Datasheet 1ch Compact High Side Switch ICs 1.0A Current Limit High Side Switch ICs BD2226G BD2227G General Description Key Specifications BD2226G and BD2227G are low ON-Resistance N-Channel MOSFET high-side power switches, optimized for Universal Serial Bus (USB) applications. BD2226G and BD2227G are equipped with the function of over-current detection, thermal shutdown, under-voltage lockout and soft-start. Input Voltage Range: 2.7V to 5.5V ON-Resistance : 150mΩ(Typ) Over-Current Threshold: 0.75A (Min), 1.35A (Max) Standby Current: 0.01μA (Typ) Operating Temperature Range: -40°C to +85°C W(Typ) Package D(Typ) H (Max) Features ■ ■ ■ ■ ■ ■ ■ Over-Current Detection Thermal Shutdown Open-Drain Fault Flag Output Flag Output Delay Under-Voltage Lockout Soft-Start Circuit Control Input Logic Active-High (BD2226G) Active-Low (BD2227G) SSOP5 2.90mm x 2.80mm x 1.25mm Applications USB hub in consumer appliances, PC, PC peripheral equipment, and so forth Typical Application Circuit 5V (Typ.) 5V(Typ) 3.3V 10kΩ to 10kΩ~ 100kΩ 100kΩ CIN VIN IN VOUT OUT GND EN CL + - /OC Lineup Min Over-Current Threshold Typ Max Control Input Logic Package Orderable Part Number 750mA 1000mA 1350mA High SSOP5 Reel of 3000 BD2226G-TR 750mA 1000mA 1350mA Low SSOP5 Reel of 3000 BD2227G-TR ○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays www.rohm.com TSZ02201-0E3E0H300210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 1/22 TSZ22111･14･001 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Block Diagram Over-Current Detection Delay Counter Under-Voltage Lockout Charge Pump /OC Thermal Shutdown GND EN(/EN) OUT IN Pin Configurations BD2226G TOP VIEW BD2227G TOP VIEW 1 IN 1 IN OUT 5 OUT 5 2 GND 2 GND 3 EN 3 /EN /OC 4 /OC 4 Pin Description Pin No. Symbol I/O 1 IN - Input switch and the supply voltage for the IC 2 GND - Ground 3 EN, /EN I Enable input EN: High level input turns on the switch (BD2226G) /EN: Low level input turns on the switch (BD2227G) 4 /OC O Over-current notification terminal Low level output during over-current or over-temperature condition Open-drain fault flag output 5 OUT O Output switch www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Function 2/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Absolute Maximum Ratings (Ta= 25°C) Parameter Symbol Rating Unit -0.3 to +6.0 V -0.3 to +6.0 V /OC Voltage V IN V EN , V /EN V /OC -0.3 to +6.0 V /OC Sink Current I /OC 5 mA OUT Voltage V OUT -0.3 to V IN + 0.3 V Storage Temperature Tstg -55 to +150 °C IN Supply Voltage EN(/EN) Input Voltage Power Dissipation Pd 0.67 (Note 1) W (Note 1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1°C above 25°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Rating Min Typ Max Unit IN Operating Voltage V IN 2.7 5.0 5.5 V Operating Temperature Topr -40 - +85 °C Electrical Characteristics BD2226G (V IN = 5V, Ta= 25°C, unless otherwise specified.) DC Characteristics Parameter Symbol Limit Min Typ Max Unit Conditions Operating Current I DD - 110 160 μA Standby Current I STB - 0.01 5 μA V ENH 2.0 - - V V EN = 5V V OUT = Open V EN = 0V V OUT = Open High Input V ENL - - 0.8 V Low Input EN Input Leakage I EN -1 +0.01 +1 μA V EN = 0V or 5V ON-Resistance R ON - 150 200 mΩ I OUT = 250mA Over-Current Threshold I TH 750 1000 1350 mA EN Input Voltage Short Circuit Output Current /OC Output Low Voltage UVLO Threshold I SC 500 - - mA V /OC - - 0.4 V I /OC = 0.5mA V OUT = 0V, RMS V TUVH 2.1 2.3 2.5 V V IN Increasing V TUVL 2.0 2.2 2.4 V V IN Decreasing AC Characteristics Parameter Symbol Limit Min Typ Max Unit Conditions Output Rise Time t ON1 0.2 1 6 ms R L = 20Ω Output Turn ON Time t ON2 0.3 1.5 10 ms R L = 20Ω Output Fall