Altera EP1C6F400I8ES Section i. cyclone fpga family data sheet Datasheet

Section I. Cyclone FPGA
Family Data Sheet
This section provides designers with the data sheet specifications for
Cyclone® devices. The chapters contain feature definitions of the internal
architecture, configuration and JTAG boundary-scan testing information,
DC operating conditions, AC timing parameters, a reference to power
consumption, and ordering information for Cyclone devices.
This section contains the following chapters:
Revision History
Altera Corporation
■
Chapter 1. Introduction
■
Chapter 2. Cyclone Architecture
■
Chapter 3. Configuration and Testing
■
Chapter 4. DC and Switching Characteristics
■
Chapter 5. Reference and Ordering Information
Refer to each chapter for its own specific revision history. For information
on when each chapter was updated, refer to the Chapter Revision Dates
section, which appears in the complete handbook.
Section I–1
Preliminary
Revision History
Section I–2
Preliminary
Cyclone Device Handbook, Volume 1
Altera Corporation
1. Introduction
C51001-1.5
Introduction
The Cyclone® field programmable gate array family is based on a 1.5-V,
0.13-μm, all-layer copper SRAM process, with densities up to
20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like
phase-locked loops (PLLs) for clocking and a dedicated double data rate
(DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM)
memory requirements, Cyclone devices are a cost-effective solution for
data-path applications. Cyclone devices support various I/O standards,
including LVDS at data rates up to 640 megabits per second (Mbps), and
66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI),
for interfacing with and supporting ASSP and ASIC devices. Altera also
offers new low-cost serial configuration devices to configure Cyclone
devices.
Features
The Cyclone device family offers the following features:
■
■
■
■
■
■
■
■
■
■
■
■
2,910 to 20,060 LEs, see Table 1–1
Up to 294,912 RAM bits (36,864 bytes)
Supports configuration through low-cost serial configuration device
Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards
Support for 66- and 33-MHz, 64- and 32-bit PCI standard
High-speed (640 Mbps) LVDS I/O support
Low-speed (311 Mbps) LVDS I/O support
311-Mbps RSDS I/O support
Up to two PLLs per device provide clock multiplication and phase
shifting
Up to eight global clock lines with six clock resources available per
logic array block (LAB) row
Support for external memory, including DDR SDRAM (133 MHz),
FCRAM, and single data rate (SDR) SDRAM
Support for multiple intellectual property (IP) cores, including
Altera® MegaCore® functions and Altera Megafunctions Partners
Program (AMPPSM) megafunctions.
Table 1–1. Cyclone Device Features (Part 1 of 2)
Feature
LEs
M4K RAM blocks (128 × 36 bits)
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May 2008
EP1C3
EP1C4
EP1C6
EP1C12
EP1C20
2,910
4,000
5,980
12,060
20,060
13
17
20
52
64
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Table 1–1. Cyclone Device Features (Part 2 of 2)
Feature
Total RAM bits
EP1C3
EP1C4
EP1C6
EP1C12
EP1C20
59,904
78,336
92,160
239,616
294,912
PLLs
Maximum user I/O pins (1)
1
2
2
2
2
104
301
185
249
301
Note to Table 1–1:
(1)
This parameter includes global clock pins.
Cyclone devices are available in quad flat pack (QFP) and space-saving
FineLine® BGA packages (see Tables 1–2 through 1–3).
Table 1–2. Cyclone Package Options and I/O Pin Counts
Device
100-Pin TQFP 144-Pin TQFP 240-Pin PQFP
256-Pin
324-Pin
400-Pin
(1)
(1), (2)
(1)
FineLine BGA FineLine BGA FineLine BGA
EP1C3
65
104
—
—
—
—
EP1C4
—
—
—
—
249
301
EP1C6
—
98
185
185
—
—
EP1C12
—
—
173
185
249
—
EP1C20
—
—
—
—
233
301
Notes to Table 1–2:
(1)
(2)
TQFP: thin quad flat pack.
PQFP: plastic quad flat pack.
Cyclone devices support vertical migration within the same package (i.e., designers can migrate between the
EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package).
Vertical migration means you can migrate a design from one device to
another that has the same dedicated pins, JTAG pins, and power pins, and
are subsets or supersets for a given package across device densities. The
largest density in any package has the highest number of power pins; you
must use the layout for the largest planned density in a package to
provide the necessary power pins for migration.
For I/O pin migration across densities, cross-reference the available I/O
pins using the device pin-outs for all planned densities of a given package
type to identify which I/O pins can be migrated. The Quartus® II
software can automatically cross-reference and place all pins for you
when given a device migration list. If one device has power or ground
pins, but these same pins are user I/O on a different device that is in the
migration path,the Quartus II software ensures the pins are not used as
user I/O in the Quartus II software. Ensure that these pins are connected
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Preliminary
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May 2008
Document Revision History
to the appropriate plane on the board. The Quartus II software reserves
I/O pins as power pins as necessary for layout with the larger densities
in the same package having more power pins.
Table 1–3. Cyclone QFP and FineLine BGA Package Sizes
100-Pin
TQFP
Dimension
144-Pin
TQFP
240-Pin
PQFP
256-Pin
FineLine
BGA
324-Pin
FineLine
BGA
400-Pin
FineLine
BGA
Pitch (mm)
0.5
0.5
0.5
1.0
1.0
1.0
Area (mm2)
256
484
1,024
289
361
441
16×16
22×22
34.6×34.6
17×17
19×19
21×21
Length × width
(mm × mm)
Document
Revision History
Table 1–4 shows the revision history for this document.
Table 1–4. Document Revision History
Date and
Document
Version
Changes Made
Summary of Changes
May 2008
v1.5
Minor textual and style changes.
—
January 2007
v1.4
Added document revision history.
—
August 2005
v1.3
Minor updates.
—
October 2003
v1.2
Added 64-bit PCI support information.
—
September
2003 v1.1
●
May 2003 v1.0
Added document to Cyclone Device Handbook.
●
Altera Corporation
May 2008
Updated LVDS data rates to 640 Mbps from 311 Mbps.
Updated RSDS feature information.
—
—
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Cyclone Device Handbook, Volume 1
1–4
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May 2008
2. Cyclone Architecture
C51002-1.6
Functional
Description
Cyclone® devices contain a two-dimensional row- and column-based
architecture to implement custom logic. Column and row interconnects
of varying speeds provide signal interconnects between LABs and
embedded memory blocks.
The logic array consists of LABs, with 10 LEs in each LAB. An LE is a
small unit of logic providing efficient implementation of user logic
functions. LABs are grouped into rows and columns across the device.
Cyclone devices range between 2,910 to 20,060 LEs.
M4K RAM blocks are true dual-port memory blocks with 4K bits of
memory plus parity (4,608 bits). These blocks provide dedicated true
dual-port, simple dual-port, or single-port memory up to 36-bits wide at
up to 250 MHz. These blocks are grouped into columns across the device
in between certain LABs. Cyclone devices offer between 60 to 288 Kbits of
embedded RAM.
Each Cyclone device I/O pin is fed by an I/O element (IOE) located at the
ends of LAB rows and columns around the periphery of the device. I/O
pins support various single-ended and differential I/O standards, such as
the 66- and 33-MHz, 64- and 32-bit PCI standard and the LVDS I/O
standard at up to 640 Mbps. Each IOE contains a bidirectional I/O buffer
and three registers for registering input, output, and output-enable
signals. Dual-purpose DQS, DQ, and DM pins along with delay chains
(used to phase-align DDR signals) provide interface support with
external memory devices such as DDR SDRAM, and FCRAM devices at
up to 133 MHz (266 Mbps).
Cyclone devices provide a global clock network and up to two PLLs. The
global clock network consists of eight global clock lines that drive
throughout the entire device. The global clock network can provide
clocks for all resources within the device, such as IOEs, LEs, and memory
blocks. The global clock lines can also be used for control signals. Cyclone
PLLs provide general-purpose clocking with clock multiplication and
phase shifting as well as external outputs for high-speed differential I/O
support.
Figure 2–1 shows a diagram of the Cyclone EP1C12 device.
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May 2008
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Cyclone Device Handbook, Volume 1
Figure 2–1. Cyclone EP1C12 Device Block Diagram
IOEs
Logic Array
EP1C12 Device
PLL
M4K Blocks
The number of M4K RAM blocks, PLLs, rows, and columns vary per
device. Table 2–1 lists the resources available in each Cyclone device.
Table 2–1. Cyclone Device Resources
M4K RAM
Device
PLLs
LAB Columns
LAB Rows
13
1
24
13
17
2
26
17
Columns
Blocks
EP1C3
1
EP1C4
1
EP1C6
1
20
2
32
20
EP1C12
2
52
2
48
26
EP1C20
2
64
2
64
32
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Logic Array Blocks
Logic Array
Blocks
Each LAB consists of 10 LEs, LE carry chains, LAB control signals, a local
interconnect, look-up table (LUT) chain, and register chain connection
lines. The local interconnect transfers signals between LEs in the same
LAB. LUT chain connections transfer the output of one LE's LUT to the
adjacent LE for fast sequential LUT connections within the same LAB.
