AD ADP1290ACBZ-R7 12 v, 2 a logic controlled high-side power switch Datasheet

12 V, 2 A Logic Controlled
High-Side Power Switch
ADP1290
Data Sheet
TYPICAL APPLICATIONS CIRCUIT
Low RDSON of 40 mΩ
Wide input voltage range: 2.3 V to 13.2 V
2 A continuous operating current, TJ = <85°C
1.2 V logic compatible enable input
Low 15 µA quiescent current, VIN = 3.3 V
Low 19 µA quiescent current, VIN = 6.5 V
Ultralow shutdown current: 2.0 µA at VIN = 6.5 V
Ultrasmall 1.0 mm × 1.5 mm, 6-ball, 0.5 mm pitch WLCSP
VIN
VOUT
+
–
GND
ON
EN OFF
CHARGE
PUMP
APPLICATIONS
ADP1290
Mobile phones
Digital cameras and audio devices
Portable and battery-powered equipment
Figure 1.
LOAD
12529-001
FEATURES
GENERAL DESCRIPTION
The ADP1290 is a high-side load switch designed for operation
between 2.3 V and 13.2 V. This load switch provides power
domain isolation, helping to extend battery operation. The
device contains a low on-resistance, N-channel MOSFET that
supports more than 2 A of continuous current and minimizes
power loss. In addition, RDSON is constant independent of the VIN
voltage. The low 15 µA quiescent current and ultralow shutdown
current of 20 µA make the ADP1290 ideal for battery-operated
portable equipment. The built-in level shifter for enable logic
makes the ADP1290 compatible with many processors and
general-purpose input/output (GPIO) controllers.
Rev. 0
In addition to operating performance, the ADP1290 occupies
minimal printed circuit board (PCB) space with an area of less
than 1.5 mm2 and a height of 0.60 mm.
The ADP1290 is available in an ultrasmall, 1 mm × 1.5 mm,
6-ball, 0.5 mm pitch WLCSP.
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rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
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One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2014 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADP1290
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Theory of Operation .........................................................................9
Applications ....................................................................................... 1
Applications Information .............................................................. 10
Typical Applications Circuit............................................................ 1
Capacitor Selection .................................................................... 10
General Description ......................................................................... 1
Ground Current .......................................................................... 10
Revision History ............................................................................... 2
Enable Feature ............................................................................ 10
Specifications..................................................................................... 3
Timing ......................................................................................... 11
Timing Diagram ........................................................................... 3
Current and Thermal Overload Precautions .......................... 11
Absolute Maximum Ratings............................................................ 4
Thermal Considerations............................................................ 11
Thermal Resistance ...................................................................... 4
Outline Dimensions ....................................................................... 12
ESD Caution .................................................................................. 4
Ordering Guide .......................................................................... 12
Pin Configuration and Function Descriptions ............................. 5
Typical Performance Characteristics ............................................. 6
REVISION HISTORY
12/14—Revision 0: Initial Version
Rev. 0 | Page 2 of 12
Data Sheet
ADP1290
SPECIFICATIONS
VIN = 6.5 V, enable input voltage (VEN) = VIN, IOUT = 2 A, TA = 25°C, TJ = −40°C to +105°C for minimum/maximum specifications, unless
otherwise noted.
Table 1.
