bq27621-G1 www.ti.com SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 System-Side Impedance Track™ Fuel Gauge With Dynamic Voltage Correlation Check for Samples: bq27621-G1 FEATURES APPLICATIONS • • • • • 1 2 • • • • Single series cell Li-Ion battery fuel gauge – Resides on system board – Supports embedded or removable batteries – Powered directly from battery with integrated LDO Easy to configure fuel gauging based on patented Impedance Track™ technology – Reports Remaining Capacity and State of Charge (SOC) with Smoothing Filter – Automatically adjusts for battery aging, self-discharge, temperature, and rate changes – Battery State of Health (aging) estimation Microcontroller peripheral supports: – 400-kHz I2C serial interface – Configurable SOC Interrupt, or Battery low digital output warning – Internal temperature sensor, or Host reported temperature Support 4.2V, 4.3V, and 4.35V chemistries 9-pin 1,62 × 1,58 mm, 0.5 mm pitch YZF package Smartphones, Feature phones and Tablets Digital Still and Video Cameras Handheld Terminals MP3 or Multimedia Players DESCRIPTION The Texas Instruments bq27621-G1 is an easy to configure microcontroller peripheral that provides system-side fuel gauging for single-cell Li-Ion batteries. The device requires minimal user configuration and system microcontroller firmware development. The bq27621-G1 uses the patented Impedance Track™ algorithm with Dynamic Voltage Correlation for fuel gauging. This patented process eliminates the need for a sense resistor when calculating remaining battery capacity (mAh), state-of-charge (%), battery voltage (mV),temperature (°C) and state of health (%). Battery fuel gauging with the bq27621-G1 requires connections only to PACK+ (P+) and PACK– (P–) for a removable battery pack or embedded battery circuit. The tiny 9-pin 1,62 × 1,58 mm, 0.5 mm pitch YZF package is ideal for space constrained applications. TYPICAL APPLICATION bq27621 Battery Pack SCL I2C Bus SDA PACKP BAT ADC Li-Ion Cell CPU GPOUT BIN VDD 1.8V LDO VSS T Protection IC PACKN NFET NFET 0.47uF 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Impedance Track is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013–2014, Texas Instruments Incorporated bq27621-G1 SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DEVICE INFORMATION AVAILABLE OPTIONS BATTERY TYPE CHEM_ID LiCoO2 (4.2 V max charge) 0x1202 LiMn2O4 (4.3 V max charge) 0x1210 LiMn2O4 (4.35 V max charge) 0x354 PART NUMBER bq27621YZFR-G1A (1) (2) (3) (1) FIRMWARE VERSION PACKAGE (3) COMM. FORMAT 1.05 (0x0105) CSP-9 I2C (2) See the CHEM_ID subcommand to confirm the battery chemistry type. See section on alternate chemistry to select different chemistries. See the FW_VERSION subcommand to confirm the firmware version. For the most current package and ordering information see the Package Option Addendum at the end of this document; or, see the TI website at www.ti.com. THERMAL INFORMATION THERMAL METRIC (1) bq27621-G1 YZF (9 PINS) θJA Junction-to-ambient thermal resistance θJCtop Junction-to-case (top) thermal resistance 0.7 θJB Junction-to-board thermal resistance 60.4 ψJT Junction-to-top characterization parameter 3.5 ψJB Junction-to-board characterization parameter 60.4 θJCbot Junction-to-case (bottom) thermal resistance n/a (1) 2 UNITS 107.8 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 bq27621-G1 www.ti.com SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 PIN DIAGRAM AND PACKAGE DIMENSIONS (TOP VIEW) D (BOTTOM VIEW) C3 C2 C1 C1 C2 C3 B3 B2 B1 B1 B2 B3 A3 A2 A1 A1 A2 A3 Pin A1 Index Area E DIM MIN TYP MAX D 1550 1580 1610 E 1590 1620 1650 UNITS m PIN FUNCTIONS PIN NAME NO. TYPE (1) DESCRIPTION BAT C2,C3 PI, AI VDD B3 PO 1.8V Regulator Output. Decouple with 0.47μF ceramic capacitor to Vss. VSS B2,C1 PI Ground pins. The center pin B2 is the actual device ground pin while pin C1 is floating internally and therefore C1 may be used as a bridge to connect to the board ground plane without requiring a via under the device package. Recommend routing the center pin B2 to the corner pin C1 using a top-layer metal trace on the board. Then route the corner pin C1 to the board ground plane. GPOUT A1 DO General Purpose open-drain output. May be configured as a Battery Low indicator or perform SOC interrupt (SOC_INT) function. SDA A2 DIO Slave I2C serial communications data line for