BCD AA4003GTR-E1 2w stereo audio power amplifier with shutdown Datasheet

Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
General Description
Features
The AA4003 is a Class AB stereo Audio Power Amplifier which can deliver 2.0W into 4Ω speakers with limitation of THD+N less than 1%. The chip is designed
specially for Portable DVD player, Portable Media
Player, LCD monitor and Digital Photo Frame applications.
·
AA4003 is available in package of SOIC-16 and
TSSOP-20 (EDP).
·
·
·
·
·
·
AA4003
Output Power,
BTL: 2.0W/CH (4Ω, THD+N≤1%)
SE: 160mW/CH (16Ω, THD+N≤1%)
Supply Voltage Range: 2.7V to 5.5V
External Feedback Loop for Flexible Gain Set-up
Low Power Consumption at Shutdown Mode
0.7μA Typical
SE, BTL Mode Switchable
Optimized Click/POP Noise Suppression
Thermal Shutdown Protection
Applications
·
·
·
·
Portable DVD Player
Portable Media Player
LCD Monitor
Digital Photo Frame
TSSOP-20 (EDP)
SOIC-16
Figure 1. Packages Type of AA4003
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
1
Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Pin Configuration
G Package
(TSSOP-20 (EDP))
SHUTDOWN
1
20
HP-SENSE
GND
2
19
GND
OUTL+
3
18
OUTR+
VDD
4
17
VDD
OUTL-
5
16
OUTR-
LIN-
6
15
RIN-
GND
7
14
BYPASS
LIN+
8
13
RIN+
PGND
9
12
PGND
PGND
10
11
PGND
M Package
(SOIC-16)
SHUTDOWN
1
16
HP-SENSE
GND
2
15
GND
OUTL+
3
14
OUTR+
VDD
4
13
VDD
OUTL-
5
12
OUTR-
LIN-
6
11
RIN-
GND
7
10
BYPASS
LIN+
8
9
RIN+
Figure 2. Pin Configurations of AA4003 (Top View)
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Pin Description
Pin Number
Pin Name
Function
G Package
M Package
1
1
SHUTDOWN
2, 7, 19
2, 7, 15
GND
3
3
OUTL+
4, 17
4, 13
VDD
5
5
OUTL-
Left channel negative output
6
6
LIN-
Left channel negative input
8
8
LIN+
Left channel positive input
PGND
Power ground, used for thermal release
Right channel positive input
9, 10, 11, 12
Shutdown mode enable pin, active High
Signal ground
Left channel positive output
Power supply pin
13
9
RIN+
14
10
BYPASS
15
11
RIN-
Right channel negative input
16
12
OUTR-
Right channel negative output
18
14
OUTR+
Right channel positive output
20
16
HP-SENSE
Internal reference voltage pin, connect a 1.0μF capacitor to GND
SE, BTL Mode switch pin,
L – BTL Mode
H – SE Mode
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Ordering Information
AA4003
-
Circuit Type
E1: Lead Free
Package
TR: Tape and Reel
Blank: Tube
G: TSSOP-20 (EDP)
M: SOIC-16
Package
Temperature Range
TSSOP-20
(EDP)
-40 to 85 ℃
SOIC-16
-40 to 85 ℃
Part Number
Marking ID
Packing Type
AA4003G-E1
AA4003G-E1
Tube
AA4003GTR-E1
AA4003G-E1
Tape & Reel
AA4003M-E1
AA4003M-E1
Tube
AA4003MTR-E1
AA4003M-E1
Tape & Reel
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant.
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Value
Unit
Supply Voltage
VDD
6
V
Input Voltage
VIN
-0.3 to VDD + 0.3
V
Power Dissipation
PD
Internally limited
M Package
90
G Package
50 (Note 2)
oC/W
RθJA
Package Thermal Resistance
Operating Junction Temperature
TJ
150
TSTG
-65 to 150
oC
TLEAD
260
oC
ESD (Human Body Model)
2000
V
ESD (Machine Model)
300
V
Storage Temperature Range
Lead Temperature 1.6mm from Case for 10 Seconds
oC
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operation is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability.
