TI BQ294602 Single-cell protector for li-ion battery Datasheet

bq294602, bq294604
www.ti.com
SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012
Single-Cell Protector for Li-Ion Batteries
Check for Samples: bq294602, bq294604
FEATURES
•
•
•
•
•
•
1
•
Single-Cell Monitor for Secondary Protection
Fixed Programmable Delay Timer
Fixed OVP Threshold
– bq294602 = 4.35 V with 4-s Delay Timer
– bq294604 = 4.35 V with 6.5-s Delay Timer
– bq294622 = 4.45 V with 4-s Delay Timer
– bq294624 = 4.45 V with 6.5-s Delay Timer
– bq294682 = 4.225 V with 4-s Delay Timer
– bq294684 = 4.225 V with 6.5-s Delay Timer
High-Accuracy Overvoltage Protection:
± 10 mV
Low Power Consumption ICC ≈ 1 µA
(VCELL(ALL) < VPROTECT)
Low leakage current per cell input < 100 nA
Small package footprint
– 6-pin SON
APPLICATIONS
•
2nd-Level Protection in Li-Ion Battery Packs in:
– Tablets
– Slates
– Portable Equipment and Instrumentation
DESCRIPTION
The bq2946xy family of products is a secondary level voltage monitor and protector for Li-Ion battery pack
systems. The cell is monitored for over voltage condition and triggers an internal counter once the OVP threshold
is exceeded and after a fixed set delay the out is transitioned to a high level. The output is reset (goes low) if the
cell voltage drops below the set threshold minus the hysteresis.
DRV Package
(Top View)
NC
1
V1
2
VSS
3
6
OUT
5
VDD
4
VSS
PWR PAD
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2012, Texas Instruments Incorporated
bq294602, bq294604
SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
TA
OVP (V)
DELAY TIME (S)
TAPE AND REEL
(LARGE)
TAPE AND REEL
(SMALL)
bq294602
4.35
4.0
bq294602DRVR
bq294602DRVT
bq294604
4.35
6.5
bq294604DRVR
bq294604DRVT
4.45
4.0
bq294622DRVR
bq294622DRVT
4.45
6.5
bq294624DRVR
bq294624DRVT
bq294682 (2)
4.225
4.0
bq294682DRVR
bq294682DRVT
(2)
4.225
6.5
bq294684DRVR
bq294684DRVT
PART NUMBER
–40°C to
110°C
bq294622
(1)
(2)
PACKAGE
DESIGNATOR
(2)
bq294624 (2)
bq294684
PACKAGE
SON-6
DRV
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder on ti.com (www.ti.com).
Product Preview only
THERMAL INFORMATION
bq2946xy
THERMAL METRIC
(1)
SON
UNITS
6 PINS
θJA
Junction-to-ambient thermal resistance
θJC(top)
Junction-to-case(top) thermal resistance
90.4
θJB
Junction-to-board thermal resistance
110.7
ψJT
Junction-to-top characterization parameter
96.7
ψJB
Junction-to-board characterization parameter
90
θJC(bottom)
Junction-to-case(bottom) thermal resistance
n/a
(1)
2
186.4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
bq294602, bq294604
www.ti.com
SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012
PIN FUNCTIONS
bq2946xy
Pin Name
Type I/O
1
NC
—
No Connection
Description
2
V1
IA
Sense input for positive voltage of the cell
3
VSS
P
Electrically connected to IC ground and negative terminal of the
cell
4
VSS
P
Electrically connected to IC ground and negative terminal of the
cell
5
VDD
P
Power supply
6
OUT
OA
Output drive for external N-Channel FET
Thermal Pad
PWRPAD
—
VSS pin to be connected to the PWRPAD on the printed circuit
board for proper operation
PIN DETAILS
Description
The method of overvoltage detection is comparing the cell voltage to an overvoltage protection threshold voltage
VOV. Once the cell voltage exceeds the programmed fixed value VOV, the delay timer circuit is activated. This
delay (tDELAY) is fixed for 4 s for the bq294602 device. When these conditions are satisfied, the OUT terminal is
transitioned to a high level. This output (OUT) is released to a low condition if the cell input (V1) is below the
OVP threshold minus the VHYS.
Cell Voltage (V)
V1–VSS)
VOV
VOV – VHYS
t DELAY
OUT (V)
Figure 1. Timing for Overvoltage Sensing
Sense Positive Input for V1
This is an input to sense single battery cell voltage. A series resistor and a capacitor across the cell is required
for noise filtering and stable voltage monitoring.
