Rohm BM2P053F Pwm type dc/dc converter ic included 650v mosfet Datasheet

Datasheet
AC/DC Drivers
PWM type DC/DC converter IC
Included 650V MOSFET
BM2PXX3F Series
●General
The PWM type DC/DC converter (BM2PXX3F) for
AC/DC provide an optimum system for all products that
include an electrical outlet.
BM2PXX3F supports both isolated and non-isolated
devices, enabling simpler design of various types of
low-power electrical converters.
BM2PXX3F built in a HV starter circuit that tolerates 650V,
it contributes to low-power consumption.
With current detection resistors as external devices, a
higher degree of design freedom is achieved. Since current
mode control is utilized, current is restricted in each cycle
and excellent performance is demonstrated in bandwidth
and transient response.
The switching frequency is 65 kHz. At light load, the
switching frequency is reduced and high efficiency is
achieved.
A frequency hopping function is also on chip, which
contributes to low EMI.
We can design easily, because BM2PXX3F includes the
switching MOSFET.
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●Features
PWM frequency : 65kHz
PWM current mode method
Burst operation when load is light
Frequency reduction function
Built-in 650V start circuit
Built-in 650V switching MOSFET
VCC pin under voltage protection
VCC pin overvoltage protection
SOURCE pin Open protection
SOURCE pin Short protection
SOURCE pin Leading-Edge-Blanking function
Per-cycle over current protection circuit
Soft start
Secondary Over current protection circuit
●Package
W (Typ.) x D (Typ.) x H (Max.)
5.00mm x 6.20mm x 1.71mm
SOP8
●Basic specifications
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Operating Power Supply Voltage Range:
VCC 8.9V to 26.0V DRAIN：～650V
Operating Current: Normal Mode
BM2P053F: 0.60mA (Typ.)
BM2P093F: 0.50mA (Typ.)
Burst Mode: 0.40mA (Typ.)
Oscillation Frequency:
65kHz (Typ.)
o
o
Operating Temperature:
- 40 C to +105 C
MOSFET ON Resistance:
●Applications
AC adapters and household appliances (vacuum
cleaners, humidifiers, air cleaners, air conditioners, IH
cooking heaters, rice cookers, etc.)
●Line Up
Product
BM2P053F:4.0Ω (Typ.)
BM2P093F:8.5Ω (Typ.)
●Application circuit
MOSFET ON resistor
BM2P053F
4.0Ω
BM2P093F
8.5Ω
Figure 1．Application circuit
○Product structure：Silicon monolithic integrated circuit
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Datasheet
BM2PXX3F
●Absolute Maximum Ratings（Ta=25C）
Parameter
Symbol
Rating
Unit
Vmax1
Vmax2
V max3
-0.3～30
-0.3～6.5
650
V
V
V
Drain current pulse
IDP
2.60
A
Drain current pulse
IDP
1.30
A
Maximum applied voltage 1
Maximum applied voltage 2
Maximum applied voltage 3
Conditions
VCC
SOURCE, FB
DRAIN
PW=10us, Duty cycle=1%
(BM2P053F)
PW=10us, Duty cycle=1%
(BM2P093F)
Allowable dissipation
Pd
563
mW
Operating
o
-40 ～ +105
C
Topr
temperature range
o
MAX junction temperature
TJMAX
150
C
Storage
o
-55 ～ +150
Tstr
C
temperature range
(Note1) SOP8 : When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).
Reduce to 4.504 mW/C when Ta = 25C or above.