Note 2: Chip is soldered to 200mm2 copper (top side solder mask) of 1oz. on PCB with 8 x 0.5mm vias..
Recommended Operating Conditions
Parameter
Supply Voltage
Operating Ambient Temperature
Symbol
Min
Max
Unit
VDD
2.7
5.5
V
TA
-40
85
oC
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Electrical Characteristics
(VDD=5V, TA=25oC, CI=1μF, COUT=220μF and RI=RF=20kΩ unless otherwise specified. For SE Mode, HP_SENSE=5V,
for BTL Mode, HP_SENSE=0V. )
Parameter
Quiescent Current
Shutdown Current
HP_SENSE LOGIC
SHUTDOWN LOGIC
Symbol
IDD
ISD
Conditions
Min
Typ
Max
SE Mode, VIN=0, IO=0
3
10
BTL Mode, VIN=0, IO=0
6
20
0.7
2.0
mA
VSHUTDOWN=5V
VIH
4
μA
V
VIL
0.8
VIH
Unit
3
V
V
VIL
0.8
V
Thermal Shutdown Temperature
170
oC
Hysteresis Temperature Window
25
oC
SE Mode
Output Power
Total Harmonic Distortion + Noise
Signal to Noise Ratio
Crosstalk
Power Supply Rejection Ratio
PO
THD+N=1%, RL=32Ω
80
THD+N=10%, RL=32Ω
110
THD+N=1%, RL=16Ω
160
THD+N=10%, RL=16Ω
220
mW
THD+N PO=75mW, RL=32Ω,
0.2
%
PO=75mW, RL=32Ω,
90
dB
XTALK
PO=75mW, RL=32Ω, f=1kHz
-80
dB
PSRR
Cb=1μF, f=1KHz,
VRIPPLE=0.2VRMS, RL=16Ω
60
dB
SNR
BTL Mode
Output Offset Voltage
Output Power
Total Harmonic Distortion + Noise
Signal to Noise Ratio
VOS
PO
±5
VIN=0V, No load
THD+N=1%, RL=4Ω
2
THD+N=10%, RL=4Ω
2.5
THD+N=1%, RL=8Ω
1.1
THD+N=10%, RL=8Ω
1.5
± 50
mV
W
THD+N PO=1W, RL=4Ω,
0.1
%
PO=1W, RL=8Ω,
95
dB
SNR
Crosstalk
XTALK
PO=1W, RL=8Ω, f=1kHz
-80
dB
Power Supply Rejection Ratio
PSRR
Cb=1μF, f=1KHz,
VRIPPLE=0.2VRMS, RL=8Ω
67
dB
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Typical Performance Characteristics
Figure 4. Quiescent Current vs. Ambient Temperature
Figure 3. Quiescent Current vs. Supply Voltage
10
10
1
THD+N (%)
THD+N (%)
1
VDD=5.0V, SE Mode
f=1kHz, LPF=30kHz
RL=16Ω
RL=32Ω
0.1
VDD=5.0V, BTL Mode
f=1kHz
LPF=30kHz
RL=4Ω
RL=8Ω
0.1
0.01
1E-3
10m
100m
0.01
10m
300m
100m
1
3
Output Power (W)
Output Power (W)
Figure 5. THD+N vs. Output Power
@ SE Mode
Figure 6. THD+N vs. Output Power
@ BTL Mode
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Typical Performance Characteristics
10
10
VDD=5.0V, BTL Mode
PO=1.5W, RL=4Ω
LPF=80kHz
VDD=5.0V, SE Mode
COUT=1000μF, PO=150mW
RL=16Ω, LPF=80kHz
1
THD+N (%)
THD+N (%)
1
0.1
0.1
0.01
20
0.01
20
100
1k
10k
20k
100
10k
20k
Figure 8. THD+N vs. Output Power
@ BTL Mode
Figure 7. THD+N vs. Output Power
@ SE Mode
10
10
BTL Mode, VDD=5.0V
PO=1W, RL=8Ω
LPF=80kHz
SE Mode, VDD=5.0V
PO=75mW, RL=32Ω
LPF=80kHz, COUT=1000μF
1
THD+N (%)
THD+N (%)
1
0.1
0.1
0.01
20
1k