Parameter
INPUT VOLTAGE RANGE
EN INPUT
EN Input
EN Input Pull-Down Current
CURRENT
Ground (Quiescent) Current
Shutdown Current
Continuous Operating Current
VIN TO VOUT RESISTANCE
VOUT TURN ON
Turn On Delay Time
Turn On Rise Time
Turn On Time
VOUT TURN OFF
Turn Off Delay Time
Turn Off Fall Time
Turn Off Time
SOURCE DRAIN BODY DIODE
Diode Forward Current
Symbol
VIN
Test Conditions/Comments
Min
2.3
Typ
Max
13.2
Unit
V
0.4
1000
V
V
nA
VIN = 2.3 V to 13.2 V
VIH
VIL
IEN
1.0
15
IGND
VIN = 2.3 V
VIN = 3.3 V
VIN = 6.5 V
VIN = 13.2 V
VEN = 0 V, VIN = 6.5 V, output = high impedance
VEN = 0 V, output voltage (VOUT) = 0 V, VIN = 2.3 V to 13.2 V
VIN = 2.3 V to 13.2 V, TJ = <85°C
10
15
19
20
40
40
40
40
tOFF_DLY
tOFF_FALL
tOFF
VIN = 2.3 V
VIN = 3.3 V
VIN = 6.5 V
VIN = 13.2 V
See Figure 2
VIN = 5.5 V, CLOAD = 10 µF
VIN = 5.5 V, CLOAD = 10 µF
Turn on delay time + turn on rise time
See Figure 2
VIN = 5.5 V, CLOAD = 10 µF, IOUT = 20 mA
VIN = 5.5 V, CLOAD = 10 µF, IOUT = 20 mA
Turn off delay time + turn off fall time
ID
VIN = 0 V, pulse width = 70 µs, duty cycle < 1%, VOUT = 0.9 V
4
IOFF
IOUT
RDSON
tON_DLY
tON_RISE
tON
TURN OFF
DELAY
VOUT
TURN OFF
FALL
Figure 2. Timing Diagram
Rev. 0 | Page 3 of 12
12529-002
10%
TURN ON
RISE
70
70
70
70
mΩ
mΩ
mΩ
mΩ
2000
µs
µs
µs
125
2000
2125
VEN
90%
µA
µA
µA
µA
µA
µA
A
2
250
350
600
TIMING DIAGRAM
TURN ON
DELAY
30
45
45
45
2.0
4.0
µs
µs
µs
6
A
ADP1290
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
VIN to GND
VOUT to GND
EN to GND
Continuous Drain Current
TJ = 70°C
TJ = 105°C
Continuous Diode Current
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Rating
−0.3 V to +16.5 V
−0.3 V to VIN
−0.3 V to +16.5 V
±3 A
±1.6 A
−50 mA
−65°C to +150°C
−40°C to +105°C
JEDEC J-STD-020
θJA is specified for the worst case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3 Thermal Resistance
Package Type
6-Ball, 0.5 mm Pitch WLCSP
ESD CAUTION
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. 0 | Page 4 of 12
θJA
260
ΨJB
58
Unit
°C/W
Data Sheet
ADP1290
1
2
A
VIN
VOUT
B
VIN
VOUT
C
EN
GND
ADP1290
TOP VIEW
(Not to Scale)
12529-003
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
A1, B1
A2, B2
C1
C2
Mnemonic
VIN
VOUT
EN
GND
Description
Input Voltage.
Output Voltage.
Enable Input. Drive the EN pin high to turn on the switch. Drive the EN pin low to turn off the switch.
Ground.
Rev. 0 | Page 5 of 12
ADP1290
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 6.5 V, VEN = VIN, CIN = COUT = 0 µF, TA = 25°C, unless otherwise noted.
0.08
100
90
0.07
VIN = 2.3V
VIN = 5.0V
VIN = 6.5V
VIN = 12.0V
80
VOLTAGE DROP (mV)
RDSON (Ω)
0.06
0.05
0.04
0.03
ILOAD
ILOAD
ILOAD
ILOAD
ILOAD
ILOAD
70
60
50
= 50mA
= 100mA
= 200mA
= 500mA
= 1000mA
= 2000mA
40
30
0.02
12529-004
0
–50
–30
–10
10
30
50
TEMPERATURE (°C)
70
90
10
0
110
2
6
4
10
12
14
Figure 7. Voltage Drop vs. Input Voltage (VIN), Different Load Currents (ILOAD)
10
0.08
9
0.07
VIN = 2.3V
VIN = 5.0V
VIN = 6.5V
VIN = 12.0V
8
GROUND CURRENT (µA)
0.06
0.05
0.04
0.03
0.02
7
6
5
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 500mA
ILOAD = 1000mA
ILOAD = 2000mA
4
3
12529-005
0
–50
–30
–10
50
10
30
TEMPERATURE (°C)
70
90
12529-008
2
0.01
1
0
–40
110
Figure 5. RDSON vs. Temperature, 2 A, Different Input Voltages (VIN)
–5
25
TEMPERATURE (°C)
85
105
