CLARE CPC1979 Isoplusâ ¢-264 power relay Datasheet

CPC1979
ISOPLUS™-264 Power Relay
Parameter
Blocking Voltage
Load Current, TA=25ºC
With 5°C/W Heat Sink
No Heat Sink
On-resistance
RθJC
Rating
600
3.5
1.4
0.75
0.3
Description
Units
VP
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of high power Solid State Relays.
Arms
Ω
As part of this family, the CPC1979 single pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.5Arms continuous load current with a
5ºC/W heat sink.
°C/W
Features
•
•
•
•
•
•
•
•
•
Compact ISOPLUS-264 Power Package
Low Thermal Resistance (0.3 °C/W)
3.5Arms Load Current with 5°C/W Heat Sink
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
2500Vrms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
•
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Pin Configuration
The CPC1979 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The output is constructed with efficient
MOSFET switches and photovoltaic die that use
Clare’s patented OptoMOS architecture while the
input, a highly efficient GaAlAs infrared LED provides
the optically coupled control. The combination of
low on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered
by IXYS allows Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper
Bond (DCB) substrate instead of the traditional
copper leadframe. The DCB ceramic, the same
substrate used in high power modules, not only
provides 2500Vrms isolation but also very low thermal
resistance (0.3 °C/W).
Approvals
• UL recognized component: File # E69938
• Certified to: UL 508
Ordering Information
Part Number
CPC1979J
Description
ISOPLUS-264 (25 per tube)
Switching Characteristics of Normally
Open (Form A) Devices
CONTROL
ILOAD
+
90%
10%+
RoHS
2002/95/EC
e3
DS-CPC1979-R04
TON
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TOFF
1
CPC1979
Absolute Maximum Ratings
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Isolation voltage Input to Output
Operational Temperature
Storage Temperature
Ratings
600
5
100
1
150
2500
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical absolute maximum ratings are at 25°C
Electrical Characteristics
Parameter
Output Characteristics
Load Current 1
Peak
Continuous
Continuous
Continuous
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current 3
Input Dropout Current
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance Input to Output
1
2
3
2
Conditions
TA=25°C
t ≤ 10ms
No Heat Sink
TC=25ºC
TC=99ºC
IF=10mA, IL=1A
VL=600V
IF=20mA, VL=10V
V=25V, f=1MHz
TA=25°C
IL=1A
IF=5mA
VR=5V
TA=25°C
-
Symbol
Min
Typ
Max
Units
AP
-
-
IL(99)
RON
ILEAK
-
0.59
-
20
1.4
14.5
1.7
0.75
1
TON
TOFF
COUT
-
8
0.2
700
25
5
-
IF
IF
VF
IR
0.6
0.9
-
1.2
-
10
1.4
10
mA
mA
V
µA
CI/O
-
1
-
pF
IL
Arms
Ω
µA
ms
pF
Higher load currents are possible with proper heat sinking.
Measurement taken within 1 second of on time.
For applications requiring high temperature operation (greater than 60oC) an LED drive current of 20mA is recommended.
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CPC1979
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
Thermal Resistance (junction to ambient)
Junction Temperature (operation)
Conditions
free air
-
Symbol
RθJC
RθJA
TJ
Min
-40
Typ
33
-
Max
0.3
100
Units
°C/W
°C/W
°C
Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal
interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate
junction-to-ambient thermal resistance of 12.5°C/W.
Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
RθCA =
(TJ - TA) IL(99)2
IL
2
•
RθJC
- RθJC
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (Arms)
IL = Desired Operating Load Current (Arms), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
* Elevated junction temperature reduces semiconductor lifetime.