Frequency (Hz)
Frequency (Hz)
100
1k
10k
0.01
20
20k
Frequency (Hz)
100
1k
10k
20k
Frequency (Hz)
Figure 9. THD+N vs. Frequency
@ SE Mode
Figure 10. THD+N vs. Frequency
@ BTL Mode
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Typical Performance Characteristics (Continued)
800
2.5
VDD=5.0V, SE Mode
f=1kHz, LPF=30kHz
THD+N=10%
THD+N=1%
2.0
Output Power (W)
Output Power (mW)
600
VDD=5.0V, BTL Mode
f=1kHz, LPF=30kHz
THD+N=10%
THD+N=1%
400
1.5
1.0
200
0.5
0
10
20
30
40
50
60
0.0
0.0
70
5.0
10.0
Figure 11. Output Power vs. Resistor Load
@ SE Mode
20.0
25.0
30.0
35.0
Figure 12. Output Power vs. Resistor Load
@ BTL Mode
3.0
250
SE Mode, RL=16Ω
f=1kHz, LPF=30kHz
THD+N=10%
THD+N=1%
BTL Mode, RL=4Ω
f=1kHz, LPF=30kHz
THD+N=10%
THD+N=1%
2.5
Output Power (mW)
200
Output Power (mW)
15.0
Resistor Load (Ω)
Resistor Load (ohm)
150
100
2.0
1.5
1.0
50
0.5
0
2.5
3.0
3.5
4.0
4.5
0.0
2.5
5.0
3.0
3.5
4.0
4.5
5.0
Supply Voltage (V)
Supply Voltage (V)
Figure 13. Output Power vs. Supply Voltage
@ SE Mode
Figure 14. Output Power vs. Supply Voltage
@ BTL Mode
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Typical Performance Characteristics (Continued)
75
70
70
60
65
PSRR (dB)
PSRR (dB)
50
40
30
VDD=5.0V, SE Mode
RL=32Ω,Cb=1.0μF
VRIPPLE=0.2Vrms
20
60
55
50
VDD=5.0V, BTL Mode
RL=8Ω, Cb=1.0μF
VRIPPLE=0.2Vrms
45
40
10
10
100
1k
10k
20k
10
100
1k
10k
20k
Frequency (Hz)
Frequency (Hz)
Figure 16. PSRR vs. Frequency
@ BTL Mode
Figure 15. PSRR vs. Frequency
@ SE Mode
4
1000
-80
0
Gain
-120
-4
Gain (dB)
Start-up Time (ms)
800
600
400
-160
-8
Phase
-200
-12
-240
200
-16
0
0.2
0.4
0.6
0.8
-20
10
1.0
Bypass Capacitor (μF)
SE Mode, VDD=5.0V
RF=RI=20k, COUT=1000μF
100
1k
10k
-280
100k
1M
10M
Frequency (Hz)
Figure 17. Start-up Time vs. Bypass Capacitor
Figure 18. Closed Loop Frequency Response
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
10
Phase (deg)
VDD=5.0V
Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
Application Information
COUT
220μF
+
_
SE/BTL Mode, HP_SENSE Pin
20kΩ
+
Left Out20kΩ
20kΩ
AMP1L
+
R1
100kΩ
RPD
1.5kΩ
Left Out+
R2
100kΩ
HP_SENSE= Low Level
Left Out+
R2
R1
100kΩ 100kΩ
HP_SENSE= High Level
AMP2L
VDD
Headphone
Speak
AMP2L
Main
Speak
_
RPD
1.5kΩ
Main
Speak
_
VDD
+
20kΩ
AMP1L
COUT
220μF
+
_
Left Out-
+
The AA4003 can operate under 2 types of output
configuration, BTL (Bridged-Tied-Load) mode and SE
(Single-Ended) mode, determined by HP_SENSE pin's
logic level. (Here is the discussion about left channel
only, it equally applies to right channel.)
