Diodes D58V0X4U8LP7 58v unidirectional tvs diode array Datasheet

D58V0M4U8MR
PRODUCT
ADVANCED NEW
INFORMATION
58V UNIDIRECTIONAL TVS DIODE ARRAY
Features
Mechanical Data

2.7kW Peak Pulse Power (tp = 8x20µs)


Provides ESD Protection per IEC 61000-4-2 Standard:
Air ±30kV, Contact ±30kV


4 Channels of ESD Protection and 4 Decoupling Capacitances


Typically Used in Power Over Ethernet PSE Equipment against

Case: SO-8
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Copper leadframe
Line Overvoltages
(Lead Free Plating). Solderable per MIL-STD-202, Method 208

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)

Weight: 0.08 grams (approximate)
SO-8
PS1
PS4
GND
GND
GND
GND
PS2
PS3
Top View
Pin Configuration
Top View
Device Schematic
Ordering Information (Note 4)
D58V0 M X B X XXX- XX
Voltage
Capacitance
5V0: 5.0 Volts X: Extremely Low (<0.5pF)
58V0: 58.0 Volts F: Ultra Low (0.5 ~ 1.0pF)
P: Very Low (1.1 ~ 10pF)
L: Low (10.1 ~ 20pF)
M: Medium (>20pF)
Product
D58V0M4U8MR-13
Notes:
# of Channels
Polarity
# of Pins
Package
1: 1 Channel
2: 2 Channels
4: 4 Channels
6: 6 Channels
B: Bidirectional
(Symmetrical)
U: Unidirectional
A: Bidirectional
(Asymmetrical)
2: 2 Pins
3: 3 Pins
5: 5 Pins
6: 6 Pins
8: 8 Pins
10: 10 Pins
LP3: X3-DFN0603-2
LP: X1-DFN1006-2
LP4: X2-DFN1006-2
WS: SOD323
T: SOD523/SOT523
SO: SOT23/SOT25
W: SOD123/SOT323
TS: TSOT25/TSOT26
S: SOT353/SOT363
V:SOT553/SOT563
Compliance
Standard
Marking
TV58
Reel size(inches)
13
Tape width(mm)
12
Packing
7: 7” reel
7B: 7” reel (DFN1006
Package Only)
13: 13” reel
Quantity per reel
2500/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Top View
8
5
Logo
Part Marking
TV58
Xth week: 01 ~ 53
YY WW
Year: “13” = 2013
1
D58V0M4U8MR
Document number: DS36183 Rev. 2 - 2
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D58V0M4U8MR
Maximum Ratings (@TA = +25°C, unless otherwise specified.), Per Element
Symbol
Value
Unit
Peak Pulse Power Dissipation
Characteristic
PPP
2700
W
8/20µs, Per Figure 1
Peak Pulse Current
IPP
24
A
8/20µs, Per Figure 1
VESD_Contact
VESD_Air
±30
kV
IEC 61000-4-2 Standard
±30
kV
IEC 61000-4-2 Standard
ESD Protection – Air Discharge
Thermal Characteristics
Characteristic
Symbol
Package Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Value
Unit
PD
1.0
W
RθJA
125
°C/W
TJ, TSTG
-65 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Reverse Standoff Voltage
Symbol
Min
Typ
Max
Unit
Test Conditions
VRWM
—
—
58
V
—
Channel Leakage Current (Note 6)
IRM
—
—
0.2
μA
VRWM = 58V
Breakdown Voltage
VBR
64.4
—
71.2
V
IR = 1mA
Clamping Voltage
VCL
—
—
100
V
IPP = 24A, tp = 8/20μS
Channel Input Capacitance
CT
—
55
—
pF
VR = 50V, f = 1MHz
Notes:
5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
100
PPP(TJ INITIAL)/ PPP(TJ INITIAL = 25°C)
110
IPP, PEAK PULSE CURRENT (%Ipp)
PRODUCT
ADVANCED NEW
INFORMATION
ESD Protection – Contact Discharge
Conditions
Peak Value Ipp
Half Value Ipp/2
50
0
8x20 Waveform
as defined by R.E.A.
0
20
40
t, TIME (s)
Figure 1 Pulse Waveform
D58V0M4U8MR
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100
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
TJ (°C)
Figure 2 Peak Power Dissipation vs.
Initial Junction Temperature
175
April 2014
© Diodes Incorporated
D58V0M4U8MR
100.0
100.0
TJ Initial = 25°C
IPP (A)
PPP (kW)
10.0
1.0
1.0
TJ Initial = 25°C
8/20µs
0.1
1.0E-03
0.1
1.0E-01
1.0E+00
1.0E+01
tp (mS)
Figure 3 Peak Pulse Power vs. Exponential Pulse Duration
(TJ Initial = 25°C)
1.0E-02
70
80
90
100
VCL (V)
Figure 4 Clamping Voltage vs. Peak Pulse Current
(Exponential Waveform, Maximum Values)
1.0E+01
1000
f = 1MHz
VOSC = 30mVRMS
TJ = 25°C
IFM (A)
CT (pF)
1.0E+00
100
1.0E-01
TJ = 25°C
TJ = 125°C
10
40
1.0E-02
45
50
55
VR (V)
Figure 5 Capacitance vs. Voltage (typical values)
0
0.5
1
1.5
VFM (V)
Figure 6 Peak Forward Voltage Drop vs.
Peak Forward Current (typical values)
1.E+04
1
VR = VRWM
1.E+03
1.E+02
IR (nA)
Zth(j-a)/ Rth(j-a)
PRODUCT
ADVANCED NEW
INFORMATION
10.0
0.1
1.E+01
1.E+00
1.E-01
0.01
1.0E-03
1.0E-01
1.0E+01
1.0E+03
tP (s)
Figure 7 Relative Variation of Thermal Impedance
Junction Ambient vs. Pulse Duration
D58V0M4U8MR
Document number: DS36183 Rev. 2 - 2
1.E-02
25
100
125
150
TJ (°C)
Figure 8 Leakage Current vs. Junction Temperature
(typical values)
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50
75
April 2014
© Diodes Incorporated
D58V0M4U8MR
Package Outline Dimensions
0.254
PRODUCT
ADVANCED NEW
INFORMATION
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
h
7°~9°
45°
Detail ‘A’
A2 A A3
b
e
D
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0
8

All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
C1
C2
Dimensions
X
Y
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
Y
D58V0M4U8MR
Document number: DS36183 Rev. 2 - 2
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D58V0M4U8MR
IMPORTANT NOTICE
PRODUCT
ADVANCED NEW
INFORMATION
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
D58V0M4U8MR
Document number: DS36183 Rev. 2 - 2
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April 2014
© Diodes Incorporated
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