Rohm BZ6A1206GM 0.65a output, fully integrated, step-down switching power supply module Datasheet

BZ6A7D06GM
Datasheet
One Package Regulator Series
0.65A Output, Fully Integrated,
Step-down Switching Power Supply Module
BZ6Axx06GM Series
●General Description
Tne BZ6Axx06GM is a fully integrated power supply
module that is useful for shortening the product at the
design period and shortening the product launch time for
electronics product, communication of portable it,
and various applications industrial etc.
BZ6Axx06GM is based on a high efficiency 6MHz
synchronous step-down switching regulator. It provides
up to 0.65A load current and an input voltage range from
2.3V to 5.5V, optimized for battery powered portable
applications.
BZ6Axx06GM has a mode control pin that allows the
user to select Forced PWM(Pulse Width Modulation)
mode or PFM(Pulse Frequency Modulation) and PWM
auto change mode utilized power save operation at light
load current.
●Applications
Smart Phones, Cell phones, Portable applications,
POL applications, RF applications,
and USB Line Application
●Package(s)
BGA-MD
●Features
No External components required SMPS
Fast transient response
Automatic PFM/PWM operation
Forced PWM operation
Internal Soft Start
Under voltage lockout
Over current protection
Thermal shutdown
Ultra small and low profile package
BGA-MD
●Typical Application Circuit(s)
VIN
Vin=2.3~5.5V
VIN
EN
From
Controller
●Lineup
Part No.
Output voltage
BZ6A1206GM
1.20V
BZ6A7D06GM
1.25V
GND
A3
A1
VOUT
Vout
A2
B2
GND
C3
GND
C2
B1
MODE
C1 GND
From
Controller
GND
Figure 1. Typical Application Circuit(s)
●Pin Description(s)
●Pin Configuration(s) (Top View)
Pin No.
1
2
3
4
5
6
7
8
Coil
Cin
W(Typ.) x D(Typ.) x H(Max.)
2.90mm x 2.30mm x 1.00mm
Co
INDEX
MARK
Symbol
A1
A2
A3
B1
B2
C1
C2
C3
Name
VOUT
VIN
VIN
MODE
EN
GND
GND
GND
Function
Output pin
Power supply input pin
Power supply input pin
Forced PWM mode pin
Enable pin
GND pin
GND pin
GND pin
Figure 2. Pin Configuration(s)
○製品構造:シリコンモノリシック集積回路
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Datasheet
BZ6Axx06GM Series
●Block Diagram(s)
L : PWM/PFM MODE
H : PWM MODE
MODE
VIN
TSD
UVLO
PWM/PFM
control
Cin
2.3~ 5.5V
FB
VOUT
+
ERROR COMP
Switching
Control Logic
and
Gate Driver
L
VOUT
Co
VREF
EN
H : ON
L : OFF
SHUTDOWN
Frequency
control
GND
Figure 3. Block Diagram(s)
Cin : C1005X5R0J225M
Co : C1005X5R0J475M
L : MLP2012V1R0M
●Description of Block(s)
The BZ6Axx06GM are a synchronous step-down DC/DC converter that achieves fast transient response from light load to
heavy load by hysteretic PWM control system and current constant PFM control system.
○PWM control
BZ6Axx06GM operates by hysteretic PWM control. This scheme ensures fast switching, high efficiency, and fast transient
response.
When the output voltage is below the VREF voltage, the error comparator output is low to high and turning on P-channel
MOSFET until above the VREF voltage and minimum on time.
○PFM control
At light load the regulator and MODE=low, the regulator operates with reduced switching frequency and improves the
efficiency.
During PFM operation, the output voltage slightly
higher than typical output voltage.
Figure 4. Operation of PFM mode and PWM mode
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Datasheet
BZ6Axx06GM Series
●Description of operations
1) Shutdown
If the EN input pin set to low (<0.4V), all circuit are shut down and the regulator is standby mode.
Do not leave the EN pin floating.
2) Soft start function
The regulator has a soft start circuit that reduces in-rush current at start-up. Typical start up times with a 4.7uF output
capacitor is 120usec.
3) Current limit
The BZ6Axx06GM has a current limit circuit that protects itself and external components during overload condition.
4) Under Voltage Lock Out (UVLO)
The BZ6Axx06GM has a Under Voltage Lock Out circuit that turn off device when VIN>2.05V(typ.)
5) FORCED PWM MODE
Setting MODE pin high (>1.4V) places the regulator in forced PWM.This control provides noise reduction and output
stability.
Do not leave the MODE pin floating.
6) TSD
The BZ6Axx06GM has a thermal shutdown feature to protect the device if the junction temperature exceeds 150℃.In
thermal shutdown, the DRIVER is disabled.
This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC. Therefore,
the user should not plan to activate this circuit with continued operation in mind.