AA4003
SLEEVE
HEADPHONE
JACK
Figure 19. Output Configuration for Left Channel
in BTL Mode
When HP_SENSE pin is held low which sets the chip
in BTL mode, the AMP2L unit is turned on. AMP2L
has fixed unity gain internally, AC signal at OUT+ is
180 degree phase shifted from OUT-. Because the DC
component (Output Bias voltage, approx 1/2 VDD)
between OUT+ and OUT- is canceled, there is no
necessity to use DC block capacitors for main speak. In
BTL mode, output voltage swing across main speaker
is about 2 times that in SE mode, so there is 4 times
output power compared to SE mode with same load
and input. (see Figure 19)
Figure 20. Output Configuration for Left Channel
in SE Mode
When headphone plug is not inserted, the voltage of
HP_SENSE pin is determined by voltage divider
formed by R1 and RPD. For given resistor's value in
Figure 19, R1=100kΩ, RPD=1.5kΩ, DC voltage at
HP_SENSE is about 74mV. AC signal equals output
amplitude of OUT- through COUT, so signal at
HP_SENSE node is 74mV DC plus AC signal. The
maximum peak-to-peak voltage at OUT- is no greater
than VDD (supply voltage 5.0V), so the positive
maximum voltage of HP_SENSE node will be no
greater than 2.5V+75mV≈2.575V, which is less than
HP_SENSE input high level minimum value (4.0V).
That means the chip is in BTL mode and there is no
risk of operation mode switch between SE and BTL.
When headphone plug is inserted, as the RPD is
disconnected from R1, the voltage of HP_SENSE pin
is pulled up by R1 to VDD and sets the chip in SE
mode.
HP_SENSE pin can also be connected to MCU I/O
port to control the mode switch through MCU.
If applying high level to HP_SENSE pin which sets the
chip in SE mode, the AMP2L unit is in high impedance
state. There is no current loop between OUT+ and
OUT-, the main speak is naturally disabled without any
hardware change. The output audio signal rides on bias
voltage at OUT- (Output Bias voltage, approx 1/2
VDD) , so it has to use a capacitor COUT to block DC
bias and couple AC signal to headphone speak. (See
Figure 20)
It is necessary to note that AA4003 still can drive
headphone even in BTL mode because OUT- is always
active whatever the chip is in SE or BTL mode.
CIN, COUT, Cb and CS (Power Supply) Selection
For input stages of AA4003, input capacitors CI is used
to accommodate different DC level between input
source and AA4003 bias voltage (about 2.31V). Input
capacitors CI and input resistors RI form a first order
High Pass Filter, which determines the lower corner
frequency according to the classic equation below,
It is recommended to connect HP_SENSE to the
headphone jack switch pin illustrated in Figure 19.
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
Application Information (Continued)
Example:
VDD=5V, RL=8Ω, BTL configuration, Desired output
power PO=1.0W (each channel), THD+N ≤ 1%.
Input signal, VIN=1.0VRMS from D-A converter.
1
.............................................(1)
2πRI ∗ C I
f CIL =
Step 1,
To check if the chip can deliver 1W to 8Ω load with the
limitation of THD+N ≤ 1%, VDD=5V. From Figure 6,
Figure 12, AA4003 can deliver 1W to 8Ω load each
channel.
Similarly, for output stage in SE mode, output
capacitor (COUT), and headphone load also form a first
order High Pass Filters, and its cut-off frequency is
determined by equation 2.
f COL =
1
......................................(2)
2πRHP ∗ COUT
Step 2,
If yes, to calculate output voltage,
VOUT = P O ∗R L = 1* 8 = 2.83VRMS
The purpose of bypass capacitor (Cb) is to filter
internal noise, reduce harmonic distortion, and
improve power supply rejection ratio performance.
