 8
Software TX_DISABLE Assert Time
t_off_soft
100
ms
Note 9
Software TX_DISABLE Negate Time
t_on_soft
100
ms
Note 10
Software Tx_FAULT Assert Time
t_fault_soft
100
ms
Note 11
Software Rx_LOS Assert Time
t_loss_on_soft
100
ms
Note 12
Software Rx_LOS Deassert Time
t_loss_off_soft
100
ms
Note 13
Analog parameter data ready
t_data
1000
ms
Note 14
Serial bus hardware ready
t_serial
300
ms
Note 15
Write Cycle Time
t_write
10
ms
Note 16
Serial ID Clock Rate
f_serial_clock
400
kHz
10
Notes:
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.
3. Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.
4. From power on or negation of TX_FAULT using TX_DISABLE.
5. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.
6. Time from loss of optical signal to Rx_LOS Assertion.
7. Time from valid optical signal to Rx_LOS De-Assertion.
8. Time from rising or falling edge of Rate_Select input until transceiver is in conformance with appropriate specification.
9. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured
from falling clock edge after stop bit of write transaction.
10. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of
nominal.
11. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.
12. Time for two-wire interface assertion of Rx_LOS (A2h, byte 110, bit 1) from loss of optical signal.
13. Time for two-wire interface de-assertion of Rx_LOS (A2h, byte 110, bit 1) from presence of valid optical signal.
14. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.
15. Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h).
16. Time from stop bit to completion of a 1-8 byte write command.
12
Table 10. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ± 10%)
Parameter
Symbol
Min.
Units
Notes
Transceiver Internal Temperature
TINT
±3.0
°C
Accuracy
Temperature is measured internal to the transceiver.
Valid from = -10°C to 85°C case temperature.
Transceiver Internal Supply
VINT
±0.1
V
Voltage Accuracy
Supply voltage is measured internal to the transceiver
and can, with less accuracy, be correlated to
voltage at the SFP Vcc pin. Valid over 3.3 V ± 10%.
Transmitter Laser DC Bias Current
Accuracy
IINT is better than ±10% of the nominal value.
IINT
±10
%
Transmitted Average Optical
PT
±3.0
dB
Output Power Accuracy
Coupled into 50/125 µm multi-mode fiber. Valid from
100 µW to 500 µW, avg.
Received Average Optical Input
PR
±3.0
dB
Power Accuracy
Coupled from 50/125 µm multi-mode fiber. Valid from
31 µW to 500 µW, avg.
V CC T,R > 2.97 V
V CC T,R > 2.97 V
TX_FAULT
TX_FAULT
TX_DISABLE
TX_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_init
t_init
t-init: TX DISABLE NEGATED
t-init: TX DISABLE ASSERTED
V CC T,R > 2.97 V
TX_FAULT
TX_FAULT
TX_DISABLE
TX_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_off
t_init
t_on
INSERTION
t-init: TX DISABLE NEGATED, MODULE HOT PLUGGED
t-off & t-on: TX DISABLE ASSERTED THEN NEGATED
OCCURANCE OF FAULT
OCCURANCE OF FAULT
TX_FAULT
TX_FAULT
TX_DISABLE
TX_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_fault
t_reset
* SFP SHALL CLEAR TX_FAULT IN
< t_init IF THE FAILURE IS TRANSIENT
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED
t_init*
t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED
OCCURANCE OF FAULT
TX_FAULT
LOS
TRANSMITTED SIGNAL
* SFP SHALL CLEAR TX_FAULT IN
< t_init IF THE FAILURE IS TRANSIENT
t_reset
t_fault
t_loss_on
t_init*
t-fault: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL NOT RECOVERED
Figure 4. Transceiver timing diagrams (module installed except where noted)
13
OCCURANCE