Time t OFF1 0.1 1 20 μs R L = 20Ω Output Turn OFF Time t OFF2 0.3 3 40 μs R L = 20Ω /OC Delay Time t /OC 10 15 20 ms www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Electrical Characteristics - continued BD2227G (V IN = 5V, Ta= 25°C, unless otherwise specified.) DC Characteristics Parameter Symbol Limit Min Typ Max Unit Conditions Operating Current I DD - 110 160 μA Standby Current I STB - 0.01 5 μA V /ENH 2.0 - - V V /EN = 0V V OUT = Open V /EN = 5V V OUT = Open High Input V /ENL - - 0.8 V Low Input /EN Input Leakage I /EN -1 +0.01 +1 μA V /EN = 0V or 5V ON-Resistance R ON - 150 200 mΩ I OUT = 250mA Over-Current Threshold I TH 750 1000 1350 mA Short Circuit Output Current I SC 500 - - mA V /OC - - 0.4 V I /OC = 0.5mA V TUVH 2.1 2.3 2.5 V V IN Increasing V TUVL 2.0 2.2 2.4 V V IN Decreasing /EN Input Voltage /OC Output Low Voltage UVLO Threshold V OUT = 0V, RMS AC Characteristics Parameter Symbol Limit Min Typ Max Unit Conditions Output Rise Time t ON1 0.2 1 6 ms R L = 20Ω Output Turn ON Time t ON2 0.3 1.5 10 ms R L = 20Ω Output Fall Time t OFF1 0.1 1 20 μs R L = 20Ω Output Turn OFF Time t OFF2 0.3 3 40 μs R L = 20Ω /OC Delay Time t /OC 10 15 20 ms www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Measurement Circuit VIN VIN A A IN OUT OUT IN 1µF 1µF RL GND VEN(/EN) GND EN(/EN) A. VEN(/EN) /OC Operating Current B. EN(/EN) /OC EN,/EN Input Voltage, Output Rise / Fall Time VIN VIN 10kΩ A A IOC IN OUT IN 1µF VEN(/EN) C. 1µF IOUT GND EN(/EN) OUT GND VEN(/EN) /OC ON-Resistance, Over-Current Detection EN(/EN) D. /OC /OC Output Low Voltage Figure 1. Measurement Circuit Timing Diagram VEN VENL VENH tON2 90% 10% tOFF1 90% 10% 10% tON1 Figure 2. Output Rise / Fall Time (BD2226G) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 tOFF2 90% VOUT 10% tON1 V/ENH V/ENL tON2 tOFF2 90% VOUT V/EN tOFF1 Figure 3. Output Rise / Fall Time (BD2227G) 5/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Typical Performance Curves 140 OperatingCurrent: Current:IDD IDD[µA] [µA] Operating Operating Current: IDD [µA] OPERATING IDD[μA] OperatingCURRENT Current: IDD: [µA] Ta=25°C VIN=5.0V 120 100 80 60 40 20 0 -50 Supply Voltage: VIN [V] 1.0 Standby CURRENT Current: ISTB: ID[µA] STANDBY D[μA] STB [μA] STANDBY CURRENT : I [µA] Standby Current: ISTB VIN=5.0V Ta=25°C 0.8 0.6 0.4 0.2 0.0 2 3 4 5 SupplyVOLTAGE Voltage: VIN SUPPLY : V[V] IN [V] 0.8 0.6 0.4 0.2 0.0 6 -50 Figure 6. Standby Current vs Supply Voltage (EN, /EN Disable) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 100 Figure 5. Operating Current vs Ambient Temperature (EN, /EN Enable) Figure 4. Operating Current vs Supply Voltage (EN, /EN Enable) 1.0 0 50 AMBIENT Ta[℃] AmbientTEMPERATURE Temperature: Ta: [°C] 0 50 AMBIENT TEMPERATURE Ambient Temperature: Ta: Ta[℃] [°C] 100 Figure 7. Standby Current vs Ambient Temperature (EN, /EN Disable) 6/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Typical Performance Curves - continued 2.0 Ta=25°C 1.5 EnableINPUT Input Voltage: VEN,:VV/ENEN[V] [V] ENABLE CURRENT Enable INPUT Input Voltage: VEN, :VV/EN EN [V][V] ENABLE CURRENT 2.0 Low to High High to Low 1.0 0.5 0.0 VIN=5.0V Low to High 1.5 High to Low 1.0 0.5 0.0 2 3 4 5 SupplyVOLTAGE Voltage: VIN SUPPLY : V[V] IN [V] 6 -50 Figure 8. EN, /EN Input Voltage vs Supply Voltage Figure 9. EN, /EN Input Voltage vs Ambient Temperature 200 Ta=25°C [mΩ] ONON-Resistance: RESISTANCE :RRONON [mΩ] [mΩ] ONON-Resistance: RESISTANCE :RRONON [mΩ] 200 0 50 100 AmbientTEMPERATURE Temperature: Ta :[°C] AMBIENT Ta[℃] 150 100 50 0 VIN=5.0V 150 100 50 0 2 3 4 5 SupplyVOLTAGE Voltage: VIN SUPPLY : V[V] IN [V] 6 -50 Figure 10. ON-Resistance vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 