Agilent APDS-9002 Miniature Surface-Mount Ambient Light Photo Sensor Data Sheet Features • Excellent responsivity which peaks in the human luminosity curve Close responsivity to the human eye Description The APDS-9002 is a low-cost analog-output ambient light photo sensor in lowest cost miniature chipLED lead-free surface mount package. It consists of a spectrally suited phototransistor, which peaks in human luminosity curve. Hence, it provides an excellent responsivity that is close to the response of human eyes, as shown in Figure 2. It provides a design-alternative to the HSDL-9000 digital-output ambient light photo sensor is suitable for portable applications with its ultra small package design. The APDS-9002 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as the mobile phones and PDAs that draw heavy current from display backlighting will benefit from incorporating these photo sensor products in their designs by reducing power consumption significantly. • Miniature chipLED lead-free surface-mount package Height – 0.80 mm Width – 2.00 mm Depth – 1.25 mm • Good output linearity across wide illumination range • Low sensitivity variation across various light sources • Guaranteed temperature performance -40°C to 85°C • VCC supply 2.4 to 5.5 V • Lead-free package Applications • Detection of ambient light to control display backlighting Mobile devices – mobile phones, PDAs Computing devices – notebooks, webpads Consumer devices – TVs, video cameras, digital still cameras • Automatic residential and commercial lighting management • Electronic signs and signals • Daylight and artificial light exposed devices Application Support Information The Application Engineering Group is available to assist you with the application design associated with APDS-9002 ambient light photo sensor module. You can contact them through your local sales representatives for additional details. Ordering Information Part Number Packaging Type Package Quantity APDS-9002-021 Tape and Reel 4-pins Chipled package 2500 Typical Application Circuit PIN 2: VCC PIN 3: VCC PIN 1: IOUT APDS-9002 RLOAD PIN 4: NC Figure 1. Typical application circuit for APDS-9002. Figure 1 Table Component Recommended Application Circuit Components RLOAD 1 kW I/O Pins Configuration Table Pin Symbol Description 1 IOUT IOUT 2 VCC VCC 3 VCC VCC 4 NC No Connect 2 1.1 NORMALIZED RESPONSIVITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 APDS-9002 SILICON EYE RESPONSE 0.2 0.1 0 350 450 550 650 750 850 950 1050 1150 1250 WAVELENGTH (nm) Figure 2. Relative spectral response vs. wavelength. CAUTIONS: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50°C/W Parameter Symbol Min. Max. Units Storage Temperature TS -40 85 °C Operating Temperature TA -40 85 °C Supply Voltage VCC 2.4 5.5 V Recommended Operating Conditions Parameter Symbol Min. Max. Units Operating Temperature TA -40 85 °C Supply Voltage VCC 2.4 5.5 V 3 Conditions Electrical & Optical Specifications (TA = 25°C) Parameter Symbol Min. Typ. Max. Units Conditions Photo Current (I) I_PH1 10 20 33 µA VCC = 3.0 V, Lux = 10[2] Photo Current (II) I_PH2 136 250 410 µA VCC = 3.0 V, Lux = 100[2] Photo Current (III) I_PH3 - 300 - µA VCC = 3.0 V, Lux = 100[1] Dark Current I_DARK - 50 160 nA VCC = 3.0 V, Lux = 0 Light Current Ratio I_PH3 / I_PH2 - 1.2 - - - Rise Time T_RISE - 0.95 2 ms VCC = 3.0 V, Lux = 100, Rload = 1 kΩ[3] Fall Time T_FALL - 0.8 2 ms VCC = 3.0 V, Lux = 100, Rload = 1 kΩ[3] Notes: 1. Illuminance by CIE standard light source (incandescent lamp). 2. Fluorescent light is used as light source. White LED is substituted in mass production. 3. White LED is used as light source. Light Measurement Circuit and Waveforms I_pulse PIN 2: VCC PIN 3: VCC I_pulse PIN 1: IOUT VOUT APDS-9002 RLOAD PIN 4: NC 4 90% 10% GND tr tf 0.001 0.0001 Fluorescent Incandescent 0.00001 10 100 1000 0.5 Normalized Photocurrent 0 0 50 0.8 0.6 0.4 0.2 Normalized Photocurrent 0 100 -80 -60 -40 -20 20 40 60 80 Figure 5. Normalized photocurrent vs. angle (VCC = 3 V, TA = 25°C). 1.4E-3 TA = 25°C VCC = 3 V LIGHT SOURCE: WHITE LED 0 ANGLE Figure 4. Normalized photocurrent vs. temperature (VCC = 3 V, 100 LUX). 