●Operating Conditions（Ta=25C）
Parameter
Symbol
Rating
Unit
VCC
VDRAIN
8.9～26.0
～650
V
V
Power supply voltage range 1
Power supply voltage range 2
Conditions
VCC pin voltage
DRAIN pin voltage
●Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Min
Specifications
Typ
Max
V(BR)DDS
650
-
IDSS
-
On resistance
RDS(ON)
On resistance
RDS(ON)
Parameter
Symbol
Unit
Conditions
-
V
ID=1mA / VGS=0V
-
100
uA
-
4.0
5.5
Ω
-
8.5
12.0
Ω
VDS=650V / VGS=0V
ID=0.25A / VGS=10V
(BM2P053F)
ID=0.25A / VGS=10V
(BM2P093F)
[MOSFET Block]
Between drain and
source voltage
Drain leak current
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Datasheet
BM2PXX3F
●Electrical Characteristics of Control IC part (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Specifications
Parameter
Symbol
Unit Conditions
Min
Typ
Max
[Circuit current]
BM2P053F, FB=2.0V
Circuit current (ON) 1
ION1
410
600
790
μA
(at pulse operation)
BM2P093F, FB=2.0V
Circuit current (ON) 1
ION1
350
500
650
μA
(at pulse operation)
Circuit current (ON) 2
ION2
-
400
500
μA
FB=0.0V(at burst operation)
VUVLO1
VUVLO2
VUVLO3
VOVP1
VLATCH
VCHG1
VCHG2
TLATCH
TSD
12.50
7.50
26.0
7.70
12.00
50
118
13.50
8.20
5.30
27.5
VUVLO2-0.5
8.70
13.00
100
145
14.50
8.90
29.0
9.70
14.00
150
-
V
V
V
V
V
V
V
us
C
VCC rise
VCC drop
VUVLO3= VUVLO1- VUVLO2
VCC rises
FSW1
FSW2
FDEL1
FCH
TSS1
TSS2
TSS3
TSS4
Dmax
RFB
Gain
VBST
60
20
75
0.30
0.60
1.20
4.80
68.0
23
0.300
65
25
4.0
125
0.50
1.00
2.00
8.00
75.0
30
4.00
0.400
70
30
175
0.70
1.40
2.80
11.20
82.0
37
0.500
KHz
KHz
KHz
Hz
ms
ms
ms
ms
%
kΩ
V/V
V
VDLT
1.100
1.250
1.400
V
VFOLP1A
VFOLP1B
TFOLP1
TFOLP1b
TFOLP2
2.60
40
26
358
2.80
2.60
64
32
512
3.00
88
38
666
V
V
ms
ms
ms
VCS
0.380
0.400
0.420
V
Overcurrent detection voltage SS1
VCS_SS1
-
0.100
-
V
0[ms] ~ TSS1[ms]
Overcurrent detection voltage SS2
VCS_SS2
-
0.150
-
V
TSS1 [ms] ~ TSS2 [ms]
Overcurrent detection voltage SS3
VCS_SS3
-
0.200
-
V
TSS2 [ms] ~ TSS3[ms]
Overcurrent detection voltage SS4
VCS_SS4
-
0.300
-
V
TSS3 [ms] ~ TSS4 [ms]
Leading Edge Blanking Time
Over current detection AC Voltage
compensation factor
SOURCE pin
short protection voltage
[Start circuit block]
Start current 1
Start current 2
TLEB
-
250
-
ns
KCS
12
20
28
mV/us
VCSSHT
0.020
0.050
0.080
V
ISTART1
ISTART2
0.100
1.000
0.500
3.000
1.000
6.000
mA
mA
OFF current
ISTART3
-
10
20
uA
VSC
0.800
1.500
2.100
V
[VCC protection function]
VCC UVLO voltage 1
VCC UVLO voltage 2
VCC UVLO hysteresis
VCC OVP voltage 1
Latch released VCC voltage
VCC Recharge start voltage
VCC Recharge stop voltage
Latch mask time
Thermal shut down temperature
[PWM type DCDC driver block]
Oscillation frequency 1
Oscillation frequency 2
Frequency hopping width 1
Hopping fluctuation frequency
Soft start time 1
Soft start time 2
Soft start time 3
Soft start time 4
Maximum duty
FB pin pull-up resistance
ΔFB / ΔCS gain
FB burst voltage
FB voltage of
starting Frequency reduction mode
FB OLP voltage 1a
FB OLP voltage 1b
FB OLP ON timer
FB OLP Start up timer
FB OLP OFF timer
[Over current detection block]
Overcurrent detection voltage
Start current switching voltage
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Control IC
FB=2.00V
FB=0.40V
FB=2.0V
FB falls
Overload is detected (FB rise)
Overload is detected (FB drop)
Ton=0us
VCC= 0V
VCC=10V
Inflow current from Drain pin
after UVLO released UVLO.
When MOSFET is OFF
TSZ02201-0F2F0A200060-1-2
7.Mar.2017.Rev.009
Datasheet
BM2PXX3F
●PIN DESCRIPTIONS
Table 1 Pin Description
NO.
