Anpec APL560131AH-TRG Low dropout 600ma fixed voltage linear regulator Datasheet

APL5601/5602
Low Dropout 600mA Fixed Voltage Linear Regulator
Features
General Description
•
Low Dropout Voltage: 220mV (Typical) @600mA
•
Wide Input Voltage from 2.9V~6.5V
The APL5601/5602 family of low-power and low dropout
linear regulators which operate from 2.9V to 6.5V input
•
Low Quiescent Current: 140µA
•
Output Voltage Range : 1~5V
•
Fixed Output Voltage with 2% Accuracy
•
Stable with a Low ESR, 2.2µF Output Capacitance
•
Short Circuit Current-Limit
•
Over-Temperature Protection
•
Current-Limit Protection
•
Internal Soft-Start
voltage and deliver up to 600mA output current. Typical
dropout voltage is only 220mV (typical) at 600mA output.
The APL5601/5602 regulators with low 140µA quiescent
current are ideal for battery-powered system appliances.
The APL5601/5602 regulators are stable with a 2.2µF
ceramic capacitor. The features of current-limit, short circuit current-limit, and over-temperature protection protect
the device against currnet over loads and overtemperature.
•
SOT-23-3, SOT-89, and SOT-223 Packages
•
Lead Free and Green Devices Available
The APL5601/5602 regulators come in SOT-23-3, SOT89, and SOT-223 packages.
Simplified Application Circuit
(RoHS Compliant)
Applications
APL5601/5602
VIN
•
•
CD/DVD-ROM, CD-R/W
VIN
COUT
1µF
•
Set-Top Box
•
PC Peripherals
•
Battery-Powered System
VOUT
CIN
Networking System, LAN Card, ADSL/Cable Modem
VOUT
GND
2.2µF
Pin Configuration
APL5601
GND 1
GND 1
VIN
(Tab)
VIN 2
VOUT 3
APL5602
APL5601
VIN 2
VOUT 3
VOUT 1
VOUT 1
VIN GND 2
(Tab)
VIN 3
GND
(Tab) GND 2
SOT-223
(Top View)
SOT-89
(Top View)
APL5601
APL5602
GND
(Tab)
VIN 3
SOT-89
(Top View)
SOT-223
(Top View)
GND 1
3 VIN
VOUT 2
SOT-23-3
(Top View)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
1
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APL5601/5602
Ordering and Marking Information
Voltage Code (Note 1)
10 : 1.0V 12 : 1.2V 15 : 1.5V 18 : 1.8V 25 : 2.5V
28 : 2.8V 30 : 3.0V 31 : 3.1V 33 : 3.3V 48 : 4.8V
50 : 5.0V
Package Code
A : SOT-23-3 D : SOT-89 V : SOT-223
Operating Ambient Temperature Range
I : -40 to 85 oC H : -40 to 125oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL5601/2
Assembly Material
Handling Code
Temperature Range
Package Code
Voltage Code
APL5601
XXXXX VV
APL5601/2 D/V:
APL5602
XXXXX VV
XXXXX - Date Code
VV - Voltage Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Note 1: For other voltage versions please contact ANPEC for details.
Marking for SOT-23-3
Product Name
Marking
APL5601-10A
61aX
APL5601-12A
615X
APL5601-15A
619X
APL5601-18A
61CX
APL5601-25A
61JX
APL5601-28A
61MX
APL5601-30A
61OX
APL5601-31A
61PX
APL5601-33A
61RX
APL5601-48A
61XX
APL5601-50A
61ZX
Note: The last character in the Marking, “X”, refers to date code.
Absolute Maximum Ratings
Symbol
VIN
VOUT
(Note 2)
Parameter
VIN Supply Voltage (VIN to GND)
Output Voltage (VOUT to GND)
PD
Power Dissipation
TJ
Maximum Junction Temperature
Rating
Unit
-0.3 to 7
V
-0.3 to VIN+0.3
V
Internally Limited
TSTG
Storage Temperature Range
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
150
o
-65 to 150
o
260
o
C
C
C
Note 2: Stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
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APL5601/5602
Thermal Characteristics (Note 3, 4)
Symbol
Parameter
Typical Value
Unit
Junction to Air Thermal Resistance
θJA
SOT-23-3
SOT-89
SOT-223
260
180
135
SOT-23-3
SOT-89
SOT-223
130
40
15
°C/W
Junction to Case Thermal Resistance
θJC
Note 3: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink
values. The junction-to-ambient thermal resistance is measured on a PC board mounting with the device soldered down to
minimum copper area. If power dissipation causes the junction temperature to exceed specified limits, the device will go into
thermal shutdown.