Figure 8. Ground Current vs. Temperature, Different Load Currents,
VIN = 2.3 V
0.050
25
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 500mA
ILOAD = 1000mA
ILOAD = 2000mA
20
GROUND CURRENT (µA)
0.045
0.040
ILOAD
ILOAD
ILOAD
ILOAD
ILOAD
ILOAD
0.030
2
4
6
8
10
5
12529-006
0.035
= 50mA
= 100mA
= 200mA
= 500mA
= 1000mA
= 2000mA
15
10
12
0
–40
14
VIN (V)
12529-009
RDSON (Ω)
8
VIN (V)
Figure 4. RDSON vs. Temperature, 50 mA, Different Input Voltages (VIN)
RDSON (Ω)
12529-007
20
0.01
–5
25
TEMPERATURE (°C)
85
105
Figure 9. Ground Current vs. Temperature, Different Load Currents,
VIN = 6.5 V
Figure 6. RDSON vs. Input Voltage (VIN), Different Load Currents (ILOAD)
Rev. 0 | Page 6 of 12
Data Sheet
ADP1290
1.00
GROUND CURRENT (µA)
SHUTDOWN CURRENT (I OFF) (µA)
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 500mA
ILOAD = 1000mA
ILOAD = 2000mA
20
15
10
12529-010
5
0
–40
–5
25
TEMPERATURE (°C)
85
0.01
–50
105
Figure 10. Ground Current vs. Temperature, Different Load Currents,
VIN = 13.2 V
25
GROUND CURRENT (µA)
15
–30
–10
50
10
30
TEMPERATURE (°C)
70
90
110
Figure 13. Ground Shutdown Current vs. Temperature, VOUT = 0 V,
Different Input Voltages (VIN)
VIN = 2.3V
VIN = 2.5V
VIN = 3.0V
VIN = 4.0V
VIN = 5.0V
VIN = 6.5V
VIN = 8.0V
VIN = 10.0V
VIN = 12.0V
VIN = 13.2V
20
VIN = 2.3V
VIN = 2.5V
VIN = 3.0V
VIN = 4.0V
VIN = 5.0V
VIN = 6.5V
VIN = 8.0V
VIN = 10.0V
VIN = 12.0V
VIN = 13.2V
0.10
12529-013
25
EN
1
INPUT CURRENT
3
10
OUTPUT
5
0
10
100
1000
12529-014
12529-011
2
CH1 2.00V BW CH2 1.00V BW M400µs
T 10.40%
CH3 200mAΩ BW
10000
ILOAD (mA)
Figure 11. Ground Current vs. Load Current (ILOAD), Different Input Voltages (VIN)
A CH4
1.04V
Figure 14. Typical Turn On Time and Inrush Current, VIN = 2.3 V,
COUT = 100 μF, RLOAD = 100 Ω
10
EN
INPUT CURRENT
1
3
0.1
0.01
–50
–30
–10
10
30
50
TEMPERATURE (°C)
70
90
OUTPUT
2
12529-015
VIN = 2.3V
VIN = 2.5V
VIN = 3.0V
VIN = 4.0V
VIN = 5.0V
VIN = 6.5V
VIN = 8.0V
VIN = 10.0V
VIN = 12.0V
VIN = 13.2V
12529-012
SHUTDOWN CURRENT (I OFF) (µA)
1
CH1 2.00V BW CH2 2.00V BW M400µs
T 10.40%
CH3 1.00AΩ BW
110
A CH4
1.04V
Figure 15. Typical Turn On Time and Inrush Current, VIN = 6.5 V,
COUT = 100 μF, RLOAD = 100 Ω
Figure 12. Ground Shutdown Current vs. Temperature, Output Open,
Different Input Voltages (VIN)
Rev. 0 | Page 7 of 12
ADP1290
Data Sheet
EN
EN
1
1
INPUT CURRENT
INPUT CURRENT
3
3
OUTPUT
OUTPUT
CH1 2.00V BW CH2 5.00V BW M400µs
T 10.40%
CH3 1.00AΩ BW
A CH4
12529-018
2
12529-016
2
CH1 2.00V BW CH2 2.00V BW M400µs
T 10.40%
CH3 100mAΩ BW
1.04V
Figure 16. Typical Turn On Time and Inrush Current, VIN = 13.2 V,
COUT = 100 μF, RLOAD = 100 Ω
A CH4
1.04V
Figure 18. Typical Turn On Time and Inrush Current, VIN = 6.5 V,
COUT = 10 μF, RLOAD = 100 Ω
EN
1
1
INPUT CURRENT
3
3
OUTPUT
CH1 2.00V BW CH2 1.00V BW M400µs
T 10.40%
CH3 50.0mAΩ BW
A CH4
12529-019
2
12529-017
2
CH1 2.00V BW CH2 5.00V BW M400µs
T 10.40%
CH3 200mAΩ BW
1.04V
Figure 17. Typical Turn On Time and Inrush Current, VIN = 2.3 V,
COUT = 10 μF, RLOAD = 100 Ω
A CH4
1.04V
Figure 19. Typical Turn On Time and Inrush Current, VIN = 13.2 V,
COUT = 10 μF, RLOAD = 100 Ω
Rev. 0 | Page 8 of 12
Data Sheet
ADP1290
THEORY OF OPERATION
The ADP1290 is a high-side NMOS load switch, controlled by
an internal charge pump. The ADP1290 is designed to operate
with power supply voltages between 2.3 V and 13.2 V.