Register chain connections transfer the output of one LE's register to the
adjacent LE's register within a LAB. The Quartus® II Compiler places
associated logic within a LAB or adjacent LABs, allowing the use of local,
LUT chain, and register chain connections for performance and area
efficiency. Figure 2–2 details the Cyclone LAB.
Figure 2–2. Cyclone LAB Structure
Row Interconnect
Column Interconnect
Direct link
interconnect from
adjacent block
Direct link
interconnect from
adjacent block
Direct link
interconnect to
adjacent block
Direct link
interconnect to
adjacent block
LAB
Local Interconnect
LAB Interconnects
The LAB local interconnect can drive LEs within the same LAB. The LAB
local interconnect is driven by column and row interconnects and LE
outputs within the same LAB. Neighboring LABs, PLLs, and M4K RAM
blocks from the left and right can also drive a LAB's local interconnect
through the direct link connection. The direct link connection feature
minimizes the use of row and column interconnects, providing higher
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Cyclone Device Handbook, Volume 1
performance and flexibility. Each LE can drive 30 other LEs through fast
local and direct link interconnects. Figure 2–3 shows the direct link
connection.
Figure 2–3. Direct Link Connection
Direct link interconnect from
left LAB, M4K memory
block, PLL, or IOE output
Direct link interconnect from
right LAB, M4K memory
block, PLL, or IOE output
Direct link
interconnect
to right
Direct link
interconnect
to left
Local
Interconnect
LAB
LAB Control Signals
Each LAB contains dedicated logic for driving control signals to its LEs.
The control signals include two clocks, two clock enables, two
asynchronous clears, synchronous clear, asynchronous preset/load,
synchronous load, and add/subtract control signals. This gives a
maximum of 10 control signals at a time. Although synchronous load and
clear signals are generally used when implementing counters, they can
also be used with other functions.
Each LAB can use two clocks and two clock enable signals. Each LAB's
clock and clock enable signals are linked. For example, any LE in a
particular LAB using the labclk1 signal will also use labclkena1. If
the LAB uses both the rising and falling edges of a clock, it also uses both
LAB-wide clock signals. Deasserting the clock enable signal will turn off
the LAB-wide clock.
Each LAB can use two asynchronous clear signals and an asynchronous
load/preset signal. The asynchronous load acts as a preset when the
asynchronous load data input is tied high.
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Logic Elements
With the LAB-wide addnsub control signal, a single LE can implement a
one-bit adder and subtractor. This saves LE resources and improves
performance for logic functions such as DSP correlators and signed
multipliers that alternate between addition and subtraction depending
on data.
The LAB row clocks [5..0] and LAB local interconnect generate the
LAB-wide control signals. The MultiTrackTM interconnect's inherent low
skew allows clock and control signal distribution in addition to data.
Figure 2–4 shows the LAB control signal generation circuit.
Figure 2–4. LAB-Wide Control Signals
Dedicated
LAB Row
Clocks
6
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Logic Elements
Altera Corporation
May 2008
labclkena2
labclkena1
labclk1
labclk2
labclr2
syncload
asyncload
or labpre
labclr1
addnsub
synclr
The smallest unit of logic in the Cyclone architecture, the LE, is compact
and provides advanced features with efficient logic utilization. Each LE
contains a four-input LUT, which is a function generator that can
implement any function of four variables. In addition, each LE contains a
programmable register and carry chain with carry select capability. A
single LE also supports dynamic single bit addition or subtraction mode
selectable by a LAB-wide control signal. Each LE drives all types of
interconnects: local, row, column, LUT chain, register chain, and direct
link interconnects. See Figure 2–5.
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Figure 2–5. Cyclone LE
Register chain
routing from
previous LE
LAB-wide
Register Bypass
Synchronous
Load
LAB-wide
Packed
Synchronous
Register Select
Clear
LAB Carry-In
addnsub
Carry-In1
Carry-In0
Programmable
Register
LUT chain
routing to next LE
data1
data2
data3
Look-Up
Table
(LUT)
Carry
Chain
Synchronous
Load and
Clear Logic
PRN/ALD
D
Q
ADATA
Row, column,
and direct link
routing
data4
ENA
CLRN
labclr1
labclr2
labpre/aload
Chip-Wide
Reset
Asynchronous
Clear/Preset/
Load Logic
Row, column,
and direct link
routing
Local Routing
Clock &
Clock Enable
Select
Register
Feedback
Register chain
output
labclk1
labclk2
labclkena1
labclkena2
Carry-Out0
Carry-Out1
LAB Carry-Out
Each LE's programmable register can be configured for D, T, JK, or SR
operation. Each register has data, true asynchronous load data, clock,
clock enable, clear, and asynchronous load/preset inputs. Global signals,
general-purpose I/O pins, or any internal logic can drive the register's
clock and clear control signals. Either general-purpose I/O pins or
internal logic can drive the clock enable, preset, asynchronous load, and
asynchronous data. The asynchronous load data input comes from the
data3 input of the LE. For combinatorial functions, the LUT output
bypasses the register and drives directly to the LE outputs.
Each LE has three outputs that drive the local, row, and column routing
resources. The LUT or register output can drive these three outputs
independently. Two LE outputs drive column or row and direct link
routing connections and one drives local interconnect resources. This
allows the LUT to drive one output while the register drives another
output. This feature, called register packing, improves device utilization
because the device can use the register and the LUT for unrelated
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Logic Elements
functions. Another special packing mode allows the register output to
feed back into the LUT of the same LE so that the register is packed with
its own fan-out LUT. This provides another mechanism for improved
fitting. The LE can also drive out registered and unregistered versions of
the LUT output.
LUT Chain and Register Chain
In addition to the three general routing outputs, the LEs within a LAB
have LUT chain and register chain outputs. LUT chain connections allow
LUTs within the same LAB to cascade together for wide input functions.
Register chain outputs allow registers within the same LAB to cascade
together. The register chain output allows a LAB to use LUTs for a single
combinatorial function and the registers to be used for an unrelated shift
register implementation. These resources speed up connections between
LABs while saving local interconnect resources. “MultiTrack
Interconnect” on page 2–12 for more information on LUT chain and
register chain connections.
addnsub Signal
The LE's dynamic adder/subtractor feature saves logic resources by
using one set of LEs to implement both an adder and a subtractor. This
feature is controlled by the LAB-wide control signal addnsub. The
addnsub signal sets the LAB to perform either A + B or A −B. The LUT
computes addition; subtraction is computed by adding the two's
complement of the intended subtractor. The LAB-wide signal converts to
two's complement by inverting the B bits within the LAB and setting
carry-in = 1 to add one to the least significant bit (LSB). The LSB of an
adder/subtractor must be placed in the first LE of the LAB, where the
LAB-wide addnsub signal automatically sets the carry-in to 1. The
Quartus II Compiler automatically places and uses the adder/subtractor
feature when using adder/subtractor parameterized functions.
LE Operating Modes
The Cyclone LE can operate in one of the following modes:
■
■
Normal mode
Dynamic arithmetic mode
Each mode uses LE resources differently. In each mode, eight available
inputs to the LE⎯the four data inputs from the LAB local interconnect,
carry-in0 and carry-in1 from the previous LE, the LAB carry-in
from the previous carry-chain LAB, and the register chain connection⎯are
directed to different destinations to implement the desired logic function.
LAB-wide signals provide clock, asynchronous clear, asynchronous
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preset/load, synchronous clear, synchronous load, and clock enable
control for the register. These LAB-wide signals are available in all LE
modes. The addnsub control signal is allowed in arithmetic mode.
The Quartus II software, in conjunction with parameterized functions
such as library of parameterized modules (LPM) functions, automatically
chooses the appropriate mode for common functions such as counters,
adders, subtractors, and arithmetic functions. If required, you can also
create special-purpose functions that specify which LE operating mode to
use for optimal performance.
Normal Mode
The normal mode is suitable for general logic applications and
combinatorial functions. In normal mode, four data inputs from the LAB
local interconnect are inputs to a four-input LUT (see Figure 2–6). The
Quartus II Compiler automatically selects the carry-in or the data3
signal as one of the inputs to the LUT. Each LE can use LUT chain
connections to drive its combinatorial output directly to the next LE in the
LAB. Asynchronous load data for the register comes from the data3
input of the LE. LEs in normal mode support packed registers.