Note 4: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) = (TJ – TA) / θJA; TJ =
125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Recommended Operating Conditions
Symbol
Parameter
Range
Unit
2.9 to 6.5V
V
Output Cur rent
0 to 0.6
A
Input Capacitor
0.82 to 470
µF
1 to 33 0
µF
Ju nction Tempera ture
-40 to 125
°C
Ambien t Tempe rature (Temperature Code:I)
-40 to 85
°C
Ambien t Tempe rature (Temperature Code:H)
-40 to 125
°C
VIN
VIN Supply Voltage
I OUT
C IN
C OUT
TJ
TA
Output Cap acitor
Electrical Characteristics
Refer to the typical application circuit. V IN = VOUT+1V or (Minimum VIN=2.9V ), IOUT = 1mA, T A = -40 to 85°C , unle ss o therwise specified.
Typical va lues are at TA = 25 °C.
AP L5601/APL5602
Symbol
Pa ram eter
Test Conditions
Unit
Min.
Typ.
Max.
-
140
220
µA
2.1
2.5
2.9
V
-
0.15
-
V
T A = 25°C
-1
-
+1
T A = -40 to 8 5°C
-2
-
+2
SUPP LY CURRENT
IQ
Quie scent Cu rrent
V IN =5V, IOUT =0mA
UNDER-VOLTAGE-LOCKOUT
VIN UVLO Threshol d
V IN rising
VIN UVLO Hysteresis
OUTPUT VOLTAGE
VOUT
VDROP
Output Vol tag e
%VOUT
Line Regul ati on
V IN = V OUT + 1V to 6V
-
0.03
0.19
%/V
Load Regu lation
I OUT = 1mA to 600mA
-
0.6
1.5
%/A
V OUT=2 .8V, I OUT=600mA
-
240
500
V OUT=3 .3V, I OUT=600mA
-
220
450
V OUT=5 V, I OU T=600mA
-
200
420
Dropout Vo lta ge
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
3
mV
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APL5601/5602
Electrical Characteristics(Cont.)
Refer to the typical app lication circu it. VIN = VOUT +1V or (Minimum VIN=2.9V) , I OUT = 1mA, T A = -40 to 85 °C , unless otherwise
specified. Typical values are at TA = 25 °C.
APL56 01/AP L5 602
S ymbol
Parameter
Test Conditions
Unit
Min.
Typ.
Max.
-
55
-
dB
700
-
-
mA
Thermal Shutdown Temperature
-
150
-
°C
Thermal Shutdown Hysteresis
-
40
-
°C
-
250
-
mA
-
130
300
µs
OUTPUT VOLTAGE (Cont.)
PSRR
Power Supply Ripple Reje ction
V IN = VOUT + 2V, f = 1kHz
SOFT-S TART AND PROTECTIO N
I LIM
Output Cu rrent Limit
Shor t Circu it Curren t Limit
T SS
V OUT < 0 .6V
Soft-Start Time
Refer to the typical app lication circuit. VIN = VOUT +1V or (Minimum VIN=2.9V ), I OUT = 1mA, T A = -40 to 125°C , unless othe rwise
specified. Typical values are at TA = 25 °C.
AP L5601/APL5602
S ymbol
Parameter
Te st Conditions
Unit
Min.
Typ.
Max.
-
140
300
2.1
2.5
2.9
V
-
0.1 5
-
V
SUPP LY CURRENT
IQ
Q uiescent Current
VIN=5V , I OUT =0mA
µA
UNDER-VOLTAGE-LOCKOUT
V IN UVLO Th reshold
VIN r isin g
V IN UVLO Hysteresis
OUTPUT VOLTAGE
VOUT
V DROP
TA = 25°C
-1
-
+1
TA = -40 to 125°C
-3
-
+3
L ine Regulation
VIN = V OU T + 1V to 6V
-
0.0 3
0.3
% /V
Load Regulation
IOUT = 1mA to 600mA
-
0.6
2
% /A
VOUT=2.8V, I OUT=600mA
-
240
550
VOUT=3.3V, I OUT=600mA
-
220
500
VOUT=5V, I OUT =600mA
-
200
470
700
-
-
mA
-
250
-
mA
-
130
400
µs
O utput Voltage
Dropout Voltage
% VOUT
mV
SOFT-S TART AND PROTECTIO N
I LIM
O utput Current Limit
S hort Circuit Current L imi t
T SS
VOUT < 0.6V
S oft-Sta rt Time
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APL5601/5602
Typical Operating Characteristics
VIN=5V, VOUT=3.3V, CIN=1µF, COUT=2.2µF, TA=25OC, unless otherwise specified.