The ADP1290 is capable of 2 A of continuous current as long as
TJ is less than 85°C. Between 85°C and 105°C, the rated current
decreases linearly to 1.6 A.
An internal charge pump biases the NMOS switch to achieve a
relatively constant, ultralow on resistance of 40 mΩ across the
entire input voltage range. The use of the internal charge pump
also allows controlled turn on times. Turning the NMOS switch on
and off is controlled by the enable input, EN, which is capable of
interfacing directly with 1.2 V logic signals.
ESD protection structures are shown in the block diagram as
Zener diodes.
VIN
The ADP1290 is a low quiescent current device with a weak 15 nA
pull-down current sink on its enable pin (EN).
The ADP1290 is available in a space-saving 1.0 mm × 1.5 mm,
0.5 mm pitch, 6-ball WLCSP.
VOUT
GND
CHARGE PUMP
AND
SLEW RATE CONTROL
12529-020
EN
Figure 20. Functional Block Diagram
Rev. 0 | Page 9 of 12
ADP1290
Data Sheet
APPLICATIONS INFORMATION
CAPACITOR SELECTION
ENABLE FEATURE
Output Capacitor
The ADP1290 uses the EN pin to enable and disable the VOUT
pin under normal operating conditions. As shown in Figure 22,
when a rising voltage (VEN) on the EN pin crosses the active
threshold, the VOUT pin turns on. When a falling voltage (VEN)
on the EN pin crosses the inactive threshold, the VOUT pin
turns off.
The ADP1290 is designed for operation with small, spacesaving ceramic capacitors but functions with most commonly
used capacitors when the effective series resistance (ESR) value
is carefully considered. The ESR of the output capacitor affects
the response to load transients. A typical 1 µF capacitor with an
ESR of 0.1 Ω or less is recommended for good transient response.
Using a larger value of output capacitance improves the transient
response to large changes in load current.
6
5
Input Bypass Capacitor
4
VOUT (V)
Connecting at least 1 µF of capacitance from VIN to GND reduces
the circuit sensitivity to the PCB layout, especially when high
source impedance or long input traces are encountered. When
an output capacitance of greater than 1 µF is required, increase
the input capacitor to match it.
VEN RISING
0
0.50 0.55
GROUND CURRENT (µA)
0.95
1.00
0.7
14
INPUT VOLTAGE (V)
Figure 21. Ground Current vs. Input Voltage (VIN), Different Load Currents (ILOAD)
0.6
EN RISE
EN FALL
0.5
0.4
0.3
0.2
0.1
12529-023
12
0.90
0.8
ENABLE THRESHOLD (V)
10
0.85
0.9
12529-021
8
0.80
The EN pin rising and falling thresholds derive from the VIN
voltage; therefore, these thresholds vary with the changing input
voltage. Figure 23 shows the typical EN rising and falling
thresholds when the input voltage varies from 2.3 V to 13.2 V.
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 500mA
ILOAD = 1000mA
ILOAD = 2000mA
6
0.75
As shown in Figure 22, the EN pin has hysteresis built into it.
The hysteresis prevents on/off oscillations that can occur due to
noise on the EN pin as it passes through the threshold points.
15
4
0.70
Figure 22. Typical EN Operation
20
5
0.60 0.65
ENABLE VOLTAGE (V)
25
10
12529-022
1
The major source for ground current in the ADP1290 is the
internal charge pump for the FET drive circuitry. Figure 21
shows the typical ground current when VEN = VIN and varies
from 2.3 V to 13.2 V.