●Absolute Maximum Ratings
(Ta=25℃)
Parameter
Maximum input power supply voltage
Power dissipation
Symbol
Rating
Unit
VIN
7
V
*1
Pd
0.75
Operating temperature range
Topr
-40 to +85
℃
Storage temperature range
Tstg
-55 to +125
℃
Tjmax
+125
℃
Junction temperature
W
*1 When mounted on the specified PCB (55mm x 63mm), Deducted by 3.9m W/c when used over Ta=25c
●Recommended Operating Rating(s)
Rating
Parameter
Symbol
Input voltage
VIN
2.3
5.5
V
Output current
IOUT
0
0.65
A
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Min.
3/16
Typ.
Max.
Unit
TSZ02201-0F2F0A100020-1-2
24.Jul.2012 Rev.001
Datasheet
BZ6Axx06GM Series
●Electrical Characteristic(s)
(unless otherwise specified VIN=3.6V, Ta=25℃)
Min.
Rating
Typ.
Max.
-2.5
-
+2.5
-2.5
-
+3.5
Tss
65
120
240
usec
Operation
VENH
1.4
-
VIN
V
Non Operation
VENL
0
-
0.4
V
Operation
VMODEH
1.4
-
VIN
V
Forced PWM
Non Operation
VMODEL
0
-
0.4
V
Automatic PFM/PWM
Protect threshold voltage
Uvth
1.95
2.05
2.15
V
Hysteresis
Uvhy
50
100
150
mV
Operating quiescent current
IINS
-
45
72
uA
EN:H, MODE:L,
VOUT=3.6V forced
Not switching
Shutdown current
SHD
-
0
1
uA
EN=0V
Item
Symbol
Unit
Condition
【Switching regulator】
Output voltage accuracy
VOUTA
%
MODE:H(PWM Operation)
MODE:L(PFM Operation)
【Soft start】
Soft start time
【Control】
EN pin control
voltage
MODE pin
control voltage
【UVLO】
【Circuit current】
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Datasheet
BZ6Axx06GM Series
●Electrical characteristic curves (Reference data)
BZ6A1206GM(1.20V OUTPUT)
EN
2V/div
EN
2V/div
20us
VOUT
500mV/div
100us
VOUT
500m/div
Figure 5. Start up
Figure 6. Shut down
Vout
50mV/div
1.2V offset
Vout
50mV/div
1.2V offset
4us
10us
IOUT
200mA/div
IOUT
200mA/div
Figure 8. Load transient response 50mA to 350mA
tr=tf=100ns, MODE : Low
Figure 7. Load transient response 5mA to 200mA
tr=tf=100ns, MODE : Low
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Datasheet
BZ6Axx06GM Series
Vout
50mV/div
ac coupled
Vout
20mV/div
ac coupled
2us
2us
IOUT
100mA/div
IOUT
100mA/div
Figure 10. PWM mode Operation
Iout=50mA
Figure 9. PWM/PFM Auto mode Operation
Iout=50mA
Vout
20mV/div
ac coupled
Vout
50mV/div
ac coupled
2us
2us
IOUT
100mA/div
IOUT
100mA/div
Figure 11. PWM/PFM Auto mode Operation
Iout=100mA
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Figure 12. PWM mode Operation
Iout=100mA
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Datasheet
BZ6Axx06GM Series
Vout
50mV/div
ac coupled
Vout
20mV/div
ac coupled
2us
IOUT
100mA/div
2us
IOUT
100mA/div
Figure 13. PWM/PFM Auto mode Operation
Iout=200mA
Figure 14. PWM mode Operation
Iout=200mA
MODE
2V/div
MODE
2V/div
10us
10us
Vout
50mV/div
ac coupled
Vout
50mV/div
ac coupled
Figure 15. Mode Change Response
MODE : Low to High
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Figure 16. Mode Change Response
MODE : High to Low
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Datasheet
100
100
90
90
80
80
70
70
Efficiency [%]
Efficiency [%]
BZ6Axx06GM Series
60
50
40
VIN=2.5V
VIN=3.6V
VIN=4.2V
30
60
50
40
20
20
10
10
0
0
0.1
1
10
100
VIN=2.5V
VIN=3.6V
VIN=4.2V
30
0.1
1000
1
100
1000
Load current [mA]
Load current [mA]
Figure 18. Efficiency vs Load current
PWM mode
Figure 17. Efficiency vs Load current
PWM/PFM Auto mode
1.224
1.224
1.212
1.212
VIN=4.2
VIN=3.6
VIN=2.5
Output Voltage [V]
Output Voltage [V]
10
1.200
VIN=4.2
VIN=3.6
VIN=2.5
1.200
1.188
1.188
1.176
1.176
0
100
200
300
400
500
600
700
100
200
300
400
500
600
700
Load current [mA]
Load current [mA]
Figure 19. Load regulation
PWM/PFM Auto mode
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0
Figure 20. Load regulation
PWM mode
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Datasheet
BZ6Axx06GM Series
●Electrical characteristic curves (Reference data)
BZ6A7D06GM(1.25V OUTPUT)
EN
2V/div
EN
2V/div
20us
VOUT
500mV/div
100us
VOUT
500m/div
Figure 21. Start up
Figure 22. Shut down
Vout
50mV/div
1.2V offset
Vout
50mV/div
1.2V offset
4us
10us
IOUT
200mA/div
IOUT
200mA/div