VIN to VOUT Dropout vs. Junction
Temperature
Quiescent Current vs. Input Voltage
350
200
VIN to VOUT Dropout, VDROP (V)
Quiescent Current (µA)
IOUT=0mA
160
120
80
40
1
2
3
4
5
250
200
IOUT=600mA
150
IOUT=400mA
100
50
IOUT=200mA
0
-50
0
0
VOUT=3.3V
300
6
-25
25
50
75
100 125
150
o
Junction Temperature, TJ ( C)
Input Voltage, VIN (V)
VIN to VOUT Dropout vs. Junction
Temperature
Current-Limit vs. Junction Temperature
300
1.8
VOUT=5V
VIN=5V
1.6
250
1.4
Current-Limit, ILIM (A)
VIN to VOUT Dropout, VDROP (V)
0
200
IOUT=600mA
150
100
IOUT=400mA
50
-25
0
25
1
0.8
0.6
VIN=3.3V
0.4
0.2
IOUT=200mA
0
-50
1.2
50
75
100
125
0
150
-50
o
-25
0
25
50
75
100
125
150
o
Junction Temperature, TJ ( C)
Junction Temperature, TJ ( C)
Power Supply Ripple Rejection
0
-10
VIN=3.3V, VOUT=1.8V, CIN=1µF, COUT=2.2µF,
IOUT=500mA
PSRR (dB)
-20
-30
-40
-50
-60
-70
-80
1000
10000
100000
Frequency (Hz)
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APL5601/5602
Operating Waveforms
VIN=5V, VOUT=3.3V, CIN=1µF, COUT=2.2µF, TA=25OC, unless otherwise specified.
Power Off
Power On
VVININ
VIN
1
1
VSET
VOUT
2
VOUT
2
VOUT
IOUT
IOUT
IOUT
3
3
CH1 : VIN , 2V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
Time : 1ms/div
CH1 : VIN , 2V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
Time : 200ms/div
Line Transient
Load Transient
VIN=5V, VOUT=3.3V CIN=1µF, COUT=2.2µF,
IOUT rising/falling time=1µs
1
VIN=4.5~6V, VIN rising/falling=10µs, IOUT=300mA
VOUT
VIN
IOUT
1
2
VOUT
2
CH1 : VOUT , 100mV/div (offset=3.3V)
CH2 : IOUT , 200mV/div
Time : 200µs/div
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
CH1 : VIN , 2V/div
CH2 : VOUT , 20mV/div (offset=3.3V)
Time : 200µs/div
6
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APL5601/5602
Operating Waveforms (Cont.)
VIN=5V, VOUT=3.3V, CIN=1µF, COUT=2.2µF, TA=25OC, unless otherwise specified.
Thermal Shutdown
Current-Limit and Short Circuit Current-Limit
VIN
1
VIN
VOUT
1
VOUT
2
2
IOUT
IOUT
3
3
CH1 : VIN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 1A/div
Time : 2ms/div
CH1 : VIN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
Time : 500ms/div
Pin Description
PIN
NO.
FUNCTION
NAME
1
VIN
2
VOUT
Input Supply Pin. Supply voltage can range from 2.9V to 6.5V. Bypass with a 1µF capacitor to the GND
Regulator Output. Sources up to 600mA. A small capacitor is needed from this pin to ground to assure stability.
3
GND
Ground.
