DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 QUAD, 12-BIT, LOW-POWER, VOLTAGE OUTPUT, I C INTERFACE DIGITAL-TO-ANALOG CONVERTER 2 FEATURES DESCRIPTION • • • • • • • The DAC7573 is a low-power, quad channel, 12-bit buffered voltage output DAC. Its on-chip precision output amplifier allows rail-to-rail output swing to be achieved. The DAC7573 utilizes an I2C compatible two wire serial interface supporting high-speed interface mode with address support of up to sixteen DAC7573s for a total of 64 channels on the bus. • • • • • Micropower Operation: 600 µA at 5 V VDD Power-On Reset to Zero +2.7-V to +5.5-V Analog Power Supply 12-Bit Monotonic I2C™ Interface up to 3.4 Mbps Data Transmit Capability On-Chip Output Buffer Amplifier, Rail-to-Rail Operation Double-Buffered Input Register Address Support for up to Sixteen DAC7573s Synchronous Update Support for up to 64 Channels Operation From –40°C to 105°C Small 16 Lead TSSOP Package The low power consumption of this part in normal operation makes it ideally suited to portable battery operated equipment. The power consumption is less than 3 mW at VDD=5 V reducing to 1 µW in power-down mode. APPLICATIONS • • • • • Process Control Data Acquisition Systems Closed-Loop Servo Control PC Peripherals Portable Instrumentation VDD The DAC7573 requires an external reference voltage to set the output range of the DAC. The DAC7573 incorporates a power-on-reset circuit that ensures that the DAC output powers up at zero volts and remains there until a valid write takes place in the device. The DAC7573 contains a power-down feature, accessed via the internal control register, that reduces the current consumption of the device to 200 nA at 5 V. The DAC7573 is available in a 16-lead TSSOP package. IOVDD VREFH Data Buffer A DAC Register A VOUTA DAC A VOUTB VOUTC 18 SCL SDA Data Buffer D DAC Register D Buffer Control Register Control I2C Block DAC D Power-Down Control Logic Resistor Network 8 A0 A1 GND VOUTD A2 A3 LDAC VREFL Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. I2C is a trademark of Philips Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003, Texas Instruments Incorporated DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE PACKAGE DRAWING NUMBER SPECIFICATION TEMPERATURE RANGE PACKAGE MARKING DAC7573 16-TSSOP PW –40°C TO +105°C D7573I ORDERING NUMBER TRANSPORT MEDIA DAC7573IPW 90 Piece Tube DAC7573IPWR 2000 Piece Tape and Reel PW PACKAGE (TOPVIEW) PIN DESCRIPTIONS PIN 16 A3 NAME DESCRIPTION 1 VOUTA Analog output voltage from DAC A 2 VOUTB Analog output voltage from DAC B Positive reference voltage input VOUTA 1 VOUTB 2 15 A2 3 3 14 A1 VREFH VREFH 4 VDD VDD 4 13 A0 5 VREFL Negative reference voltage input VREFL 5 12 IOVDD 6 GND GND 6 11 SDA Ground reference point for all circuitry on the part VOUTC 7 10 SCL VOUTD 8 9 LDAC DAC7573 Analog voltage supply input 7 VOUTC Analog output voltage from DAC C 8 VOUTD Analog output voltage from DAC D 9 LDAC 10 SCL H/W synchronous VOUT update Serial clock input 11 SDA Serial data input 12 IOVDD 13 A0 Device address select - I2C 14 A1 Device address select - I2C 15 A2 Device address select - Extended 16 A3 Device address select - Extended I/O voltage supply input ABSOLUTE MAXIMUM RATINGS (1) VDD to GND –0.3 V to +6 V Digital input voltage to GND –0.3 V to VDD + 0.3 V VOUT to GND –0.3 V to VDD + 0.3 V Operating temperature range –40°C to +105°C Storage temperature range –65°C to +150°C Junction temperature range (TJ max) Power dissipation: Lead temperature, soldering: (1) 2 +150°C Thermal impedance (ΘJA) 161°C/W Thermal impedance (ΘJC) 29°C/W Vapor phase (60s) 215°C Infrared (15s) 220°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 ELECTRICAL CHARACTERISTICS VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications -40°C to +105°C, unless otherwise specified. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS STATIC PERFORMANCE (1) (2) Resolution 12 Bits Relative accuracy Differential nonlinearity Specified monotonic by design ±8 LSB ±1 LSB Zero-scale error 5 20 mV Full-scale error -0.15 ±1.0 % of FSR ±1.0 % of FSR Gain error Zero code error drift ±7 µV/°C Gain temperature coefficient ±3 ppm of FSR/°C OUTPUT CHARACTERISTICS (3) Output voltage range Output voltage settling time (full scale) 0 Digital-to-analog glitch impulse 12 µs 1 V/µs 0.02 LSB 1 kHz Sine Wave -100 dB RL= ∞ 470 pF RL= 2 kΩ 1000 pF 1 LSB change around major carry 12 nV-s 0.3 nV-s 1 Ω VDD= 5 V 50 mA VDD= 3 V 20 mA Coming out of power-down mode, VDD= +5 V 2.5 µs Coming out of power-down mode, VDD= +3 V 5 µs Digital feedthrough DC output impedance Short-circuit current Power-up time µs RL = ∞ ; CL = 500 pF DC crosstalk (channel-to-channel) Capacitive load stability V 10 8 Slew rate AC crosstalk (channel-to-channel) VREFH RL = ∞; 0 pF < CL < 200 pF REFERENCE INPUT VREFH Input range VREFL Input range 0 VREFL<VREFH 0 Reference input impedance Reference current LOGIC INPUTS VDD GND VDD 25 V V kΩ VREF=VDD = +5 V 185 260 VREF=VDD = +3 V 122 200 µA (3) Input current VIN_L, Input low voltage VIN_H, Input high voltage VDD= 3 V ±1 µA 0.3xIOVDD V 3 pF 5.5 V 0.7xIOVDD V Pin Capacitance POWER REQUIREMENTS VDD, IOVDD 2.7 IDD(normal operation), including reference current Excluding load current IDD@ VDD=+3.6V to +5.5V VIH= IOVDD and VIL=GND 600 900 µA IDD@ VDD =+2.7V to +3.6V VIH= IOVDD and VIL=GND 550 750 µA IDD (all power-down modes) (1) (2) (3) Linearity tested using a reduced code range of 48 to 4047; output unloaded. VREFH = VDD - 0.1, VREFL = GND Specified by design and characterization, not production tested. 3 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 ELECTRICAL CHARACTERISTICS (continued) VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications -40°C to +105°C, unless otherwise specified. PARAMETER TEST CONDITIONS TYP MAX UNITS IDD@ VDD=+3.6V to +5.5V VIH= IOVDD and VIL=GND MIN 0.2 1 µA IDD@ VDD =+2.7V to +3.6V VIH= IOVDD and VIL=GND 0.05 1 µA ILOAD= 2 mA, VDD= +5 V 93% +105 °C POWER EFFICIENCY IOUT/IDD TEMPERATURE RANGE Specified performance -40 TIMING CHARACTERISTICS VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND; all specifications -40°C to +105°C, unless otherwise specified. SYMBOL PARAMETER fSCL SCL clock frequency tBUF Bus free time between a STOP and START condition tHD; tSTA Hold time (repeated) START condition TEST CONDITIONS MIN MAX UNITS Standard mode 100 kHz Fast mode 400 kHz High-Speed mode, CB = 100 pF max 3.4 MHz 1.7 MHz High-speed mode, CB = 400 pF max tLOW tHIGH tSU; tSTA tSU; tDAT tHD; tDAT LOW period of the SCL clock HIGH period of the SCL clock Setup time for a repeated START condition Data setup time Data hold time Standard mode 4.7 µs Fast mode 1.3 µs Standard mode 4.0 µs Fast mode 600 ns High-speed mode 160 ns Standard mode 4.7 µs Fast mode 1.3 µs High-speed mode, CB = 100 pF max 160 ns High-speed mode, CB = 400 pF max 320 ns Standard mode 4.0 µs Fast mode 600 ns High-Speed Mode, CB = 100 pF max 60 ns High-speed