Figure 23. Load transient response 5mA to 200mA
tr=tf=100ns, MODE : Low
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Figure 24. Load transient response 50mA to 350mA
tr=tf=100ns, MODE : Low
TSZ02201-0F2F0A100020-1-2
24.Jul.2012 Rev.001
Datasheet
BZ6Axx06GM Series
Vout
50mV/div
ac coupled
Vout
20mV/div
ac coupled
2us
2us
IOUT
100mA/div
IOUT
100mA/div
Figure 25. PWM/PFM Auto mode Operation
Iout=50mA
Figure 26. PWM mode Operation
Iout=50mA
Vout
20mV/div
ac coupled
Vout
50mV/div
ac coupled
2us
2us
IOUT
100mA/div
IOUT
100mA/div
Figure 27. PWM/PFM Auto mode Operation
Iout=100mA
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Figure 28. PWM mode Operation
Iout=100mA
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Datasheet
BZ6Axx06GM Series
Vout
50mV/div
ac coupled
Vout
20mV/div
ac coupled
2us
IOUT
100mA/div
2us
IOUT
100mA/div
Figure 30. PWM mode Operation
Iout=200mA
Figure 29. PWM/PFM Auto mode Operation
Iout=200mA
MODE
2V/div
MODE
2V/div
10us
10us
Vout
50mV/div
ac coupled
Vout
50mV/div
ac coupled
Figure 31. Mode Change Response
MODE : Low to High
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Figure 32. Mode Change Response
MODE : High to Low
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Datasheet
100
100
90
90
80
80
70
70
Efficiency[%]
Efficiency[%]
BZ6Axx06GM Series
60
50
40
VIN=2.5V
VIN=3.6V
VIN=4.2V
30
60
50
40
VIN=2.5V
VIN=3.6V
VIN=4.2V
30
20
20
10
10
0
0
0.1
1
10
100
0.1
1000
1
100
1000
Load current[mA]
Load current[mA]
Figure 34. Efficiency vs Load current
PWM mode
Figure 33. Efficiency vs Load current
PWM/PFM Auto mode
1.2750
1.2750
1.2625
1.2625
VIN=4.2V
VIN=3.6V
VIN=2.5V
Output Voltage[V]
Output Voltage[V]
10
1.2500
1.2500
1.2375
1.2375
1.2250
1.2250
0
100
200
300
400
500
600
700
Load current[mA]
0
100
200
300
400
500
600
700
Load current[mA]
Figure 35. Load regulation
PWM/PFM Auto mode
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VIN=4.2V
VIN=3.6V
VIN=2.5V
Figure 36. Load regulation
PWM mode
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Datasheet
BZ6Axx06GM Series
●PC Board layout
The suggested PCB layout for the BZ6Axx06GM is shown in Figure.
Copper
( Unit : mm )
Resist
opening
0.3
0.8
1.0
A1 pin
Figure 37. Recommended Land Pattern (TOP VIEW)
Figure 38. PCB layout (Mount side)
Figure 39. PCB layout (solder side)
Figure 40. PCB Circuit
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Datasheet
BZ6Axx06GM Series
●Caution of use
1) Absolute maximum ratings
An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2) GND voltage
The potential of GND pin must be minimum potential in all condition. As an exception, the circuit design allows voltages
up to -0.3 V to be applied to the IC pin.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
5) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
6) Mutual impedance
Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize ripple as
much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and
capacitance).
7) Thermal shutdown Circuit (TSD Circuit)
This model IC has a built-in TSD circuit. This circuit is only to cut off the IC from thermal runaway, and has not been design
to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation in mind.
8) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example, as shown in the figures below, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate,
such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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Datasheet
BZ6Axx06GM Series
●Ordering Information
B
Z
Part
Number
6
A
Frequency
6A : 6MHz
x
x
Output
voltage
12 : 1.20V
7D : 1.25V
0
6
Output
current
06 : 0.65A
G
M
Package
GM: BGA-MD
-
TR
Packaging and forming specification
TR: Embossed tape and reel
●Physical Dimension Tape and Reel Information
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Datasheet
BZ6Axx06GM Series
●改訂履歴
Date
Revision
24.Jul.2012
001
Changes
New Release
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
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