Figure 2–6. LE in Normal Mode
sload
sclear
(LAB Wide) (LAB Wide)
aload
(LAB Wide)
Register chain
connection
addnsub (LAB Wide)
(1)
data1
data2
data3
cin (from cout
of previous LE)
4-Input
LUT
ALD/PRE
ADATA Q
D
Row, column, and
direct link routing
ENA
CLRN
Row, column, and
direct link routing
clock (LAB Wide)
ena (LAB Wide)
data4
Local routing
aclr (LAB Wide)
LUT chain
connection
Register
chain output
Register Feedback
Note to Figure 2–6:
(1)
This signal is only allowed in normal mode if the LE is at the end of an adder/subtractor chain.
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Logic Elements
Dynamic Arithmetic Mode
The dynamic arithmetic mode is ideal for implementing adders, counters,
accumulators, wide parity functions, and comparators. An LE in dynamic
arithmetic mode uses four 2-input LUTs configurable as a dynamic
adder/subtractor. The first two 2-input LUTs compute two summations
based on a possible carry-in of 1 or 0; the other two LUTs generate carry
outputs for the two chains of the carry select circuitry. As shown in
Figure 2–7, the LAB carry-in signal selects either the carry-in0 or
carry-in1 chain. The selected chain's logic level in turn determines
which parallel sum is generated as a combinatorial or registered output.
For example, when implementing an adder, the sum output is the
selection of two possible calculated sums:
data1 + data2 + carry-in0
or
data1 + data2 + carry-in1
The other two LUTs use the data1 and data2 signals to generate two
possible carry-out signals⎯one for a carry of 1 and the other for a carry of
0. The carry-in0 signal acts as the carry select for the carry-out0
output and carry-in1 acts as the carry select for the carry-out1
output. LEs in arithmetic mode can drive out registered and unregistered
versions of the LUT output.
The dynamic arithmetic mode also offers clock enable, counter enable,
synchronous up/down control, synchronous clear, synchronous load,
and dynamic adder/subtractor options. The LAB local interconnect data
inputs generate the counter enable and synchronous up/down control
signals. The synchronous clear and synchronous load options are
LAB-wide signals that affect all registers in the LAB. The Quartus II
software automatically places any registers that are not used by the
counter into other LABs. The addnsub LAB-wide signal controls
whether the LE acts as an adder or subtractor.
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May 2008
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Figure 2–7. LE in Dynamic Arithmetic Mode
LAB Carry-In
sload
sclear
(LAB Wide) (LAB Wide)
Register chain
connection
Carry-In0
Carry-In1
addnsub
(LAB Wide)
(1)
data1
data2
data3
LUT
LUT
LUT
aload
(LAB Wide)
ALD/PRE
ADATA Q
D
Row, column, and
direct link routing
ENA
CLRN
Row, column, and
direct link routing
clock (LAB Wide)
ena (LAB Wide)
Local routing
aclr (LAB Wide)
LUT chain
connection
LUT
Register
chain output
Register Feedback
Carry-Out0 Carry-Out1
Note to Figure 2–7:
(1)
The addnsub signal is tied to the carry input for the first LE of a carry chain only.
Carry-Select Chain
The carry-select chain provides a very fast carry-select function between
LEs in dynamic arithmetic mode. The carry-select chain uses the
redundant carry calculation to increase the speed of carry functions. The
LE is configured to calculate outputs for a possible carry-in of 0 and
carry-in of 1 in parallel. The carry-in0 and carry-in1 signals from a
lower-order bit feed forward into the higher-order bit via the parallel
carry chain and feed into both the LUT and the next portion of the carry
chain. Carry-select chains can begin in any LE within a LAB.
The speed advantage of the carry-select chain is in the parallel
pre-computation of carry chains. Since the LAB carry-in selects the
precomputed carry chain, not every LE is in the critical path. Only the
propagation delays between LAB carry-in generation (LE 5 and LE 10) are
now part of the critical path. This feature allows the Cyclone architecture
to implement high-speed counters, adders, multipliers, parity functions,
and comparators of arbitrary width.
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Logic Elements
Figure 2–8 shows the carry-select circuitry in a LAB for a 10-bit full adder.
One portion of the LUT generates the sum of two bits using the input
signals and the appropriate carry-in bit; the sum is routed to the output
of the LE. The register can be bypassed for simple adders or used for
accumulator functions. Another portion of the LUT generates carry-out
bits. A LAB-wide carry-in bit selects which chain is used for the addition
of given inputs. The carry-in signal for each chain, carry-in0 or
carry-in1, selects the carry-out to carry forward to the carry-in signal
of the next-higher-order bit. The final carry-out signal is routed to an LE,
where it is fed to local, row, or column interconnects.
Figure 2–8. Carry Select Chain
LAB Carry-In
0
1
A1
B1
LE1
A2
B2
LE2
Sum1
LAB Carry-In
Carry-In0
Carry-In1
A3
B3
LE3
A4
B4
LE4
A5
B5
LE5
0
Sum2
Sum3
LUT
data1
data2
Sum
LUT
Sum4
LUT
Sum5
LUT
1
A6
B6
LE6
A7
B7
LE7
A8
B8
LE8
A9
B9
LE9
A10
B10
LE10
Sum6
Carry-Out0
Carry-Out1
Sum7
Sum8
Sum9
Sum10
LAB Carry-Out
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The Quartus II Compiler automatically creates carry chain logic during
design processing, or you can create it manually during design entry.
Parameterized functions such as LPM functions automatically take
advantage of carry chains for the appropriate functions.
The Quartus II Compiler creates carry chains longer than 10 LEs by
linking LABs together automatically. For enhanced fitting, a long carry
chain runs vertically allowing fast horizontal connections to M4K
memory blocks. A carry chain can continue as far as a full column.
Clear and Preset Logic Control
LAB-wide signals control the logic for the register's clear and preset
signals. The LE directly supports an asynchronous clear and preset
function. The register preset is achieved through the asynchronous load
of a logic high. The direct asynchronous preset does not require a
NOT-gate push-back technique. Cyclone devices support simultaneous
preset/ asynchronous load and clear signals. An asynchronous clear
signal takes precedence if both signals are asserted simultaneously. Each
LAB supports up to two clears and one preset signal.
In addition to the clear and preset ports, Cyclone devices provide a
chip-wide reset pin (DEV_CLRn) that resets all registers in the device. An
option set before compilation in the Quartus II software controls this pin.
This chip-wide reset overrides all other control signals.
MultiTrack
Interconnect
In the Cyclone architecture, connections between LEs, M4K memory
blocks, and device I/O pins are provided by the MultiTrack interconnect
structure with DirectDriveTM technology. The MultiTrack interconnect
consists of continuous, performance-optimized routing lines of different
speeds used for inter- and intra-design block connectivity. The Quartus II
Compiler automatically places critical design paths on faster
interconnects to improve design performance.
DirectDrive technology is a deterministic routing technology that ensures
identical routing resource usage for any function regardless of placement
within the device. The MultiTrack interconnect and DirectDrive
technology simplify the integration stage of block-based designing by
eliminating the re-optimization cycles that typically follow design
changes and additions.
The MultiTrack interconnect consists of row and column interconnects
that span fixed distances. A routing structure with fixed length resources
for all devices allows predictable and repeatable performance when
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MultiTrack Interconnect
migrating through different device densities. Dedicated row
interconnects route signals to and from LABs, PLLs, and M4K memory
blocks within the same row. These row resources include:
■
■
Direct link interconnects between LABs and adjacent blocks
R4 interconnects traversing four blocks to the right or left
The direct link interconnect allows a LAB or M4K memory block to drive
into the local interconnect of its left and right neighbors. Only one side of
a PLL block interfaces with direct link and row interconnects. The direct
link interconnect provides fast communication between adjacent LABs
and/or blocks without using row interconnect resources.
The R4 interconnects span four LABs, or two LABs and one M4K RAM
block. These resources are used for fast row connections in a four-LAB
region. Every LAB has its own set of R4 interconnects to drive either left
or right. Figure 2–9 shows R4 interconnect connections from a LAB. R4
interconnects can drive and be driven by M4K memory blocks, PLLs, and
row IOEs. For LAB interfacing, a primary LAB or LAB neighbor can drive
a given R4 interconnect. For R4 interconnects that drive to the right, the
primary LAB and right neighbor can drive on to the interconnect. For R4
interconnects that drive to the left, the primary LAB and its left neighbor
can drive on to the interconnect. R4 interconnects can drive other R4
interconnects to extend the range of LABs they can drive. R4
interconnects can also drive C4 interconnects for connections from one
row to another.
Altera Corporation
May 2008
2–13
Preliminary
Cyclone Device Handbook, Volume 1
Figure 2–9. R4 Interconnect Connections
Adjacent LAB can
Drive onto Another
LAB's R4 Interconnect
C4 Column Interconnects (1)
R4 Interconnect
Driving Right
R4 Interconnect
Driving Left
LAB
Neighbor
Primary
LAB (2)
LAB
Neighbor
Notes to Figure 2–9:
(1)
(2)
C4 interconnects can drive R4 interconnects.
This pattern is repeated for every LAB in the LAB row.
