TECHNICAL NOTE Sound Path Selector IC Series for Mobile Phones Mixer & Selector with PCM CODEC and 16bit D/A Converter BU7861KN ●Abstract The “In/Output Selector with Built-in PCM Codec 16bit D/A Converter” LSI is ideal for improving the sound quality of and miniaturizing cellular phone handsets with music playback function, accumulating analog circuits for sound which application CPUs and bass band LSIs are not ideally able to handle. ●Features 1) Loaded with stereo 16bit audio D/A converter 2) Compatible with stereo and analog interfaces 3) Built-in stereo headphone amp (16Ω) 4) Lowpass correction circuit built into the headphone amp 5) Gain-adjustable volume built in 6) Flexible mixing function built in ●Uses Portable information communication devices such as cellular phone handsets and PDA (Personal Digital Assistants) Cellular phone handsets with music playback function ●Absolute Maximum rating Parameter Symbol rating Unit Supply Voltage DVDD AVDD, PVDD -0.3 ～ 4.5 V Power Dissipation Pd 500 *1 mW Operational Temperature Range TOPR -25 ～ +80 ℃ -55 ～ +125 Storage Temperature Range TSTG *1 When used at over Ta=25℃, lessen by 5.0mW per 1℃ increase. ℃ ●Recommended Operational Range Parameter Digital Supply Voltage Analog Supply Voltage Power Supply Voltage PLL Synchronous Signal Frequency Symbol DVDD AVDD PVDD Min. 2.7 2.7 2.7 Typ. 3.0 3.0 3.0 Max. 3.3 3.3 3.3 Unit V V V FSYNC － 8 － kHz Sep. 2008 ●Electrical Characteristics (Unless specified, Ta=25℃, DVDD=AVDD=3.0V, PVDD=3.0V, FSYNC=8kHz) ・Complete Block Parameter Symbol Min. Typ. Max. Unit Consumed Current 1 IDD1 － 0.1 10 μA Consumed Current 2 Consumed Current 3 Consumed Current 4 Consumed Current 5 IDD2 IDD3 IDD4 IDD5 － － － － 0.8 1.7 1.6 1.0 1.2 2.6 2.4 1.5 mA mA mA mA Consumed Current 6 IDD6 － 5.9 9.0 mA Consumed Current 7 IDD7 － 6.4 9.6 mA Consumed Current 8 Consumed Current 9 IDD8 IDD9 － － 2.2 2.9 3.3 4.5 mA mA Consumed Current 10 IDD10 － 2.2 3.3 mA Consumed Current 11 IDD11 － 10.0 15.0 mA Consumed Current 12 IDD12 － 18.0 27.0 mA Digital High Level Input Voltage VIH 0.8× DVDD － － V Digital Low Level Input Voltage VIL － － Digital High Level Input Current Digital Low Level Input Current Digital High Level Output Voltage Digital Low Level Output Voltage IIH IIL － － μA μA VIH=DVDD VIL=0V VOH － -10 DVDD －0.5 0.2× DVDD 10 － － － V IOH=－1mA VOL － － 0.5 V IOL=1mA Schmidt Input Hysteresis Width Vhys 0.3 0.5 0.7 V SYSCLK, BCLK, LRCLK, FSYNC, DSPCLK ・Sound Block Parameter Min. Typ. Max. Unit Frequency Characteristics -3 － +3 dB DAC Full Scale Gain Error between Channels Distortion (No Bass Boost) Distortion (With Bass Boost) 1.4 1.8 2.2 VP-P - - ±1.5 dB － － 1 % － － 10 % S/N 75 83 － dB Crosstalk 70 80 － dB Output Level during Mute 70 80 － dB 2/12 Conditions When all power down, FSYNC L fixed REFON, FSYNC L fixed REFON+PLLON, FSYNC=8kHz REFON+MICBON, FSYNC L fixed REFON+EXTOUT, FSYNC L fixed REFON+PLLON+VICON, FSYNC=8kHz REFON+PLLON+VICON+TONEON, FSYNC=8kHz REFON+RECON, FSYNC L fixed REFON+HPON, FSYNC L fixed REFON+ HPVOLON, FSYNC L fixed DACON, SYSCLK=256fs All power on FSYNC=8kHz SYSCLK=256fs V Conditions Reference level (-20dB due to full scale) f=20Hz～20kHz -3dB band width 0.6×VDD Difference between Lch and Rch levels during DAC full scale DAC input=-0.5dBFS, HP_VOL=-2dB, HP2_VOL=0dB DAC input=-0.5dBFS, HP_VOL=-2dB, HP2_VOL=0dB During full scale HP_VOL, HP2_VOL=0dB, f=1kHz, A-weighted Stereo headphone amp included Measures the leak from Lch to Rch during full-scale output. 