mode, CB = 400 pF max 120 ns Standard mode 4.7 µs Fast mode 600 ns High-speed mode 160 ns Standard mode 250 ns Fast mode 100 ns High-speed mode 10 ns Standard mode 0 3.45 µs Fast mode 0 0.9 µs High-speed mode, CB = 100 pF max 0 70 ns High-speed mode, CB = 400 pF max 0 150 ns 1000 ns 20 + 0.1CB 300 ns High-speed mode, CB = 100 pF max 10 40 ns High-speed mode, CB = 400 pF max 20 Standard mode tRCL tRCL1 4 Rise time of SCL signal Rise time of SCL signal after a repeated START condition and after an acknowledge BIT TYP Fast mode Standard mode Fast mode 20 + 0.1CB 80 ns 1000 ns 300 ns High-speed mode, CB = 100 pF max 10 80 ns High-speed mode, CB = 400 pF max 20 160 ns DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 TIMING CHARACTERISTICS (continued) VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND; all specifications -40°C to +105°C, unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS MIN MAX UNITS 300 ns 20 + 0.1CB 300 ns High-speed mode, CB = 100 pF max 10 40 ns High-speed mode, CB = 400 pF max 20 80 ns 1000 ns Standard mode tFCL Fall time of SCL signal Fast mode Standard mode tRDA Rise time of SDA signal Fast mode 20 + 0.1CB 300 ns High-speed mode, CB = 100 pF max 10 80 ns High-speed mode, CB = 400 pF max 20 160 ns 300 ns Standard mode tFDA tSU; tSTO Fall time of SDA signal Setup time for STOP condition CB Capacitive load for SDA and SCL tSP Pulse width of spike suppressed VNH Noise margin at the HIGH level for each connected device (including hysteresis) VNL Noise margin at the LOW level for each connected device (including hysteresis) TYP 20 + 0.1CB 300 ns High-speed mode, CB = 100 pF max Fast mode 10 80 ns High-speed mode, CB = 400 pF max 20 160 ns Standard mode 4.0 µs Fast mode 600 ns High-speed mode 160 ns 400 pF Fast mode 50 ns High-speed mode 10 ns Standard mode Fast mode 0.2 VDD V 0.1 VDD V High-speed mode Standard mode Fast mode High-speed mode 5 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 TYPICAL CHARACTERISTICS At TA = +25°C, unless otherwise noted. 8 6 4 2 0 -2 -4 -6 -8 Channel A VDD = 5 V LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE LE - LSB LE - LSB LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE Channel B 0.5 0.0 - 0.5 - 1.0 0.5 0.0 - 0.5 - 1.0 0 512 1024 1536 2048 2560 3072 3584 0 512 1024 3072 3584 LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE 8 6 4 2 0 -2 -4 -6 -8 Channel C VDD = 5 V 8 6 4 2 0 -2 -4 -6 -8 Channel D VDD = 5 V 1.0 DLE - LSB DLE - LSB 2560 Figure 2. 0.5 0.0 - 0.5 - 1.0 0.5 0.0 - 0.5 - 1.0 0 512 1024 1536 2048 2560 3072 3584 0 512 1024 Digital Input Code 1536 2048 2560 3072 3584 Digital Input Code Figure 3. Figure 4. LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE 8 6 4 2 0 -2 -4 -6 -8 Channel A VDD = 2.7 V LE - LSB LE - LSB 2048 Figure 1. 1.0 1.0 8 6 4 2 0 -2 -4 -6 -8 Channel B VDD = 2.7 V 1.0 DLE - LSB DLE - LSB 1536 Digital Input Code LE - LSB LE - LSB Digital Input Code 0.5 0.0 - 0.5 - 1.0 0.5 0.0 - 0.5 - 1.0 0 512 1024 1536 2048 2560 Digital Input Code Figure 5. 6 VDD = 5 V 1.0 DLE - LSB DLE - LSB 1.0 8 6 4 2 0 -2 -4 -6 -8 3072 3584 0 512 1024 1536 2048 2560 Digital Input Code Figure 6. 3072 3584 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, unless otherwise noted. 8 6 4 2 0 -2 -4 -6 -8 Channel C VDD = 2.7 V LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE LE - LSB LE - LSB LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE Channel D VDD = 2.7 V 1.0 DLE - LSB DLE - LSB 1.0 8 6 4 2 0 -2 -4 -6 -8 0.5 0.0 - 0.5 - 1.0 0.5 0.0 - 0.5 - 1.0 0 512 1024 1536 2048 2560 3072 3584 0 512 1024 Digital Input Code 2048 2560 3072 3584 Digital Input Code Figure 7. Figure 8. ZERO-SCALE ERROR vs TEMPERATURE ZERO-SCALE ERROR vs TEMPERATURE 4 9 VDD = 5 V VDD = 2.7 V CH A 6 CH D CH C 3 CH B Zero-Scale Error − mV Zero-Scale Error − mV 1536 2 CH A CH D 0 CH C CH B −2 0 −40 −10 20 50 80 −40 −10 FULL-SCALE ERROR vs TEMPERATURE FULL-SCALE ERROR vs TEMPERATURE −1 VDD = 2.7 V CH B CH A Full-Scale Error − mV Full-Scale Error − mV CH D CH C −4 −40 80 Figure 10. VDD = 5 V −3 50 Figure 9. −1 −2 20 TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C −1.25 CH D CH C −1.5 CH A CH B −1.75 −2 −10 20 50 TA − Free-Air Temperature − °C Figure 11. 80 −40 −10 20 50 80 TA − Free-Air Temperature − °C Figure 12. 7 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, unless otherwise noted. SINK CURRENT CAPABILITY AT NEGATIVE RAIL SOURCE CURRENT CAPABILITY AT POSITIVE RAIL 0.150 5.50 Typical For All Channels 0.125 0.100 VOUT - Output Voltage - V VOUT - Output Voltage - V Typical For All Channels VDD = 2.7 V VDD = 5.5 V 0.075 0.050 0.025 5.45 5.40 5.35 DAC Loaded With FFFH VDD = 5.5 V DAC Loaded With 000H 0.000 5.30 0 1 2 3 4 5 0 1 ISINK - Sink Current - mA SOURCE CURRENT CAPABILITY AT POSITIVE RAIL SUPPLY CURRENT vs DIGITAL INPUT CODE 5 800 IDD - Supply Current - µA 700 2.6 2.5 2.4 DAC Loaded With FFFH VDD = 2.7 V VDD = 5.5 V 600 500 400 VDD = 2.7 V 300 200 100 2.3 All Channels Powered, No Load 0 0 1 2 3 4 5 0 512 1024 1536 2048 2560 3072 3584 4096 ISOURCE - Source Current - mA Digital Input Code Figure 15. Figure 16. SUPPLY CURRENT vs TEMPERATURE SUPPLY CURRENT vs SUPPLY VOLTAGE 700 700 650 600 IDD - Supply Current - µA IDD - Supply Current - µA 4 Figure 14. Typical For All Channels VDD = 5.5 V 500 400 VDD = 2.7 V 300 200 100 600 550 500 450 400 350 300 250 All Channels Powered, No Load 0 All DACs Powered, No Load 200 - 40 - 10 20 50 TA - Free - Air Temperature - °C Figure 17. 8 3 Figure 13. 2.7 VOUT - Output Voltage - V 2 ISOURCE - Source Current - mA 80 110 2.7 3.1 3.5 3.9 4.3 4.7 VDD - Supply Voltage - V Figure 18. 5.1 5.5 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, unless otherwise noted. SUPPLY CURRENT vs LOGIC INPUT VOLTAGE 2000 TA = 25°C SCL Input (All Other Inputs = GND) VDD = 5 V 1000 1500 Frequency IDD - Supply Current - µA 1200 HISTOGRAM OF CURRENT CONSUMPTION 800 VDD = 5.5 V 600 1000 500 400 VDD = 2.7 V 200 0 0 1 2 3 4 500 520 540 560 580 600 620 640 660 680 700 720 740 5 IDD - Current Consumption - µA VLogic - Logic Input Voltage - V Figure 19. Figure 20. HISTOGRAM OF CURRENT CONSUMPTION EXITING POWER-DOWN MODE 2000 6 VOUT - Output Voltage - V VDD = 2.7 V Frequency 1500 1000 500 0 5 VDD = 5 V Powerup to Code 4000 4 3 2 1 0 -1 400 420 440 460 480 500 520 540 560 580 600 620 Time (2 µs/div) IDD - Current Consumption - µA Figure 21. Figure 22. 2.54 2.52 VDD = 5 V Code 7FFH to 800H to 7FFH (Glitch Occurs Every N*256 Code Boundary) 2.50 2.48 2.46 2.44 2.42 2.40 OUTPUT GLITCH (Worst Case) VOUT - Output Voltage - V (20 mV/div) VOUT - Output Voltage - V (20 mV/div) OUTPUT GLITCH (Mid-Scale) 2.56 4.74 4.72 4.70 4.68 VDD = 5 V Code EFFH to F00H to EFFH (Glitch Occurs Every N*256 Code Boundary) 4.66 4.64 4.62 4.60 4.58 4.56 Time (15 µs/div) Time (15 µs/div) Figure 23. Figure 24. 