The column interconnect operates similarly to the row interconnect. Each
column of LABs is served by a dedicated column interconnect, which
vertically routes signals to and from LABs, M4K memory blocks, and row
and column IOEs. These column resources include:
■
■
■
LUT chain interconnects within a LAB
Register chain interconnects within a LAB
C4 interconnects traversing a distance of four blocks in an up and
down direction
Cyclone devices include an enhanced interconnect structure within LABs
for routing LE output to LE input connections faster using LUT chain
connections and register chain connections. The LUT chain connection
allows the combinatorial output of an LE to directly drive the fast input
of the LE right below it, bypassing the local interconnect. These resources
can be used as a high-speed connection for wide fan-in functions from
LE 1 to LE 10 in the same LAB. The register chain connection allows the
register output of one LE to connect directly to the register input of the
next LE in the LAB for fast shift registers. The Quartus II Compiler
automatically takes advantage of these resources to improve utilization
and performance. Figure 2–10 shows the LUT chain and register chain
interconnects.
2–14
Preliminary
Altera Corporation
May 2008
MultiTrack Interconnect
Figure 2–10. LUT Chain and Register Chain Interconnects
Local Interconnect
Routing Among LEs
in the LAB
LUT Chain
Routing to
Adjacent LE
LE 1
Register Chain
Routing to Adjacent
LE's Register Input
LE 2
Local
Interconnect
LE 3
LE 4
LE 5
LE 6
LE 7
LE 8
LE 9
LE 10
The C4 interconnects span four LABs or M4K blocks up or down from a
source LAB. Every LAB has its own set of C4 interconnects to drive either
up or down. Figure 2–11 shows the C4 interconnect connections from a
LAB in a column. The C4 interconnects can drive and be driven by all
types of architecture blocks, including PLLs, M4K memory blocks, and
column and row IOEs. For LAB interconnection, a primary LAB or its
LAB neighbor can drive a given C4 interconnect. C4 interconnects can
drive each other to extend their range as well as drive row interconnects
for column-to-column connections.
Altera Corporation
May 2008
2–15
Preliminary
Cyclone Device Handbook, Volume 1
Figure 2–11. C4 Interconnect Connections
Note (1)
C4 Interconnect
Drives Local and R4
Interconnects
Up to Four Rows
C4 Interconnect
Driving Up
LAB
Row
Interconnect
Adjacent LAB can
drive onto neighboring
LAB's C4 interconnect
Local
Interconnect
C4 Interconnect
Driving Down
Note to Figure 2–11:
(1)
Each C4 interconnect can drive either up or down four rows.
2–16
Preliminary
Altera Corporation
May 2008
MultiTrack Interconnect
All embedded blocks communicate with the logic array similar to
LAB-to-LAB interfaces. Each block (i.e., M4K memory or PLL) connects
to row and column interconnects and has local interconnect regions
driven by row and column interconnects. These blocks also have direct
link interconnects for fast connections to and from a neighboring LAB.
Table 2–2 shows the Cyclone device's routing scheme.
Table 2–2. Cyclone Device Routing Scheme
LUT Chain
Register Chain
Local Interconnect
Direct Link Interconnect
R4 Interconnect
C4 Interconnect
LE
M4K RAM Block
PLL
Column IOE
Row IOE
Destination
LUT Chain
—
—
—
—
—
—
v
—
—
—
—
Register Chain
—
—
—
—
—
—
v
—
—
—
—
Local Interconnect
—
—
—
—
—
—
v
v
v
v
v
Direct Link
Interconnect
—
—
v
—
—
—
—
—
—
—
—
R4 Interconnect
—
—
v
—
v
v
—
—
—
—
—
C4 Interconnect
—
—
v
—
v
v
—
—
—
—
—
LE
v
v
v
v
v
v
—
—
—
—
—
M4K RAM Block
—
—
v
v
v
v
—
—
—
—
—
PLL
—
—
—
v
v
v
—
—
—
—
—
Column IOE
—
—
—
—
—
v
—
—
—
—
—
Row IOE
—
—
—
v
v
v
—
—
—
—
—
Source
Altera Corporation
May 2008
2–17
Preliminary
Cyclone Device Handbook, Volume 1
Embedded
Memory
The Cyclone embedded memory consists of columns of M4K memory
blocks. EP1C3 and EP1C6 devices have one column of M4K blocks, while
EP1C12 and EP1C20 devices have two columns (refer to Table 1–1 on
page 1–1 for total RAM bits per density). Each M4K block can implement
various types of memory with or without parity, including true dual-port,
simple dual-port, and single-port RAM, ROM, and FIFO buffers. The
M4K blocks support the following features:
■
■
■
■
■
■
■
■
■
■
■
1
4,608 RAM bits
250 MHz performance
True dual-port memory
Simple dual-port memory
Single-port memory
Byte enable
Parity bits
Shift register
FIFO buffer
ROM
Mixed clock mode
Violating the setup or hold time on the address registers could
corrupt the memory contents. This applies to both read and
write operations.
Memory Modes
The M4K memory blocks include input registers that synchronize writes
and output registers to pipeline designs and improve system
performance. M4K blocks offer a true dual-port mode to support any
combination of two-port operations: two reads, two writes, or one read
and one write at two different clock frequencies. Figure 2–12 shows true
dual-port memory.
Figure 2–12. True Dual-Port Memory Configuration
A
dataA[ ]
addressA[ ]
wrenA
clockA
clockenA
qA[ ]
aclrA
2–18
Preliminary
B
dataB[ ]
addressB[ ]
wrenB
clockB
clockenB
qB[ ]
aclrB
Altera Corporation
May 2008
Embedded Memory
In addition to true dual-port memory, the M4K memory blocks support
simple dual-port and single-port RAM. Simple dual-port memory
supports a simultaneous read and write. Single-port memory supports
non-simultaneous reads and writes. Figure 2–13 shows these different
M4K RAM memory port configurations.
Figure 2–13. Simple Dual-Port and Single-Port Memory Configurations
Simple Dual-Port Memory
data[ ]
wraddress[ ]
wren
inclock
inclocken
inaclr
rdaddress[ ]
rden
q[ ]
outclock
outclocken
outaclr
Single-Port Memory (1)
data[ ]
address[ ]
wren
inclock
inclocken
inaclr
q[ ]
outclock
outclocken
outaclr
Note to Figure 2–13:
(1)
Two single-port memory blocks can be implemented in a single M4K block as long
as each of the two independent block sizes is equal to or less than half of the M4K
block size.
The memory blocks also enable mixed-width data ports for reading and
writing to the RAM ports in dual-port RAM configuration. For example,
the memory block can be written in ×1 mode at port A and read out in ×16
mode from port B.
The Cyclone memory architecture can implement fully synchronous
RAM by registering both the input and output signals to the M4K RAM
block. All M4K memory block inputs are registered, providing
synchronous write cycles. In synchronous operation, the memory block
generates its own self-timed strobe write enable (wren) signal derived
from a global clock. In contrast, a circuit using asynchronous RAM must
generate the RAM wren signal while ensuring its data and address
signals meet setup and hold time specifications relative to the wren
Altera Corporation
May 2008
2–19
Preliminary
Cyclone Device Handbook, Volume 1
signal. The output registers can be bypassed. Pseudo-asynchronous
reading is possible in the simple dual-port mode of M4K blocks by
clocking the read enable and read address registers on the negative clock
edge and bypassing the output registers.
When configured as RAM or ROM, you can use an initialization file to
pre-load the memory contents.
Two single-port memory blocks can be implemented in a single M4K
block as long as each of the two independent block sizes is equal to or less
than half of the M4K block size.
The Quartus II software automatically implements larger memory by
combining multiple M4K memory blocks. For example, two 256×16-bit
RAM blocks can be combined to form a 256×32-bit RAM block. Memory
performance does not degrade for memory blocks using the maximum
number of words allowed. Logical memory blocks using less than the
maximum number of words use physical blocks in parallel, eliminating
any external control logic that would increase delays. To create a larger
high-speed memory block, the Quartus II software automatically
combines memory blocks with LE control logic.
Parity Bit Support
The M4K blocks support a parity bit for each byte. The parity bit, along
with internal LE logic, can implement parity checking for error detection
to ensure data integrity. You can also use parity-size data words to store
user-specified control bits. Byte enables are also available for data input
masking during write operations.
Shift Register Support
You can configure M4K memory blocks to implement shift registers for
DSP applications such as pseudo-random number generators,
multi-channel filtering, auto-correlation, and cross-correlation functions.
These and other DSP applications require local data storage, traditionally
implemented with standard flip-flops, which can quickly consume many
logic cells and routing resources for large shift registers. A more efficient
alternative is to use embedded memory as a shift register block, which
saves logic cell and routing resources and provides a more efficient
implementation with the dedicated circuitry.
