CAT6243 1 Amp Adjustable CMOS LDO Voltage Regulator Description The CAT6243 is a low dropout CMOS voltage regulator providing up to 1000 mA of output current with fast response to load current and line voltage changes. CAT6243 offers a user adjustable output voltage from 0.8 V to 5.0 V and its low quiescent current make CAT6243 ideal for energy conscious designs. CAT6243 is available in a DPAK−5 4 and 5 lead packages and in a space saving 3 mm x 3 mm WDFN−6 package with a power pad for heat sinking to the PCB. http://onsemi.com WDFN−6 3 x 3 mm CASE 511AP DPAK−5 LEAD 3 CROP CASE 175AA Features Guaranteed 1000 mA Continuous Output Current VOUT: 0.8 V to 5.0 V Dropout Voltage of 350 mV Typical at 1000 mA ±2.0% Output Voltage Accuracy Over Temperature No−load Ground Current of 70 mA Typical Full−load Ground Current of 140 mA Typical “Zero” Current Shutdown Mode Under Voltage Lockout Stable with Ceramic Output Capacitors Current Limit and Thermal Protection 4 and 5 Lead DPAK−5 and 3 mm x 3 mm WDFN−6 Power Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant DPAK−5 TO−252 CASE 369AE PIN CONNECTIONS (Top Views) DSP Core and I/O Voltages FPGAs, ASICs PDAs, Mobile Phones, GPS Camcorders and Cameras Hard Disk Drives VIN GND ADJ BYP VOUT GND (Tab) Typical Applications GND (Tab) 1 5 ADJ VOUT GND VIN EN • • • • • 1 EN 1 5 ADJ VOUT GND VIN EN • • • • • • • • • • • • ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 15 of this data sheet. MARKING DIAGRAMS 6243 AXXX YWW G 1 6243 A XXX Y WW G = Specific Device Code = Assembly Location = Last Three Digits of = Assembly Lot Number = Production Year (Last Digit) = Production Week (Two Digits) = Pb−Free Package x6243yG ALYWW *Pb−Free indicator, “G” or microdot “G”, may or may not be present. © Semiconductor Components Industries, LLC, 2012 July, 2012 − Rev. 5 1 x6243yG ALYWW x 6243 y G A L Y WW = P (CAT) = Device Code = Output Voltage = W = Adjustable = Pb−Free Package = Assembly Location = Wafer Lot = Year = Work Week Publication Order Number: CAT6243/D CAT6243 VIN VIN VOUT VOUT ENABLE CIN 1 mF CAT6243 BYP CBYP (Optional) COUT 2.2 mF ADJ GND Figure 1. Application Schematic VOUT VIN ISENSE Thermal Shutdown + ADJ − + VREF − Enable Logic EN BYP 2.5 M GND Figure 2. Simplified Block Diagram Table 1. PIN FUNCTION DESCRIPTION Pin # WDFN−6 Pin # DPAK−5−4 Pin # DPAK−5−5 Pin Name 1 5 5 EN The Enable Input. An active HIGH input, turning ON the LDO. This input should be tied to VIN if the LDO is not intended to be shut off during normal operation. A pull−down 2.5 MW resistor maintains the circuit in the OFF state if the pin is left open. 2, PAD 3, TAB 3, TAB GND Power Supply Ground; Device Substrate. The center pad is internally connected to Ground and as such can cause short circuits to signal traces running beneath the IC. This pad is intended for heat sinking the IC to the PCB and is typically connected to the PCB ground plane. 3 NC NC BYP Bypass input. Placing a capacitor of 100 pF to 470 pF between BYP and ground reduces noise on VOUT. This capacitor is optional and it increases the turn−on time. 4 2 2 VOUT Regulated Output Voltage. A protection block eliminates any current flow from output to input if VOUT > VIN. 5 1 1 ADJ Output Voltage Adjust Input. This input ties to the common point of a resistor divider which determines the regulator’s output voltage. See Applications section for details on selecting resistor values. 