1kHz BPF １kHz BPF ・Driver Amp Block Microphone Amp Receiver Amp Stereo Headphone Amp SPOUT Terminal EXTOUT Terminal ・Codec Block Parameter Gain Configurable Range (THD≦1%) Maximum Output Voltage (THD ≦1%) S/N 100Hz PSRR 1kHz Min. Typ. Max. Unit 40 － － dB － 1.0 － Vrms 60 12 66 20 － － dB 25 35 － Load Maximum Output Power（THD ≦1%） S/N Offset Voltage 100Hz PSRR 1kHz 26 32 － Ω 31.25 45 － mW RL=32Ω, f=1kHz 80 － 65 90 5 77 － 100 － dB mV RL=32Ω, C-Message Load Maximum Output Power（THD ≦1%） 100Hz PSRR 1kHz Maximum Output Voltage (THD ≦1%) Maximum Output Voltage (THD ≦1%) Parameter Transmitting Side Reference Input Level Receiving Side Reference Input Level Pass Gain Transmitter Signal vs. General Power Distortion MICIN→DSPOUT Receiver Signal vs. General Power Distortion DSPIN→RECP Transmitter Transmission Level MICIN→DSPOUT Receiver Transmission Level DSPIN→RECP Transmitter Transmission Loss F Special MICIN→DSPOUT Receiver Transmission Loss F Special DSPIN→RECP dB f=100Hz～3.4kHz MICO terminal, f=1kHz C-Message 0.2VP-P superimposed to supply COMIN 1.0µF, MICIN no input 0.2VP-P superimposed supply COMIN 1.0µF to 60 70 － 12 16 － Ω 15 25 － mW RL=16Ω, f=1kHz 15 26 － dB 0.2VP-P superimposed to supply COMIN 1.0µF, HP_Vol=0dB 40 48 － 0.707 － － Vrms RL=10kΩ, f=1kHz 0.707 － － Vrms RL=3kΩ, f=1kHz Conditions When 1020Hz, sine wave, 0dBm0 transmitting MIC amp gain 0dB, Tx_Vol 0dB When 1020Hz, sine wave, 0dBm0 transmitting Amp gain 11.37dB, Tx_Vol 0dB At 1020Hz, sine wave, 0dBm0 input Rx_Vol 0dB At 1020Hz, sine wave, 0dBm0 input Rx_Vol 0dB At 1020Hz, sine wave, 0dBm0 input Rx_Vol 0dB EXTIN input, Rx_testline path Rx_Vol 0dB EXTIN input, Rx_testline path SPRX_Vol 0dB 1020Hz, sine wave, MIC amp gain 0dB Tx_Vol 0dB, C-MESSAGE Min. Typ. Max. Unit MICIN→ DSPOUT 0.44 0.50 0.56 Vrms EXTIN→ DSPOUT 0.119 0.135 0.151 Vrms 0.44 0.50 0.56 Vrms 0.44 0.50 0.56 Vrms 0.44 0.50 0.56 Vrms 2.4 3.2 4.0 dB 2.4 3.2 4.0 dB 24 29 35 24 29 35 -0.9 -0.6 -0.3 -0.9 -0.6 -0.3 24 0 -0.3 -0.3 0 6.5 -0.3 -0.3 0.0 － － － － － － － － － － － － － － － － － － － － － － － － － － － 0.9 0.6 0.3 0.9 0.6 0.3 － 2.5 0.3 0.9 － － 0.5 0.9 － DSPIN→ RECP DSPIN→ SPOUT DSPIN→ EXTOUT EXTIN→ RECN EXTIN→ SPOUT -45dBm0 -40dBm0 0, -30dBm0 -45dBm0 -40dBm0 0, -30dBm0 -55dBm0 -50dBm0 0, -40dBm0 -55dBm0 -50dBm0 0, -40dBm0 0.06kHz 0.2kHz 0.3～3.0kHz 3.4kHz 3.6kHz 3.78kHz 0.3～3.0kHz 3.4kHz 3.6kHz dB Conditions 3/12 dB dB dB dB 1020Hz, sine wave Rx_Vol 0dB, C-MESSAGE 1020Hz, -10dBm0 typical MIC amp gain 0dB Tx_Vol 0dB, C-MESSAGE 1020Hz, -10dBm0 typical Rx_Vol 0dB, C-MESSAGE 1020Hz, 0dBm0 at transmission MIC amp gain 0dB Tx_Vol 0dB dB dB 1020Hz, 0dBm0 at input Rx_Vol 0dB Noise during transmission Noise during reception 3.78kHz MICIN→ DSPOUT DSPIN→ REC[P-N] idle idle 6.5 － － － － -65 dBm0 － － -75 dBV Crosstalk (Transmitter→Receiver) MICIN→ REC[P-N] 60 70 － dB Crosstalk (Receiver→Transmitter) DSPIN→ DSPOUT 63 68 － dB Distortion 2nd to 5th time 40 50 － dB Min. Typ. Max. Unit ※1 70 80 － dB ※2 70 80 － dB RX Higher Component Harmonic ・Pass Switch Block Parameter Mute Level MIC amp gain 0dB Tx_Vol 0dB, C-MESSAGE DSPIN ALL0 Rx_Vol 0dB, C-MESSAGE 1020Hz, 0dBm0 at transmission MIC amp gain 0dB DSPIN ALL0 Tx_Vol 0dB Rx_Vol 0dB ST_MT OFF 1020Hz, 0dBm0 at input, 2040Hz component MIC amp gain 30dB Tx_Vol 0dB Rx_Vol 0dB ST_MT ON 1020Hz, sine wave, 0dBm0 at input Rx_Vol 0dB Conditions Configured at each mute SW Measured at 1kHz BPF Configured at each mute SW Leakage amount to each test line during normal usage Measured at 1kHz BPF Receiving side is muted digitally by VIC_MT and SPVIC_MT. ※1 MIC_SEL, MIC_MT, EXTIN_MT, MEL_MT, VIC_MT, REC_MT, ST_MT, HSJL_MT, HSJR_MT, SPVIC_MT, SPMEL_VOL, EXTOUT_SEL, TONE_MT, SOUND_MT, DIG_MT, AIN_MT, HP_SMT, SPOUT_SMT, EXTOUT_SMT, REC_SMT, HPR_MT, HPL_MT ※2 Tx_test1, Tx_test2, Rx_test1, Rx_test2, REC_TST, HPR_TST, HPL_TST ・DTMF/TONE Generator Block Item Symbol Min. Typ. Max. Unit VDTMF_L -15.3 -14.3 -13.3 dBV VDTMF_H -12.8 -11.8 -10.8 dBV VTONE_L -15.3 -14.3 -13.3 dBV VTONE_H -12.8 -11.8 -10.8 dBV SDTN － － -38 dB Symbol VO Min. 1.8 Typ. 2.0 Max. 2.2 Unit V IO 2 － － mA ΔVO1 － 14.0 30 mV N － -109 -90 dBV Output Level Tone Distortion ・Microphone Bias Block Parameter Output Voltage Maximum Output Current Load Stability Output Noise Voltage 4/12 Conditions f：DTMF_L TONE→RECP MEL_Vol 0dB Rx_Vol 0dB f：DTMF_H TONE→RECP MEL_Vol 0dB Rx_Vol 0dB f: designated TONE, low band TONE→RECP MEL_Vol 0dB Rx_Vol 0dB f: designated TONE, high band TONE→RECP MEL_Vol 0dB Rx_Vol 0dB f=1kHz ( designated TONE) TONE→REC[P-N] MEL_Vol 0dB Rx_Vol 0dB C-Message Conditions Io=500A Io=100A～2mA C-Message Io=500A ●Reference Data 2.0 19 1.0 0.8 Vdd=3.4V Vdd=3.0V 16 Vdd=2.6V 15 0.4 Vdd=3.4V Gain [dB] 17 0.6 1.5 Stand-by Current [uA] Circuit Current[mA] 18 Vdd=3.0V 1.0 Vdd=2.6V 0 50 0 Temperature[℃] 50 100 0 5000 Lch -70 Rch 15000 20000 Fig.3 16bit D/A Converter Frequency Characteristics @ 0dBFS 0 0 -20 -20 -40 -40 LEVEL [dBV] LEVEL [dBV] -50 10000 Frequency [Hz] Fig.2 Static Consumed Current -40 THD+N [dB] -0.8 Temperature [℃] Fig.1 Operational Current (All On) -60 Rch -1.0 -50 100 -0.2 -0.6 0.0 -50 Lch 0.0 -0.4 0.5 14 0.2 -60 -80 -60 -80 -100 -100 -120 -120 -80 -90 -40 -20 0 -140 -140 0 5000 DAC Output Level [dBFS] 0 -2 2dB Bass Boost Gain [dB] Bass Boost Gain [dB] 2 0 4dB 6dB -8 8dB -10 10dB -12 12dB -14 10 100 1000 10000 Fig.7 Bus Boost Frequency Characteristics -2 4dB -4 2dB 0 8dB -10 10dB -6 12dB -8 14dB -10 -20 -30 -40 -50 -60 100 1000 10000 0 100000 -20 -20 -30 -30 THD+N [dB] THD+N [dB] 0 -40 -50 -40 -50 -60 -60 -10 -70 -70 -12 -80 3000 4000 Frequency [Hz] Fig.10 Voice CODEC RX Frequency Characteristics 4000 Fig.9 Voice CODEC TX Frequency Characteristics 0 2000 3000 Fig.8 Bus Boost + High Pass Emphasis Frequency Characteristics -10 1000 2000 Frequency [Hz] 0 -8 1000 Frequency [Hz] -10 -6 20000 -12 10 -2 RX Gain [dB] 6dB 2 -4 15000 Fig.6 16bit D/A Converter FFT @ 0FS -16 100000 10000 10 Frequency [Hz] 0 5000 Frequency [Hz] -14 14dB -16 0 20000 Fig.5 16bit D/A Converter FFT @ 0dBFS, 1kHz 2 -6 15000 Frequency [Hz] Fig.4 