The size of a w × m × n shift register is determined by the input data width
(w), the length of the taps (m), and the number of taps (n). The size of a
w × m × n shift register must be less than or equal to the maximum number
of memory bits in the M4K block (4,608 bits). The total number of shift
2–20
Preliminary
Altera Corporation
May 2008
Embedded Memory
register outputs (number of taps n × width w) must be less than the
maximum data width of the M4K RAM block (×36). To create larger shift
registers, multiple memory blocks are cascaded together.
Data is written into each address location at the falling edge of the clock
and read from the address at the rising edge of the clock. The shift register
mode logic automatically controls the positive and negative edge
clocking to shift the data in one clock cycle. Figure 2–14 shows the M4K
memory block in the shift register mode.
Figure 2–14. Shift Register Memory Configuration
w × m × n Shift Register
m-Bit Shift Register
w
w
m-Bit Shift Register
w
w
n Number
of Taps
m-Bit Shift Register
w
w
m-Bit Shift Register
w
w
Memory Configuration Sizes
The memory address depths and output widths can be configured as
4,096 × 1, 2,048 × 2, 1,024 × 4, 512 × 8 (or 512 × 9 bits), 256 × 16 (or 256 × 18
bits), and 128 × 32 (or 128 × 36 bits). The 128 × 32- or 36-bit configuration
Altera Corporation
May 2008
2–21
Preliminary
Cyclone Device Handbook, Volume 1
is not available in the true dual-port mode. Mixed-width configurations
are also possible, allowing different read and write widths. Tables 2–3
and 2–4 summarize the possible M4K RAM block configurations.
Table 2–3. M4K RAM Block Configurations (Simple Dual-Port)
Write Port
Read Port
4K × 1
2K × 2
1K × 4
512 × 8
256 × 16
128 × 32
512 × 9 256 × 18 128 × 36
4K × 1
v
v
v
v
v
v
—
—
—
2K × 2
v
v
v
v
v
v
—
—
—
1K × 4
v
v
v
v
v
v
—
—
—
512 × 8
v
v
v
v
v
v
—
—
—
256 × 16
v
v
v
v
v
v
—
—
—
128 × 32
v
v
v
v
v
v
—
—
—
512 × 9
—
—
—
—
—
—
v
v
v
256 × 18
—
—
—
—
—
—
v
v
v
128 × 36
—
—
—
—
—
—
v
v
v
Table 2–4. M4K RAM Block Configurations (True Dual-Port)
Port B
Port A
4K × 1
2K × 2
1K × 4
512 × 8
256 × 16
512 × 9
256 × 18
4K × 1
v
v
v
v
v
—
—
2K × 2
v
v
v
v
v
—
—
1K × 4
v
v
v
v
v
—
—
512 × 8
v
v
v
v
v
—
—
256 × 16
v
v
v
v
v
—
—
512 × 9
—
—
—
—
—
v
v
256 × 18
—
—
—
—
—
v
v
When the M4K RAM block is configured as a shift register block, you can
create a shift register up to 4,608 bits (w × m × n).
2–22
Preliminary
Altera Corporation
May 2008
Embedded Memory
Byte Enables
M4K blocks support byte writes when the write port has a data width of
16, 18, 32, or 36 bits. The byte enables allow the input data to be masked
so the device can write to specific bytes. The unwritten bytes retain the
previous written value. Table 2–5 summarizes the byte selection.
Table 2–5. Byte Enable for M4K Blocks
byteena[3..0]
Notes (1), (2)
datain ×18
datain ×36
[0] = 1
[8..0]
[8..0]
[1] = 1
[17..9]
[17..9]
[2] = 1
—
[26..18]
[3] = 1
—
[35..27]
Notes to Table 2–5:
(1)
(2)
Any combination of byte enables is possible.
Byte enables can be used in the same manner with 8-bit words, i.e., in ×16 and ×32
modes.
Control Signals and M4K Interface
The M4K blocks allow for different clocks on their inputs and outputs.
Either of the two clocks feeding the block can clock M4K block registers
(renwe, address, byte enable, datain, and output registers). Only the
output register can be bypassed. The six labclk signals or local
interconnects can drive the control signals for the A and B ports of the
M4K block. LEs can also control the clock_a, clock_b, renwe_a,
renwe_b, clr_a, clr_b, clocken_a, and clocken_b signals, as
shown in Figure 2–15.
The R4, C4, and direct link interconnects from adjacent LABs drive the
M4K block local interconnect. The M4K blocks can communicate with
LABs on either the left or right side through these row resources or with
LAB columns on either the right or left with the column resources. Up to
10 direct link input connections to the M4K block are possible from the
left adjacent LABs and another 10 possible from the right adjacent LAB.
M4K block outputs can also connect to left and right LABs through 10
direct link interconnects each. Figure 2–16 shows the M4K block to logic
array interface.
Altera Corporation
May 2008
2–23
Preliminary
Cyclone Device Handbook, Volume 1
Figure 2–15. M4K RAM Block Control Signals
Dedicated
LAB Row
Clocks
6
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
alcr_a
clocken_a
clock_b
renwe_b
Local
Interconnect
Local
Interconnect
clock_a
renwe_a
alcr_b
clocken_b
Figure 2–16. M4K RAM Block LAB Row Interface
C4 Interconnects
Direct link
interconnect
to adjacent LAB
R4 Interconnects
10
Direct link
interconnect
to adjacent LAB
dataout
Direct link
interconnect
from adjacent LAB
M4K RAM
Block
Direct link
interconnect
from adjacent LAB
Byte enable
Control
Signals
Clocks
address
datain
6
M4K RAM Block Local
Interconnect Region
2–24
Preliminary
LAB Row Clocks
Altera Corporation
May 2008
Embedded Memory
Independent Clock Mode
The M4K memory blocks implement independent clock mode for true
dual-port memory. In this mode, a separate clock is available for each port
(ports A and B). Clock A controls all registers on the port A side, while
clock B controls all registers on the port B side. Each port, A and B, also
supports independent clock enables and asynchronous clear signals for
port A and B registers. Figure 2–17 shows an M4K memory block in
independent clock mode.
Figure 2–17. Independent Clock Mode
Notes (1), (2)
6 LAB Row Clocks
A
6
dataA[ ]
D
Data In
Q
ENA
byteenaA[ ]
D
Memory Block
256 ´ 16 (2)
512 ´ 8
1,024 ´ 4
2,048 ´ 2
4,096 ´ 1
Byte Enable A
Q
B
6
Data In
Q
Byte Enable B
Q
D
dataB[ ]
D
byteenaB[ ]
ENA
ENA
addressA[ ]
D
ENA
Address A
Q
Address B
Q
D
addressB[ ]
ENA
ENA
wrenA
wrenB
D
clkenA
ENA
clockA
Q
Write/Read
Enable
Write/Read
Enable
Write
Pulse
Generator
Data Out
D
Write
Pulse
Generator
Q
D
ENA
clkenB
clockB
Data Out
Q
Q
D
ENA
ENA
qA[ ]
qB[ ]
Notes to Figure 2–17:
(1)
(2)
All registers shown have asynchronous clear ports.
Violating the setup or hold time on the address registers could corrupt the memory contents. This applies to both
read and write operations.
Input/Output Clock Mode
Input/output clock mode can be implemented for both the true and
simple dual-port memory modes. On each of the two ports, A or B, one
clock controls all registers for inputs into the memory block: data input,
wren, and address. The other clock controls the block's data output
registers. Each memory block port, A or B, also supports independent
clock enables and asynchronous clear signals for input and output
registers. Figures 2–18 and 2–19 show the memory block in input/output
clock mode.
Altera Corporation
May 2008
2–25
Preliminary
Cyclone Device Handbook, Volume 1
Figure 2–18. Input/Output Clock Mode in True Dual-Port Mode
Notes (1), (2)
6 LAB Row Clocks
6
dataA[ ]
A
D
Data In
Q
ENA
byteenaA[ ]
D
Memory Block
256 × 16 (2)
512 × 8
1,024 × 4
2,048 × 2
4,096 × 1
Byte Enable A
Q
6
B
Data In
Q
Byte Enable B
Q
D
dataB[ ]
D
byteenaB[ ]
ENA
ENA
addressA[ ]
D
ENA
Address A
Q
Address B
Q
D
addressB[ ]
ENA
ENA
wrenA
wrenB
D
clkenA
ENA
clockA
Q
Write/Read
Enable
Write
Pulse
Generator
Write/Read
Enable
Data Out
Write
Pulse
Generator
Q
D
ENA
Data Out
clkenB
D
Q
Q
D
ENA
ENA
q A[ ]
clockB
q B[ ]
Notes to Figure 2–18:
(1)
(2)
All registers shown have asynchronous clear ports.
Violating the setup or hold time on the address registers could corrupt the memory contents. This applies to both
read and write operations.