6 4 4 VIN Positive Power Supply Input. Supplies power for VOUT as well as the regulator’s internal circuitry. Description http://onsemi.com 2 CAT6243 Table 2. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN −0.3 to 6.0 V VOUT −0.3 to 6.0 V Enable Input Range EN −0.3 to 5.5 V or (VIN + 0.3), whichever is lower V Adjust Input Range ADJ −0.3 to 5.5 V V Bypass Input Range BYP −0.3 to 5.5 V or (VIN + 0.3), whichever is lower V Power Dissipation PD Internally Limited mW TJ(max) 150 °C TSTG −65 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2 kV ESD Capability, Machine Model (Note 2) ESDMM 200 V TSLD 260 °C Input Voltage Range (Note 1) Output Voltage Range Maximum Junction Temperature Storage Temperature Range Lead Temperature Soldering Reflow (SMD Styles Only), Pb−Free Versions (Note 3) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating range. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78 3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D Table 3. THERMAL CHARACTERISTICS Rating Symbol Value RqJA RyJL 55 10 Thermal Characteristics, WDFN−6, 3 x 3 mm Thermal Resistance, Junction−to−Air: 1 in2/1 oz. copper (Note 4) Thermal Reference, Junction−to−Case (Note 4) Unit °C/W 4. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Table 4. OPERATING RANGES (Note 5) Symbol Min Max Unit Input Voltage CAT6243 (Note 6) VIN 1.8 5.5 V Output Current IOUT 0.1 1000 mA Output Voltage VOUT 0.8 5.0 V TA −40 85 °C Rating Ambient Temperature 5. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating range. 6. Minimum VIN_MIN = 1.8 V or (VOUT + VDO), whichever is higher. Table 5. ELECTRICAL CHARACTERISTICS (VIN = (VOUT + 1 V) or VIN_MIN, whichever is higher, CIN = 1 mF, COUT = 2.2 mF, for typical values TA = 25°C, for Bold values TA = −40°C to 85°C; unless otherwise noted.) Parameter Symbol Conditions Min Typ Max Unit INPUT / OUTPUT VIN VOUT VOUT−ACC VADJ TCOUT IOUT Input Voltage 1.8 5.5 V Output Voltage Range 0.8 5.0 V 2 % 0.816 V Output Voltage Accuracy Initial accuracy, IOUT = 1 mA Voltage at ADJ input −2 0.784 Output Voltage Temp. Coefficient Output Current 0.0001 http://onsemi.com 3 0.8 25 ppm/°C 1 A CAT6243 Table 5. ELECTRICAL CHARACTERISTICS (VIN = (VOUT + 1 V) or VIN_MIN, whichever is higher, CIN = 1 mF, COUT = 2.2 mF, for typical values TA = 25°C, for Bold values TA = −40°C to 85°C; unless otherwise noted.) Symbol Parameter Conditions Min Typ Max Unit VIN = VOUT + 1.0 V to 5.5 V, IOUT = 10 mA −0.2 ±0.05 0.2 %/V VIN = VOUT + 1.0 V to 5.5 V, IOUT = 10 mA −0.35 INPUT / OUTPUT VR−LINE VR−LOAD Line Regulation Load Regulation 0.35 1.5 IOUT = 100 mA to 1000 mA VOUT = 1.2 V VOUT = 2.5 V IOUT = 300 mA TA = 25°C 600 IOUT = 1 A TA = 25°C 625 VOUT = 2.5 V 85 350 VOUT = 3.3 V 275 IADJ ADJ Input Current 100 IGND Ground Current 70 IOUT = 0 mA IOUT = 1000 mA 140 IOUT = 1000 mA ISC nA mA 100 IOUT = 0 mA IGND−SD mV 110 VOUT = 3.3 V VOUT = 1.2 V % 3 IOUT = 100 mA to 1000 mA VDO 2 200 250 Shutdown Ground Current VEN < 0.4 V Output short circuit current limit VOUT = 0 V 900 mA f = 1 kHz, BYP = 470 pF, IOUT = 10 mA 54 dB f = 20 kHz, BYP = 470 pF, IOUT = 10 mA 42 BW = 10 Hz to 100 kHz BYP = 470 pF, IOUT = 10 mA 45 2 mA PSRR AND NOISE PSRR eN Power Supply Rejection Ratio CAT6243 Output Noise Voltage for 1.8 V output mVrms UVLO, ROUT AND ESR VUVLO ROUT−SH ESR Under voltage lockout threshold 1.65 ON resistance of Discharge Transistor 150 COUT equivalent series resistance 5 1.75 V W 500 mW ENABLE INPUT VHI Logic High Level VIN = 1.8 to 5.5 V VLO Logic Low Level VIN = 1.8 to 5.5 V IEN Enable Input Current VEN = 0.4 V VEN = VIN = 2.5 V REN Enable pull−down resistor V 1.6 0.4 V 0.15 1 mA 1 3 2.5 MW CBYP = 0 pF 230 ms CBYP = 470 pF 1600 TIMING TON Turn−On Time THERMAL PROTECTION TSD Thermal Shutdown 145 °C THYS Thermal Hysteresis 10 °C 7. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. http://onsemi.com 4 CAT6243 TYPICAL CHARACTERISTICS (shown for VOUT = 2.5 V, VIN = 3.5 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.) 2.55 2.52 2.52 2.51 2.50 2.49 2.48 2.47 2.46 2.45 GROUND CURRENT (mA) OUTPUT VOLTAGE (V) 2.53 0 2.50 2.49 2.5 3.0 3.5 4.0 4.5 5.0 Figure 3. Output Voltage vs. Load Current Figure 4. Output Voltage vs. Input Voltage 100 90 130 80 120 110 100 90 80 70 100 200 300 400 500 600 700 800 900 1000 5.5 70 60 50 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 OUTPUT LOAD CURRENT (mA) INPUT VOLTAGE (V) Figure 5. Ground Current vs. Load Current Figure 6. Ground Current vs. Input Voltage 3.0 400 350 OUTPUT VOLTAGE (V) 2.5 300 250 200 150 100 IOUT = 1 mA 2.0 IOUT = 1000 mA 1.5 1.0 0.5 50 0 2.0 INPUT VOLTAGE (V) 150 0 1.5 OUTPUT LOAD CURRENT (mA) 140 60 50 DROPOUT VOLTAGE (mV) 2.51 2.48 100 200 300 400 500 600 700 800 900 1000 GROUND CURRENT (mA) OUTPUT VOLTAGE (V) 2.54 0 100 200 300 400 500 600 700 800 900 1000 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 OUTPUT LOAD CURRENT (mA) INPUT VOLTAGE (V) Figure 7. Dropout Voltage vs. Load Current Figure 8. Dropout Characteristics http://onsemi.com 5 CAT6243 TYPICAL CHARACTERISTICS 1.2 1.0 1.0 0.8 0.6 0.4 0.2 0 CURRENT LIMIT (mA) ENABLE THRESHOLD (V) 1.2 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.6 0.4 0.2 2.0 2.5 3.0 3.5 4.0 4.5 5.5 5.0 INPUT VOLTAGE (V) Figure 9. Rising Enable Threshold vs. Supply Voltage Figure 10. Falling Enable Threshold vs. Supply Voltage 1400 80 1200 70 1000 60 VOUT = 0 800 600 400 0 1.5 INPUT VOLTAGE (V) 50 40 30 20 200 10 0 1 2 3 4 0 5 1E+01 1E+02 1E+03 1E+04 1E+05 INPUT VOLTAGE (V) FREQUENCY (Hz) Figure 11. Current Limit on Output vs. Supply Voltage Figure 12. PSRR @ 10 mA 1E+06 80 GROUND CURRENT (mA) 820 ADJUSTABLE VOLTAGE (mV) 0.8 0 5.5 5.0 PSRR (dB) ENABLE THRESHOLD (V) (shown for VOUT = 2.5 V, VIN = 3.5 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.) 810 800 790 780 −40 −20 0 20 40 60 80 100 70 60 50 40 −40 −20 120 0 20 40 60 80 100 120 TEMPERATURE (°C) TEMPERATURE (°C) Figure 13. Adjustable Voltage vs. Temperature Figure 14. Ground Current vs. Temperature http://onsemi.com 6 CAT6243 TRANSIENT CHARACTERISTICS (shown for VOUT = 2.0 V, VIN = 3.0 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.) Figure 15. Enable Turn−On (1 mA Load) Figure 16. Enable Turn−Off (1 mA Load) Figure 17. Enable Turn−On (1000 mA Load) Figure 18. Enable Turn−Off (1000 mA Load) Figure 19. Enable Turn−On (1 mA Load) CBYP = 470 pF Figure 20. Enable Turn−On (1000 mA Load) CBYP = 470 pF http://onsemi.com 7 CAT6243 TRANSIENT CHARACTERISTICS (shown for VOUT = 2.0 V, VIN = 3.0 V, IOUT = 1 mA, CIN = 1 mF, COUT = 4.7 mF, CBYP = 0, and TA = 25°C unless otherwise specified.) Figure 21. Slow Enable Operation (1 mA Load) Figure 22. Slow Enable Operation (1000 mA Load) Figure 23. Load Transient Response (1 mA to 1000 mA) Figure 24. Enable Turn−On (1 mA Load) (VOUT = 0.8 V and VIN = 1.8 V) Figure 25. Load Transient Response (1 mA to 400 mA) (VOUT = 0.8 V and VIN = 1.8 V) Figure 26. Load Transient Response (1 mA to 800 mA) (VOUT = 0.8 V and VIN = 1.8 V) http://onsemi.com 8 CAT6243 PIN FUNCTIONS