16bit D/A Converter Distortion @ 1kHz -4 10000 TX Gain [dB] -60 -80 0 10 20 30 40 50 0 20 40 60 80 100 Output Power [mW] Output Power [mW] Fig.11 Headphone Amp Output Characteristics @ vdd=3.0V, 1kHz Fig.12 Receiver Amp Output Characteristics @ vdd=3.0V, 1kHz 5/12 MICO MICIN_C MICIN_1 MICIN_2 PVDD SMUTE POP PVSS DVSS AVDD AVSS DVDD PVCOM COMIN TXCOM RXCOM AUDCLK AUDRXD VREF/COMMON CPU I/F CPOP MIC BIAS MIC_BIAS SMUTE MICB_1 MICB_2 AUDTXD RSTB AUDCS ●Block Diagrams VDD/VSS 100kΩ MIC_MT 100kΩ 16step + + MIC_SEL TX_TEST1 A/D TX_VOL 27kΩ BPF +6～-8dB DSPCLK RX_TEST1 EXTIN DSPIN EXTIN_MT Tx_testline EXTGND 330kΩ DSPOUT DSP I/F Rx_testline EXTOUT 8step EXTOUT TX_TEST2 ST_VOL 60kΩ EXTOUT_SMT ST_MT -18～-42dB 60kΩ 100kΩ D/A + RX_VOL + RECN Gain=3.2dB 32step 100kΩ REC_MT 41.7kΩ VIC_MT LPF RX_TEST2 0～-30dB 100kΩ REC_TST 100kΩ RECP PLLLPF 32step +6～-54dB PLL FSYNC MEL_VOL 40kΩ 40kΩ 60kΩ MEL_MT + 100kΩ 60kΩ 41.7kΩ SPVIC_MT 60kΩ SPMEL_MT 16step +6～-8dB 32step SPOUT + SPRX_VOL SPOUT_SMT TONE_MT + Gain=3.2dB REC_SMT DTMF/ TONE SPMEL_VOL 16step 0～-28dB 0～-30dB SOUND_MT AIN_R 50kΩ HPR_TST Gain=+3dB 70.8kΩ + - 100kΩ 200kΩ 100kΩ HP_RI Gain=+3dB 70.8kΩ + - HPL_MT HP_VOL HSJR_MT 50kΩ + HPR_MT 8step +14～0dB 25kΩ 25kΩ DIG_MT HP2_VOL 100kΩ 200kΩ 8step +14～0dB SDI Digital I/F HP_SMT LRCLK BCLK 25kΩ 25kΩ TEST DACLO DACRO CSTEP PVDD HP_RI HP_R HP_L HP_LI PVSS AUDRXD AUDTXD AUDCS AUDCLK PLLLPF FSYNC Fig.13 BU7861KN Block Diagram 36 35 34 33 32 31 30 29 28 27 26 25 24 DSPIN RECN 37 23 DSPOUT RECP 38 22 DSPCLK CSTEP 39 21 DVSS CPOP 40 20 DVDD SMUTE 41 19 SYSCLK BU7861KN RXCOM42 18 BCLK TXCOM43 PVCOM 44 COMIN 45 17 SDI 16 LRCLK 15 RSTB EXTOUT46 6 7 8 AVDD AVSS 9 10 11 Fig.14 BU7861KN Pin Placement Diagram 6/12 12 DACLO 5 AIN_R 4 AIN_L 3 SPOUT 2 EXTIN 13 DACRO 1 EXTGND 48 MICIN_2 MICB_2 14 TEST MICIN_1 47 MICIN_C MICB_1 MICO HP_R 100kΩ SYSCLK + HP2_VOL Digital Bass Boost + HP_L + 50kΩ 50kΩ 32step 0～-45dB HP_LI 200kΩ 80kΩ HSJL_MT 16bit DAC 100kΩ AIN_VOL AIN_L 80kΩ HPL_TST 200kΩ 100kΩ AIN_MT ●Lowpass Correction Circuit The headphone output terminal (either HP_X or HPX_OUT) has a built-in “lowpass correction circuit” to correct lowpass decay, comprised of output coupling capacity and headphone impedance. 200kΩ CCHPx HP_XI or HPX_FB 200kΩ 100kΩ CL + + HP_X or HPX_OUT OUTPUT RL Fig.15 Headphone Output Section Equivalent Circuit Lowpass Cut-off Frequency Lowpass Boost Frequency Boost Gain fC= 1/(2･π･CL･RL) fBOOST = 1/(2･π･CCHPx･200kΩ) ABOOST = 20･log((200 kΩ+1/(2･π･f･CCHPx))/100 kΩ) (Maximum lowpass boost is 6dB.) The constant configuration calculates the lowpass cut-off frequency fC after confirming the output coupling capacity CL and headphone impedance RL used. CCHPx is determined in order for the lowpass cut-off frequency fC and lowpass boost frequency fBOOST to roughly correspond. The recommended constants are CL = 100μF, when RL = 16Ω and CCHPx = 6800pF. The chart below shows the frequency characteristics (calculated values) during recommended constant use. 10 5 Amp Output 0 -5 Gain [dB] -10 After correction -15 Before correction -20 -25 -30 -35 -40 1 10 100 1000 10000 Frequency [Hz] Fig.16 Low pass Correction Circuit Frequency Characteristics 