2–26
Preliminary
Altera Corporation
May 2008
Embedded Memory
Figure 2–19. Input/Output Clock Mode in Simple Dual-Port Mode
Notes (1), (2)
6 LAB Row
Clocks
Memory Block
256 ´ 16
Data In
512 ´ 8
1,024 ´ 4
2,048 ´ 2
4,096 ´ 1
6
data[ ]
D
Q
ENA
address[ ]
D
Q
ENA
Read Address
Data Out
byteena[ ]
D
Q
ENA
Byte Enable
wraddress[ ]
D
Q
ENA
Write Address
D
Q
ENA
Read Enable
D
Q
ENA
To MultiTrack
Interconnect
rden
wren
outclken
inclken
inclock
D
Q
ENA
Write
Pulse
Generator
Write Enable
outclock
Notes to Figure 2–19:
(1)
(2)
All registers shown except the rden register have asynchronous clear ports.
Violating the setup or hold time on the address registers could corrupt the memory contents. This applies to both
read and write operations.
Altera Corporation
May 2008
2–27
Preliminary
Cyclone Device Handbook, Volume 1
Read/Write Clock Mode
The M4K memory blocks implement read/write clock mode for simple
dual-port memory. You can use up to two clocks in this mode. The write
clock controls the block's data inputs, wraddress, and wren. The read
clock controls the data output, rdaddress, and rden. The memory
blocks support independent clock enables for each clock and
asynchronous clear signals for the read- and write-side registers.
Figure 2–20 shows a memory block in read/write clock mode.
Figure 2–20. Read/Write Clock Mode in Simple Dual-Port Mode
6 LAB Row
Clocks
Memory Block
256 × 16
512 × 8
1,024 × 4
Data In
2,048 × 2
4,096 × 1
6
data[ ]
Notes (1), (2)
D
Q
ENA
Data Out
address[ ]
D
Q
ENA
Read Address
wraddress[ ]
D
Q
ENA
Write Address
byteena[ ]
D
Q
ENA
Byte Enable
D
Q
ENA
Read Enable
D
Q
ENA
To MultiTrack
Interconnect
rden
wren
rdclken
wrclken
wrclock
D
Q
ENA
Write
Pulse
Generator
Write Enable
rdclock
Notes to Figure 2–20:
(1)
(2)
All registers shown except the rden register have asynchronous clear ports.
Violating the setup or hold time on the address registers could corrupt the memory contents. This applies to both
read and write operations.
2–28
Preliminary
Altera Corporation
May 2008
Global Clock Network and Phase-Locked Loops
Single-Port Mode
The M4K memory blocks also support single-port mode, used when
simultaneous reads and writes are not required. See Figure 2–21. A single
M4K memory block can support up to two single-port mode RAM blocks
if each RAM block is less than or equal to 2K bits in size.
Figure 2–21. Single-Port Mode
Note (1)
6 LAB Row
Clocks
RAM/ROM
256 × 16
512 × 8
1,024 × 4
Data In
2,048 × 2
4,096 × 1
6
data[ ]
D
Q
ENA
Data Out
address[ ]
D
Q
ENA
Address
D
Q
ENA
To MultiTrack
Interconnect
wren
Write Enable
outclken
inclken
inclock
D
Q
ENA
Write
Pulse
Generator
outclock
Note to Figure 2–21:
(1)
Violating the setup or hold time on the address registers could corrupt the memory contents. This applies to both
read and write operations.
Global Clock
Network and
Phase-Locked
Loops
Altera Corporation
May 2008
Cyclone devices provide a global clock network and up to two PLLs for a
complete clock management solution.
Global Clock Network
There are four dedicated clock pins (CLK[3..0], two pins on the left side
and two pins on the right side) that drive the global clock network, as
shown in Figure 2–22. PLL outputs, logic array, and dual-purpose clock
(DPCLK[7..0]) pins can also drive the global clock network.
2–29
Preliminary
Cyclone Device Handbook, Volume 1
The eight global clock lines in the global clock network drive throughout
the entire device. The global clock network can provide clocks for all
resources within the device—IOEs, LEs, and memory blocks. The global
clock lines can also be used for control signals, such as clock enables and
synchronous or asynchronous clears fed from the external pin, or DQS
signals for DDR SDRAM or FCRAM interfaces. Internal logic can also
drive the global clock network for internally generated global clocks and
asynchronous clears, clock enables, or other control signals with large
fanout. Figure 2–22 shows the various sources that drive the global clock
network.
Figure 2–22. Global Clock Generation
Note (1)
DPCLK2
DPCLK3
Cyclone Device
Global Clock
Network
8
DPCLK1
DPCLK4
From logic
array
From logic
array
4
CLK0
CLK1 (3)
4
PLL1
4
2
4
2
DPCLK0
PLL2
(2)
CLK2
CLK3 (3)
DPCLK5
DPCLK7
DPCLK6
Notes to Figure 2–22:
(1)
(2)
(3)
The EP1C3 device in the 100-pin TQFP package has five DPCLK pins (DPCLK2, DPCLK3, DPCLK4, DPCLK6, and
DPCLK7).
EP1C3 devices only contain one PLL (PLL 1).
The EP1C3 device in the 100-pin TQFP package does not have dedicated clock pins CLK1 and CLK3.
2–30
Preliminary
Altera Corporation
May 2008
Global Clock Network and Phase-Locked Loops
Dual-Purpose Clock Pins
Each Cyclone device except the EP1C3 device has eight dual-purpose
clock pins, DPCLK[7..0] (two on each I/O bank). EP1C3 devices have
five DPCLK pins in the 100-pin TQFP package. These dual-purpose pins
can connect to the global clock network (see Figure 2–22) for high-fanout
control signals such as clocks, asynchronous clears, presets, and clock
enables, or protocol control signals such as TRDY and IRDY for PCI, or
DQS signals for external memory interfaces.
Combined Resources
Each Cyclone device contains eight distinct dedicated clocking resources.
The device uses multiplexers with these clocks to form six-bit buses to
drive LAB row clocks, column IOE clocks, or row IOE clocks. See
Figure 2–23. Another multiplexer at the LAB level selects two of the six
LAB row clocks to feed the LE registers within the LAB.
Figure 2–23. Global Clock Network Multiplexers
Global Clock
Network
Global Clocks [3..0]
Dual-Purpose Clocks [7..0]
Clock [7..0]
Column I/O Region
IO_CLK]5..0]
LAB Row Clock [5..0]
PLL Outputs [3..0]
Core Logic [7..0]
Row I/O Region
IO_CLK[5..0]
IOE clocks have row and column block regions. Six of the eight global
clock resources feed to these row and column regions. Figure 2–24 shows
the I/O clock regions.
Altera Corporation
May 2008
2–31
Preliminary
Cyclone Device Handbook, Volume 1
Figure 2–24. I/O Clock Regions
Column I/O Clock Region
IO_CLK[5..0]
6
I/O Clock Regions
Cyclone Logic Array
LAB Row Clocks
labclk[5..0]
LAB Row Clocks
labclk[5..0]
LAB Row Clocks
labclk[5..0]
LAB Row Clocks
labclk[5..0]
6
6
Global Clock
Network
6
6
8
Row
I/O Regions
LAB Row Clocks
labclk[5..0]
LAB Row Clocks
labclk[5..0]
6
6
I/O Clock Regions
6
Column I/O Clock Region
IO_CLK[5..0]
PLLs
Cyclone PLLs provide general-purpose clocking with clock
multiplication and phase shifting as well as outputs for differential I/O
support. Cyclone devices contain two PLLs, except for the EP1C3 device,
which contains one PLL.
2–32
Preliminary
Altera Corporation
May 2008
Global Clock Network and Phase-Locked Loops
Table 2–6 shows the PLL features in Cyclone devices. Figure 2–25 shows
a Cyclone PLL.
Table 2–6. Cyclone PLL Features
Feature
PLL Support
Clock multiplication and division
m/(n × post-scale counter) (1)
Phase shift
Down to 125-ps increments (2), (3)
Programmable duty cycle
Yes
Number of internal clock outputs
2
Number of external clock outputs
One differential or one single-ended (4)
Notes to Table 2–6:
(1)
The m counter ranges from 2 to 32. The n counter and the post-scale counters
range from 1 to 32.
The smallest phase shift is determined by the voltage-controlled oscillator (VCO)
period divided by 8.
For degree increments, Cyclone devices can shift all output frequencies in
increments of 45°. Smaller degree increments are possible depending on the
frequency and divide parameters.
The EP1C3 device in the 100-pin TQFP package does not support external clock
output. The EP1C6 device in the 144-pin TQFP package does not support external
clock output from PLL2.
(2)
(3)
(4)
Figure 2–25. Cyclone PLL
Note (1)
VCO Phase Selection
Selectable at Each PLL
Output Port
Post-Scale
Counters
CLK0 or
LVDSCLK1p (2)
÷n
Δt
PFD (3)
Charge
Pump
CLK1 or
LVDSCLK1n (2)
Δt
Loop
Filter
VCO
÷g0
Global clock
÷g1
Global clock
÷e
I/O buffer
÷m
Notes to Figure 2–25:
(1)
(2)
(3)
The EP1C3 device in the 100-pin TQFP package does not support external outputs or LVDS inputs. The EP1C6
device in the 144-pin TQFP package does not support external output from PLL2.