communication with system (Master). Open-drain I/O. Use with 10kΩ pull-up resistor (typical). SCL A3 DIO Slave I2C serial communications clock input line for communication with system (Master). Use with 10kΩ pull-up resistor (typical). BIN B1 DI (1) LDO regulator input and battery voltage input typically connected to the PACK+ terminal. Battery-insertion detection input. A logic high to low transition is detected as a battery insertion event. Recommend using a pull-up resistor >1MΩ (4.7 MΩ typical) to VDD for reduced power consumption. An internal pull-up resistor option is also available. I/O = Digital input/output, IA = Analog input, P = Power connection Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 3 bq27621-G1 SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 www.ti.com ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VBAT BAT pin input voltage range PARAMETER –0.3 6 V VDD VDD pin supply voltage range (LDO ouptut) –0.3 2 V VIOD Open-drain I/O pins (SDA, SCL) –0.3 6 V VIOPP Push-Pull I/O pins (BIN ) –0.3 [VDD + 0.3] V TA Operating free-air temperature range –40 85 °C TSTG Storage temperature range –65 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS TA = 30°C and VREGIN = VBAT = 3.6V (unless otherwise noted) PARAMETER CBAT CLDO18 VPU (1) External input capacitor for internal LDO between BAT and VSS (1) (1) (1) External output capacitor for internal LDO between VDD and VSS TEST CONDITIONS MIN Nominal capacitor values specified. Recommend a 5% ceramic X5R type capacitor located close to the device. External pull-up voltage for opendrain pins (SDA, SCL, GPOUT ) TYP MAX UNIT 0.1 μF 0.47 μF 1.62 3.6 V Specified by design. Not production tested. SUPPLY CURRENT TA = 30°C and VREGIN = VBAT = 3.6V (unless otherwise noted) PARAMETER ICC (1) TEST CONDITIONS μA μA 9 μA 0.6 μA ILOAD < Sleep Current IHIB (1) HIBERNATE mode current ILOAD < Hibernate Current SHUTDOWN mode current Fuel gauge in host commanded SHUTDOWN mode. (LDO Regulator Output Disabled.) 4 UNIT 21 SLEEP mode current (1) MAX 27 (1) (1) TYP ILOAD > Sleep Current ISLP ISD MIN NORMAL mode current Specified by design. Not production tested. Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 bq27621-G1 www.ti.com SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 DIGITAL INPUT AND OUTPUT DC CHARACTERISTICS TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER TEST CONDITIONS (2) VIH(OD) Input voltage, high VIL Input voltage, low VOL Output voltage, low IOH Output source current, high VPU x 0.7 V 0.6 V 0.5 mA -3 mA 5 pF (2) (3) (2) (2) Input leakage current (SCL, SDA, BIN) 0.1 Input leakage current (GPOUT) (1) (2) (3) UNIT (2) Output sink current, low Ilkg MAX 0.6 (1) Input capacitance TYP (2) (3) IOL(OD) CIN External pullup resistor to VPU MIN V μA 1 Specified by design. Not production tested. Open Drain pins: (SCL, SDA) Push Pull pin: (BIN ) LDO REGULATOR, WAKE-UP AND AUTO-SHUTDOWN DC CHARACTERISTICS TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER VBAT BAT pin regulator input VDD Regulator output voltage UVLOIT+ VBAT Under Voltage Lock Out LDO Wake-Up Rising Threshold UVLOIT- VBAT Under Voltage Lock Out LDO Auto-Shutdown Falling Threshold (1) TEST CONDITIONS MIN TYP 2.45 MAX 4.5 UNIT V 1.8 V 2 V 1.95 V Specified by design. Not production tested. ADC (TEMPERATURE AND CELL MEASUREMENT) CHARACTERISTICS TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1) PARAMETER VIN(BAT) BAT pin voltage measurement range. tADC_CONV Conversion time TEST CONDITIONS Voltage divider enabled. Effective Resolution (1) MIN TYP 2.45 MAX 4.5 UNIT V 125 ms 15 bits Specified by design. Not tested in production. Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 5 bq27621-G1 SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 www.ti.com I2C-COMPATIBLE INTERFACE COMMUNICATION TIMING CHARACTERISTICS TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Standard Mode (100 kHz) 4 μs 4.7 μs 4 μs 4.7 μs 250 ns td(STA) Start to first falling edge of SCL tw(L) SCL pulse duration (low) tw(H) SCL pulse duration (high) tsu(STA) Setup for repeated start tsu(DAT) Data setup time Host drives SDA th(DAT) Data hold time Host drives SDA 0 ns tsu(STOP) Setup time for stop 4 μs t(BUF) Bus free time between stop and Includes Command Waiting Time start 66 μs tf SCL/SDA fall time tr SCL/SDA rise time fSCL Clock frequency (2) (1) 