Infineon BFR750L3RH High gain ultra low noise rf transistor Datasheet

BFR750L3RH
Linear Low Noise SiGe:C Bipolar RF Transistor
• High gain ultra low noise RF transistor
• Based on Infineon's reliable high volume Silicon
Germanium technology
• Provides outstanding performance for a wide range
of wireless applications up to 10 GHz
• Ideal for WLAN and all 5-6 GHz applications
• High OIP3 and P-1dB for driver stages
• High maximum stable and available gain
Gms = 21 dB at 1.8 GHz, Gma = 11.5 dB at 6 GHz
• Pb-free (RoHS compliant) and halogen-free very thin
small leadless package (package height 0.32 mm max.
ideal for modules)
• Qualification report according to AEC-Q101 available
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type
BFR750L3RH
Marking
R8
Pin Configuration
1=B
1
2=C
3=E
Package
TSLP-3-9
2013-09-09
BFR750L3RH
Maximum Ratings at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Collector-emitter voltage
VCEO
Value
Unit
V
TA = 25 °C
4
TA = -55 °C
3.5
Collector-emitter voltage
VCES
13
Collector-base voltage
VCBO
13
Emitter-base voltage
VEBO
1.2
Collector current
IC
90
Base current
IB
9
Total power dissipation1)
Ptot
360
mW
Junction temperature
TJ
150
°C
Storage temperature
TStg
mA
TS ≤ 96°C
-55 ... 150
Thermal Resistance
Parameter
Symbol
Junction - soldering point2)
RthJS
Value
Unit
150
K/W
Values
Unit
Electrical Characteristics at T A = 25 °C, unless otherwise specified
Symbol
Parameter
min.
typ.
max.
V(BR)CEO
4
4.7
-
V
ICES
-
-
100
µA
ICBO
-
-
100
nA
IEBO
-
-
10
µA
hFE
160
250
400
-
DC Characteristics
Collector-emitter breakdown voltage
IC = 3 mA, I B = 0
Collector-emitter cutoff current
VCE = 13 V, VBE = 0
Collector-base cutoff current
VCB = 5 V, IE = 0
Emitter-base cutoff current
VEB = 0.5 V, IC = 0
DC current gain
IC = 60 mA, VCE = 3 V, pulse measured
1T
S is measured on the emitter lead at the soldering point to the pcb
2For the definition of R
thJS please refer to Application Note AN077 (Thermal
2
Resistance Calculation)
2013-09-09
BFR750L3RH
Electrical Characteristics at TA = 25 °C, unless otherwise specified
Symbol
Values
Parameter
Unit
min.
typ.
max.
fT
-
37
-
Ccb
-
0.24
0.42
Cce
-
0.31
-
Ceb
-
0.97
-
AC Characteristics (verified by random sampling)
Transition frequency
GHz
IC = 60 mA, VCE = 3 V, f = 2 GHz
Collector-base capacitance
pF
VCB = 3 V, f = 1 MHz, emitter grounded
Collector emitter capacitance
VCE = 3 V, f = 1 MHz, base grounded
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz, collector grounded
Minimum noise figure
dB
NFmin
IC = 25 mA, VCE = 3 V, f = 1.8 GHz, ZS = ZSopt
IC = 25 mA, VCE = 3 V, f = 6 GHz, ZS = ZSopt
Power gain, maximum stable1)
-
0.6
-
-
1.1
-
Gms
-
21
-
dB
Gma
-
11.5
-
dB
IC = 60 mA, VCE = 3 V, ZS = ZSopt,
ZL = ZLopt , f = 1.8 GHz
Power gain, maximum available1)
IC = 60 mA, VCE = 3 V, ZS = ZSopt,
ZL = ZLopt, f = 6 GHz
|S21e|2
Transducer gain
IC = 60 mA, VCE = 3 V, ZS = ZL = 50 Ω,
f = 1.8 GHz
dB
-
18
-
-
8
-
IP3
-
29.5
-
P-1dB
-
16.5
-
IC = 60 mA, VCE = 3 V, ZS = ZL = 50 Ω,
f = 6 GHz
Third order intercept point at output2)
dBm
VCE = 3 V, IC = 60 mA, f = 1.8 GHz,
ZS = ZL = 50 Ω
1dB compression point at output
IC = 60 mA, VCE = 3 V, ZS = ZL = 50 Ω,
f = 1.8 GHz
1/2
ma = |S21e / S12e | (k-(k²-1) ), Gms = |S21e / S12e|
2IP3 value depends on termination of all intermodulation frequency components.
Termination used for this measurement is 50Ω from 0.1 MHz to 6 GHz
1G
3
2013-09-09
BFR750L3RH
Total power dissipation P tot = ƒ(TS)
Permissible Puls Load RthJS = ƒ (t p)
400
350
300
2
10
RthJS [K/W]
Ptot [mW]
250
200
D = 0.5
D = 0.2
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D=0
150
1
10
100
→ tp
←
D=tp /T
50
← T
→
0
10
0
0
15
30
45
60
75
90
105
120
135
−8
10
150
TS [°C]
−6
10
−4
10
−2
10
0
10
tp [s]
Permissible Pulse Load
Collector-base capacitance Ccb = ƒ (VCB)
Ptotmax/PtotDC = ƒ(tp )
f = 1 MHz
2
10
0.6
→ tp
←
D=tp /T
0.55
0.5
← T
→
0.45
D=0
D = 0.005
D = 0.01
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
1
10
0.35
Ccb [pF]
Ptotmax/PtotDC
0.4
0.3
0.25
0.2
0.15
0.1
0.05
0
10
−8
10
0
−6
10
−4
10
−2
10
0
10
0
2
4
6
8
10
12
VCB [V]
tp [s]
4
2013-09-09
BFR750L3RH
Transition frequency fT = ƒ(IC)
Power gain Gma, Gms = ƒ (f)
VCE = parameter, f = 1 GHz
VCE = 3 V, IC = 60 mA
45
40
2V to 4V
40
35
1.00V
35
30
30
0.75V
25
G
ms
G [dB]
fT [GHz]
25
20
20
15
15
|S |2
21
10
10
5
5
0.50V
0
0
0
10
20
30
40
50
60
70
80
0
1
2
3
IC [mA]
4
5
6
f [GHz]
Power gain Gma, Gms = ƒ (IC)
Power gain Gma, Gms = ƒ (VCE )
VCE = 3 V
IC = 60 mA
f = parameter
f = parameter
28
27
0.90GHz
0.90GHz
26
24
24
1.80GHz
21
22
2.40GHz
18
1.80GHz
3.00GHz
15
2.40GHz
G [dB]
G [dB]
20
18
4.00GHz
5.00GHz
12
16
3.00GHz
14
4.00GHz
6.00GHz
9
5.00GHz
6
12
6.00GHz
3
10
8
0
0
10
20
30
40
50
60
70
80
0
IC [mA]
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
VCE [V]
5
2013-09-09
Package TSLP-3-9
6
BFR750L3RH
2013-09-09
BFR750L3RH
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
7
2013-09-09
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