LVDS input is supported via the secondary function of the dedicated clock pins. For PLL 1, the CLK0 pin’s secondary
function is LVDSCLK1p and the CLK1 pin’s secondary function is LVDSCLK1n. For PLL 2, the CLK2 pin’s secondary
function is LVDSCLK2p and the CLK3 pin’s secondary function is LVDSCLK2n.
PFD: phase frequency detector.
Altera Corporation
May 2008
2–33
Preliminary
Cyclone Device Handbook, Volume 1
Figure 2–26 shows the PLL global clock connections.
Figure 2–26. Cyclone PLL Global Clock Connections
G1
G0
G3
G5
G2
G4
G7
G6
g0
CLK0
g0
PLL1 g1
CLK1 (1)
CLK2
g1 PLL2
e
CLK3 (2)
e
PLL2_OUT (3), (4)
PLL1_OUT (3), (4)
Notes to Figure 2–26:
(1)
(2)
(3)
(4)
PLL 1 supports one single-ended or LVDS input via pins CLK0 and CLK1.
PLL2 supports one single-ended or LVDS input via pins CLK2 and CLK3.
PLL1_OUT and PLL2_OUT support single-ended or LVDS output. If external output is not required, these pins are
available as regular user I/O pins.
The EP1C3 device in the 100-pin TQFP package does not support external clock output. The EP1C6 device in the
144-pin TQFP package does not support external clock output from PLL2.
Table 2–7 shows the global clock network sources available in Cyclone
devices.
Table 2–7. Global Clock Network Sources (Part 1 of 2)
Source
PLL Counter
Output
Dedicated
Clock Input
Pins
2–34
Preliminary
GCLK0
GCLK1
GCLK2
GCLK3
GCLK4
GCLK5
GCLK6
GCLK7
PLL1 G0
—
v
v
—
—
—
—
—
PLL1 G1
v
—
—
v
—
—
—
—
PLL2 G0 (1)
—
—
—
—
—
v
v
—
PLL2 G1 (1)
—
—
—
—
v
—
—
v
CLK0
v
—
v
—
—
—
—
—
CLK1 (2)
—
v
—
v
—
—
—
—
CLK2
—
—
—
—
v
—
v
—
CLK3 (2)
—
—
—
—
—
v
—
v
Altera Corporation
May 2008
Global Clock Network and Phase-Locked Loops
Table 2–7. Global Clock Network Sources (Part 2 of 2)
Source
Dual-Purpose
Clock Pins
GCLK0
GCLK1
GCLK2
GCLK3
GCLK4
GCLK5
GCLK6
GCLK7
DPCLK0 (3)
—
—
—
v
—
—
—
—
DPCLK1 (3)
—
—
v
—
—
—
—
—
DPCLK2
v
—
—
—
—
—
—
—
DPCLK3
—
—
—
—
v
—
—
—
DPCLK4
—
—
—
—
—
—
v
—
DPCLK5 (3)
—
—
—
—
—
—
—
v
DPCLK6
—
—
—
—
—
v
—
—
DPCLK7
—
v
—
—
—
—
—
—
Notes to Table 2–7:
(1)
(2)
(3)
EP1C3 devices only have one PLL (PLL 1).
EP1C3 devices in the 100-pin TQFP package do not have dedicated clock pins CLK1 and CLK3.
EP1C3 devices in the 100-pin TQFP package do not have the DPCLK0, DPCLK1, or DPCLK5 pins.
Clock Multiplication and Division
Cyclone PLLs provide clock synthesis for PLL output ports using
m/(n × post scale counter) scaling factors. The input clock is divided by
a pre-scale divider, n, and is then multiplied by the m feedback factor. The
control loop drives the VCO to match fIN × (m/n). Each output port has
a unique post-scale counter to divide down the high-frequency VCO. For
multiple PLL outputs with different frequencies, the VCO is set to the
least-common multiple of the output frequencies that meets its frequency
specifications. Then, the post-scale dividers scale down the output
frequency for each output port. For example, if the output frequencies
required from one PLL are 33 and 66 MHz, the VCO is set to 330 MHz (the
least-common multiple in the VCO's range).
Each PLL has one pre-scale divider, n, that can range in value from 1 to
32. Each PLL also has one multiply divider, m, that can range in value
from 2 to 32. Global clock outputs have two post scale G dividers for
global clock outputs, and external clock outputs have an E divider for
external clock output, both ranging from 1 to 32. The Quartus II software
automatically chooses the appropriate scaling factors according to the
input frequency, multiplication, and division values entered.
Altera Corporation
May 2008
2–35
Preliminary
Cyclone Device Handbook, Volume 1
External Clock Inputs
Each PLL supports single-ended or differential inputs for sourcesynchronous receivers or for general-purpose use. The dedicated clock
pins (CLK[3..0]) feed the PLL inputs. These dual-purpose pins can also
act as LVDS input pins. See Figure 2–25.
Table 2–8 shows the I/O standards supported by PLL input and output
pins.
Table 2–8. PLL I/O Standards
I/O Standard
CLK Input
EXTCLK Output
3.3-V LVTTL/LVCMOS
v
v
2.5-V LVTTL/LVCMOS
v
v
1.8-V LVTTL/LVCMOS
v
v
1.5-V LVCMOS
v
v
3.3-V PCI
v
v
LVDS
v
v
SSTL-2 class I
v
v
SSTL-2 class II
v
v
SSTL-3 class I
v
v
SSTL-3 class II
v
v
Differential SSTL-2
—
v
For more information on LVDS I/O support, refer to “LVDS I/O Pins” on
page 2–54.
External Clock Outputs
Each PLL supports one differential or one single-ended output for
source-synchronous transmitters or for general-purpose external clocks.
If the PLL does not use these PLL_OUT pins, the pins are available for use
as general-purpose I/O pins. The PLL_OUT pins support all I/O
standards shown in Table 2–8.
The external clock outputs do not have their own VCC and ground voltage
supplies. Therefore, to minimize jitter, do not place switching I/O pins
next to these output pins. The EP1C3 device in the 100-pin TQFP package
2–36
Preliminary
Altera Corporation
May 2008
Global Clock Network and Phase-Locked Loops
does not have dedicated clock output pins. The EP1C6 device in the
144-pin TQFP package only supports dedicated clock outputs from
PLL 1.
Clock Feedback
Cyclone PLLs have three modes for multiplication and/or phase shifting:
■
Zero delay buffer mode⎯The external clock output pin is phasealigned with the clock input pin for zero delay.
■
Normal mode⎯If the design uses an internal PLL clock output, the
normal mode compensates for the internal clock delay from the input
clock pin to the IOE registers. The external clock output pin is phase
shifted with respect to the clock input pin if connected in this mode.
You defines which internal clock output from the PLL should be
phase-aligned to compensate for internal clock delay.
■
No compensation mode⎯In this mode, the PLL will not compensate
for any clock networks.
Phase Shifting
Cyclone PLLs have an advanced clock shift capability that enables
programmable phase shifts. You can enter a phase shift (in degrees or
time units) for each PLL clock output port or for all outputs together in
one shift. You can perform phase shifting in time units with a resolution
range of 125 to 250 ps. The finest resolution equals one eighth of the VCO
period. The VCO period is a function of the frequency input and the
multiplication and division factors. Each clock output counter can choose
a different phase of the VCO period from up to eight taps. You can use this
clock output counter along with an initial setting on the post-scale
counter to achieve a phase-shift range for the entire period of the output
clock. The phase tap feedback to the m counter can shift all outputs to a
single phase. The Quartus II software automatically sets the phase taps
and counter settings according to the phase shift entered.
Lock Detect Signal
The lock output indicates that there is a stable clock output signal in
phase with the reference clock. Without any additional circuitry, the lock
signal may toggle as the PLL begins tracking the reference clock.
Therefore, you may need to gate the lock signal for use as a
system-control signal. For correct operation of the lock circuit below
–20 C, fIN/N > 200 MHz.
Altera Corporation
May 2008
2–37
Preliminary
Cyclone Device Handbook, Volume 1
Programmable Duty Cycle
The programmable duty cycle allows PLLs to generate clock outputs with
a variable duty cycle. This feature is supported on each PLL post-scale
counter (g0, g1, e). The duty cycle setting is achieved by a low- and
high-time count setting for the post-scale dividers. The Quartus II
software uses the frequency input and the required multiply or divide
rate to determine the duty cycle choices.
Control Signals
There are three control signals for clearing and enabling PLLs and their
outputs. You can use these signals to control PLL resynchronization and
the ability to gate PLL output clocks for low-power applications.