1.8E-3 1.6E-3 1.2E-3 1.4E-3 0.1 10 100 Figure 6. Output voltage vs. luminance at different load resistor. 1.2E-3 800.0E-6 600.0E-6 200.0E-6 000.0E+0 800.0E-6 AVERAGE 400.0E-6 AVERAGE 1000 1.0E-3 600.0E-6 400.0E-6 R = 1 kW R = 5.1 kW R = 11 kW R = 51 kW 0.01 1.0E-3 Trise (sec) 1 FALL TIME (sec) OUTPUT VOLTAGE, VOUT (V) 1.0 TEMPERATURE (°C) LUMINANCE, Ev (LUX) 5 2.0 1.0 -50 Figure 3. Photocurrent vs. luminence (VCC = 3 V, TA = 25°C). 0.001 1.2 1.5 LUX 10 2.5 NORMALIZED PHOTOCURRENT NORMALIZED PHOTOCURRENT PHOTOCURRENT (A) 0.01 200.0E-6 0 500 1000 1500 RLOAD (W) Figure 7. Fall time vs. RLOAD. 2000 2500 000.0E+0 0 500 1000 1500 RLOAD (W) Figure 8. Rise time vs. RLOAD. 2000 2500 APDS-9002 Package Outline 1.25 0.35 R0.20 P1 P2 MOLDING BODY (LENS) 0.45 1.40 2.00 0.45 P3 P4 P.C. BOARD 0.45 0.20 UNITS: in mm PIN 1: IOUT TOLERANCE: ±0.2 mm PIN 2: VCC PIN 3: VCC 0.80 PIN 4: NC (NO CONNECT) 0.30 0.14 6 APDS-9002 Tape and Reel Dimensions 2.00 ± 0.05 1.25 4.00 ± 0.1 P1 P2 P3 P4 4.00 ± 0.1 0.20 ∅1.56 ± 0.1 1.75 ± 0.1 3.50 ± 0.05 8 ± 0.1 2.00 ORIENTATION OF UNIT IN TAPE AND REEL POCKETS IN PROGRESSIVE DIRECTION ∅1.00 ± 0.1 1.96 ± 0.1 1.04 ± 0.1 0.20 1.04 ± 0.1 PROGRESSIVE DIRECTION MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT SENSITIVE ADHESIVE EMPTY PARTS MOUNTED (40 mm MIN.) LEADER (400 mm MIN.) EMPTY "B" "C" (40 mm MIN.) 178 75 UNIT: mm 18.4 (MAX.) DETAIL A 2.0 ± 0.50 C B DIA. 13.0 ± 0.50 LABEL R1.0 20.2 (MIN.) DETAIL A 7 15.4 (MAX.) Moisture Proof Packaging All APDS-9002 options are shipped in moisture proof package. Once opened, moisture absorption begins. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. This part is compliant to JEDEC Level 4. Package Temp. Time In Reels 60°C 20 hours In Bulk 125°C 5 hours Baking should only be done once. UNITS IN A SEALED MOISTURE-PROOF PACKAGE Recommended Storage Conditions PACKAGE IS OPENED (UNSEALED) YES YES PACKAGE IS OPENED LESS THAN 72 HOURS NO PERFORM RECOMMENDED BAKING CONDITIONS 8 10°C to 30°C Relative Humidity Below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. If times longer than three days are needed, the parts must be stored in a dry box. ENVIRONMENT LESS THAN 30°C, AND LESS THAN 60% RH NO BAKING IS NECESSARY Storage Temperature NO Recommended Reflow Profile MAX. 260°C T – TEMPERATURE – (°C) 255 R3 230 220 200 180 R4 R2 60 sec. MAX. ABOVE 220°C 160 R1 120 R5 80 25 0 50 100 150 200 250 300 t-TIME (SECONDS) P1 HEAT UP P2 SOLDER PASTE DRY P3 SOLDER REFLOW P4 COOL DOWN Process Zone Symbol DT Maximum DT/DTime Heat Up P1, R1 25°C to 160°C 4°C/s Solder Paste Dry P2, R2 160°C to 200°C 0.5°C/s P3, R3 200°C to 255°C (260°C at 10 seconds max.) 4°C/s P3, R4 255°C to 200°C -6°C/s P4, R5 200°C to 25°C -6°C/s Solder Reflow Cool Down The reflow profile is a straightline representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates. The DT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and APDS-9002 castellation pins are heated to a temperature of 160°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4°C per second to allow for even heating of both the PC board and APDS-9002 castellations. 9 Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS-9002 castellations to change dimensions evenly, putting minimal stresses on the APDS-9002. Appendix A: SMT Assembly Application Note Agilent APDS-9002: Miniature Surface-Mount Ambient Light Sensor METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 9. Stencil and PCBA. 1.1 Recommended Land Pattern 0.55 0.55 0.45 0.55 1 0.55 10 1.2 Recommended Metal Solder Stencil Aperture APERTURE OPENING 0.1 It is recommended that a 0.10 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.6 mm x 0.6 mm. This is to ensure adequate printed solder paste volume and no shorting. 1.65 2.2 UNIT: mm Figure 10. Solder stencil aperture. 2.65 1.3 Adjacent Land Keepout and Solder Mask Areas Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. MOUNTING CENTER 3.2 Note: Wet/Liquid PhotoImageable solder resist/mask is recommended. UNIT: mm 0.2 MIN. Figure 11. Adjacent land keepout and solder mask areas. 