Output Drive, OUT
The gate of an external N-Channel MOSFET is connected to this terminal. This output transitions to a high level
when an overvoltage condition is detected and after the programmed delay timer. The out will reset to a low level
if the cell voltage falls below the VOV threshold before the fixed delay timer expires.
Supply Input, VDD
This terminal is the unregulated input power source for the IC. A series resistor is connected to limit the current,
and a capacitor is connected to ground for noise filtering.
Thermal Pad, PWRPAD
For correct operation, the power pad (PWRPAD) is connected to the VSS terminal on the printed circuit board.
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
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3
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SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012
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FUNCTIONAL BLOCK DIAGRAM
PACK +
R VD
CVD
VDD
CIN
VSS
Enable Monitoring
REG
V1
RIN
INT_EN
VOV
Delay
Timer
OSC
OUT
PWRPAD
PACK –
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted) (1)
PARAMETER
CONDITION
VALUE/UNIT
VDD–VSS
–0.3 to 30 V
V1–VSS
–0.3 to 8 V
Supply voltage range
Input voltage range
Output voltage range
OUT–VSS
–0.3 to 30 V
Continuous total power dissipation, PTOT
See package dissipation rating.
Functional temperature
–65 to 110°C
Storage temperature range, TSTG
–65 to 150°C
Lead temperature (soldering, 10 s), TSOLDER
(1)
300°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted)
PARAMETER
Supply voltage, VDD (1)
Input voltage range
V1–VSS
Operating ambient temperature range, TA
(1)
4
MIN
NOM
3
MAX
UNIT
8
V
0
5
V
–40
110
°C
See APPLICATION SCHEMATIC.
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
bq294602, bq294604
www.ti.com
SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012
DC CHARACTERISTICS
Typical values stated where TA = 25°C and VDD = 4 V, MIN/MAX values stated where TA = –40°C to 110°C and VDD = 4 V
(unless otherwise noted).
Test
#
Symbol
Parameter
Condition
Min
Typ
Max
Unit
Voltage Protection Threshold VCx
1.0
bq294602, fixed delay 4 s, V1 > VOV
4.35
V
1.1
bq294604, fixed delay 6.5 s, V1 > VOV
4.35
V
bq294622, fixed delay 4 s, V1 > VOV (1)
4.45
V
1.2
VOV
1.3
V(PROTECT) –
Overvoltage
Detection
bq294624, fixed delay 6.5 s, V1 > VOV
(1)
1.4
bq294682, fixed delay 4 s, V1 > VOV
1.5
bq294684, fixed delay 6.5 s, V1 > VOV
1.6
VHYS
Overvoltage
Detection
Hysteresis
1.7
VOA
OV Detection
Accuracy
TA = 25°C
1.8
VOA –DRIFT
OV Detection
Accuracy due to
Temperature
TA = –40°C
TA = 0°C
TA = 60°C
TA = 110°C
(1)
(1)
250
4.45
V
4.225
V
4.225
V
300
400
V
–10
10
mV
–40
–20
–24
–54
44
20
24
54
mV
mV
mV
mV
Supp ly and Leakage Current
1.9
ICC
Supply Current
1.10
IIN
Input Current at
V1 Pins
(V1–VSS) = 4.0 V (See Figure 9 for reference)
1
(V1–VSS) = 2.8 V with TA = –40°C to 60°C
2
1.25
Measured at V1 = 4.0 V
(V1–VSS) = 4.0 V
TA = 0°C to 60°C (See Figure 9 for reference.)
–0.1
(V1–VSS) > VOV
VDD = V1, IOH = 100 µA, TA = –40°C to 110°C
3.0
0.1
µA
µA
Output Drive OUT
1.11
1.12
VOUT
Output Drive
Voltage
VDD - 0.3
V
(V1–VSS) < VOV, IOL = 100 µA, TA = 25°C
TA = –40°C to 110°C
250
400
mV
OUT Short
Circuit Current
OUT = 0 V, (V1–VSS) > VOV
1.5
3.0
mA
CL = 1 nF, VOH(OUT) = 0 V to 5 V (2)
1.13
1.14
IOUT(Short)
1.15
tR
Output Rise
Time
1.16
ZO
Output
Impedance
5
µs
2
5
kΩ
Fixed Delay Timer
1.17
tDELAY
Fault Detection
Delay Time
1.18
tDELAY_CTM
Fault Detection
Delay Time in
Test Mode
(1)
(2)
Fixed Delay, bq2946x2
3.2
4
4.8
Fixed Delay, bq2946x4
5.2
6.5
7.8
Fixed delay (Internal settings)
15
s
ms
Product Preview only
Specified by design. Not 100% tested in production.