9 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, unless otherwise noted. ABSOLUTE ERROR† ABSOLUTE ERROR† 24 18 VDD = 5 V TA = 25°C 14 Channel A Output 16 12 8 Channel C Output Output Error - mV Output Error - mV 20 Channel B Output 10 6 2 -6 0 512 1024 1536 2048 2560 3072 3584 0 1024 1536 2048 2560 Figure 25. Figure 26. LARGE SIGNAL SETTLING TIME LARGE SIGNAL SETTLING TIME 3072 3584 3.0 4 VDD = 5 V Output Loaded with 200 pF to GND 10% to 90% FSR 2 1 0 VOUT - Output Voltage - V 5 VOUT - Output Voltage - V 512 Digital Input Code Digital Input Code † Channel C Output -2 Channel D Output 0 3 Channel A Output Channel D Output Channel B Output 4 VDD = 2.7 V TA = 25°C 2.5 2.0 1.5 VDD = 2.7 V Output Loaded with 200 pF to GND 10% to 90% FSR 1.0 0.5 0.0 Time (25 µs/div) Time (25 µs/div) Figure 27. Figure 28. Absolute error is the deviation from ideal DAC characteristics. It includes affects of offset, gain, and integral linearity. 10 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 THEORY OF OPERATION D/A SECTION The architecture of the DAC7573 consists of a string DAC followed by an output buffer amplifier. Figure 29 shows a generalized block diagram of the DAC architecture. VREFH 50 k 50 k 70 k _ Ref+ Resistor String Ref− DAC Register + VOUT VREFL Figure 29. R-String DAC Architecture The input coding to the DAC7573 is unsigned binary, which gives the ideal output voltage as: V OUT VREFL (VREFH VREFL) D 4096 Where D = decimal equivalent of the binary code that is loaded to the DAC register; it can range from 0 to 4095. RESISTOR STRING The resistor string section is shown in Figure 30. It is basically a divide-by-2 resistor, followed by a string of resistors, each of value R. The code loaded into the DAC register determines at which node on the string the voltage is tapped off to be fed into the output amplifier by closing one of the switches connecting the string to the amplifier. Because the architecture consists of a string of resistors, it is specified monotonic. To Output Amplifier VREFH VREFL R R R R Figure 30. Typical Resistor String Output Amplifier The output buffer is a gain-of-2 noninverting amplifier, capable of generating rail-to-rail voltages on its output, which gives an output range of 0V to VDD. It is capable of driving a load of 2 kΩ in parallel with 1000 pF to GND. The source and sink capabilities of the output amplifier can be seen in the typical curves. The slew rate is 1 V/µs with a half-scale settling time of 8 µs with the output unloaded. I2C Interface I2C is a 2-wire serial interface developed by Philips Semiconductor (see I2C-Bus Specification, Version 2.1, January 2000). The bus consists of a data line (SDA) and a clock line (SCL) with pullup structures. When the bus is idle, both SDA and SCL lines are pulled high. All the I2C compatible devices connect to the I2C bus through open drain I/O pins, SDA and SCL. A master device, usually a microcontroller or a digital signal processor, controls the bus. The master is responsible for generating the SCL signal and device addresses. The master also generates specific conditions that indicate the START and STOP of data transfer. A slave device receives and/or transmits data on the bus under control of the master device. 11 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 THEORY OF OPERATION (continued) The DAC7573 works as a slave and supports the following data transfer modes, as defined in the I2C-Bus Specification: standard mode (100 kbps), fast mode (400 kbps), and high-speed mode (3.4 Mbps). The data transfer protocol for standard and fast modes is exactly the same, therefore they are referred to as F/S-mode in this document. The protocol for high-speed mode is different from the F/S-mode, and it is referred to as H/S-mode. The DAC7573 supports 7-bit addressing; 10-bit addressing and general call address are not supported. F/S-Mode Protocol • • • • The master initiates data transfer by generating a start condition. The start condition is when a high-to-low transition occurs on the SDA line while SCL is high, as shown in Figure 31. All I2C-compatible devices should recognize a start condition. The master then generates the SCL pulses, and transmits the 7-bit address and the read/write direction bit R/W on the SDA line. During all transmissions, the master ensures that data is valid. A valid data condition requires the SDA line to be stable during the entire high period of the clock pulse (see Figure 32). All devices recognize the address sent by the master and compare it to their internal fixed addresses. Only the slave device with a matching address generates an acknowledge (see Figure 33) by pulling the SDA line low during the entire high period of the ninth SCL cycle. Upon detecting this acknowledge, the master knows that communication link with a slave has been established. The master generates further SCL cycles to either transmit data to the slave (R/W bit 1) or receive data from the slave (R/W bit 0). In either case, the receiver needs to acknowledge the data sent by the transmitter. So an acknowledge signal can either be generated by the master or by the slave, depending on which one is the receiver. 9-bit valid data sequences consisting of 8-bit data and 1-bit acknowledge can continue as long as necessary. To signal the end of the data transfer, the master generates a stop condition by pulling the SDA line from low to high while the SCL line is high (see Figure 31). This releases the bus and stops the communication link with the addressed slave. All I2C compatible devices must recognize the stop condition. Upon the receipt of a stop condition, all devices know that the bus is released, and they wait for a start condition followed by a matching address. H/S-Mode Protocol • • • When the bus is idle, both SDA and SCL lines are pulled high by the pullup devices. The master generates a start condition followed by a valid serial byte containing H/S master code 00001XXX. This transmission is made in F/S-mode at no more than 400 Kbps. No device is allowed to acknowledge the H/S master code, but all devices must recognize it and switch their internal setting to support 3.4 Mbps operation. The master then generates a repeated start condition (a repeated start condition has the same timing as the start condition). After this repeated start condition, the protocol is the same as F/S-mode, except that transmission speeds up to 3.4 Mbps are allowed. A stop condition ends the H/S-mode and switches all the internal settings of the slave devices to support the F/S-mode. Instead of using a stop condition, repeated start conditions should be used to secure the bus in H/S-mode. SDA SDA SCL SCL S P Start Condition Stop Condition Figure 31. START and STOP Conditions 12 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 THEORY OF OPERATION (continued) SDA SCL Data Line Stable; Data Valid Change of Data Allowed Figure 32. Bit Transfer on the I2C Bus Data Output by Transmitter Not Acknowledge Data Output by Receiver Acknowledge SCL From Master 1 2 8 9 S Clock Pulse for Acknowledgement START