2
VEN FALLING
2
GROUND CURRENT
0
VOUT AT 2.3V
VOUT AT 5.0V
3
0
2
4
6
8
10
12
14
VIN (V)
Figure 23. Typical EN Thresholds (Rising and Falling) vs. Input Voltage (VIN)
Rev. 0 | Page 10 of 12
Data Sheet
ADP1290
TIMING
Turn on delay is defined as the interval between the time that
VEN exceeds the rising threshold voltage and when VOUT rises to
~10% of its final value. The ADP1290 includes circuitry that has
a typical 250 μs turn on delay and a controlled rise time to limit
the VIN inrush current. As shown in Figure 24 and Figure 25,
the turn on delay is nearly independent of the input voltage.
Figure 26 and Figure 27 show the typical turn off times with
VIN = 6.5 V, COUT = 10 μF and 100 μF, and RLOAD = 100 Ω.
EN
1
EN
1
OUTPUT
INPUT CURRENT
3
12529-026
2
OUTPUT
CH1 2.00V BW CH2 2.00V BW M400µs
T 10.40%
A CH4
1.04V
Figure 26. Typical Turn Off Time, COUT = 10 μF, RLOAD = 100 Ω
12529-024
2
CH1 2.00V BW CH2 2.00V BW M400µs
T 10.40%
CH3 100mAΩ BW
A CH4
1.04V
EN
Figure 24. Typical Turn On Time and Inrush Current, VIN = 2.5 V,
COUT = 10 μF, RLOAD = 100 Ω
1
EN
1
INPUT CURRENT
OUTPUT
3
12529-027
2
CH1 1.00V BW CH2 2.00V BW M400µs
T 10.40%
OUTPUT
A CH4
1.08V
Figure 27. Typical Turn Off Time, COUT = 100 μF, RLOAD = 100 Ω
CURRENT AND THERMAL OVERLOAD
PRECAUTIONS
12529-025
2
CH1 2.00V BW CH2 5.00V BW M400µs
T 10.40%
CH3 200mAΩ BW
A CH4
1.04V
Figure 25. Typical Turn On Time and Inrush Current, VIN = 6.5 V,
COUT = 10 μF, RLOAD = 100 Ω
The rise time is defined as the time it takes the output voltage
to rise from 10% to 90% of VOUT reaching its final value. The turn
on delay is dependent on the rise time of the internal charge pump.
For very large values of output capacitance, the RC time constant
(where C is the load capacitance, CLOAD, and R is the RDSON||RLOAD)
can become a factor in the rise time of the output voltage. Because
RDSON is much smaller than RLOAD, an adequate approximation for
RC is RDSON × CLOAD. An input or load capacitor is not required for
the ADP1290; however, capacitors can suppress noise on the board.
The turn off time is defined as the time it takes for the output
voltage to fall from 90% to 10% of VOUT reaching its final value. The
turn off time is also dependent on the RC time constant of the
output capacitance (CLOAD) and load resistance (RLOAD).
The ADP1290 is not protected against damage due to excessive
power dissipation and does not have thermal overload protection
circuits. To prevent permanent damage, never allow current
through the ADP1290 to exceed its rated value for more than a
few milliseconds. Permanent damage can also occur if the
output is shorted to ground
THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of the
ADP1290 must not exceed 105°C. To ensure that the junction
temperature stays below this maximum value, the user must be
aware of the parameters that contribute to junction temperature
changes. These parameters include ambient temperature, power
dissipation in the power device, and thermal resistances between
the junction and ambient air (θJA). The θJA number is dependent
on the package assembly and the amount of copper used to solder
the package pins to the PCB.
Rev. 0 | Page 11 of 12
ADP1290
Data Sheet
OUTLINE DIMENSIONS
1.000
0.950
0.900
2
1
A
BALL A1
IDENTIFIER
1.500
1.450
1.400
1.00
REF
C
0.50
BSC
TOP VIEW
(BALL SIDE DOWN)
0.675
0.595
0.515
B
0.50 BSC
BOTTOM VIEW
0.380
0.355
0.330
SIDE VIEW
(BALL SIDE UP)
0.345
0.295
0.245
SEATING
PLANE
0.270
0.240
0.210
11-08-2012-B
COPLANARITY
0.075
Figure 28. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADP1290ACBZ-R7
ADP1290CB-EVALZ
1
Temperature Range
−40°C to +105°C
Package Description
6-Ball Wafer Level Chip Scale Package [WLCSP]
Evaluation Board
Z = RoHS Compliant Part.
©2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12529-0-12/14(0)
Rev. 0 | Page 12 of 12
Package Option
CB-6-2
Branding
CL
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