7/12 100000 ●Recommended Circuits PVSS DVSS PVDD AVSS DVDD COMIN PVCOM RXCOM 1u CPOP 0.1u 1u 1u 1u + + SMUTE AUDRXD + + 1u AUDCLK AUDTXD RSTB AUDCS TXCOM AVDD CPU MICB_1 MICB_2 MIC_BIAS MIC BIAS VREF/COMMON CPU I/F VDD/VSS SMUTE POP MICO MICIN_C MICIN_1 16step MIC_MT + MICIN_2 + MIC_SEL TX_TEST1 TX_VOL A/D BPF +6～-8dB EXTIN DSPCLK DSPIN RX_TEST1 EXTIN_MT Tx_testline Rx_testline DSP I/F EXTOUT 8step TX_TEST2 EXTOUT ST_VOL ST_MT RX_VOL + -18～-42dB Gain=3.2dB 32step REC_MT RECN D/A + VIC_MT 0～-30dB LPF PLLLPF 0.01u RX_TEST2 32step +6～-54dB REC_TST 32Ω PLL MEL_VOL Gain=3.2dB SPVIC_MT 32step SPOUT + SPRX_VOL SP amp 16step +6～-8dB + TONE_MT SPMEL_VOL SPMEL_MT 16step 0～-28dB 0～-30dB HPR_TST AIN_R SOUND_MT AIN_MT HPL_TST 6800pF 100u HP_RI + 8step HPL_MT +14～0dB HSJR_MT + + - 音源IC SDI + HP2_VOL 16bit DAC + DIG_MT HP_VOL LRCLK BCLK + HP2_VOL 8step HPR_MT +14～0dB TEST 0.1u CSTEP Fig.17 Recommended Circuit 8/12 DACLO DACRO + 16Ω AIN_L SYSCLK 32step 0～-45dB 6800pF + 100u HP_L HP_R AIN_VOL HSJL_MT HP_LI 16Ω DTMF/ TONE Digital I/F 8Ω FSYNC MEL_MT + Digital Bass Boost RECP CPU DSPOUT DSP ●Input/output No equivalent circuit figure Terminal name I/O Analog/Digital 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 MICO MICIN_C MICIN_1 MICIN_2 EXTGND EXTIN AVDD AVSS SPOUT AIN_L AIN_R DACLO DACRO TEST RSTB LRCLK SDI BCLK SYSCLK DVDD DVSS DSPCLK DSPOUT DSPIN FSYNC PLLLPF AUDCLK O O I I O I O I I I I I I I I I I I O I I O I Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Analog Digital 28 AUDCS I Digital 29 30 31 AUDTXD AUDRXD PVSS I O - Digital Digital Analog 32 HP_LI I Analog 33 34 HP_L HP_R O O Analog Analog 35 HP_RI I Analog 36 37 38 PVDD RECN RECP O O Analog Analog Analog 39 CSTEP O Analog 40 41 42 43 44 45 46 47 48 CPOP SMUTE RXCOM TXCOM PVCOM COMIN EXTOUT MICB_1 MICB_2 O O O O O I O O O Analog Analog Analog Analog Analog Analog Analog Analog Analog Terminal function MIC output MIC Selection output MIC1 input MIC2 input External ground External input Power source for analog GND for analog Speaker output Melody input terminal Lch Melody input terminal Rch DAC Lch LPF Condenser connected terminal DAC Rch LPF Condenser connected terminal Please connect to DVSS L:Reset input LRCLK terminal 44.1kHz(fs) for DAC SDI terminal for DAC BCLK terminal 2.8224MHz(64fs) for DAC SYSCLK terminal 11.2896MHz(256fs) for DAC The power source for digital GND for digital PCMClock input for PCM signal PCMsignal input PCM signal input 8kHz The reference clock for PLL Condenser connected terminal for PLL CPU I/F clock input terminal The chip selection terminal for CPU I/F (H active) CPU I/FData input terminal CPU I/FData output terminal GND for Headphone and receiver Lch head phone amplifier revision terminal in low limits Lch Head phone amplifier output terminal Rch Head phone amplifier output terminal Rch head phone amplifier revision terminal in low limits Power source for Headphone and receiver Receiver output Receiver output Step noise decrease terminal when volume is variable Pop sound decrease terminal Constant terminal when soft mute Receiving standard voltage output Transmit standard voltage output PATH standard voltage output Standard