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APL5601/5602
Block Diagram
VIN
Current-Limit
UVLO and
Soft-Start
VREF
0.8V
VOUT
Thermal
Shutdown
Short Circuit
Current-Limit
GND
Typical Application Circuit
APL5601/5602
VOUT
VIN
VOUT
VIN
CIN
1µF
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
COUT
2.2µF
GND
8
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APL5601/5602
Function Description
Under Voltage Lockout (UVLO)
Thermal Shutdown
The APL5601/5602 regulators have built-in under-volt-
A thermal shutdown circuit limits the junction tempera-
age lock-out circuits to keep the output shuting off until
internal circuitry is operating properly. The UVLO function
ture of APL5601/5602. When the junction temperature
exceeds +150oC, the thermal shutdown circuitry disables
initiates a soft-start process after input voltage exceeds
its rising UVLO threshold during power on. Typical UVLO
the output, allowing the device to cool down. The output
circuitry is enabled again after the junction temperature
threshold is 2.5V with 0.15V hysteresis.
cools down by 40oC, resulting in a pulsed output during
continuous thermal overload conditions. Thermal pro-
Soft-Start
tection is designed to protect the IC in the event of over
temperature conditions. For reliable operation, the junc-
The APL5601/5602 provide an internal soft-start circuitry
tion temperature cannot exceed TJ=+125 oC.
to control rise rate of the output voltage and limit the current surge during start-up. Approximate 20µs delay time
after the VIN is over the UVLO threshold, the output voltage
starts the soft-start. The typical soft-start interval is about
130µs.
Current-Limit
The APL5601/5602 provides a current-limit circuitry, which
monitors and controls P-MOS’s gate voltage, limiting the
output current to 700mA. For reliable operation, the device should not be operated in current-limit for extended
period.
Short Circuit Current-Limit
When the output voltage drops below 0.6V, which is
caused by the over load or short circuit, the internal short
circuit current-limit circuitry limits the output current down
to 250mA. The short circuit current-limit is used to reduce
the power dissipation during short circuit condition. In
some high VIN-VOUT conditions, if the junction temperature is over the thermal shutdown temperature, the device will enter the thermal shutdown. Please refer to the
section on thermal considerations for power dissipation
calculations. The short circuit current-limit has a blanking time feature after the UVLO threshold is reached, so
that it will avoid the output causing short circuit currentlimit protection during start-up; the blanking time is about
600µs.
Copyright  ANPEC Electronics Corp.
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APL5601/5602
Application Information
For normal operation, do not exceed the maximum operating junction temperature of TJ=125 oC. The calculated
Input Capacitor
The APL5601/5602 require proper input capacitors to
power dissipation should be less than:
supply surge current during stepping load transients to
prevent the input rail from dropping. Because the para-
PD =(125-25)/260
= 0.38(W)
sitic inductor from the voltage sources or other bulk capacitors to the VIN limits the slew rate of the surge current,
The pin 3 of the SOT-23 and the tabs (and pin 2) of the
SOT-89 and SOT-223 provide an electrical connections
it is necessary to place the input capacitors near VIN as
close as possible. Input capacitors should be larger than
and channel heat away. Connect the pins and tabs to a
large area copper plane on PCBs for better heat
0.82µF.
dissipation.
Output Capacitor
Layout Consideration
The APL5601/5602 need a proper output capacitor to
maintain circuit stability and to improve transient response
Figure 1 illustrates the layout. Below is a checklist for
your layout:
over temperature and current. In order to insure the circuit stability, the proper output capacitor value should be
1. Please place the input capacitors close to the VIN.
2. Ceramic capacitors for load must be placed near the
larger than 1µF. With X5R and X7R dielectrics, 2.2µF is
sufficient at all operating temperatures. Maximum output
load as close as possible.
3. To place APL5601/5602 and output capacitors near the
capacitor should be less than 330µF to insure the system can be powered on successfully.
load is good for performance.
4. Large current paths, the bold lines in figure 1, must
100
Instable region
ESR (Ω)
10
have wide tracks.
1
APL5601/5602
0.1
Stable region
VIN
0.01
VIN
0.001
0.0001
CIN
Untested
1
10
100
Output Capacitor(µF)
VOUT
VOUT
COUT
GND
1000
Operation Region and Power Dissipation
Figure 1.