OF LOSS
OPTICAL SIGNAL
TX_DISABLE
t-loss-on & t-loss-off
t_loss_off
Table 12. EEPROM Serial ID Memory Contents – Conventional SFP Memory (Address A0h)
Byte # Data
Decimal Hex Notes
Byte #
Data
Decimal Hex
Notes
0
03
SFP physical device
37
00
Hex Byte of Vendor OUI[4]
1
04
SFP function defined by serial ID only
38
17
Hex Byte of Vendor OUI[4]
2
07
LC optical connector
39
6A
Hex Byte of Vendor OUI[4]
3
00
40
53
“A” - Vendor Part Number ASCII character
4
00
41
41
“F” - Vendor Part Number ASCII character
5
00
42
42
“B” - Vendor Part Number ASCII character
6
01
1000Base-SX
43
52
“R” - Vendor Part Number ASCII character
7
20
Intermediate distance (per FC-PI)
44
2D
“-” - Vendor Part Number ASCII character
8
40
Shortwave laser without OFC (open fiber control)
45
35
“5” - Vendor Part Number ASCII character
9
0C
Multi-mode 50 µm and 62.5 µm optical media
46
37
“7” - Vendor Part Number ASCII character
10
15
100, 200 & 400 Mbytes/sec FC-PI speed[1]
47
52
“R” - Vendor Part Number ASCII character
11
01
Compatible with 8B/10B encoded data
48
36
“6” - Vendor Part Number ASCII character
12
2B
4300 MBit/sec nominal bit rate (4.25 Gbit/s)
49
41
“A” - Vendor Part Number ASCII character
13
00
50
45
“E” - Vendor Part Number ASCII character
14
00
51
5A
“Z” - Vendor Part Number ASCII character
15
00
52
20
“ ” - Vendor Part Number ASCII character
16
0F
150 m of 50/125 µm fiber @ 4.25GBit/sec[2]
53
20
“ ” - Vendor Part Number ASCII character
17
07
70 m of 62.5/125 µm fiber @ 4.25GBit/sec[3]
54
20
“ ” - Vendor Part Number ASCII character
18
00
55
20
“ ” - Vendor Part Number ASCII character
19
00
56
20
“ ” - Vendor Part Number ASCII character
20
41
“A” - Vendor Name ASCII character
57
20
“ ” - Vendor Part Number ASCII character
21
56
“V” - Vendor Name ASCII character
58
20
“ ” - Vendor Part Number ASCII character
22
41
“A” - Vendor Name ASCII character
59
20
“ ” - Vendor Part Number ASCII character
23
47
“G” - Vendor Name ASCII character
60
03
Hex Byte of Laser Wavelength[5]
24
4F
“0” - Vendor Name ASCII character
61
52
Hex Byte of Laser Wavelength[5]
25
20
“ ” - Vendor Name ASCII character
62
00
26
20
“ ” - Vendor Name ASCII character
63
27
20
“ ” - Vendor Name ASCII character
64
Checksum for Bytes 0-62[6]
00
28
20
“ ” - Vendor Name ASCII character
65
3A
Hardware SFP TX_DISABLE, TX_FAULT,
& RX_LOS, RATE_SELECT
29
20
“ ” - Vendor Name ASCII character
66
00
30
20
“ ” - Vendor Name ASCII character
67
00
31
20
“ ” - Vendor Name ASCII character
68-83
Vendor Serial Number ASCII characters[7]
32
20
“ ” - Vendor Name ASCII character
84-91
Vendor Date Code ASCII characters[8]
33
20
“ ” - Vendor Name ASCII character
92
Digital Diagnostics, Internal Cal, Rx Pwr Avg
68
34
20
“ ” - Vendor Name ASCII character
93
F8
A/W, Soft SFP TX_DISABLE, TX_FAULT,
& RX_LOS, RATE_SELECT
35
20
SFF-8472 Compliance to revision 9.3
36
00
“ ” - Vendor Name ASCII character
94
01
95
Checksum for Bytes 64-94[6]
96 - 255 00
Notes:
1. FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec. 200 MBytes/sec is a serial bit rate of 2.125 GBit/sec. 400 MBytes/sec is a serial
bit rate of 4.25 GBit/sec.
2. Link distance with 50/125 µm cable at 1.0625 GBit/sec is 500 m. Link distance at 2.125 GBit/sec is 300 m.
3. Link distance with 62.5/125 µm cable at 1.0625 GBit/sec is 300 m. Link distance with 62.5/125 µm cable at 2.125 GBit/sec is 150 m.
4. The IEEE Organizationally Unique Identifier (OUI) assigned to Avago Technologies is 00-17-6A (3 bytes of hex).
5. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352.