Pin Name
I/O
1
2
3
4
5
6
7
8
VCC
N.C.
N.C.
DRAIN
SOURCE
N.C.
GND
FB
I
I/O
I/O
I/O
I
Function
Power supply input pin
MOSFET DRAIN pin
MOSFET SOURCE pin
GND pin
Feedback signal input pin
ESD Diode
VCC
○
○
○
○
○
●I/O Equivalent Circuit Diagram
Figure 2. I/O Equivalent Circuit Diagram
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BM2PXX3F
●Block Diagram
+
FUSE
AC
Diode
Bridge
Filter
-
VCC
DRAIN
1
4
VCC UVLO
VCC OVP
+
-
13.5V
/ 8.2V
100us
Filter
+
-
Starter
4.0V
Line Reg
12V Clamp
Circuit
27.5V
10uA
Internal Block
S
R
DRIVER
Q
PWM Control
4.0V
30k
8
OLP
+
1M
64ms
Timer
Current
Limiter
Burst
Comparator
Leading Edge
Blanking
(typ=250ns)
+
-
5
+
RS
Soft Start
PWM
Comparator
-
AC Input
Compensation
MAX
DUTY
+
+
OSC
(65kHz)
7
Frequency
Hopping
Slope
Compensation
FeedBack
With
Isolation
Figure 3. Block Diagram
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Datasheet
BM2PXX3F
●Description of Blocks
(1) Start circuit (DRIAN: 4pin)
This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting.
After starting, consumption power is idling current ISTART3（typ=10uA） only.
Reference values of Starting time are shown in Figure-7. When Cvcc=10uF it can start less than 0.1 sec.
+
FUSE
Diode
Bridge
AC
85-265Vac
-
DRAIN
SW1
VCC
Cvcc
+
VCCUVLO
Figure4. Block diagram of start circuit
1.0
0.9
0.8
起動時間[sec]
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
5
10
15
20
25
30
35
40
45
50
Cvcc [uF]
Figure 5. Start current vs VCC voltage
Figure 6. Start time (reference value)
* Start current flows from the DRAIN pin
ex) Consumption power of start circuit only when the Vac=100V
PVH＝100V*√2*10uA=1.41mW
ex) Consumption power of start circuit only when the Vac=240V
PVH＝240V*√2*10uA=3.38mW
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Datasheet
BM2PXX3F
(2) Start sequences
(Soft start operation, light load operation, and auto recovery operation during overload protection)
Start sequences are shown in Figure 7. See the sections below for detailed descriptions.
Switching
Figure 7. Start sequences Timing Chart
A:
B:
C:
D:
E:
F:
G:
H:
I:
Input voltage VH is applied
This IC starts operation when VCC pin voltage rises and VCC > VUVLO1 (13.5 V typ).Switching function starts when other
protection functions are judged as normal. Until the secondary output voltage becomes constant level, VCC voltage drops
because of the VCC consumption current. VCC recharge function start if VCC voltage < VCHG1 （8.7V typ）
With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.
When the switching operation starts, VOUT rises.The output voltage become to stable state, VCC voltage also become to
stable state through auxiliary winding.Please set the rated voltage within the TFOLP1b period (32ms typ) from VCC voltage
> VUVLO1.
During a light load, if it reaches FB voltage < VBST (= 0.4Vtyp), the IC starts burst operation to keep power consumption
low.During burst operation, it becomes low-power consumption mode.
When the FB Voltage＞VFOLP1A（=2.8V typ）, it becomes a overload operation.
When FB pin voltage keeps VFOLP1A (= 2.8V typ) at or above TFOLP1 (64ms typ), the overload protection function is triggered
and switching stops 64ms later. If the FB pin voltage becomes FB<VFOLP1B even once, the IC’s FB OLP timer is reset.
If the VCC voltage drops to VCC < VUVLO2 (8.2Vtyp) or below, restart is executed.
The IC’s circuit current is reduced and the VCC pin value rises. (Same as B)
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Datasheet
BM2PXX3F
(3) VCC pin protection function
BM2PXX3F built in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), over voltage protection
function VCC OVP (Over Voltage Protection) and VCC charge function that operates in case of dropping the VCC
voltage.VCC UVLO and VCC OVP monitor VCC pin and prevent VCC pin from destroying switching MOSFET at
abnormal voltage.