VIN 100 pF to 470 pF. Values larger than this will provide no additional improvement and will further extend CAT6243’s startup time. A bypass capacitor is not required for operation and BYP may be left open or floating if no capacitor is used but DO NOT ground BYP as this will interfere with the error amplifier’s functioning. Positive Power Input. Power is supplied to the device through the VIN pin. A bypass capacitor is required on this pin if the device is more than six inches away from the main input filter capacitor. In general it is advisable to include a small bypass capacitor adjacent to the regulator. In battery−powered circuits this is particularly important because the output impedance of a battery rises with frequency, so a bypass capacitor in the range of 1 mF to 10 mF is recommended. ADJ ADJ = Adjust and is the voltage control input. ADJ connects to the center point of a resistor divider which determines the CAT6243’s output voltage. See Applications Section for resistor selection guidelines. GND Ground. The negative voltage of the input power source. The center pad on the back of the package is also electrically ground. This pad is used for cooling the device by making connection to the buried ground plane through solder filled vias or by contact with a topside copper surface exposed to free flowing air. VOUT VOUT is the regulator’s output and supplies power to the load. VOUT can be shut off via the ENABLE input. All CAT6243 members are designed to block reverse current, meaning anytime VOUT becomes greater than VIN the pass FET will be shut off so there is no reverse current flow from output to input. CAT6243 is also equipped with an output discharge transistor that is turned ON anytime ENABLE is at a logic Low. This transistor ensures VOUT discharges to 0 V when the regulator is shutdown. This is especially important when powering digital circuitry because if VOUT fails to reach 0 V their POR (power−ON reset) circuitry may not trigger and scrambled data or unpredictable operations may result. A minimum output capacitor of 2.2 mF should be placed between VOUT and GND to insure stable operation. Increasing the size of COUT, up to 22 mF, will improve transient response to large changes in load current. ENABLE ENABLE is an active high logic input which controls the regulator’s the output state. If ENABLE < 0.4 V the regulator is shutdown and VOUT = 0 V. If ENABLE > 1.6 V the regulator is active and supplying power to the load. If the regulator is intended to operate continuously and won’t be shut down from time to time ENABLE should be tied to VIN. BYP The Bypass Capacitor input is used to decrease output voltage noise by placing a capacitor between BYP and ground. The recommended range of capacitance is from http://onsemi.com 9 CAT6243 APPLICATIONS INFORMATION Input Decoupling (CIN) VIN A ceramic or tantalum 1 mF capacitor is recommended and should be connected close to the CAT6243’s package. Higher capacitance and lower ESR will improve the overall line and load transient response. ENABLE CIN BYP CBYP The minimum output decoupling value is 2.2 mF and can be augmented to fulfill stringent load transient requirements. The regulator works with ceramic chip capacitors. Larger values, up to 22 mF, improve noise rejection and load regulation transient response. The CAT6243 is a highly stable regulator and performs well over a wide range capacitor Equivalent Series Resistances (ESR). As power in the