The APL5601/5602 maximum power dissipation de-
Recommended Minimum Footprint
pends on the thermal resistance and temperature difference between the die junction and ambient air. The power
0.076
0.126
0.067
junction and ambient air. θJA is the thermal resistance
between junction and ambient air. Assuming the TA=25oC,
maximum TJ=150oC (typical thermal limit threshold) and
θJA=260oC/W (SOT-23-3), so the maximum power dissi-
0.091
pation is calculated as:
0.038
Unit : Inch
PD(max)=(150-25)/260
= 0.48(W)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
0.067
0.164
where (TJ-TA) is the temperature difference between the
0.104
0.277
PD = (TJ - TA) / θJA
0.140
dissipation PD across the device is:
SOT-223
10
0.059
0.022
Unit : Inch
SOT-89
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APL5601/5602
Application Information (Cont.)
Recommended Minimum Footprint (Cont.)
0.057
0.037
0.102
0.024
0.074
Unit : Inch
SOT-23-3
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APL5601/5602
Package Information
SOT-23-3
D
e
E
E1
SEE
VIEW A
c
b
0.25
A
L
GAUGE PLANE
SEATING PLANE
0
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-3
INCHES
MILLIMETERS
MIN.
MIN.
MAX.
A
MAX.
0.057
1.45
A1
0.00
0.15
0.000
0.006
A2
0.90
1.30
0.035
0.051
b
0.30
0.50
0.012
0.020
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
E
2.60
3.00
0.102
0.118
E1
1.40
1.80
0.055
e
0.95 BSC
e1
0.071
0.037 BSC
1.90 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
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APL5601/5602
Package Information
SOT-89
A
C
L
H
E
E1
D
D1
e
e1
B
B1
SOT-89
S
Y
M
B
O
L
A
MIN.
MAX.
MIN.
MAX.
1.40
1.60
0.055
0.063
MILLIMETERS
INCHES
B
0.44
0.56
0.017
0.022
B1
0.36
0.48
0.014
0.019
C
0.35
0.44
0.014
0.017
D
4.40
4.60
0.173
0.181
D1
1.62
1.83
0.064
0.072
0.102
0.090
E
2.29
2.60
0.090
E1
2.13
2.29
0.084
e
1.50 BSC
0.059 BSC
e1
3.00 BSC
0.118 BSC
H
3.94
4.25
0.155
0.167
L
0.89
1.20
0.035
0.047
Note : Follow JEDEC TO-243 AA.
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APL5601/5602
Package Information
SOT-223
D
b2
E
E1
SEE
VIEW A
e
c
0.25°
L
b
0
A
A1
A2
e1
GAUGE PLANE
SEATING PLANE
VIEW A
S
Y
M
B
O
L
SOT-223
MILLIMETERS
MIN.
INCHES
MAX.
A
MIN.
MAX.
1.80
0.071
A1
0.02
0.10
0.001
0.004
A2
1.50
1.70
0.059
0.067
b
0.66
0.84
0.026
0.033
b2
2.90
3.10
0.114
0.122
c
0.23
0.33
0.009
0.013
D
6.30
6.70
0.248
0.264
E
6.70
7.30
0.264
0.287
E1
3.30
3.70
0.130
0.146
e
2.30 BSC
e1
4.60 BSC
L
0
0.091 BSC
0.181 BSC
0.030
0.75
0°
0°
10 °
10 °
Note : 1. Follow from JEDEC TO-261 AA.
2. Dimension D and E1 are determined at the outermost extremes
of the plastic exclusive of mold flash, tie bar burrs, gate burrs,
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
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APL5601/5602
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
OD1
B
A
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SOT-23-3
Application
SOT-89
Application
SOT-223
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±
0.20
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
4.80±0.20
4.50±0.20
1.80±
0.20
A
H
T1
C
d
D
W
E1
F
320.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
P0
P1
P2
D0
D1
T
A0
B0
K0
2.00±0.50
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.90±0.20
7.50±0.20
2.10±
0.20
4.00±0.10
8.00±0.10
12.0±0.30 1.75±0.10
12.00±0.30 1.75±0.10
5.50±
0.05
5.50±
0.05
(mm)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
15
www.anpec.com.tw
APL5601/5602
Devices Per Unit
Package type
Unit
Quantity
SOT-23-3
Tape & Reel
3000
SOT-89
Tape & Reel
1000
SOT-223
Tape & Reel
2500
Taping Direction Information
SOT-23-3
USER DIRECTION OF FEED
SOT-89
USER DIRECTION OF FEED
SOT-223
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
16
www.anpec.com.tw
APL5601/5602
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
17
www.anpec.com.tw
APL5601/5602
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
18
www.anpec.com.tw
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