Tantalum or ceramic capacitor with low ESR is
recommended, and it should be placed as close as
possible to the chip in PCB layout. The chip will not
work until internal DC bias is set up completely. So the
size of Cb will also affect the chip start up time, which
is approx linearly proportional to the value of bypass
capacitor. For AA4003, here are various start-up times
for several typical capacitor values. (see Figure 17)
Cb (μF)
Start up Time (ms)
0.33
340
0.47
420
1.0
970
So pass-band gain, AV=VOUT/VIN=2.83x.
Step 3,
Assuming input resistor is 20kΩ, the feedback
resistor=20kΩ*1.415=28.3kΩ.. Select the closest
standard value 28kΩ.
Shutdown
AA4003 has a shutdown feature to reduce power
consumption. If apply high level to shutdown pin,
output amplifiers will be turned off, bias circuit is also
disabled, the maximum current drawn from VDD is less
than 2.0μA. A logic low level will enable the device.
Optimizing CLICK/POP Noise
The AA4003 includes optimized circuits to suppress
CLICK/POP noise during power up/power down
transition.
For AA4003 power supply, it is better to use an
individual power source generated from voltage
regulator split from video, digital circuit units in
system. The power supply bypass capacitors, CS, is
recommended to use one low ESR electrolytic
capacitor between 4.7μF to 10μF with a parallel 0.1μF
ceramic capacitor which is located close to the chip.
In BTL mode the AA4003 can effectively reduce most
common mode signal including CLICK/POP noise.
In SE mode, optimized ramp for rise/fall edge of BIAS
can significantly reduce click/pop noise due to charge
and/or
discharge
output
capacitor
(COUT).
Furthermore, increasing bypass capacitor value (Cb)
can slower ramp of charging bypass capacitor, prolong
start-up time, mask most of transient noises before bias
voltage is set up completely. It is recommended to use
1.0μF capacitor with lower ESR.
Setup Proper Gain, Design Example
The closed loop gain of AA4003 is determined by the
ratio of feedback resistor (RF) to input resistor (RI).
AV =
AA4003
RF ........................................................(3)
RI
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
Application Information (Continued)
πVP
per channel, total power dissipation PDTOTAL=2*
PDBTLMAX=2.53W. According to formula 6, maximum
ambient temperature is,
.......................................................(4)
o
TA = TJMAX − θ JA ∗ PDBTLMAX =150-50*2.53=23.5 C
4VDD
here VP is output peak voltage across the load.
That is to say, if user wants AA4003 to delivery 2W
power per channel to 4Ω load at VDD=5.0V, BTL
mode, ambient temperature has to hold lower than
23.5oC. When junction temperature exceeds about
170oC, OTSD feature will be enabled, and shutdown
the device to limit total power dissipation.
Thermal dissipation becomes major concern when
delivering more output power especially in BTL mode.
The maximum power dissipation can be calculated by
following equation.
PDMAX =
Here
2VDD
2 × 52
=
= 1.266W
π 2 RL 3.14 2 × 4
2
PDBTLMAX =
Power Dissipation, Efficiency and Thermal
Design Consideration
For Class AB amplifiers, Formula 4 is the basic
equation of efficiency worked in BTL configuration,
η=
AA4003
TJMAX − TA ......................................(5)
There is an exposed thermal pad on bottom of the chip
to provide the direct thermal path from die to heat sink.
It is recommended to use copper on the surface of
Printed Circuit Board as heat sink. To dig some matrix
regular holes under chip, remove mask of this area
copper, and make sure to keep them contact well when
soldering on PCB are also recommended. (See Figure
21)
θ JA
TJMAX
is
maximum
operating
junction
temperature,
TA is ambient temperature, θ JA is
thermal resistance from junction to ambient, which is
50oC/W for TSSOP-20 (EDP), given in datasheet.
150oC,
Assuming TA is 25oC, the maximum power dissipation
PDMAX is about 2.5W according to formula 6.
Recommended PCB Layout for AA4003
Using wide traces for power supply to reduce power
losses caused by parasitic resistance in all outputs is
useful to help releasing heat away from the chip. It is
recommended to place bypass capacitor, power supply
bypass capacitors as close as possible to the chip.