CAT6243 increases, it may become necessary to provide thermal relief. The maximum power dissipation supported by this device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the CAT6243 has good thermal conductivity through the PCB, the junction temperature will be relatively low even with high power applications. The maximum dissipation the CAT6243 can handle is given by: P D(MAX) + The output voltage can be adjusted from 0.8 V to 5.0 V using resistors between the output and the ADJ input. The output voltage and resistors are chosen using Equation 1 and Equation 2. R2 ^ 0.8 V I DIV ǒ R1 ^ R2 V OUT *1 0.8 V R 1Ǔ ƪTJ(MAX) * TAƫ R qJA (eq. 4) Since TJ is not recommended to exceed 125°C, then with CAT6243 soldered to 645 mm2 (1 sq inch), 1 oz copper area, FR4 PCB material can dissipate in excess of 1 W when the ambient temperature (TA) is 25°C. Note that this assumes the pad in the center of the package is soldered to the dissipating copper foil. See Figure below for RqJA versus PCB area for heat dissipating areas smaller than 645 mm2. Power dissipation can be calculated from the following equations: (eq. 1) (eq. 2) Ǔ R2 Thermal Considerations Output Voltage Adjust Ǔ GND Input bias current, IADJ, for all practical designs can be ignored (IADJ = 0). Considering that the lowest recommended IOUT value is 100 mA, then, when there is no load on VOUT, IDIV must be 100 mA to keep CAT6243 in regulation. This then sets R2’s value using Equation 2 to 8 KW, which minimizes output noise. Use Equation 3 to find the required value for R1. If needed, lower values for IDIV can be considered, but not lower than 10 mA. The price will be worse values for both load regulation and TCOUT. The CAT6243 adjustable regulator will operate properly under conditions where the only load current is through the resistor divider that sets the output voltage. However, in the case where the CAT6243 is configured to provide a 0.8 V output, there is no resistor divider and the ADJ pin is connected to VOUT. If the part is enabled under no−load conditions, leakage current through the pass transistor at junction temperatures above 85°C can approach several microamperes, especially as junction temperature approaches 150°C. If this leakage current is not directed into a load, the output voltage will rise above nominal until a load is applied. For this reason it is recommended that a minimum load of 100 mA be present at all times. Normally the voltage setting resistor divider will serve this function but if no divider is used (VOUT = 0.8 V) then an external load of 8 KW should be provided. R1 ) ǒI ADJ R2 COUT ADJ Figure 27. Adjustable Output Resistor Divider No−Load Regulation Considerations ǒ R1 CAT6243 Output Decoupling (COUT) V OUT + 0.8 1 ) VOUT VOUT VIN P D [ V IN(I GND ) I OUT) ) I OUT(V IN * V OUT) (eq. 5) (eq. 3) or V IN(MAX) [ http://onsemi.com 10 P D(MAX) ) (V OUT I OUT ) I GND I OUT) (eq. 6) CAT6243 300 1 oz C.F 250 Theta JA (°C/W) 2 oz C.F 1 oz Sim 200 2 oz Sim 150 100 50 0 0 25 50 75 100 125 150 175 200 225 250 275 300 650 Copper heat spreading area (mm2) Figure 28. Thermal Resistance vs. PCB Copper Area for 3 mm x 3 mm WDFN Package PCB Layout Top Layer and connections to heat spreading plane Close−up of pad area Figure 29. Topside Copper Foil Pattern for Heat Dissipation Design Hints external components, especially the input and output capacitors, as close as possible to the CAT6243, and keep traces between power source and load as short