11 Appendix B: Optical Window Design for APDS-9002 2.0 Optical Window Dimensions To ensure that the performance of the APDS-9002 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS-9002. This minimum dimension that is recommended will ensure at least a ±35° light reception cone. If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal reflection to focus the light. FLAT PHOTO LIGHT SENSOR Figure 12(a). Window size determination for flat window. Figure 12(b). Window design of flat window with light guide. 12 The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figures 12(a) and 12(b) illustrate the two types of windows that we have recommended which could either be a flat window or a flat window with light guide. The window should be placed directly on top of the photo light sensor to achieve better performance and if a flat Table 1 and Figure 13 below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0 mm with a refractive index 1.585. window with a light pipe is used, dimension D2 should be 1.5 mm to optimize the performance of APDS-9002. D1 TOP VIEW T D1 L Z PHOTO LIGHT SENSOR D1 T L Z WINDOW DIAMETER THICKNESS LENGTH OF LIGHT PIPE DISTANCE BETWEEN WINDOW REAR PANEL AND APDS-9002 Figure 13. Recommended window dimensions. Table 1: Recommended Dimension for Optical Window All dimensions are in mm Flat Window Flat Window with Light Pipe (L = 0.0) (D2 = 1.5; Z = 0.5) WD (T+L+Z) Z D1 D1 L 1.5 0.5 2.25 2.0 1.0 3.25 2.5 1.5 4.25 3.0 2.0 5.00 2.5 1.5 2.1 Optical Window Material The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture. Table 2: Recommended Plastic Materials The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp. (USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2. 13 Material Number Visible Light Transmission Refractive Index Makrolon LQ2647 87% 1.587 Makrolon LQ3147 87% 1.587 Makrolon LQ3187 85% 1.587 Appendix C: General Application Guide for APDS-9002 The APDS-9002 is a low cost analog-output ambient light photo sensor which spectral response closely emulates the human eyes. APDS-9002 consists of a phototransistor that enables the photo sensor to produce a high gain photo current to a sufficient level that can be converted to voltage with a standard value of external resistor. APDS-9002 is then easily integrated into systems that use ADC input which is available for sampling of the external source, as shown in Figure 14 below. The amount of converted voltage, VOUT, is mainly dependant proportionally on the photo current which is generated by the brightness of the light shone on the photo sensor and the load resistor used, RL. Increasing the brightness of the light and/or the load resistor will increase the output voltage. Brightness is measured as “LUX” unit, which describes how intense a light source that our eyes perceive. LUX meter is the equipment for “LUX” measurement. Light sources with the same LUX level appear at the same brightness to the human eyes. VCC VCC 2 3 LIGHT SOURCE APDS-9002 VOUT 1 C 4 A/D RL MICROCONTROLLER NC Figure 14. Configuration of APDS-9002 being used directly. Light source, e.g., fluorescent light, consists of ac noise about 100 Hz frequency. A capacitor of 10 µF, which acts as a low-pass filter, is recommended to add in parallel with resistor to by-pass the ripples. 14 10 OUTPUT VOLTAGE, VOUT (V) Selection of the load resistor RL will determine the amount of current-to-voltage conversion in the circuit. Based on Figure 14 and using white LED as the light source, measurement has been carried out by using different load resistors to examine the variation of the output voltage towards the intense of LUX. The result is shown in Graph 1. APDS-9002 allows output voltage hits around 2.3 V, after this it saturates. TA = 25°C VCC = 3 V LIGHT SOURCE: WHITE LED 1 0.1 R = 1 kW R = 5.1 kW R = 11 kW R = 51 kW 0.01 0.001 10 100 1000 LUMINANCE, Ev (LUX) Graph 1. Output voltage vs. luminance at different load resistor. Agilent has fabricated an evaluation board based on the configuration shown in Figure 14 for the designer to test the ambient light sensor under different lighting conditions. A reference layout of a 2-layout Agilent evaluation board for APDS-9002 is shown in Figure 15 below. Figure 15. Evaluation board layout. 15 www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2005 Agilent Technologies, Inc. May 10, 2005 5989-3051EN