Figure 21 and Figure 22 show the recommended layout
for double layer PCB.
There is an other formula about power dissipation
which is determined by supply voltage and load
resistance.
2
PDBTLMAX
2V
= 2DD ......................................(6)
π RL
If power dissipation calculated in an application is
larger than that package permitted, there will be a need
to assemble an additional heat sink, or keep ambient
temperature around the chip low, or increase load
resistance, or decrease power supply voltage.
Here is an example. Assuming VDD=5.0V, RL=4Ω,
stereo in BTL mode,
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Application Information (Continued)
Figure 21. Copper and Holes under Part
Figure 22. Top Route and Silk Screens
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Typical Application
RF
20kΩ
CS
10μF
+
VDD
4,13
CI
1uF
+
Left IN
RI
6
LIN-
20kΩ
8
LIN+
COUT RPD
220μF 1.5kΩ
+
_
+
OUTL-
5
OUTL+
3
20kΩ
VDD
16
100kΩ
20kΩ
AMP1L
HP-SENSE
100kΩ
_
To control pin
+
To HP-Sense circuit
AMP2L
CI
1μF
RI
+
Right IN
20kΩ
Cb
1.0μF
10
BYPASS
11
RIN-
9
RIN+
COUT
220μF
+
_
OUTR-
+
12
20kΩ
+
20kΩ
AMP1R
SLEEVE
RPD
1.5kΩ
HEADPHONE
JACK
_
+
1
SHUTDOWN
OUTR+
14
AMP2R
2,7,15
RF
20kΩ
Figure 23. Typical Application Circuit of AA4003 (M Package)
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
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Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Mechanical Dimensions
TSSOP-20(EDP)
Unit: mm(inch)
6.400(0.252)
6.600(0.260)
4.100(0.161)
4.300(0.169)
2.900(0.114)
3.100(0.122)
6.200(0.244)
6.600(0.260)
EXPOSED PAD
4.300(0.169)
4.500(0.177)
#1 PIN
INDEX0.750(0.030)Dp0.000(0.000)
0.850(0.033) 0.100(0.004)
0.100(0.004)
0.190(0.007)
0.650(0.026)TYP
0.900(0.035)
1.050(0.041)
0.340(0.013)
0.540(0.021)
4-10°
14°
TOP & BOTTOM
0.200(0.008)MIN
R0.090(0.004)MIN
1.200(0.047)
MAX
0.050(0.002) R0.090(0.004)MIN
0.150(0.006)
0.250(0.010)TYP
0°
8°
0.200(0.008)
0.280(0.011)
0.450(0.018)
0.750(0.030)
Oct. 2007 Rev. 1. 1
1.000(0.039)
REF
BCD Semiconductor Manufacturing Limited
16
Data Sheet
2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN
AA4003
Mechanical Dimensions (Continued)
SOIC-16
1.000(0.039)
1.300(0.051)
Unit: mm(inch)
1.650(0.065)
0.700(0.028)
7°
0.406(0.016)
φ 2.000(0.079)
Depth 0.060(0.002)
0.100(0.004)
7°
B
A
20:1
0.250(0.010)
0.500(0.020)
10.000(0.394)
1°
5°
R0.200(0.008)
R0.200(0.008)
0.150(0.006)
0.250(0.010)
0.203(0.008)
6.040(0.238)
3.940(0.155)
8°
9.5
°
0.200(0.008)
S φ1.000(0.039)
8°
8°
C-C
50:1
B
20:1
C
3°
7°
0.250(0.010)
0.200(0.008)MIN
Depth 0.200(0.008)
A
0.400(0.016)×45°
1.000(0.039)
1.270(0.050)
0.600(0.024)
C
Oct. 2007 Rev. 1. 1
BCD Semiconductor Manufacturing Limited
17
BCD Semiconductor Manufacturing Limited
http://www.bcdsemi.com
IMPORTANT NOTICE
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