as possible. VIN and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high due to narrow trace width or long length, there is a chance to pick up noise or cause the regulator to malfunction. Place http://onsemi.com 11 CAT6243 PACKAGE DIMENSIONS DPAK 5, CENTER LEAD CROP CASE 175AA−01 ISSUE A −T− SEATING PLANE C B V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. E R R1 Z A S DIM A B C D E F G H J K L R R1 S U V Z 1 2 3 4 5 U K F J L H D G 5 PL 0.13 (0.005) M T SOLDERING FOOTPRINT 6.4 0.252 2.2 0.086 0.34 5.36 0.013 0.217 5.8 0.228 10.6 0.417 0.8 0.031 SCALE 4:1 mm Ǔ ǒinches 5−LEAD DPAK CENTRAL LEAD CROP http://onsemi.com 12 INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.020 0.028 0.018 0.023 0.024 0.032 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.045 BSC 0.170 0.190 0.185 0.210 0.025 0.040 0.020 −−− 0.035 0.050 0.155 0.170 MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.51 0.71 0.46 0.58 0.61 0.81 4.56 BSC 0.87 1.01 0.46 0.58 2.60 2.89 1.14 BSC 4.32 4.83 4.70 5.33 0.63 1.01 0.51 −−− 0.89 1.27 3.93 4.32 CAT6243 PACKAGE DIMENSIONS WDFN6 3x3, 0.95P CASE 511AP−01 ISSUE O A D B L1 PIN 1 REFERENCE 2X 0.15 C 2X ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ 0.15 C 0.10 C DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS ÇÇ ÉÉ ÉÉ EXPOSED Cu TOP VIEW DETAIL B 0.08 C (A3) SIDE VIEW ÇÇÇ ÉÉÉ A1 A1 C DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.35 0.45 3.00 BSC 2.40 2.60 3.00 BSC 1.50 1.70 0.95 BSC 0.20 −−− 0.30 0.50 −−− 0.15 SEATING PLANE D2 L e 1 6X A3 ALTERNATE CONSTRUCTIONS A 6X MOLD CMPD DETAIL B 7X DETAIL A NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMESNION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L 4X 3 SOLDERING FOOTPRINT* E2 K 6 2.60 PKG OUTLINE 6X 0.63 4 6X BOTTOM VIEW b 0.10 C A B 0.05 C 1.70 3.30 NOTE 3 1 0.95 PITCH 6X 0.45 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 13 CAT6243 PACKAGE DIMENSIONS DPAK−5 (TO−252, 5 LEAD) CASE 369AE−01 ISSUE O C A E b2 A B c2 L3 Z D H DETAIL A 1 2 3 4 E2 5 c e b TOP VIEW 0.12 M SIDE VIEW C A B BOTTOM VIEW H C L2 GUAGE PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. THERMAL PAD CONTOUR OPTIONAL, WITHIN DIMENSIONS b3, E2, L3 AND Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. THESE DIMENSIONS TO BE MEASURED AT DATUM H. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. DIM A A1 b b2 c c2 D E E2 e H L L1 L2 L3 Z 0.10 C L A1 L1 DETAIL A RECOMMENDED SOLDERING FOOTPRINT* 5.70 6.00 10.50 5X 2.10 5X 1.27 PITCH 0.80 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 MILLIMETERS MIN MAX 2.10 2.50 0.00 0.13 0.40 0.60 5.14 5.54 0.40 0.60 0.40 0.60 5.90 6.30 6.40 6.80 5.04 REF 1.27 BSC 9.60 10.20 1.39 1.78 2.50 2.90 0.51 BSC 0.90 1.30 2.74 REF CAT6243 Table 6. ORDERING INFORMATION (Notes 8 − 11) Output Voltage Package Shipping CAT6243−ADJMT5T3 Adjustable WDFN−6, 3 mm x 3 mm (Pb−Free) 3,000 / Tape & Reel CAT6243DTADJ−RKG Adjustable DPAK 5 4−Lead (Pb−Free) 2,500 / Tape & Reel CAT6243DCADJ−RKG Adjustable DPAK 5 5−Lead (Pb−Free) 2,500 / Tape & Reel Device 8. The standard lead finish is Matte−Tin. 9. For additional package and temperature options, contact your nearest ON Semiconductor Sales office. 10. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 11. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device Nomenclature document, TND310/D, available at www.onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 15 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CAT6243/D