6. Addresses 63 and 95 are checksums calculated (per SFF-8472 and SFF-8074) and stored prior to product shipment.
7. Addresses 68-83 specify the AFBR-57R6AEZ ASCII serial number and will vary on a per unit basis.
8. Addresses 84-91 specify the AFBR-57R6AEZ ASCII date code and will vary on a per date code basis.
14
Table 13. EEPROM Serial ID Memory Contents – Enhanced Feature Set Memory (Address A2h)
Byte #
Decimal
Notes
Byte #
Decimal
Notes
Byte #
Decimal
Notes
0
Temp H Alarm MSB[1]
26
Tx Pwr L Alarm MSB[4]
104
Real Time Rx Pwr MSB[5]
1
Temp H Alarm LSB[1]
27
Tx Pwr L Alarm LSB[4]
105
Real Time Rx Pwr LSB[5]
2
Temp L Alarm MSB[1]
28
Tx Pwr H Warning MSB[4]
106
Reserved
3
Temp L Alarm LSB[1]
29
Tx Pwr H Warning LSB[4]
107
Reserved
4
Temp H Warning MSB[1]
30
Tx Pwr L Warning MSB[4]
108
Reserved
5
Temp H Warning LSB[1]
31
Tx Pwr L Warning LSB[4]
109
Reserved
6
Temp L Warning MSB[1]
32
Rx Pwr H Alarm MSB[5]
110
Status/Control
- See Table 14
7
Temp L Warning LSB[1]
33
Rx Pwr H Alarm LSB[5]
111
Reserved
8
Vcc H Alarm MSB[2]
34
Rx Pwr L Alarm MSB[5]
112
Flag Bits - See Table 15
9
Vcc H Alarm LSB[2]
35
Rx Pwr L Alarm LSB[5]
113
Flag Bits - See Table 15
10
Vcc L Alarm MSB[2]
36
Rx Pwr H Warning MSB[5]
114
Reserved
11
Vcc L Alarm LSB[2]
37
Rx Pwr H Warning LSB[5]
115
Reserved
12
Vcc H Warning MSB[2]
38
Rx Pwr L Warning MSB[5]
116
Flag Bits - See Table 15
13
Vcc H Warning LSB[2]
39
Rx Pwr L Warning LSB[5]
117
Flag Bits - See Table 15
14
Vcc L Warning MSB[2]
40-55
Reserved
118-127
Reserved
15
Vcc L Warning LSB[2]
56-94
External Calibration Constants[6]
128-247
Customer Writeable
16
Tx Bias H Alarm MSB[3]
95
Checksum for Bytes 0-94[7]
248-255
Vendor Specific
17
Tx Bias H Alarm LSB[3]
96
Real Time Temperature MSB[1]
18
Tx Bias L Alarm MSB[3]
97
Real Time Temperature LSB[1]
19
Tx Bias L Alarm LSB[3]
98
Real Time Vcc MSB[2]
20
Tx Bias H Warning MSB[3]
99
Real Time Vcc LS[2]
21
Tx Bias H Warning LSB[3]
100
Real Time Tx Bias MSB[3]
22
Tx Bias L Warning MSB[3]
101
Real Time Tx Bias LSB[3]
23
Tx Bias L Warning LSB[3]
102
Real Time Tx Power MSB[4]
24
Tx Pwr H Alarm MSB[4]
103
Real Time Tx Power LSB[4]
25
Tx Pwr H Alarm LSB[4]
Notes:
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256°C.
2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 µV.
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 µA.
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.
5. Received average optical power (Rx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.
6. Bytes 56-94 are not intended for use with AFBR-57R6AEZ, but have been set to default values per SFF-8472.
7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.
15
Table 14. EEPROM Serial ID Memory Contents – Soft Commands (Address A2h, Byte 110)
Bit #
Status/
Control Name
Description
Notes
7
TX_ DISABLE State
Digital state of SFP TX_ DISABLE Input Pin (1 = TX_DISABLE asserted)
Note 1
6
Soft TX_ DISABLE
Read/write bit for changing digital state of TX_DISABLE function
Note 1, 2
5
Reserved
4
Rate Select State
Digital state of SFP Rate Select Input Pin (1 = RATE_SELECT asserted)
Note 1, 3
3
Soft Rate_Select
Read/write bit for changing digital state of RATE_SELECT function
Note 1, 3
2
TX_FAULT State
Digital state of the SFP TX_FAULT Output Pin (1 = TX_FAULT asserted)
Note 1
1
RX_LOS State
Digital state of the SFP RX_LOS Output Pin (1 = RX_LOS asserted)
Note 1
0
Data Ready (Bar)
Indicates transceiver is powered and real time sense data is ready. (0 = Ready)
Note 3
Notes:
1. The response time for soft commands of the AFBR-57R6AEZ is 100 msec as specified by the MSA SFF-8472.
2. Bit 6 is logic OR’d with the SFP TX_DISABLE input pin 3 ... either asserted will disable the SFP transmitter.
3. AFBR-57R6AEZ is optimized for 4.25 G, 2.125 Gb/s, and 1.0625 Gb/s performance when the Rate_Select (pin 7) is high. The AFBR-57R6AEZ is
optimized for 2.125 Gb/s and 1.0625 Gb/s Fibre Channel and 1.25 Gb/s Ethernet performance when the Rate_Select (pin 7) is low. Bit 3 is logic
OR’d with the SFP RATE_SELECT input pin 7 . . . either asserted will set the SFP transceiver to high bit rate parametric performance.