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
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5
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SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012
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TYPICAL CHARACTERISTICS
1.3
ICC Current (µA)
1.2
1.1
1
0.9
0.8
0.7
-40
0
25
Temperature Deg C
60
110
Figure 2. ICC Current Consumption Versus Temperature
Overoltage Threshold (V)
4.370
4.360
4.350
Min
4.340
Max
Mean
4.330
4.320
4.310
–40
0
25
60
110
Temperature Deg C
Figure 3. bq294602 Overvoltage Threshold (OVT) vs. Temp
325
324
323
Vhys (mV)
322
321
320
319
318
317
316
315
-40
0
25
60
110
Temperature Deg C
Figure 4. Hysteresis VHYS Versus Temperature
6
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
bq294602, bq294604
www.ti.com
SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012
–3.85
–3.9
I OUT (mA)
–3.95
–4
–4.05
–4.1
–40
0
25
60
110
Temperature Deg C
Figure 5. Output Current IOUT Versus Temperature
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
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7
bq294602, bq294604
SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012
www.ti.com
APPLICATION INFORMATION
Pack +
RVD
bq2946xy
NC
OUT
V1
VDD
VSS
VSS
RIN
VCELL
CVD
CIN
Pack –
Figure 6. Application Configuration
NOTE
Connect VSS (Pins 3 and 4) externally to the CELL– terminal.
Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. Figure 6 shows each
external component.
Table 1. Parameters
PARAMETER
External
Component
MIN
NOM
MAX
UNIT
Voltage monitor filter
resistance
RIN
900
1000
1100
Ω
Voltage monitor filter
capacitance
CIN
0.01
0.1
Supply voltage filter
resistance
RVD
100
Supply voltage filter
capacitance
CVD
µF
Ω
1K
0.1
µF
APPLICATION SCHEMATIC
Pack +
100
bq2946xy
NC
OUT
V1
VDD
VSS
VSS
1K
VCELL
0.1 µF
0.1 µF
Pack –
Figure 7. 1-Cell Configuration with Fixed Delay
NOTE
Connect VSS (Pins 3 and 4) externally to the CELL– terminal.
8
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Product Folder Link(s): bq294602 bq294604
bq294602, bq294604
www.ti.com
SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012
CUSTOMER TEST MODE
Customer Test Mode (CTM) helps to reduce test time for checking the overvoltage delay timer parameter once
the circuit is implemented in the battery pack. To enter CTM, VDD should be set to at least 10 V higher than V1
(see Figure 8). The delay timer is greater than 10 ms, but considerably shorter than the timer delay in normal
operation. To exit Customer Test Mode, remove the VDD to V1 voltage differential of 10 V so that the decrease
in this value automatically causes an exit.
CAUTION
Avoid exceeding any Absolute Maximum Voltages on any pins when placing the part
into Customer Test Mode. Also avoid exceeding Absolute Maximum Voltage for the
cell voltage (V1–VSS). Stressing the pins beyond the rated limits may cause
permanent damage to the device.
Figure 8 shows the timing for the Customer Test Mode.
VDD – Test Pin (V1) = 10 V
VDD
Test Pin (V1)
t DELAY > 10 ms
OUT (V)
Figure 8. Timing for Customer Test Mode
Figure 9 shows the measurement for current consumption for the product for both VDD and Vx.
bq2946xy
IIN
1 NC
OUT 6
2 V1
VDD 5
3 VSS
ICC
VSS 4
PWRPAD
3.6 V
Figure 9. Configuration for IC Current Consumption Test
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
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SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012
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REVISION HISTORY
Changes from Original (December 2011) to Revision A
•
Page
Added the bq294604 device into production. ....................................................................................................................... 2
Changes from Original (February 2012) to Revision B
•
10
Page
Added a second ICC Test Condition ...................................................................................................................................... 5
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Product Folder Link(s): bq294602 bq294604
PACKAGE OPTION ADDENDUM
www.ti.com
5-May-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
BQ294602DRVR
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294602DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294604DRVR
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294604DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-May-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
BQ294602DRVR
SON
DRV
6
BQ294602DRVT
SON
DRV
BQ294604DRVR
SON
DRV
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
330.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
6
250
180.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
6
3000
330.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-May-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ294602DRVR
SON
DRV
6
3000
346.0
346.0
29.0
BQ294602DRVT
SON
DRV
6
250
210.0
185.0
35.0
BQ294604DRVR
SON
DRV
6
3000
346.0
346.0
29.0
Pack Materials-Page 2
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