Condition Figure 33. Acknowledge on the I2C Bus Recognize START or REPEATED START Condition Recognize STOP or REPEATED START Condition Generate ACKNOWLEDGE Signal P SDA MSB Acknowledgement Signal From Slave Sr Address R/W SCL S or Sr START or Repeated START Condition 1 2 7 8 9 ACK 1 2 3-8 9 ACK Sr or P Clock Line Held Low While Interrupts are Serviced STOP or Repeated START Condition Figure 34. Bus Protocol 13 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 DAC7573 I2C Update Sequence The DAC7573 requires a start condition, a valid I2C address, a control byte, an MSB byte, and an LSB byte for a single update. After the receipt of each byte, DAC7573 acknowledges by pulling the SDA line low during the high period of a single clock pulse. A valid I2C address selects the DAC7573. The control byte sets the operational mode of the selected DAC7573. Once the operational mode is selected by the control byte, DAC7573 expects an MSB byte followed by an LSB byte for data update to occur. DAC7573 performs an update on the falling edge of the acknowledge signal that follows the LSB byte. The control byte needs not to be resent until a change in operational mode is required. The bits of the control byte continuously determine the type of update performed. Thus, for the first update, DAC7573 requires a start condition, a valid I2C address, a control byte, an MSB byte and an LSB byte. For all consecutive updates, DAC7573 needs an MSB byte, and an LSB byte as long as the control command remains the same. Using the I2C high-speed mode (fscl= 3.4 MHz), the clock running at 3.4 MHz, each 12-bit DAC update other than the first update can be done within 18 clock cycles (MSB byte, acknowledge signal, LSB byte, acknowledge signal), at 188.88 KSPS. Using the fast mode (fscl= 400 kHz), clock running at 400 kHz, maximum DAC update rate is limited to 22.22 KSPS. Once a stop condition is received, DAC7573 releases the I2C bus and awaits a new start condition. Address Byte MSB 1 LSB 0 0 1 1 A1 A0 R/W The address byte is the first byte received following the START condition from the master device. The first five bits (MSBs) of the address are factory preset to 10011. The next two bits of the address are the device select bits A1 and A0. The A1, A0 address inputs can be connected to VDD or digital GND, or can be actively driven by TTL/CMOS logic levels. The device address is set by the state of these pins during the power-up sequence of the DAC7573. Up to 16 devices (DAC7573) can still be connected to the same I2C-Bus. 14 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 Broadcast Address Byte MSB LSB 1 0 0 1 0 0 0 0 Broadcast addressing is also supported by DAC7573. Broadcast addressing can be used for synchronously updating or powering down multiple DAC7573 devices. DAC7573 is designed to work with other members of the DAC857x and DAC757x families to support multichannel synchronous update. Using the broadcast address, DAC7573 responds regardless of the states of the address pins. Broadcast is supported only in write mode (Master writes to DAC7573). Control Byte MSB LSB A3 A2 L1 L0 X Sel1 Sel0 PD0 Table 1. Control Register Bit Descriptions Bit Name Bit Number/Description A3 Extended address bit A2 Extended address bit L1 Load1 (mode select) bit L2 Load0 (mode select) bit Are used for selecting the update mode. 00 Store I2C data. The contents of MS-BYTE and LS-BYTE (or power down information) are stored in the temporary register of a selected channel. This mode does not change the DAC output of the selected channel. 01 Update selected DAC with I2C data. Most commonly utilized mode. The contents of MS-BYTE and LS-BYTE (or power down information) are stored in the temporary register and in the DAC register of the selected channel. This mode changes the DAC output of the selected channel with the new data. 10 4-Channel synchronous update. The contents of MS-BYTE and LS-BYTE (or power down information) are stored in the temporary register and in the DAC register of the selected channel. Simultaneously, the other three channels get updated with previously stored data from the temporary register. This mode updates all four channels together. 11 Broadcast update mode. This mode has two functions. In broadcast mode, DAC7573 responds regardless of local address matching, and channel selection becomes irrelevant as all channels update. This mode is intended to enable up to 64 channels simultaneous update, if used with the I2C broadcast address (1001 0000). Sel1 Buff Sel1 Bit Sel0 Buff Sel0 Bit PD0 The state of these bits must match the state of pins A3 and A2 in order for a proper DAC7573 data update, except in broadcast update mode. If Sel1=0 All four channels are updated with the contents of their temporary register data. If Sel1=1 All four channels are updated with the MS-BYTE and LS-BYTE data or powerdown. Channel select bits 00 Channel A 01 Channel B 10 Channel C 11 Channel D Power Down Flag 0 Normal operation 1 Power-down flag (MSB7 and MSB6 indicate a power-down operation, as shown in Table 2). 15 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 Table 2. Control Byte C7 C6 C5 C4 C3 C2 C1 C0 MSB7 MSB6 MSB5... A3 A2 Load1 Load0 Don't Care Ch Sel 1 Ch Sel 0 PD0 MSB (PD1) MSB-1 (PD2) MSB-2 ...LSB 0 0 X 0 0 0 Data 0 0 X 0 1 0 Data Write to temporary register B (TRB) with data 0 0 X 1 0 0 Data Write to temporary register C (TRC) with data 0 0 X 1 1 0 Data Write to temporary register D (TRD) with data 0 0 X 0 1 X 0 1 X 1 0 X 1 0 X DESCRIPTION (Address Select) (A3 and A2 should correspond to the package address, set via pins A3 and A2) Write to temporary register A (TRA) with data (00, 01, 10, or 11) 1 see Table 8 0 (00, 01, 10, or 11) 0 Write to TRx (selected by C2 &C1 and load DACx w/data Data (00, 01, 10, or 11) 1 see Table 8 0 (00, 01, 10, or 11) 0 see Table 8 Power-down DACx (selected by C2 and C1) Write to TRx (selected by C2 &C1 w/ data and load all DACs Data (00, 01, 10, or 11) 1 Write to TRx (selected by C2 &C1 w/Powerdown Command 0 Power-down DACx (selected by C2 and C1) & load all DACs Broadcast Modes (controls up to 4 devices on a single serial bus) X X 1 1 X 0 X X X Update all DACs, all devices with previously stored TRx data X X 1 1 X 1 X 0 Data Update all DACs, all devices with MSB[7:0] and LSB[7:0] data X X 1 1 X 1 X 1 see Table 8 0 Power-down all DACs, all devices Most Significant Byte Most Significant Byte MSB[7:0] consists of eight most significant bits of 12-bit unsigned binary D/A conversion data. C0=1, MSB[7], MSB[6] indicate a power-down operation as shown in Table 8. Least Significant Byte Least Significant Byte LSB[7:0] consists of the 4 least significant bits of the 12-bit unsigned binary D/A conversion data, followed by 4 don't care bits. DAC7573 updates at the falling edge of the acknowledge signal that follows the LSB[0] bit. Default Readback Condition If the user initiates a readback of a specified channel without first writing data to that specified channel, the default readback is all zeros, since the readback register is initialized to 0 during the power on reset phase. 