Ambient Temperature: Ta :[°C] AMBIENT TEMPERATURE Ta[℃] Figure 11. ON-Resistance vs Ambient Temperature 7/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G 1.3 Over-CurrentTHRESHOLD Threshold: ITH: I[A]TH [A] OVERCURRENT Over-CurrentTHRESHOLD Threshold: ITH: I[A]TH [A] OVERCURRENT Typical Performance Curves - continued Ta=25°C 1.2 1.1 1.0 0.9 0.8 0.7 2 3 4 5 SupplyVOLTAGE Voltage: VIN IN [V] SUPPLY : V[V] 1.3 VIN=5.0V 1.2 1.1 1.0 0.9 0.8 0.7 6 -50 0 50 100 AmbientTEMPERATURE Temperature: Ta :[°C] AMBIENT Ta[℃] Figure 12. Over-Current Threshold vs Supply Voltage Figure 13. Over-Current Threshold vs Ambient Temperature 100 100 VIN=5.0V /OC Low Voltage: V/OC [mV] /OC Output OUTPUT LOW VOLTAGE : V /OC [mV] /OC Low Voltage: V/OC [mV] /OC Output OUTPUT LOW VOLTAGE : /OC V [mV] Ta=25°C 80 80 60 60 40 40 20 20 0 0 2 3 4 5 SupplyVOLTAGE Voltage: VIN: V[V] SUPPLY IN [V] 6 -50 Figure 14. /OC Output Low Voltage vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 Ambient Temperature: Ta:[°C] AMBIENT TEMPERATURE Ta[℃] Figure 15. /OC Output Low Voltage vs Ambient Temperature 8/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Typical Performance Curves - continued 1.0 UVLO Hysteresis VOLTAGE:V Voltage: VHYS [V] HSY[V] UVLO HYSTERESIS UVLO Threshold: V TUVH , VTUVL [V] UVLO THRESHOLD : VTUVH , VTUVL [V] 2.5 2.4 2.3 VTUVH 2.2 VTUVL 2.1 2.0 -50 0 50 AmbientTEMPERATURE Temperature: Ta :[°C] AMBIENT Ta[℃] 0.8 0.6 0.4 0.2 0.0 -50 100 Figure 16. UVLO Threshold Voltage vs Ambient Temperature 100 Figure 17. UVLO Hysteresis Voltage vs Ambient Temperature 5.0 5.0 VIN=5.0V Output Rise: Time: tON1 [ms] RISE TIME T ON1 [ms] Ta=25°C Output Rise: T Time: tON1 [ms] ON1 [ms] RISE TIME 0 50 AmbientTEMPERATURE Temperature: Ta :[°C] AMBIENT Ta[℃] 4.0 3.0 2.0 1.0 4.0 3.0 2.0 1.0 0.0 0.0 2 3 4 5 SupplyVOLTAGE Voltage: VIN SUPPLY : V[V] IN [V] -50 6 Figure 18. Output Rise Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 Ambient Temperature: Ta :[°C] AMBIENT TEMPERATURE Ta[℃] 100 Figure 19. Output Rise Time vs Ambient Temperature 9/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Typical Performance Curves - continued 5.0 Ta=25°C OutputON Turn ON :Time: ON2 [ms] TURN TIME T ON2t[ms] OutputON Turn ON: Time: tON2 [ms] TURN TIME T ON2 [ms] 5.0 4.0 3.0 2.0 1.0 0.0 VIN=5.0V 4.0 3.0 2.0 1.0 0.0 2 3 4 5 SupplyVOLTAGE Voltage: VIN SUPPLY : V[V] IN [V] 6 -50 Figure 20. Output Turn ON Time vs Supply Voltage Figure 21. Output Turn ON Time vs Ambient Temperature 5.0 5.0 VIN=5.0V Ta=25°C 4.0 Output Fall Time: tOFF1 FALL TIME : T OFF1 [μs][µs] Output Fall Time: tOFF1 FALL TIME : T OFF1 [μs][µs] 0 50 100 Ambient Temperature: Ta :[°C] AMBIENT TEMPERATURE Ta[℃] 3.0 2.0 1.0 0.0 4.0 3.0 2.0 1.0 0.0 2 3 4 5 SupplyVOLTAGE Voltage: VIN: V[V] SUPPLY IN [V] 6 -50 Figure 22. Output Fall Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 AmbientTEMPERATURE Temperature: Ta [°C] AMBIENT : Ta[℃] 100 Figure 23. Output Fall Time vs Ambient Temperature 10/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Typical Performance Curves - continued 6.0 Ta=25°C Output Turn OFF: Time: OFF2 [µs] TURN OFF TIME T OFF2t[μs] Output Turn OFF: Time: TURN OFF TIME T OFF2tOFF2 [μs] [µs] 6.0 5.0 4.0 3.0 2.0 1.0 0.0 5.0 VIN=5.0V 4.0 3.0 2.0 1.0 0.0 2 3 4 5 Supply VOLTAGE Voltage: VIN: V[V] IN [V] SUPPLY 6 -50 Figure 24. Output Turn OFF Time vs Supply Voltage Figure 25. Output Turn OFF Time vs Ambient Temperature 20 20 VIN=5.0V Ta=25°C 18 /OC Delay TIME Time: :t/OC /OC DDLAY T/OC[ms] [ms] /OCDDLAY Delay TIME Time: :t/OC /OC T/OC[ms] [ms] 0 50 100 AmbientTEMPERATURE Temperature: Ta :[°C] AMBIENT Ta[℃] 16 14 12 10 18 16 14 12 10 2 3 4 5 Supply VOLTAGE Voltage: VIN: V[V] SUPPLY IN [V] -50 6 100 Figure 27. /OC Delay Time vs Ambient Temperature Figure 26. /OC Delay Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 AmbientTEMPERATURE Temperature: Ta :[°C] AMBIENT Ta[℃] 11/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Typical Wave Forms (BD2226G) VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V RL=20Ω IOUT (0.5A/div.) VIN=5V IOUT (0.5A/div.) RL=20Ω TIME(1ms/div.) TIME(1μs/div.) Figure 28. Output Rise Characteristic Figure 29. Output Fall Characteristic VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) CL=220μF CL=100μF IOUT (0.2A/div.) CL=47μF IOUT (0.5A/div.) VIN=5V RL=20Ω VIN=5V TIME (1ms/div.) TIME (5ms/div.) Figure 30. Inrush Current Response Figure 31. Over-Current Response Ramped Load www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Typical Wave Forms - continued VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) IOUT (0.5A/div.) VIN=5V VIN=5V TIME (5ms/div.) TIME (100ms/div.) Figure 32. Over-Current Response Enable to Short Circuit Figure 33. Over-Current Response Enable to Short Circuit VOUT (5V/div.) VIN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VIN=5V IOUT (0.2A/div.) IOUT (1A/div.) RL=20Ω TIME (5ms/div.) TIME (10ms/div.) Figure 34. Over-Current Response 1ΩLoad Connected at EN Figure 35. UVLO Response when Increasing VIN www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Typical Wave Forms - continued VIN (5V/div.) VOUT (5V/div.) IOUT (0.2A/div.) RL=20Ω TIME (10ms/div.) Figure 36. UVLO Response when Decreasing VIN www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Typical Application Circuit 10kΩ 10kΩ~ to 100kΩ 100kΩ CIN Controller 5V(Typ) 5V (Typ.) IN VIN OUT VOUT GND EN(/EN) Ferrite Beads CL + - /OC Application Information When excessive current flows due to output short circuit or so, ringing occurs because of inductance between power source line and IC. This may cause bad effects on IC operations. In order to avoid this case, connect a bypass capacitor across IN terminal and GND terminal of IC. 1μF or higher is recommended. In order to decrease voltage fluctuations from power source line to IC, connect a lower ESR capacitor in parallel with C IN . 10uF to 100uF or higher is recommended. Pull up /OC output by a 10kΩ to 100kΩ resistance. Set up value which satisfies the application of either C L . This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including AC/DC characteristics as well as dispersion of the IC. Functional Description 1. Switch Operation IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal is also used as power source input to internal control circuit. When the switch is turned on from EN, /EN control input, the switch is bidirectional. IN terminal and OUT terminal are connected by a 150mΩ (Typ) switch. Therefore, when the potential of OUT terminal is higher than that of IN terminal, current flows from OUT terminal to IN terminal. 2. Thermal Shutdown Circuit (TSD) If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature was beyond 135°C(Typ) during the condition of over-current detection, thermal shutdown circuit operates and turns power switch off and outputs a fault flag (/OC). Then, when the junction temperature decreases lower than 115°C(Typ), power switch is turned on and fault flag (/OC) is cancelled. Unless the increase of the chip’s temperature is removed or the output of power switch is turned off, this operation repeats. Note: The thermal shutdown circuit operates when the switch is on (EN, /EN signal is active). 