VCC charge function stabilizes the secondary output voltage by charging from the high voltage line by start circuit at
dropping the VCC voltage.
(3-1) VCC UVLO ／ VCC OVP function
VCCUVLO is auto recovery protection. VCCOVP is latch protection. Refer to the operation figure-8.
VCCOVP built in mask time TLATCH（typ=100us）.By this function, this IC masks pin generated surge etc.
This function operates detection in case of continuing VCC pin voltage > VOVP1 （typ=27.5V）
Figure 8. VCC UVLO / OVP Timing Chart
A:
B:
C:
D:
E:
F:
G:
H:
I:
J:
K:
DRAIN voltage input, VCC pin voltage starts rising.
VCC>VUVLO1, DC/DC operation starts
VCC< VCHG1, VCC charge function operates and the VCC voltage rises.
VCC > VCHG2, VCC charge function is stopped.
VCC > VOVP1, function is detected
VCC > VOVP1, continues TLATCH (typ =100us), switching is stopped by the VCCOVP function.
VH is OPEN.VCC Voltage is fall.
Same as C.
Same as D.
VCC<VUVLO2, Switching is stopped by the VCC UVLO function
VCC< VLATCH, released from latch
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BM2PXX3F
（3-2）VCC Charge function
After VCC charge function operates once the VCC pin >VUVLO1 and the DC/DC operation starts then the VCC pin
voltage drops to <VCHG1. At that time the VCC pin is charged from DRAIN pin through start circuit.
By this operation, BM2PXX2 doesn’t occur to start failure.
When VCC pin voltage rises to VCC >VCHG2, charge is stopped. The operations are shown in figure 9.
VH
VUVLO1
VCHG2
VCC VCHG1
VUVLO2
Switching
VH charge
charge
charge charge charge
OUTPUT
voltage
A
B C D E
F G H
Figure 9. Charge operation VCC pin charge operation
A:
B:
C:
D:
E:
F:
G:
H:
DRAIN pin voltage rises, charge starts to VCC pin by the VCC charge function.
VCC > VUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.
When DC/DC operation starts, the VCC voltage drops.
VCC < VCHG1, VCC recharge function operates and VCC pin voltage rises...
VCC > VCHG2, VCC recharge function stops.
VCC < VCHG1, VCC recharge function operates and VCC pin voltage rises...
VCC > VCHG2, VCC recharge function stops.
After start of output voltage finished, VCC is charged by the auxiliary winding VCC pin stabilizes.
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BM2PXX3F
(4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)
BM2PXX3F is current mode PWM control.
An internal oscillator sets a fixed switching frequency (65kHz typ).
BM2PXX3F is integrated switching frequency hopping function which changes the switching frequency to fluctuate as
shown in Figure 10 below.
The fluctuation cycle is 125 Hz typ.
Switching Frequency
[kHz]
500us
69
68
67
66
65
64
63
62
61
125 Hz(8ms)
Time
Figure 10.
Frequency hopping function
Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ).
With current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur.
As a countermeasure to this, BM2PXX3F is built in slope compensation circuits.
BM2PXX3F is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption, when the
load is light.
FB pin is pull up by RFB (30 kΩ typ).
FB pin voltage is changed by secondary output voltage (secondary load power).
FB pin is monitored, burst mode operation and frequency detection start.
Figure 12 shows the FB voltage, and switching frequency, DCDC operation
・mode1: Burst operation
・mode2: Frequency reduction operation.
・mode3: Fixed frequency operation.
・mode4: Over load operation.
(operate at the max frequency)
(detect the over load state and stop the pulse operation)
Figure 11. Switching operation state changes by FB pin voltage
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Datasheet
BM2PXX3F
(5) Over Current limiter
BM2PXX3F is built in Over Current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching is
stopped. It is also built in AC voltage compensation function. This is the function which compensates the maximum
power as the AC voltage’s change by increasing over current limiter with time.
Shown in figure-12, 13, and 14.
Figure 12. No AC voltage compensation function
Figure13. built-in AC compensation
voltage
Primary peak current is decided as the formula below.
Primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay
Vcs ：Over current limiter voltage internal IC, Rs：Current detection resistance, Vdc input DC voltage, Lp ：Primary
inductance,
Tdelay：delay time after detection of over current limiter
Figure 14. Over current limiter voltage
（6）L.E.B period
When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current.
Therefore, because SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter
circuit.
To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250 ns by the
on-chip LEB (Leading Edge Blanking) function.
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BM2PXX3F
(7) SOURCE pin (5pin) short protection function
When the SOURCE pin (5pin) is shorted, BM2PXX3F is over heat.
BM2PXX3F built in short protection function to prevent destroying.
(8) SOURCE pin (5pin) open protection
If the SOURCE pin becomes OPEN, BM2PXX3F may be damaged.
To prevent to be damaged, BM2PXX3F built in OPEN protection circuit（auto recovery protection）.
(9) Output over load protection function （FB OLP Comparator）
The output overload protection function monitors the secondary output load status at the FB pin, and stops switching
when an overload occurs. In case of an overload, the output voltage is reduced and current no longer flows to the
photo coupler, so the FB pin voltage rises.
When the FB pin voltage > VFOLP1A (2.8 V typ) continuously for the period TFOLP1 (64ms typ), it is judged as an overload
and stops switching.
When the FB pin > VFOLP1A (2.8 V typ), if the voltage goes lower than VFOLP1B (2.6V typ) during the period TFOLP1 (64ms
typ), the overload protection timer is reset. The switching operation is performed during this period TFOLP1 (64ms typ).
At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of VFOLP1A (2.8 V typ)
or above. Therefore, at startup the FB voltage must be set to go to VFOLP1B (2.6 V typ) or below during the period TFOLP1
(64ms typ), and the secondary output voltage’s start time must be set within the period TFOLP1 (64ms typ) following
startup of the IC.
Recovery from the once detection of FBOLP, after the period TFOLP2 (512 ms typ)
VFOLP 1 A
FB
VH
charge
charge
charge
64ms
64ms
Switching
512ms
VUVLO 1
VCHG 2
VCC
512ms
VCHG1
VUVLO 2
A
B
C D
E
F
G H
Figure 15. Over load protection (Auto recovery)
A: The FBOLP comparator detects over load for FB>VFOLP1A
B: If the State of A continues for the period TFOLP1 (64ms typ), it is judged as an overload and stops switching after
64ms.
C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage
reaches < VCHG1, the VCC charge function operates so the VCC pin voltage rises.
D: VCC charge function stops when VCC pin voltage > VCHG2
E: If TFOLP2 （typ =512ms） go on from B point, Switching function starts on soft start.
F: If TFOLP1 (64ms typ) go on from E point to continues an overload condition (FB>VFOLP1A), Switching function stops at
F point.
G: While switching stops VCC pin voltage drops to < VCHG1, VCC charge function operates and VCC pin voltage rises.
H: If VCC pin (1pin) voltage becomes over VCHG2 by the VCC charge function, VCC charge function operation stops.
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Datasheet
BM2PXX3F
●Operation mode of protection circuit
Operation mode of protection functions are shown in table2.
Table2
Operation mode of protection circuit
Function
Operation mode
VCC Under Voltage Locked Out
Auto recovery
VCC Over Voltage Protection
Latch（with 100us timer）
TSD
Latch（with 100us timer）
FB Over Limited Protection
SOURCE Open Protection
Auto recovery（with 64ms timer）
Auto recovery
●Sequence
The sequence diagram is show in Fig-18.