16 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 LDAC Functionality Depending on the control byte, DACs are synchronously updated on the falling edge of the acknowledge signal that follows LS byte. The LDAC pin is required only when an external timing signal is used to update all the channels of the DAC asynchronously. LDAC is a positive edge triggered asynchronous input that allows four DAC output voltages to be updated simultaneously with temporary register data. The LDAC trigger should only be used after the buffer's temporary registers are properly updated through software. DAC7573 Registers Table 3. DAC7573 Architecture Register Descriptions Register Description CTRL[7:0] Stores 8-bit wide control byte sent by the master MSB[7:0] Stores the 8 most significant bits of unsigned binary data sent by the master. Can also store 2-bit power-down data. LSB[7:0] Stores the 4 least significant bits of unsigned binary data sent by the master. TRA[13:0], TRB[13:0], TRC[13:0], TRD[13:0] 14-bit temporary storage registers assigned to each channel. Two MSBs store power-down information, 12 LSBs store data. DRA[13:0], DRB[13:0], DRC[13:0], DRD[13:0] 14-bit DAC registers for each channel. Two MSBs store power-down information, 12 LSBs store DAC data. An update of this register means a DAC update with data or power-down. DAC7573 as a Slave Receiver - Standard and Fast Mode Figure 35 shows the standard and fast mode master transmitter addressing a DAC7573 Slave Receiver with a 7-bit address. S SLAVE ADDRESS R/W A Ctrl-Byte A MS-Byte A LS-Byte ”0” (write) A/A P Data Transferred (n* Words + Acknowledge) Word = 16 Bit From Master to DAC7573 DAC7573 I2C-SLAVE ADDRESS: From DAC7573 to Master MSB A = A = S = Sr = P = Acknowledge (SDA LOW) Not Acknowledge (SDA HIGH) START Condition Repeated START Condition STOP Condition 1 LSB 0 0 1 1 A1 A0 R/W ‘0’ = Write to DAC7573 ‘1’ = Read from DAC7573 Factory Preset A0 = I2C Address Pin A1 = I2C Address Pin Figure 35. Standard and Fast Mode: Slave Receiver 17 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 DAC7573 as a Slave Receiver - High-Speed Mode Figure 36 shows the high-speed mode master transmitter addressing a DAC7573 Slave Receiver with a 7-bit address. F/S-Mode S HS-Mode HS-Master Code A Sr Slave Address F/S-Mode R/W A Ctrl-Byte A MS-Byte A LS-Byte Data Transferred (n* Words + Acknowledge) Word = 12 Bit ”0” (write) HS-Mode Master Code: 0 0 0 1 X X R/W Control Byte: A3 LSB A2 L1 L0 X Sel1 Sel2 PD0 MS-Byte: MSB LSB D10 D9 D8 D7 D6 D5 D1 D0 X X X D4 LS-Byte: MSB D3 LSB D2 D11 − D0 = Data Bits X A3 A2 L1 L0 Sel1 Sel0 PD0 = = = = = = = Extended Address Bit Extended Address Bit Load1 (Mode Select) Bit Load0 (Mode Select) Bit Buff Sel1 (Channel) Select Bit Buff Sel0 (Channel) Select Bit Power Down Flag X = Don’t Care Figure 36. High-Speed Mode: Slave Receiver 18 HS-Mode Continues LSB MSB D11 P Sr Slave Address MSB 0 A/A DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 Master Transmitter Writing to a Slave Receiver (DAC7573) in Standard/Fast Modes All write access sequences begin with the device address (with R/W = 0) followed by the control byte. This control byte specifies the operation mode of DAC7573 and determines which channel of DAC7573 is being accessed in the subsequent read/write operation. The LSB of the control byte (PD0-Bit) determines if the following data is power-down data or regular data. With (PD0-Bit = 0) the DAC7573 expects to receive data in the following sequence HIGH-BYTE –LOW-BYTE – HIGH-BYTE – LOW-BYTE..., until a STOP Condition or REPEATED START Condition on the I2C-Bus is recognized (refer to the DATA INPUT MODE section of Table 4). With (PD0-Bit = 1) the DAC7573 expects to receive 2 Bytes of power-down data (refer to the POWER DOWN MODE section of Table 4). Table 4. Write Sequence in F/S Mode DATA INPUT MODE Transmitter MSB 6 5 4 Master Master 1 0 0 1 DAC7573 Master A3 A2 Load 1 1 LSB 1 Comment A1 A0 R/W Write addressing (R/W=0) Buff Sel 0 PD0 Control byte (PD0=0) D5 D4 Writing data word, high byte x x Writing data word, low byte Begin sequence Load 0 x Buff Sel 1 DAC7573 Acknowledges D11 D10 D9 D3 D2 D1 D8 DAC7573 Master 2 DAC7573 Acknowledges DAC7573 Master 3 Start D7 D6 DAC7573 Acknowledges D0 DAC7573 x x DAC7573 Acknowledges Data or Stop or Repeated Start (1) Master Data or done (2) POWER DOWN MODE Transmitter MSB 6 5 4 Master Master 1 0 0 DAC7573 Master A3 A2 Load 1 PD1 PD2 0 LSB 1 1 Comment Begin sequence A1 Load 0 x A0 R/W Write addressing (R/W=0) Buff Sel 0 PD0 Control byte (PD0 = 1) 0 0 0 Writing data word, high byte x x x Writing data word, low byte Buff Sel 1 0 0 DAC7573 Acknowledges 0 0 0 0 x DAC7573 DAC7573 Acknowledges Master Stop or Repeated Start (1) (1) (2) 1 DAC7573 Acknowledges DAC7573 Master 2 DAC7573 Acknowledges DAC7573 Master 3 Start Done Use repeated START to secure bus operation and loop back to the stage of write addressing for next Write. Once DAC7573 is properly addressed and control byte is sent, HIGH–BYTE–LOW–BYTE sequences can repeat until a STOP condition or repeated START condition is received. 19 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 Master Transmitter Writing to a Slave Receiver (DAC7573) in HS Mode When writing data to the DAC7573 in HS-mode, the master begins to transmit what is called the HS-Master Code (0000 1XXX) in F/S-mode. No device is allowed to acknowledge the HS-Master Code, so the HS-Master Code is followed by a NOT acknowledge. The master then switches to HS-mode and issues a repeated start condition, followed by the address byte (with R/W = 0) after which the DAC7573 acknowledges by pulling SDA low. This address byte is usually followed by the control byte, which is also acknowledged by the DAC7573. The LSB of the control byte (PD0-Bit) determines if the following data is power-down data or regular data. With (PD0-Bit = 0) the DAC7573 expects to receive data in the following sequence HIGH-BYTE – LOW-BYTE – HIGH-BYTE – LOW-BYTE...., until a STOP condition or repeated start condition on the I2C-Bus is recognized (refer to Table 5 HS-MODE WRITE SEQUENCE - DATA). With (PD0-Bit = 1) the DAC7573 expects to receive 2 bytes of power-down data (refer to Table 5 HS-MODE WRITE SEQUENCE - POWER DOWN). Table 5. Master Transmitter Writes to Slave Receiver (DAC7573) in HS-Mode HS MODE WRITE SEQUENCE - DATA Transmitter MSB 6 5 4 0 0 0 0 Master Master 0 0 1 X X X Comment Begin sequence 1 HS mode master code No device may acknowledge HS master code 1 A1 A0 R/W Write addressing (R/W=0) Buff Sel 0 PD0 Control byte (PD0=0) D5 D4 Writing data word, MSB x x Writing data word, LSB DAC7573 acknowledges 0 0 Load 1 DAC7573 Load 0 0 Buff Sel 1 DAC7573 acknowledges D11 D10 D9 D3 D2 D1 D8 DAC7573 Master LSB Repeated start 1 DAC7573 Master 1 Not acknowledge Master