3. Over-Current Detection (OCD) The over-current detection circuit limits current (I SC ) and outputs a fault flag (/OC) when current flowing in each MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection circuit works when the switch is on (EN, /EN signal is active). (1) When the switch is turned on while the output is in short circuit status When the switch is turned on while the output is in short circuit status, the switch goes into current limit status immediately. (2) When the output short circuits while the switch is on When the output short circuits or high-current load is connected while the switch is on, very large current flows until the over-current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out. (3) When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under-Voltage Lockout (UVLO) UVLO circuit prevents the switch from turning on until the V IN exceeds 2.3V(Typ). If the V IN drops below 2.2V(Typ) while the switch is still on, then UVLO will shut off the power switch. UVLO has hysteresis of a 100mV(Typ). Note: Under-voltage lockout circuit works when the switch is on (EN, /EN signal is active). 5. Fault Flag (/OC) Output Fault flag output is an N-MOS open drain output. At detection of over-current and/or thermal shutdown, the output level is low. Over-current detection has delay filter. This delay filter prevents current detection flags from being sent during instantaneous events such as inrush current at switch on or during hot plug. . If fault flag output is unused, /OC pin should be connected to open or ground line. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Over Current Detection Over Current Load Removed VOUT ITH ISC IOUT t/OC V/OC Figure 37. Over-Current Detection VEN Output Short Circuit VOUT Thermal Shutdown IOUT V/OC /OC Delay Time Figure 38. Over-Current Detection, Thermal Shutdown Timing (BD2226G) V/EN Output Short Circuit VOUT Thermal Shutdown IOUT V/OC /OC Delay Time Figure 39. Over-Current Detection, Thermal Shutdown Timing (BD2227G) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Power Dissipation (SSOP5 package) 700 Power Dissipation : Pd [mW] 600 500 400 300 200 100 0 0 25 50 75 85 100 Ambient Temperature : Ta [℃] 125 150 70mm x 70mm x 1.6mm Glass Epoxy Board Figure 40. Power Dissipation Curve (Pd-Ta Curve) I/O Equivalence Circuit Symbol Pin No. EN (/EN) 3 OUT 5 Equivalence Circuit EN (/EN) OUT /OC /OC www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4 17/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. In rush Current 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Operational Notes - continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin A N P+ N P N P+ N Parasitic Elements N P+ GND E N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B Parasitic Elements GND GND Figure 41. Example of monolithic IC structure N Region close-by GND 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Ordering Information B D 2 2 2 6 Part Number B D G - Package G: SSOP5 2 2 2 7 Part Number G Packaging and forming specification TR: Embossed tape and reel - Package G: SSOP5 TR TR Packaging and forming specification TR: Embossed tape and reel Marking Diagram SSOP5 (TOP VIEW) Part Number Marking LOT Number Part Number Part Number Marking BD2226G FY BD2227G FZ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 21/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 BD2226G Datasheet BD2227G Revision History Date Revision Changes 25.Dec.2012 001 New Release 21.Aug.2014 002 Applied the ROHM Standard Style and improved understandability. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/22 TSZ02201-0E3E0H300210-1-2 21.Aug.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD2226G - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD2226G SSOP5 3000 3000 Taping inquiry Yes