300 (1) ns 300 ns 100 kHz Fast Mode (400 kHz) td(STA) Start to first falling edge of SCL 600 ns tw(L) SCL pulse duration (low) 1300 ns tw(H) SCL pulse duration (high) 600 ns tsu(STA) Setup for repeated start 600 ns tsu(DAT) Data setup time Host drives SDA 100 ns th(DAT) Data hold time Host drives SDA 0 ns tsu(STOP) Setup time for stop 600 ns t(BUF) Bus free time between stop and Includes Command Waiting Time start 66 μs tf SCL/SDA fall time tr SCL/SDA rise time fSCL Clock frequency (2) (1) (2) (1) 300 (1) ns 300 ns 400 kHz Specified by design. Not production tested. If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at 400 kHz. (Refer to I2C INTERFACE and I2C Command Waiting Time) tSU(STA) tw(H) tf tw(L) tr t(BUF) SCL SDA td(STA) tsu(STOP) tf tr th(DAT) tsu(DAT) REPEATED START STOP START Figure 1. I2C-Compatible Interface Timing Diagrams 6 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 bq27621-G1 www.ti.com SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 GENERAL DESCRIPTION The bq27621-G1 accurately predicts the battery capacity and other operational characteristics of a single Libased rechargeable cell. It can be interrogated by a system processor to provide cell information, such as stateof-charge (SOC). Information is accessed through a series of commands, called Standard Commands. Further capabilities are provided by the additional Extended Commands set. Both sets of commands, indicated by the general format Command( ), are used to read and write information contained within the bq27621-G1 control and status registers, as well as its data locations. Commands are sent from system to gauge using the bq27621-G1’s I2C serial communications engine, and can be executed during application development, system manufacture, or end-equipment operation. The key to the bq27621-G1’s high-accuracy gas gauging prediction is Texas Instrument’s proprietary Impedance Track™ algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-ofcharge predictions that can achieve high accuracy across a wide variety of operating conditions and over the lifetime of the battery. The bq27621-G1 estimates charge/discharge current by monitoring the voltage across the BAT and VSS terminal. When a cell is attached to the bq27621-G1, cell impedance is computed, based on cell current, cell open-circuit voltage (OCV), and cell voltage under loading conditions. The bq27621-G1 uses an integrated temperature sensor for estimating cell temperature. Alternatively, the host processor can provide temperature data for the bq27621-G1. To minimize power consumption, the bq27621-G1 has several power modes: INITIALIZATION, NORMAL, SLEEP, and HIBERNATE. The bq27621-G1 passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly. Additional details are found in the bq27621-G1 Technical Reference Manual (SLUUAD4) . NOTE FORMATTING CONVENTIONS IN THIS DOCUMENT: Commands: italics with RemainingCapacity( ). parentheses and no breaking spaces, that is, NVM Data: italics, bold, and breaking spaces, that is, Design Capacity. Register bits and flags: brackets and italics, that is, [TDA] NVM Data bits: brackets, italics and bold, that is: [LED1] Modes and states: ALL CAPITALS, that is, UNSEALED mode. Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 7 bq27621-G1 SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 www.ti.com DATA COMMANDS Standard Data Commands The bq27621-G1 uses a series of 2-byte standard commands to enable system reading and writing of battery information. Each standard command has an associated command-code pair, as indicated in Table 1. Because each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to initiate the command function, and to read or write the corresponding two bytes of data. Additional details are found in the bq27621-G1 Technical Reference Manual (SLUUAD4) . Note: Data values read by the host may be invalid during initialization for a period of up to 3 seconds. Table 1. Standard Commands NAME UNITS SEALED ACCESS Control( ) CNTL 0x00 / 0x01 N/A R/W Temperature( ) TEMP 0x02 / 0x03 0.1°K R/W Voltage( ) VOLT 0x04 / 0x05 mV R FLAGS 0x06 / 0x07 N/A R 0x08 / 0x09 mAh R Flags( ) NominalAvailableCapacity( ) FullAvailableCapacity( ) 0x0A / 0x0B mAh R RemainingCapacity( ) RM 0x0C / 0x0D mAh R FullChargeCapacity( ) FCC 0x0E / 0x0F mAh R EffectiveCurrent( ) 0x10 / 0x11 mA R AveragePower( ) 