Master 2 Start NONE Master 3 D7 D6 DAC7573 acknowledges D0 DAC7573 x x DAC7573 acknowledges Data or stop or repeated start (1) Master Data or done (2) HS MODE WRITE SEQUENCE - POWER DOWN Transmitter MSB 6 5 4 Master Master 3 0 0 0 0 Not acknowledge Master Repeated start 1 0 0 DAC7573 Master 0 0 Load 1 PD1 PD2 0 1 X 1 A1 Load 2 0 X HS mode master code A0 R/W Write addressing (R/W = 0) Buff Sel 0 PD0 Control byte (PD0=1) 0 0 0 Writing data word, high byte x x x Writing data word, low byte Buff Sel 1 0 0 DAC7573 acknowledges 0 0 0 0 x DAC7573 acknowledges Master Stop or repeated start (1) 20 X No device may acknowledge HS master code DAC7573 (1) (2) Comment DAC7573 acknowledges DAC7573 Master LSB DAC7573 acknowledges DAC7573 Master 1 Begin sequence 1 NONE Master 2 Start Done Use repeated start to secure bus operation and loop back to the stage of write addressing for next Write. Once DAC7573 is properly addressed and control byte is sent, high-byte-low-byte sequences can repeat until a stop or repeated start condition is received. DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 DAC7573 as a Slave Transmitter - Standard and Fast Mode Figure 37 shows the standard and fast mode master receiver addressing a DAC7573 Slave Transmitter with a 7-bit address. (DAC7573) (DAC7573) (MASTER) (DAC7573) S SLAVE ADDRESS R/W A Ctrl <7:1> PD0 A Sr Slave Address R/W A MS-Byte A LS-Byte A P ’1’ (read) ’0’ (write) ’0’ = (Normal Mode) Data Transferred (2 Bytes + Acknowledge) (DAC7573) PD0 A Sr Slave Address ’1’ = (Power Down Flag) (MASTER) R/W A PDN-Byte A (MASTER) (MASTER) MS-Byte A LS-Byte A P Data Transferred (3 Bytes + Acknowledge) ’1’ (read) PDN-Byte: MSB (MASTER) LSB PD1 PD2 1 1 1 1 1 1 PD1 = Power Down Bit PD2 = Power Down Bit Figure 37. Standard and Fast Mode: Slave Transmitter DAC7573 as a Slave Transmitter - High-Speed Mode Figure 38 shows an I2C-Master addressing DAC7573 in high-speed mode (with a 7-bit address), as a Slave Transmitter. F/S-Mode HS-Master Code S A HS-Mode (DAC7573) Sr Slave Address (DAC7573) R/W A Ctrl <7:1> PD0 A Sr (DAC7573) Slave Address ’0’ = (Normal Mode) Data Transferred (2 Bytes + Acknowledge) (DAC7573) PD0 A Sr Slave Address ’1’ = (Power Down Flag) (MASTER) R/W A MS-Byte A LS-Byte A P ’1’ (read) ’0’ (write) (MASTER) (MASTER) R/W A PDN-Byte A ’1’ (read) (MASTER) (MASTER) MS-Byte A LS-Byte A P Data Transferred (3 Bytes + Acknowledge) Figure 38. High-Speed Mode: Slave Transmitter 21 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 Master Receiver Reading From a Slave Transmitter (DAC7573) in Standard/Fast Modes When reading data back from the DAC7573, the user begins with an address byte (with R/W = 0) after which the DAC7573 will acknowledge by pulling SDA low. This address byte is usually followed by the Control Byte, which is also acknowledged by the DAC7573. Following this there is a REPEATED START condition by the Master and the address is resent with (R/W = 1). This is acknowledged by the DAC7573, indicating that it is prepared to transmit data. Two or three bytes of data are then read back from the DAC7573, depending on the (PD0-Bit). The value of Buff-Sel1 and Buff-Sel0 determines, which channel data is read back. A STOP Condition follows. With the (PD0-Bit = 0) the DAC7573 transmits 2 bytes of data, HIGH-BYTE followed by the LOW-BYTE (refer to Table 2. Data Readback Mode - 2 bytes). With the (PD0-Bit = 1) the DAC7573 transmits 3 bytes of data, POWER-DOWN-BYTE followed by the HIGH-BYTE followed by the LOW-BYTE (refer to Table 2. Data Readback Mode - 3 bytes). Table 6. Read Sequence in F/S Mode DATA READBACK MODE - 2 BYTES Transmitter MSB 6 5 4 1 0 0 1 3 Master Master A3 A2 Load 1 Comment A0 R/W Write addressing (R/W=0) Buff Sel 1 Buff Sel 0 PD0 Control byte (PD0=0) A1 A0 R/W Read addressing (R/W = 1) D6 D5 D4 Reading data word, high byte x x x Reading data word, low byte Begin sequence x DAC7573 acknowledges Repeated start 1 0 0 D11 D10 D9 DAC7573 1 1 DAC7573 acknowledges Master DAC7573 A1 1 Load 0 Master DAC7573 LSB DAC7573 acknowledges DAC7573 Master 1 Start DAC7573 Master 2 D8 D7 Master acknowledges D3 D2 D1 D0 x Master Master not acknowledges Master Stop or repeated start (1) Master signal end of read Done DATA READBACK MODE - 3 BYTES Transmitter MSB 6 5 4 3 Master Master 1 0 0 1 A3 A2 Load 1 Load 0 DAC7573 Master 0 0 A1 A0 R/W Write addressing (R/W=0) Buff Sel 1 Buff Sel 0 PD0 Control byte (PD0=1) A1 A0 R/W Read addressing (R/W = 1) 1 1 1 D6 D5 D4 Reading data word, high byte x x x Reading data word, low byte Begin sequence 1 x 1 1 DAC7573 acknowledges PD1 PD2 1 D11 D10 D9 Master 1 1 D8 D7 Master acknowledges D3 D2 D1 D0 x Master Master not acknowledges Master Stop or repeated start (1) (1) 22 Read power down byte Master acknowledges Master DAC7573 Comment Repeated start 1 DAC7573 DAC7573 LSB DAC7573 acknowledges Master DAC7573 1 DAC7573 acknowledges DAC7573 Master 2 Start Master signal end of read Done Use repeated start to secure bus operation and loop back to the stage of write addressing for next Write. DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 Master Receiver Reading From a Slave Transmitter (DAC7573) in HS-Mode When reading data to the DAC7573 in HS-MODE, the master begins to transmit, what is called the HS-Master Code (0000 1XXX) in F/S-mode. No device is allowed to acknowledge the HS-Master Code, so the HS-Master Code is followed by a NOT acknowledge. The Master then switches to HS-mode and issues a REPEATED START condition, followed by the address byte (with R/W = 0) after which the DAC7573 acknowledges by pulling SDA low. This address byte is usually followed by the control byte, which is also acknowledged by the DAC7573. Then there is a REPEATED START condition initiated by the master and the address is resent with (R/W = 1). This is acknowledged by the DAC7573, indicating that it is prepared to transmit data. Two or Three bytes of data are then read back from the DAC7573, depending on the (PD0-Bit). The value of Buff-Sel1 and Buff-Sel0 determines, which channel data is read back. A STOP condition follows. With the (PD0-Bit = 0) the DAC7573 transmits 2 bytes of data, HIGH-BYTE followed by LOW-BYTE (refer to Table 7 HS-Mode Readback Sequence). With the (PD0-Bit = 1) the DAC7573 transmits 3 bytes of data, POWER-DOWN-BYTE followed by the HIGH-BYTE followed by the LOW-BYTE (refer to Table 7 HS-Mode Readback Sequence). Table 7. Master Receiver Reading Slave Transmitter (DAC7573) in HS-Mode HS MODE READBACK SEQUENCE Transmitter MSB 6 5 4 0 0 0 0 3 Master Master LSB Comment X X X HS mode master code Begin sequence 1 No device may acknowledge HS master code Not acknowledge Master Repeated start 1 0 0 DAC7573 Master 1 Start NONE Master 2 1 1 A1 A3 A2 Load 1 Load 0 X Buff Sel 1 DAC7573 DAC7573 acknowledges Master Repeated start Master 1 0 0 DAC7573 DAC7573 PD1 PD2 1 Write addressing (R/W=0) Buff Sel 0 PD0 Control byte (PD0 = 1) 1 1 A1 A0 R/W Read addressing (R/W=1) 1 1 1 1 