R04
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CPC1979
PERFORMANCE DATA*
CPC1979
Typical LED Forward Voltage Drop
(N=50, TA=25ºC, IF=10mA)
35
35
30
30
20
15
10
25
20
15
10
5
5
0
0
25
20
15
10
5
0
LED Forward Voltage (V)
On-Resistance (Ω)
650
658
666
674
Blocking Voltage (VP)
CPC1979
Typical Turn-On Time
(N=35, TA=25ºC, IL=1ADC, IF=20mA)
CPC1979
Typical Turn-Off Time
(N=50, TA=25ºC, IL=1ADC, IF=20mA)
CPC1979
Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
1.30
25
Device Count (N)
25
CPC1979
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
35
30
Device Count (N)
Device Count (N)
CPC1979
Typical On-Resistance Distribution
(N=50, TA=25ºC, IL=1ADC, IF=10mA)
1.31
1.32
1.33
1.34
0.57
50
0.58
0.59
0.60
0.61
642
0.62
9
1ºC/W
15
10
5
40
Load Current (Arms)
Device Count (N)
Device Count (N)
8
20
30
20
10
682
7
6
5
5ºC/W
4
3
10ºC/W
2
Free Air
1
0
0
0
7.8
8.3
8.8
9.3
0.20
9.8
0.21
CPC1979
Typical Leakage vs. Temperature
at Maximum Rated Voltage
(Measured Across Pins 1 & 2)
0.010
0.008
0.006
0.004
0.002
40
60
80
Turn-Off (ms)
0.20
IF = 10mA
0.10
0.05
0
-20
0
20
40
60
Temperature (ºC)
80
100
80
100
CPC1979
Typical Turn-On vs. Temperature
(IL=1ADC)
IF = 10mA
15
IF = 20mA
12
9
6
0
-20
0
20
40
60
80
100
CPC1979
Typical LED Forward Voltage Drop
vs. Temperature
IF = 20mA
40
60
Temperature (ºC)
3
CPC1979
Typical Turn-Off vs. Temperature
(IL=1ADC)
0.15
20
18
Temperature (ºC)
0.25
0
21
Temperature (ºC)
0.30
-40
700
690
680
670
660
650
640
630
620
610
600
-40
100
LED Forward Voltage Drop (V)
0.35
20
0.25
Turn-On (ms)
Blocking Voltage (VP )
Leakage (µA)
0.012
0
0.24
CPC1979
Typical Blocking Voltage
vs. Temperature
0.014
-20
0.23
Turn-Off (ms)
Turn-On (ms)
0
-40
0.22
-40
1.8
1.6
1.4
IF = 50mA
IF = 20mA
IF = 10mA
1.2
1.0
0.8
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
-20
0
20
40
60
Temperature (ºC)
80
100
CPC1979
Typical Turn-On vs. LED Forward Current
(IL=1ADC)
Turn-On (ms)
7.3
22
20
18
16
14
12
10
8
6
4
2
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R04
CPC1979
PERFORMANCE DATA*
0.9
0.275
0.8
0.270
0.7
0.265
0.260
0.255
0.250
0.245
CPC1979
Typical On-Resistance vs. Temperature
(IL=max rated)
I F = 20mA
0.6
0.5
0.4
0.3
0.2
0.1
0.240
0
0.235
0
2.5
5
-40
7.5 10 12.5 15 17.5 20 22.5 25
LED Forward Current (mA)
20
40
60
Temperature (ºC)
80
100
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
24
20
Load Current (AP)
Load Current (A)
0
CPC1979
Typical IF for Switch Operation
vs. Temperature
(IL=1ADC)
CPC1979
Energy Rating Curve
(Free Air, No Heat Sink)
CPC1979
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=10mA)
2.5
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
-1.5
-20
LED Current (mA)
0.280
On-Resistance (Ω)
Turn-Off (ms)
CPC1979
Typical Turn-Off vs. LED Forward Current
(IL=1ADC)
-1.0
-0.5
0
0.5
Load Voltage (V)
1.0
1.5
16
12
8
4
0
10µs 110µs 1ms 10ms 100ms
1s
10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R04
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5
CPC1979
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
e3
RoHS
2002/95/EC
MECHANICAL DIMENSIONS:
4-Pin ISOPLUS-264
0.190 MIN - 0.205 MAX
(4.83 MIN - 5.21 MAX)
0.046 MIN - 0.055 MAX
(1.17 MIN - 1.40 MAX)
0.770 MIN - 0.799 MAX
(19.56 MIN - 20.29 MAX)
0.210 MIN - 0.235 MAX
(5.33 MIN - 5.97 MAX)
0.065 MIN - 0.080 MAX
(1.65 MIN - 2.03 MAX)
0.668 MIN - 0.690 MAX
(16.97 MIN - 17.53 MAX)
0.100 MIN - 0.180 MAX
(2.54 MIN - 4.57 MAX)
1.020 MIN - 1.040 MAX
(25.91 MIN - 26.42 MAX)
0.490 MIN - 0.513 MAX
(12.54 MIN - 13.03 MAX)
0.801 MIN - 0.821 MAX
(20.34 MIN - 20.85 MAX)
0.100 MIN - 0.130 MAX
(2.54 MIN - 3.03 MAX)
1
2
3
4
0.080 MIN - 0.102 MAX
(2.03 MIN - 2.59 MAX)
0.780 MIN - 0.820 MAX
(19.81 MIN - 20.83 MAX)
0.300 BSC
(7.62) BSC
0.150 BSC
(3.81 BSC)
0.020 MIN - 0.029 MAX
(0.51 MIN - 0.74 MAX)
0.058 MIN - 0.068 MAX
(1.47 MIN - 1.73 MAX)
0.102 MIN - 0.118 MAX
(2.59 MIN - 3.00 MAX)
0.045 MIN - 0.055 MAX
(1.14 MIN - 1.40 MAX)
DIMENSIONS:
INCHES
(MM)
NOTE: Bottom heatsink meets 2500Vrms isolation to the pins.
Dimensions:
inches
(mm)
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1979-R04
©Copyright 2007, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
ISOPLUS™ is a trademark of IXYS Corporation
All rights reserved. Printed in USA.
4/17/07
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