AVAGO ASDL-4560 High performance infrared emitter (875nm) chipled Datasheet

ASDL-4560
High Performance Infrared Emitter (875nm) ChipLED
Data Sheet
Description
Features
ASDL-4560 Infrared emitter is a 0805 ChipLED SMT
package that is designed for high radiant intensity,
fast switching and low forward voltage applications. It
is optimized for efficiency at emission wavelength of
875nm and encapsulated with a flat lens for wide viewing
angle applications.
• 875nm wavelength
• Industry Standard Footprint:
0805 ChipLED SMT Package
• Top Emitting
• High Brightness
• Low Forward Voltage
• High Pulse Rate
Applications
• High-Speed Machine Automated System
• Remote Control
• High Speed
• Wide Viewing Angle
• Lead Free and ROHS Compliant
• Smoke Detector
• Tape & Reel for automation placement
• Medical Applications
• Non-Contact Position Sensing
• Optical Encoders
Ordering Information
Part Number
Packaging
Shipping Option
ASDL-4650-C22
Tape & Reel
12Kpcs
Package Outline
All Dimensions are in Millimeters
Tape and Reel Dimension
All Dimensions are in Millimeters (Inches)
Absolute Maximum Ratings at 25°C
Parameter
Symbol
Peak Forward Current
Min.
Max
Unit
Reference
IFPK
325
mA
Tp=500ns
Tw= 100ns
Duty Cycle=20%
Continuous Forward Current
IFDC
100
mA
Figure 5
Power Dissipation
PDISS
130
mW
Reverse Voltage
Vr
4
Operating Temperature
TO
-40
LED Junction Temperature
TJ
Lead Soldering Temperature
V
85
°C
110
°C
260 for 5 sec
°C
Ir=10uA
Electrical Characteristics at 25°C
Parameter
Symbol
Forward Voltage
VF
Reverse Voltage
Vr
Min.
Max.
Unit
Condition
1.4
1.45
1.75
2.0
V
V
IF =20mA
IF =50mA
V
IR=10uA
4
Thermal Resistance
Junction to Ambient
Diode Capacitance
Typ.
CO
380
°C/W
50
pF
Vr=0V, f=1MHz
Unit
Condition
IF = 50mA
Optical Characteristics at 25°C
Parameter
Symbol
Min.
Typ.
Max.
Radiant On-Axis Intensity
IE
2.0
2.8
mW/Sr
Viewing Angle
2θ1/2
150
deg
Peak wavelength
λPK
875
nm
IF = 50mA
Spectral Width
Δλ
45
nm
IF = 50mA
Optical Rise Time
tr
15
ns
IFPK=500mA
Duty Factor=20%
Pulse Width=100ns
Optical Fall Time
tf
10
ns
IFPK=500mA
Duty Factor=20%
Pulse Width=100ns
1.2
0.12
1.0
0.10
IF FORWARD CURRENT - A
RELATIVE RADIANT INTENSITY
Typical Electrical / Optical Characteristics Curve (TA = 25°C Unless Otherwise Stated)
0.8
0.6
0.4
0.2
0.08
0.06
0.04
0.02
0.00
0
700
800
900
PEAK WAVELENGTH - nm
1000
Figure 1. Peak Wavelength Vs Relative Radiant Intensity
0
0.5
1
1.5
VF FORWARD VOLTAGE - V
Figure 2. Forward Current Vs Forward Voltage
1
5
0.8
Ie - RELATIVE RADIANT INTENSITY
RADIANT INTENSITY - mW/Sr
6
4
3
2
1
0
0
20
40
60
80
100
120
-0.8
0.6
0.4
0.2
-0.6
-0.4
-0.2
0
0.0
0.2
0.4
FORWARD CURRENT - mA
I FDC MAX - MAXIMUM DC CURRENT PER SEGMENT - mA
Figure 3. Forward Current Vs Radiant Intensity
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
0
20
40
Figure 4. Angular Displacement Vs Relative Radiant Intensity
60
o
80
100
T A - AMBIENT TEMPERATURE - C
Figure 5. Forward Current versus Ambient Temperature derated based on Tj – 110 °C and thermal resistance at 380 °C/W
2
0.6
0.8
Recommended Reflow Profile
MAX 260C
T - TEMPERATURE (°C)
255
R3
230
217
200
180
R2
R4
60 sec to 90 sec
Above 217 C
150
R5
R1
120
80
25
0
P1
HEAT
UP
50
100
150
P2
SOLDER PASTE DRY
200
P3
SOLDER
REFLOW
250
300
P4
COOL DOWN
t-TIME
(SECONDS)
Symbol
DT
Maximum DT/Dtime
or Duration
Heat Up
P1, R1
25°C to 150°C
3°C/s
Solder Paste Dry
P2, R2
150°C to 200°C
100s to 180s
Solder Reflow
P3, R3
P3, R4
200°C to 260°C
260°C to 200°C
3°C/s
-6°C/s
Cool Down
P4, R5
200°C to 25°C
-6°C/s
> 217°C
60s to 90s
260°C
-
-
20s to 40s
25°C to 260°C
8mins
Process Zone
Time maintained above liquidus point , 217°C
Peak Temperature
Time within 5°C of actual Peak Temperature
Time 25°C to Peak Temperature
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different DT/Dtime temperature change rates or duration. The DT/Dtime rates or
duration are detailed in the above table. The temperatures are measured at the component to printed circuit
board connections.
In process zone P1, the PC board and component pins
are heated to a temperature of 150°C to activate the flux
in the solder paste. The temperature ramp up rate, R1,
is limited to 3°C per second to allow for even heating of
both the PC board and component pins.
Process zone P2 should be of sufficient time duration
(100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of
the solder.
Process zone P3 is the solder reflow zone. In zone P3,
the temperature is quickly raised above the liquidus
point of solder to 260°C (500°F) for optimum results. The
dwell time above the liquidus point of solder should be
between 60 and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the
formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within
the solder connections becomes excessive, resulting in
the formation of weak and unreliable connections. The
temperature is then rapidly reduced to a point below
the solidus temperature of the solder to allow the solder
within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze.
The cool down rate, R5, from the liquidus point of the
solder to 25°C (77°F) should not exceed 6°C per second
maximum. This limitation is necessary to allow the PC
board and component pins to change dimensions evenly,
putting minimal stresses on the component.
It is recommended to perform reflow soldering no more
than twice.
Recommended Land Pattern
All Dimensions are in Millimeters (Inches)
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0275EN - August 24, 2007
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