1 Power-down byte D5 D4 Reading data word, high byte x x Reading data word, low byte Master acknowledges D11 D10 D9 Master DAC7573 R/W DAC7573 acknowledges Master DAC7573 A0 DAC7573 acknowledges D8 D7 D6 Master acknowledges D3 D2 D1 D0 x x Master Master not acknowledges Master signal end of read Master Stop or repeated start Done Power-On Reset The DAC7573 contains a power-on-reset circuit that controls the output voltage during power up. On power up, the DAC register is filled with zeros and the output voltage is 0 V; it remains there until a valid write sequence is made to the DAC. This is useful in applications where it is important to know the state of the output of the DAC while it is in the process of powering up. No device pin should be brought high before supply is applied. Power-Down Modes The DAC7573 contains four separate power-down modes of operation. The modes are programmable via two most significant bits of the MSB byte, while (CTRL[0] = PD0 = 1). Table 8 shows how the state of these bits corresponds to the mode of operation of the device. 23 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 Table 8. Power-Down Modes of Operation for the DAC7573 CTRL[0] MSB[7] MSB[6] OPERATING MODE 1 0 0 High Impedance Output 1 0 1 1 kΩ to GND 1 1 0 100 kΩ to GND 1 1 1 High Impedance When (CTRL[0] = PD0 = 0), the device works normally with its normal power consumption of 150 µA at 5 V per channel. However, for the three power-down modes, the supply current falls to 200 nA at 5 V (50 nA at 3 V). Not only does the supply current fall but also the output stage is also internally switched from the output of the amplifier to a resistor network of known values. This has the advantage that the output impedance of the device is known while in power-down mode. There are three different options: The output is connected internally to GND through a 1 kΩ resistor, a 100 kΩ resistor or left open-circuit (high impedance). The output stage is illustrated in Figure 39. Amplifier Resistor String DAC VOUT Powerdown Circuitry Resistor Network Figure 39. Output Stage During Power Down All linear circuitry is shut down when the power-down mode is activated. However, the contents of the DAC register are unaffected when in power-down. The time to exit power down is typically 2.5 µs for VDD = 5 V and 5 µs for VDD = 3 V. (See the Typical Curves section for additional information.) The DAC7573 offers a flexible power-down interface based on channel register operation. A channel consists of a single 12 bit DAC with power-down circuitry, a temporary storage register (TR) and a DAC register (DR). TR and DR are both 14 bits wide. Two MSBs represent the power-down condition and the 12 LSBs represent data for TR and DR. By using bits 13 and 14 of TR and DR, a power-down condition can be temporarily stored and used just like data. Internal circuits ensure that MSB[7] and MSB[6] get transferred to TR[13] and TR[12] (DR[13] and DR[12]) when the power-down flag (CTRL[0] = PD0) is set. Therefore, DAC7573 treats power-down conditions like data and all the operational modes are still valid for power down. It is possible to broadcast a power-down condition to all the DAC7573s in the system, or it is possible to simultaneously power down a channel while updating data on other channels. CURRENT CONSUMPTION The DAC7573 typically consumes 150 µA at VDD = 5 V and 125 µA at VDD = 3 V for each active channel, including reference current consumption. Additional current consumption can occur at the digital inputs if VIH << VDD. For most efficient power operation, CMOS logic levels are recommended at the digital inputs to the DAC. In power-down mode, typical current consumption is 200 nA. A delay time of 10 to 20 ms after a power-down command is issued to the DAC is typically sufficient for the power-down current to drop below 10 µA. 24 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 DRIVING RESISTIVE AND CAPACITIVE LOADS The DAC7573 output stage is capable of driving loads of up to 1000 pF while remaining stable. Within the offset and gain error margins, the DAC7573 can operate rail-to-rail when driving a capacitive load. Resistive loads of 2 kΩ can be driven by the DAC7573 while achieving a good load regulation. When the outputs of the DAC are driven to the positive rail under resistive loading, the PMOS transistor of each Class-AB output stage can enter into the linear region. When this occurs, the added IR voltage drop deteriorates the linearity performance of the DAC. This only occurs within approximately the top 20 mV of the DAC's digital input-to-voltage output transfer characteristic. The reference voltage applied to the DAC7573 may be reduced below the supply voltage applied to VDD in order to eliminate this condition if good linearity is a requirement at full scale (under resistive loading conditions). CROSSTALK The DAC7573 architecture uses separate resistor strings for each DAC channel in order to achieve ultra-low crosstalk performance. DC crosstalk seen at one channel during a full-scale change on the neighboring channel is typically less than 0.05 LSBs. The ac crosstalk measured (for a full-scale, 1 kHz sine wave output generated at one channel, and measured at the remaining output channel) is typically under -100 dB. OUTPUT VOLTAGE STABILITY The DAC7573 exhibits excellent temperature stability of ±3 ppm/°C typical output voltage drift over the specified temperature range of the device. This enables the output voltage of each channel to stay within a ±25 µV window for a ±1°C ambient temperature change. Combined with good dc noise performance and true 12-bit differential linearity, the DAC7573 becomes a perfect choice for closed-loop control applications. SETTLING TIME AND OUTPUT GLITCH PERFORMANCE Settling time to within the 12-bit accurate range of the DAC7573 is achievable within 10 µs for a full-scale code change at the input. Worst case settling times between consecutive code changes is typically less than 2 µs. The high-speed serial interface of the DAC7573 is designed in order to support up to 188 ksps update rate. For full-scale output swings, the output stage of each DAC7573 channel typically exhibits less than 100 mV of overshoot and undershoot when driving a 200 pF capacitive load. Code-to-code change glitches are extremely low (~10 µV) given that the code-to-code transition does not cross an Nx256 code boundary. Due to internal segmentation of the DAC7573, code-to-code glitches occur at each crossing of an Nx256 code boundary. These glitches can approach 100 mVs for N = 15, but settle out within ~2 µs. Sufficient bypass capacitance is required to ensure 10 µs settling under capacitive loading. 