voltage input terminal External output MIC BIAS output1 MIC BIAS output2 9/12 Power source Circuit figure AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD E E E E E H I I E D D F F A A B A B B I I B C A B F A DVDD A DVDD DVDD PVDD A C I PVDD F PVDD PVDD E E PVDD F PVDD PVDD I E E AVDD F AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD F F E E E G H E E PAD PAD A C B PAD PAD PAD D F E PAD PAD PAD G PAD I H Fig.18 Terminal equivalent circuit figure 10/12 ●Operation Notes （１）Absolute maximum ratings When applied voltage (VDD and VIN), and the operating temperature range (Topr) and the like it exceeds absolute maximum rating, there is a possibility of destroying, Because it cannot specify destructive mode such as short circuit or opening, when special mode which exceeds absolute maximum rating is supposed, that physical safety measure such as a fuse should be implemented. （２）Recommendation operating range If it is this range, it is the range which almost can obtain the quality of according to expectation. Concerning electric quality ，being something which is guaranteed under condition of each item. Even inside the recommendation operating range, voltage, temperature characteristic is shown. （３）About the opposite connection of the power source connector There is a possibility of destroying LSI with the opposite connection to the power source connector. Please administer the measure such as the diode is inserted between power source and the power source terminal of LSI outside as the protection for opposite connection destruction. （４）About the power source line At the time of designing the baseplate pattern, as for wiring of the power source/GND line, please make sure to become low impedance. At that time, even digital type power source and analog type power source being the same electric potential, please separate digital type power source pattern and analog type power source pattern, control the turning of digital noise to the analog power source due to the common impedance of wiring pattern. Concerning the GND line, please consider the similar pattern design. In addition, concerning all power source terminals of LSI, the condenser is inserted between power source and the GND terminal, in the case of electrolysis condenser use, please decide constant with sufficient verification in regard to the fact of without being problem in qualities of the condenser which is used, such as the capacity pulling out happens in low temperature. （５）About GND voltage As for electric potential of the GND terminal regarding what ever working condition, please make sure to become lowest electric potential. In addition, please really verify that does not have the terminal which becomes electric potential below GND include transient phenomenon （６）About the short circuit between the terminal and error installing The occasion where you install in the set baseplate, please pay attention to the direction and the position gap of LSI sufficiently. when you install with mistake, there is a possibility of LSI destroying. In addition, there is a possibility of destruction concerning when it short-circuits e.g. due to the foreign