Table 15. EEPROM Serial ID Memory Contents – Alarms and Warnings
(Address A2h, Bytes 112, 113, 116, 117)
Byte
Bit
Flag Bit Name Description
112
7
Temp High Alarm
Set when transceiver internal temperature exceeds high alarm threshold
6
Temp Low Alarm
Set when transceiver internal temperature exceeds low alarm threshold
5
Vcc High Alarm
Set when transceiver internal supply voltage exceeds high alarm threshold
4
Vcc Low Alarm
Set when transceiver internal supply voltage exceeds low alarm threshold
3
Tx Bias High Alarm
Set when transceiver laser bias current exceeds high alarm threshold
2
Tx Bias Low Alarm
Set when transceiver laser bias current exceeds low alarm threshold
1
Tx Power High Alarm
Set when transmitted average optical power exceeds high alarm threshold
0
Tx Power Low Alarm
Set when transmitted average optical power exceeds low alarm threshold
7
Rx Power High Alarm
Set when received average optical power exceeds high alarm threshold
6
Rx Power Low Alarm
Set when received average optical power exceeds low alarm threshold
0-5
Reserved
7
Temp High Warning
Set when transceiver internal temperature exceeds high warning threshold
6
Temp Low Warning
Set when transceiver internal temperature exceeds low warning threshold
5
Vcc High Warning
Set when transceiver internal supply voltage exceeds high warning threshold
4
Vcc Low Warning
Set when transceiver internal supply voltage exceeds low warning threshold
3
Tx Bias High Warning
Set when transceiver laser bias current exceeds high warning threshold
2
Tx Bias Low Warning
Set when transceiver laser bias current exceeds low warning threshold
1
Tx Power High Warning
Set when transmitted average optical power exceeds high warning threshold
0
Tx Power Low Warning
Set when transmitted average optical power exceeds low warning threshold
7
Rx Power High Warning
Set when received average optical power exceeds high warning threshold
6
Rx Power Low Warning
Set when received average optical power exceeds low warning threshold
0-5
Reserved
113
116
117
16
55.3 ± 0.2
AFBR-57R6AEZ
850nm LASER PROD
21CRF(J) CLASS1
SINGAPORE 0446
PPOC-4102-DIn2 SN: AJ0446CD1C
13.6
AEZ OD
7R6 PR
R-5 ASERASS1
AFB 50nmRLF(J) C0L44545CD1C
DEVICE SHOWN WITH
DUST CAP AND
BAIL DELATCH
13.4 ± 0.1
1.91
8 21C INA 04
CHSN: A3
2
-Din
02
-44
G
PPO
1.39 UNCOMPRESSED
12.4 ± 0.2
8.5 ± 0.1
0.55 UNCOMPRESSED
6.25 ± 0.05
+ 0.2
13.6 0
TX
RX
14.9 UNCOMPRESSED
Figure 5. Module drawing
17
X
Y
34.5
10
3x
7.2
10x ∅1.05 ± 0.01
∅ 0.1 L X A S
16.25
MIN. PITCH
7.1
1
11.08
16.25 14.25
REF.
8.58
2.5
B
PCB
EDGE
∅ 0.85 ± 0.05
∅ 0.1 S X Y
A
1
2.5
3.68
5.68
20
PIN 1
2x 1.7
8.48
9.6
4.8
11
10
11.93
SEE DETAIL 1
2.0
11x
5
26.8
11x 2.0
9x 0.95 ± 0.05
∅ 0.1 L X A S
10
3x
3
41.3
42.3
3.2
5
0.9
20x 0.5 ± 0.03
0.06 L A S B S
LEGEND
PIN 1
9.6
10.53
10.93
0.8
TYP .
10
DET AIL 1
2. THROUGH HOLES, PLATING OPTIONAL
3. HATCHED AREA DENOTES COMPONENT
AND TRACE KEEPOUT (EXCEPT
CHASSIS GROUND)
2 ∅ 0.005 TYP.
0.06 L A S B S
Figure 6. SFP host board mechanical layout
18
11.93
11
4
2x 1.55 ± 0.05
∅ 0.1 L A S B S
1. PADS AND VIAS ARE CHASSIS GROUND
20
4. AREA DENOTES COMPONENT
KEEPOUT (TRACES ALLOWED)
DIMENSIONS ARE IN MILLIMETERS
2
1.7 ± 0.9
3.5 ± 0.3
41.78 ± 0.5
Tcase REFERENCE POINT
CAGE ASSEMBLY
15 MAX.
11.73 REF
15.25 ± 0.1
9.8 MAX.
10 REF
(to PCB)
10.4 ± 0.1
PCB
0.4 ± 0.1
(below PCB)
16.25 ± 0.1 MIN. PITCH
DIMENSIONS ARE IN MILLIMETERS
Figure 7. SFP Assembly drawing
Customer Manufacturing Processes
This module is pluggable and is not designed for aqueous wash, IR reflow, or wave soldering processes.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV01-0385EN
AV02-2797EN - January 28, 2013