25 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 APPLICATION INFORMATION The following sections give example circuits and tips for using the DAC7573 in various applications. For more information, contact your local TI representative, or visit the Texas Instruments website at http://www.ti.com. BASIC CONNNECTIONS For many applications, connecting the DAC7573 is extremely simple. A basic connection diagram for the DAC7573 is shown in Figure 40. The 0.1 µF bypass capacitors provide the momentary bursts of extra current needed from the supplies. DAC7573 I2C Pullup Resistors 1 kΩ to 10 kΩ (typical) Microcontroller or Microprocessor With I2C Port IOVDD 1 VOUTA A3 16 2 VOUTB A2 15 3 VREFH A1 14 4 VDD A0 13 5 VREFL IOVDD 12 6 GND SDA 11 7 VOUTC SCL 10 8 VOUTD LDAC 9 SCL SDA NOTE: DAC7573 power and input/output connections are omitted for clarity, except IC Inputs. Figure 40. Typical DAC7573 Connections The DAC7573 interfaces directly to standard mode, fast mode and high-speed mode I2C controllers. Any microcontroller's I2C peripheral, including master-only and non-multiple-master I2C peripherals, work with the DAC7573. The DAC7573 does not perform clock-stretching (i.e., it never pulls the clock line low), so it is not necessary to provide for this unless other devices are on the same I2C bus. Pullup resistors are necessary on both the SDA and SCL lines because I2C bus drivers are open-drain. The size of the these resistors depend on the bus operating speed and capacitance on the bus lines. Higher-value resistors consume less power, but increase the transition times on the bus, limiting the bus speed. Lower-value resistors allow higher speed at the expense of higher power consumption. Long bus lines have higher capacitance and require smaller pullup resistors to compensate. If the pullup resistors are too small the bus drivers may not be able to pull the bus line low. USING GPIO PORTS FOR I2C Most microcontrollers have programmable input/output pins that can be set in software to act as inputs or outputs. If an I2C controller is not available, the DAC7573 can be connected to GPIO pins, and the I2C bus protocol simulated, or bit-banged, in software. An example of this for a single DAC7573 is shown in Figure 41. 26 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 APPLICATION INFORMATION (continued) DAC7573 IOVDD 1 VOUTA A3 16 2 VOUTB A2 15 3 VREFH A1 14 4 VDD A0 13 5 VREFL Microcontroller or Microprocessor IOVDD 12 6 GND SDA 11 7 VOUTC SCL 10 8 VOUTD LDAC 9 GPIO-1 GPIO-2 NOTE: DAC7573 power and input/output connections are omitted for clarity, except IC Inputs. Figure 41. Using GPIO With a Single DAC7573 Bit-banging I2C with GPIO pins can be done by setting the GPIO line to zero and toggling it between input and output modes to apply the proper bus states. To drive the line low, the pin is set to output a zero; to let the line go high, the pin is set to input. When the pin is set to input, the state of the pin can be read; if another device is pulling the line low, this reads as a zero in the port's input register. Note that no pullup resistor is shown on the SCL line. In this simple case the resistor is not needed. The microcontroller can simply leave the line on output, and set it to one or zero as appropriate. It can do this because the DAC7573 never drives its clock line low. This technique can also be used with multiple devices, and has the advantage of lower current consumption due to the absence of a resistive pullup. If there are any devices on the bus that may drive their clock lines low, the above method should not be used. The SCL line should be high-Z or zero, and a pullup resistor provided as usual. Note also that this cannot be done on the SDA line in any case, because the DAC7573 drives the SDA line low from time to time, as all I2C devices do. Some microcontrollers have selectable strong pullup circuits built in to their GPIO ports. In some cases, these can be switched on and used in place of an external pullup resistor. Weak pullups are also provided on some microcontrollers, but usually these are too weak for I2C communication. Test any circuit before committing it to production. USING REF02 AS A POWER SUPPLY FOR DAC7573 Due to the extremely low supply current required by the DAC7573, a possible configuration is to use a REF02 +5 V precision voltage reference to supply the required voltage to the DAC7573's supply input as well as the reference input, as shown in Figure 42. This is especially useful if the power supply is quite noisy or if the system supply voltages are at some value other than 5 V. The REF02 outputs a steady supply voltage for the DAC7573. If the REF02 is used, the current it needs to supply to the DAC7573 is 600 µA typical and 900 µA max for 27 DAC7573 www.ti.com SLAS398 – SEPTEMBER 2003 APPLICATION INFORMATION (continued) VDD = 5 V. When a DAC output is loaded, the REF02 also needs to supply the current to the load. The total typical current required (with a 5-kΩ load on a single DAC output) is: 600 µA + (5 V / 5 kΩ) = 1.6 mA The load regulation of the REF02 is typically 0.005%/mA, which results in an error of 400 µV for 1.6 mA of current drawn from it. This corresponds to a 0.33 LSB error for a 0 V to 5 V output range. 15 V REF02 5V 1.6 mA I2C Interface SCL SDA VDD DAC7573 VOUT = 0 V to 5 V Figure 42. REF02 Power Supply LAYOUT A precision analog component requires careful layout, adequate bypassing, and clean, well-regulated power supplies. The power applied to VDD should be well-regulated and low noise. Switching power supplies and dc/dc converters often have high-frequency glitches or spikes riding on the output voltage. In addition, digital components can create similar high-frequency spikes as their internal logic switches states. This noise can easily couple into the DAC output voltage through various paths between the power connections and analog output. As with the GND connection, VDD should be connected to a positive power-supply plane or trace that is separate from the connection for digital logic until they are connected at the power-entry point. In addition, a 1 µF to 10 µF capacitor in parallel with a 0.1 µF bypass capacitor is strongly recommended. In some situations, additional bypassing may be required, such as a 100 µF electrolytic capacitor or even a Pi filter made up of inductors and capacitors—all designed to essentially low-pass filter the –5 V supply, removing the high-frequency noise. 28 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DAC7573IPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 D7573I DAC7573IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 D7573I DAC7573IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 D7573I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 13-Feb-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device DAC7573IPWR Package Package Pins Type Drawing TSSOP PW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 12.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Feb-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC7573IPWR TSSOP PW 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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