AOSMD AO3700 N-channel enhancement mode field effect transistor with schottky diode Datasheet

AO3700
N-Channel Enhancement Mode Field Effect Transistor
with Schottky Diode
General Description
Features
VDS (V) = 30V
ID = 3.3A (V GS = 10V)
RDS(ON) < 65mΩ (VGS = 10V)
RDS(ON) < 75mΩ (VGS = 4.5V)
RDS(ON) < 160mΩ (VGS = 2.5V)
SCHOTTKY
VDS (V) = 20V, I F = 1A, VF<[email protected]
The AO3700 uses advanced trench technology to provide
excellent R DS(ON) and low gate charge. A Schottky diode is
provided to facilitate the implementation of a bidirectional
blocking switch, or for DC-DC conversion applications.
Standard Product AO3700 is Pb-free (meets ROHS & Sony
259 specifications). AO3700L is a Green Product ordering
option. AO3700 and AO3700L are electrically identical.
SOT-23-5
D
K
S
A
Top View
G
S
A
1
2
3
5
D
4
K
G
Absolute Maximum Ratings T A=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TA=25°C
ID
Continuous Drain Current A
TA=70°C
IDM
Pulsed Drain Current B
VKA
Schottky reverse voltage
TA=25°C
IF
Continuous Forward Current A
TA=70°C
IFM
Pulsed Forward Current B
TA=25°C
TA=70°C
Power Dissipation
Junction and Storage Temperature Range
Parameter: Thermal Characteristics MOSFET
t ≤ 10s
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Lead C
Thermal Characteristics Schottky
Steady-State
Steady-State
Maximum Junction-to-Ambient
A
t ≤ 10s
Maximum Junction-to-Ambient
Maximum Junction-to-Lead C
A
Steady-State
Steady-State
Alpha & Omega Semiconductor, Ltd.
MOSFET
30
±12
3.3
2.6
10
Schottky
Units
V
V
A
PD
1.15
0.7
20
2
1
10
0.92
0.59
TJ, TSTG
-55 to 150
-55 to 150
°C
Typ
Max
Units
Symbol
RθJA
RθJL
RθJA
RθJL
80.3
110
117
43
150
80
109.4
135
136.5
58.5
175
80
V
A
W
°C/W
°C/W
AO3700
Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
VGS(th)
ID(ON)
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
RDS(ON)
gFS
VSD
IS
Conditions
Min
ID=250µA, VGS=0V
VDS=24V, VGS=0V
30
VDS=0V, VGS=±12V
VDS=VGS ID=250µA
VGS=4.5V, VDS=5V
VGS=10V, ID=3.3A
1
10
SCHOTTKY PARAMETERS
VF
Forward Voltage Drop
Irm
Maximum reverse leakage current
CT
trr
Qrr
Junction Capacitance
Schottky Reverse Recovery Time
Schottky Reverse Recovery Charge
Units
1.4
1
5
100
2
µA
nA
V
A
51
64
60
100
11.7
0.81
65
90
75
160
mΩ
mΩ
1
2.5
S
V
A
226
39
29
1.4
270
4.6
1.4
0.55
2.6
3.2
14.5
2.1
5.5
nC
nC
nC
ns
ns
ns
ns
IF=3.3A, dI/dt=100A/µs
IF=3.3A, dI/dt=100A/µs
10.2
3.8
13
ns
nC
IF=0.5A
VR=16V
VR=16V, TJ=125°C
0.39
0.5
0.1
V
TJ=125°C
VGS=4.5V, ID=3.0A
VGS=2.5V, ID=1A
Forward Transconductance
VDS=5V, ID=3.3A
Diode Forward Voltage
IS=1A,VGS=0V
Maximum Body-Diode Continuous Current
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
Qrr
Body Diode Reverse Recovery Charge
Max
V
TJ=55°C
Static Drain-Source On-Resistance
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
Typ
VGS=0V, VDS=15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
VGS=4.5V, VDS=15V, ID=3.3A
VGS=10V, VDS=15V, RL=4.7Ω,
RGEN=6Ω
VR=10V
IF=1A, dI/dt=100A/µs
IF=1A, dI/dt=100A/µs
2.5
20
34
5.2
0.8
mΩ
pF
pF
pF
Ω
mA
pF
10
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 µs pulses, duty cycle 0.5% max.
2
E. These tests are performed with the device mounted on 1 in FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
SOA curve provides a single pulse rating. Rev0: October 2005
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AO3700
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
15
10V
3.5V
12
8
4V
6V
VDS=5V
3V
6
ID (A)
ID(A)
9
4
6
VGS=2.5V
125°C
3
2
0
0
0
1
2
3
4
VDS (Volts)
Fig 1: On-Region Characteristics
0
0.5
25°C
1
1.5
2
2.5
3
VGS(Volts)
Figure 2: Transfer Characteristics
3.5
270
1.8
VGS=4.5V
Normalized On-Resistance
175
ID=3.0A
1.6
150
RDS(ON) (mΩ)
60
100
5
200
51
VGS=2.5V
125
1.7
VGS=10V
ID3.6
=3.3A
1.4
100
1.2
VGS=4.5V
75
50
VGS=10V
25
0
VGS=2.5V
ID=1A
1
13
0.8
0
2
4
6
8
10
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
1.0E+01
100
1.0E+00
90
125°
1.0E-01
125°C
IS (A)
RDS(ON) (mΩ)
80
1.0E-02
70
25°C
60
1.0E-03
ID=3.3A
25°C
1.0E-04
50
1.0E-05
40
0
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
1.2
AO3700
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
400
5
VDS=15V
ID=3.3A
350
4
Capacitance (pF)
300
VGS (Volts)
3
2
Ciss
250
200
150
51
100
1
Crss
50
0
60
100
Coss
0
0
1
2 Q (nC) 3
4
g
Figure 7: Gate-Charge Characteristics
5
0
5
10
15
20
25
VDS (Volts)
Figure 8: Capacitance Characteristics
30
270
100.0
20
TJ(Max)=150°C
TA=25°C
RDS(ON)
limited
10.0
1.7
15
100µs
10
10ms
1.0
1s
3.6
Power (W)
ID (Amps)
10µs
1ms
TJ(Max)=150°C
TA=25°C
5
0.1s
10s
DC
0.1
0.1
10
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
ZθJA Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=110°C/W
100
0
0.001
13
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
0.01
100
1000
AO3700
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: SCHOTTKY
100
10
125°C
f = 1MHz
80
Capacitance (pF)
IF (Amps)
1
0.1
0.01
60
40
20
25°C
0.001
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
VF (Volts)
Figure 12: Schottky Forward Characteristics
10
15
20
VKA (Volts)
Figure 13: Schottky Capacitance Characteristics
0.5
Leakage Current (A)
1.0E-02
0.4
VF (Volts)
5
IF=0.5A
0.3
0.2
1.0E-03
VR=16V
1.0E-04
1.0E-05
1.0E-06
0.1
0
25
50
75
100
Temperature (°C)
125
0
150
25
50
75
100
125
150
Temperature (°C)
Figure 15: Schottky Leakage current vs. Junction
Temperature
Figure 14: Schottky Forward Drop vs.
Junction Temperature
ZθJA Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=135°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
PD
0.1
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
Pulse Width (s)
Figure 15: Schottky Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000
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