0x18 / 0x19 mW R SOC 0x1c / 0x1d % R 0x1e / 0x1f 0.1°K R SOH 0x20 / 0x21 num / % R RemainingCapacityTrue( ) 0x28 / 0x29 mAh R RemainingCapacityFiltered( ) 0x2A / 0x2B mAh R FullChargeCapacityTrue( ) 0x2C / 0x2D mAh R FullChargeCapacityFiltered( ) 0x2E / 0x2F mAh R TrueSoc( ) 0x30 / 0x31 mAh R OperationConfiguration( ) 0x3a / 0x3b N/A R StateOfCharge( ) IntTemperature( ) StateOfHealth( ) 8 COMMAND CODE Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 bq27621-G1 www.ti.com SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 Control( ): 0x00/0x01 Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the particular control function desired. The Control( ) command allows the system to control specific features of the bq27621-G1 during normal operation and additional features when the device is in different access modes. Additional details are found in the bq27621-G1 Technical Reference Manual (SLUUAD4) Table 2. Control( ) Subcommands CNTL FUNCTION CNTL DATA SEALED ACCESS CONTROL_STATUS 0x0000 Yes DESCRIPTION Reports the status of device. DEVICE_TYPE 0x0001 Yes Reports the device type (0x0621). FW_VERSION 0x0002 Yes Reports the firmware version of the device. PREV_MACWRITE 0x0007 Yes Returns previous MAC command code. CHEM_ID 0x0008 Yes Reports the chemical identifier of the Impedance Track™ configuration BAT_INSERT 0x000c Yes Forces the [BAT_DET] bit set when the [BIE] bit is 0. BAT_REMOVE 0x000d Yes Forces the [BAT_DET] bit clear when the [BIE] bit is 0. TOGGLE_POWERMIN 0x0010 Yes Set CONTROL_STATUS [POWERMIN] to 1. SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1. CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0. SET_CFGUPDATE 0x0013 No Force CONTROL_STATUS [CFGUPMODE] to 1 and gauge enters CONFIG UPDATE mode. SHUTDOWN_ENABLE 0x001b No Enables device SHUTDOWN mode. SHUTDOWN 0x001c No Commands the device to enter SHUTDOWN mode. SEALED 0x0020 No Places the device in SEALED access mode. TOGGLE_GPOUT 0x0023 Yes Test the GPIO pin by sending a pulse signal ALT_CHEM1 0x0031 No Selects alternate chemistry 1 (0x1210) ALT_CHEM2 0x0032 No Selects alternate chemistry 2 (0x354) RESET 0x0041 No Performs a full device reset. SOFT_RESET 0x0042 No Gauge exits CONFIG UPDATE mode. EXIT_CFGUPDATE 0x0043 No Exits CONFIG UPDATE mode without an OCV measurement and without resimulating to update StateOfCharge( ). EXIT_RESIM 0x0044 No Exits CONFIG UPDATE mode without an OCV measurement and resimulates with the updated configuration data to update StateOfCharge( ). ALTERNATE CHEMISTRY SELECTION The BQ27621 device allows the user to change the chemistry settings using I2C commands. The default chemistry has a CHEM_ID of 0x1202. The two other CHEM_IDs supported by this device includes CHEM_ID 0x1210 and CHEM_ID0x354.The detailed procedure to change the chemistry is available in the bq27621-G1 Technical Reference Manual (SLUUAD4). Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 9 bq27621-G1 SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 www.ti.com FUNCTIONAL DESCRIPTION I2C INTERFACE The bq27621-G1 supports the standard I2C read, incremental read, quick read, one-byte write, and incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively. Host generated S ADDR[6:0] 0 A Gauge generated CMD [7:0] A DATA [7:0] A P S ADDR[6:0] (a) 1-byte write S ADDR[6:0] 0 A 1 A DATA [7:0] N P (b) quick read CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] N P (c) 1- byte read S ADDR[6:0] 0 A CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] A ... DATA [7:0] N P (d) incremental read S ADDR[6:0] 0 A CMD[7:0] A DATA [7:0] A DATA [7:0] A ... A P (e) incremental write (S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop). The quick read returns data at the address indicated by the address pointer. The address pointer, a register internal to the I2C communication engine, increments whenever data is acknowledged by the bq27621-G1 or the I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to consecutive command locations (such as two-byte commands that require two bytes of data). The following command sequences are not supported: Attempt to write a read-only address (NACK after data sent by master): Attempt to read an address above 0x6B (NACK command): I2C Time Out The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the bq27621-G1 is holding the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of the lines low, the I2C engine enters the low-power sleep mode. 10 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 bq27621-G1 www.ti.com SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 I2C Command Waiting Time To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus-free waiting time must be inserted between all packets addressed to the bq27621-G1. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1-byte write commands for proper data flow control. The following diagram shows the standard waiting time required between issuing the control subcommand the reading the status result. For read-write standard command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands, there is no waiting time required, but the host must not issue any standard command more than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer. S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] N P 66ms N P 66ms Waiting time inserted between two 1-byte write packets for a subcommand and reading results (required for 100 kHz < fSCL £ 400 kHz) S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] A 1 A DATA [7:0] A P DATA [7:0] A 66ms DATA [7:0] Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results (acceptable for fSCL £ 100 kHz) S ADDR [6:0] DATA [7:0] 0 A A CMD [7:0] DATA [7:0] A Sr ADDR [6:0] N P 1 A DATA [7:0] A DATA [7:0] A 66ms Waiting time inserted after incremental read I2C Clock Stretching A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes ( INITIALIZATION , NORMAL) clock stretching only occurs for packets addressed for the fuel gauge. The majority of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent yet more significant clock stretch periods may occur as blocks of NVM are updated. The following table summarizes the approximate clock stretch duration for various fuel gauge operating conditions. Approximate Duration Gauging Mode Operating Condition / Comment SLEEP HIBERNATE Clock stretch occurs at the beginning of all traffic as the device wakes up. ≤ 4 ms INITIALIZATION NORMAL Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit). ≤ 4 ms Normal Ra table NVM updates. 24 ms NVM block writes. 72 ms Restored NVM block write after loss of power. 116 ms End of discharge Ra table NVM update. 144 ms Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 11 bq27621-G1 SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 www.ti.com REFERENCE (EVM) SCHEMATIC 12 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 bq27621-G1 www.ti.com SLUSBB3B – DECEMBER 2013 – REVISED JANUARY 2014 REVISION HISTORY Changes from Revision A (January 2014) to Revision B • Page Changed the Ilkg Parameters.Split out the GPOUT pin ......................................................................................................... 5 Changes from Original (November 2013) to Revision A Page • Changed the device status From: Product Preview To: Production ..................................................................................... 1 • Changed Feature From: ..CSP package To: ..YZF package ................................................................................................ 1 • Changed the Description From: ..CSP package To: ..YZF package .................................................................................... 1 • Deleted Note 2 From the SUPPLY CURRENT table - "Wake Comparator Disabled" ......................................................... 4 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: bq27621-G1 13 PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ27621YZFR-G1A ACTIVE DSBGA YZF 9 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27621 G1A BQ27621YZFT-G1A ACTIVE DSBGA YZF 9 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27621 G1A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 13-Feb-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) BQ27621YZFR-G1A DSBGA YZF 9 3000 180.0 8.4 BQ27621YZFT-G1A DSBGA YZF 9 250 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.78 1.78 0.69 4.0 8.0 Q1 1.78 1.78 0.69 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Feb-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ27621YZFR-G1A DSBGA YZF 9 3000 182.0 182.0 17.0 BQ27621YZFT-G1A DSBGA YZF 9 250 182.0 182.0 17.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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