All condition transits OFF Mode VCC<8.2V
VCC<8.2V
ALL MODE
OFF MODE
VCC>13.5V
Soft Start 1
Time>0.5ms
Soft Start 2
Time>1.0ms
Soft Start 3
Time>2.0ms
VCC<7.7V
Soft Start 4
Time>8.0ms
SOURCE OPEN
(Pulse Stop )
NORMAL
FBOLP
OFF TIMER
( 512 ms)
OPEN
Normal MODE
VCC>27.5V
Temp>145℃
LATCH OFF MODE
(Pulse Stop )
FB>2.80V
PULSE OFF
FB>2.80V
(64 ms)
FB<2.60V
OLP MODE
( Pulse Stop )
FB<0.40V
FB>0.40V
Burst MODE
(Pulse OFF )
Figure 16. The sequence diagram
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Datasheet
BM2PXX3F
● Thermal loss
The thermal design should set operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)
1. The ambient temperature Ta must be 105℃ or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 70 mm × 70mm × 1.6 mm, mounted on glass epoxy single-layer substrate)
1000
900
800
700
Pd[mW]
600
500
400
300
200
100
0
0
25
50
75
100
125
150
Ta[℃]
Figure 17. SOP8 Thermal Abatement Characteristics
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/19
TSZ02201-0F2F0A200060-1-2
7.Mar.2017.Rev.009
Datasheet
BM2PXX3F
●Ordering Information
B
M
2
P
X
X
3
F
-
Package
F : SOP8
Product name
GE2
Packaging and
forming specification
E2: Embossed tape and reel
●Marking Diagram
SOP8 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Series
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Part Number
BM2P053F
2P053
BM2P093F
2P093
15/19
TSZ02201-0F2F0A200060-1-2
7.Mar.2017.Rev.009
Datasheet
BM2PXX3F
Physical Dimension, Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include. BURR))
(UNIT: mm)
PKG: SOP8
Drawing No. : EX112-5001-1
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
)
∗ Order quantity needs to be multiple of the minimum quantity.
16/19
TSZ02201-0F2F0A200060-1-2
7.Mar.2017.Rev.009
Datasheet
BM2PXX3F
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting
the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the GND and supply lines of the digital and
analog blocks to prevent noise in the GND and supply lines of the digital block from affecting the analog block. Furthermore,
connect a capacitor to GND at all power supply pins. Consider the effect of temperature and aging on the capacitance value
when using electrolytic capacitors.
3.
GND Voltage
Ensure that no pins are at a voltage below that of the GND pin at any time, even during transient condition.
4.
GND Wiring Pattern
When using both small-signal and large-current GND traces, the two GND traces should be routed separately but connected to
a single GND at the reference point of the application board to avoid fluctuations in the small-signal GND caused by large
currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The GND lines
must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of
the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a
70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and
copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The
electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one
power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND
wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC
to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off
completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static
discharge, GND the IC during assembly and use similar precautions during transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging
the IC. Avoid nearby pins being shorted to each other especially to GND, power supply and output pin. Inter-pin shorts could be
due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
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TSZ22111・15・001
17/19
TSZ02201-0F2F0A200060-1-2
7.Mar.2017.Rev.009
Datasheet
BM2PXX3F
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely
low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this
way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC.
So unless otherwise specified, unused input pins should be connected to the power supply or GND line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as
applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.
Figure 18. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and
the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation
(ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should
always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period,
the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The
IC should be powered down and turned ON again to resume normal operation because the TSD circuit keeps
the outputs at the OFF state even if the TJ falls below the TSD threshold.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit
is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications
characterized by continuous operation or transitioning of the protection circuit.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/19
TSZ02201-0F2F0A200060-1-2
7.Mar.2017.Rev.009
Datasheet
BM2PXX3F
date
Rev. No.
2012.07.19
001
2013.11.18
005
2015.02.23
006
P1 Package size
P16 Physical Dimension
2015.05.15
007
P13 Operation mode of protection circuit
P13 Sequence
2015.09.24
008
2017.03.07
009
Revision Point
New Release
P7 An explanation for Figure7
P8 An explanation for VCC_UVLO/VCC_OVP function
An explanation for Figure8
P11 An explanation for Over Current limiter
P12 An explanation for Output over load protection function
An explanation for Figure15
P13 Table2
P7 An explanation of Start sequence
P8 An explanation of VCC pin protection function
P8 An explanation of VCC UVLO / VCC OVP function
P9 An explanation of VCC Charge function
P11 An explanation of Over Current Limiter
P12 An explanation of Output over load protection function
P2 explanation of package power
P2 Format for Electrical Characteristics of MOSFET
P3 Format for Electrical Characteristics of Control IC
P3 An explanation of Thermal shut down temperature
P7 An explanation of Start sequences
P8 An explanation of Figure8
P9 An explanation of VCC pin protection function
P12 An explanation of OUTPUT over load protection function
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
19/19
TSZ02201-0F2F0A200060-1-2
7.Mar.2017.Rev.009
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BM2P093F - Web Page
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Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BM2P093F
SOP8
2500
2500
Taping
inquiry
Yes