material enters between the terminal and between terminal and power source and GND. （７）About the operation in the strong electromagnetic field As for the use in the strong electromagnetic field, being to be a possibility of doing the malfunction, please note. （８）About the testing with the set baseplate When inspecting with the set baseplate, the condenser is connected to the LSI terminal whose impedance is low, because there is a possibility of stress depending on LSI, please be sure to do discharge in every process. In addition, when installing and removing the tool in inspection process, by all means with power source as off to connect, to inspect, to remove. Furthermore, As a static electricity measure, please note to administer the earth and the conveyance and preservation in the case of assemble process sufficiently. （９）About each input terminal With respect to the structure of LSI, the parasitic element is formed inevitably by the relationship of electric potential. It causes the interference of circuit operation due to the fact that the parasitic element operates, the malfunction, even can become cause of destruction. Therefore, e.g., the voltage which is lower than GND in the input terminal is impressed, please note sufficiently not to do the method where the parasitic element operates. In addition, When not impress power supply voltage in LSI, please do not impress voltage in the input terminal. Furthermore, when power supply voltage is impressed even, as for each input terminal, please make voltage below power supply voltage or within guaranteed performance of electric quality. （１０）About GND wiring pattern When there are both small signal GND and a heavy-current GND, it separates small signal GND pattern from heavy-current GND pattern, in order that the pattern wiring and the voltage change caused by large current do not change the voltage of small-signal GND, it is recommended to carry out the one-point grounding at the reference point of set.. Please be careful of not to fluctuate the GND wiring pattern of external parts （１１）When in the external condenser, the ceramic condenser is used, please decide the constant on the consideration of the nominal capacity decrease caused by direct current bias and the change of the capacity due to temperature etc. 11/12 Order type name selection B 7 U Rohm model name 8 6 1 Model number K － N Package type KN=UQFN E 2 Taping model E2= Reel type embossed tape UQFN48 <Dimension> <Tape and Reel information> 7.2 ±0.1 7.0 ±0.1 0.6 +0.1 -0.3 (1.4) 36 25 24 5) .4 (0 3- 5) 7.2± 0.1 7.0± 0.1 .5 (0 37 Embossed carrier tape(with dry pack) Tape Quantity Direction of feed 2500pcs E2 (The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand) 13 12 0.4 0.05 Reel 1pin +0.03 1234 (Unit:mm) 1234 0.05 1234 1234 1234 1234 0.22 ± 0.05 0.20 ± 0.05 0.02 −0.02 0.95MAX 1 (0 . 20 ) 48 Direction of feed ※When you order , please order in times the amount of package quantity. Catalog No.08T818A '08.9 ROHM © Appendix Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2009 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster @ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix-Rev4.0