The pllenable signal enables and disables PLLs. When the pllenable
signal is low, the clock output ports are driven by ground and all the PLLs
go out of lock. When the pllenable signal goes high again, the PLLs
relock and resynchronize to the input clocks. An input pin or LE output
can drive the pllenable signal.
The areset signals are reset/resynchronization inputs for each PLL.
Cyclone devices can drive these input signals from input pins or from
LEs. When areset is driven high, the PLL counters will reset, clearing
the PLL output and placing the PLL out of lock. When driven low again,
the PLL will resynchronize to its input as it relocks.
The pfdena signals control the phase frequency detector (PFD) output
with a programmable gate. If you disable the PFD, the VCO will operate
at its last set value of control voltage and frequency with some drift, and
the system will continue running when the PLL goes out of lock or the
input clock disables. By maintaining the last locked frequency, the system
has time to store its current settings before shutting down. You can either
use their own control signal or gated locked status signals to trigger the
pfdena signal.
f
2–38
Preliminary
For more information about Cyclone PLLs, refer to Using PLLs in Cyclone
Devices chapter in the Cyclone Device Handbook.
Altera Corporation
May 2008
I/O Structure
I/O Structure
IOEs support many features, including:
■
■
■
■
■
■
■
■
■
■
■
■
Differential and single-ended I/O standards
3.3-V, 64- and 32-bit, 66- and 33-MHz PCI compliance
Joint Test Action Group (JTAG) boundary-scan test (BST) support
Output drive strength control
Weak pull-up resistors during configuration
Slew-rate control
Tri-state buffers
Bus-hold circuitry
Programmable pull-up resistors in user mode
Programmable input and output delays
Open-drain outputs
DQ and DQS I/O pins
Cyclone device IOEs contain a bidirectional I/O buffer and three registers
for complete embedded bidirectional single data rate transfer.
Figure 2–27 shows the Cyclone IOE structure. The IOE contains one input
register, one output register, and one output enable register. You can use
the input registers for fast setup times and output registers for fast
clock-to-output times. Additionally, you can use the output enable (OE)
register for fast clock-to-output enable timing. The Quartus II software
automatically duplicates a single OE register that controls multiple
output or bidirectional pins. IOEs can be used as input, output, or
bidirectional pins.
Altera Corporation
May 2008
2–39
Preliminary
Cyclone Device Handbook, Volume 1
Figure 2–27. Cyclone IOE Structure
Logic Array
OE Register
OE
D
Q
Output Register
Output
D
Q
Combinatorial
input (1)
Input
Input Register
D
Q
Note to Figure 2–27:
(1)
There are two paths available for combinatorial inputs to the logic array. Each path
contains a unique programmable delay chain.
The IOEs are located in I/O blocks around the periphery of the Cyclone
device. There are up to three IOEs per row I/O block and up to three IOEs
per column I/O block (column I/O blocks span two columns). The row
I/O blocks drive row, column, or direct link interconnects. The column
I/O blocks drive column interconnects. Figure 2–28 shows how a row
I/O block connects to the logic array. Figure 2–29 shows how a column
I/O block connects to the logic array.
2–40
Preliminary
Altera Corporation
May 2008
I/O Structure
Figure 2–28. Row I/O Block Connection to the Interconnect
R4 Interconnects
C4 Interconnects
I/O Block Local
Interconnect
21 Data and
Control Signals
from Logic Array (1)
21
LAB
Row
I/O Block
io_datain[2..0] and
comb_io_datain[2..0] (2)
Direct Link
Interconnect
to Adjacent LAB
Direct Link
Interconnect
from Adjacent LAB
io_clk[5:0]
LAB Local
Interconnect
Row I/O Block
Contains up to
Three IOEs
Notes to Figure 2–28:
(1)
(2)
The 21 data and control signals consist of three data out lines, io_dataout[2..0], three output enables,
io_coe[2..0], three input clock enables, io_cce_in[2..0], three output clock enables, io_cce_out[2..0],
three clocks, io_cclk[2..0], three asynchronous clear signals, io_caclr[2..0], and three synchronous clear
signals, io_csclr[2..0].
Each of the three IOEs in the row I/O block can have one io_datain input (combinatorial or registered) and one
comb_io_datain (combinatorial) input.
Altera Corporation
May 2008
2–41
Preliminary
Cyclone Device Handbook, Volume 1
Figure 2–29. Column I/O Block Connection to the Interconnect
Column I/O
Block Contains
up to Three IOEs
Column I/O Block
21 Data &
Control Signals
from Logic Array (1)
21
IO_datain[2:0] &
comb_io_datain[2..0]
(2)
io_clk[5..0]
I/O Block
Local Interconnect
R4 Interconnects
LAB
LAB Local
Interconnect
LAB
LAB
C4 Interconnects
Notes to Figure 2–29:
(1)
(2)
The 21 data and control signals consist of three data out lines, io_dataout[2..0], three output enables,
io_coe[2..0], three input clock enables, io_cce_in[2..0], three output clock enables, io_cce_out[2..0],
three clocks, io_cclk[2..0], three asynchronous clear signals, io_caclr[2..0], and three synchronous clear
signals, io_csclr[2..0].
Each of the three IOEs in the column I/O block can have one io_datain input (combinatorial or registered) and
one comb_io_datain (combinatorial) input.
2–42
Preliminary
Altera Corporation
May 2008
I/O Structure
The pin's datain signals can drive the logic array. The logic array drives
the control and data signals, providing a flexible routing resource. The
row or column IOE clocks, io_clk[5..0], provide a dedicated routing
resource for low-skew, high-speed clocks. The global clock network
generates the IOE clocks that feed the row or column I/O regions (see
“Global Clock Network and Phase-Locked Loops” on page 2–29).
Figure 2–30 illustrates the signal paths through the I/O block.
Figure 2–30. Signal Path through the I/O Block
Row or Column
io_clk[5..0]
To Logic
Array
To Other
IOEs
io_datain
comb_io_datain
oe
ce_in
io_csclr
ce_out
io_coe
io_cce_in
From Logic
Array
io_cce_out
Data and
Control
Signal
Selection
aclr/preset
IOE
sclr
clk_in
io_caclr
clk_out
io_cclk
io_dataout
dataout
Each IOE contains its own control signal selection for the following
control signals: oe, ce_in, ce_out, aclr/preset, sclr/preset,
clk_in, and clk_out. Figure 2–31 illustrates the control signal
selection.
Altera Corporation
May 2008
2–43
Preliminary
Cyclone Device Handbook, Volume 1
Figure 2–31. Control Signal Selection per IOE
Dedicated I/O
Clock [5..0]
Local
Interconnect
io_coe
Local
Interconnect
io_csclr
Local
Interconnect
io_caclr
Local
Interconnect
io_cce_out
Local
Interconnect
io_cce_in
Local
Interconnect
io_cclk
ce_out
clk_out
clk_in
ce_in
sclr/preset
aclr/preset
oe
In normal bidirectional operation, you can use the input register for input
data requiring fast setup times. The input register can have its own clock
input and clock enable separate from the OE and output registers. The
output register can be used for data requiring fast clock-to-output
performance. The OE register is available for fast clock-to-output enable
timing. The OE and output register share the same clock source and the
same clock enable source from the local interconnect in the associated
LAB, dedicated I/O clocks, or the column and row interconnects.
Figure 2–32 shows the IOE in bidirectional configuration.
2–44
Preliminary
Altera Corporation
May 2008
I/O Structure
Figure 2–32. Cyclone IOE in Bidirectional I/O Configuration
ioe_clk[5..0]
Column or Row
Interconect
OE
OE Register
clkout
D
PRN
Q
VCCIO
ENA
Optional
PCI Clamp
CLRN
ce_out
VCCIO
Programmable
Pull-Up
Resistor
aclr/prn
Chip-Wide Reset
Output Register
D
PRN
Q
ENA
sclr/preset
CLRN
comb_datain
Output
Pin Delay
Drive Strength Control
Open-Drain Output
Slew Control
Input Pin to
Logic Array Delay
data_in
Bus Hold
Input Register
PRN
D
Q
clkin
ce_in
Input Pin to
Input Register Delay
or Input Pin to
Logic Array Delay
ENA
CLRN
The Cyclone device IOE includes programmable delays to ensure zero
hold times, minimize setup times, or increase clock to output times.
A path in which a pin directly drives a register may require a
programmable delay to ensure zero hold time, whereas a path in which a
pin drives a register through combinatorial logic may not require the
delay. Programmable delays decrease input-pin-to-logic-array and IOE
input register delays. The Quartus II Compiler can program these delays
Altera Corporation
May 2008
2–45
Preliminary
Cyclone Device Handbook, Volume 1
to automatically minimize setup time while providing a zero hold time.
Programmable delays can increase the register-to-pin delays for output
registers. Table 2–9 shows the programmable delays for Cyclone devices.
Table 2–9. Cyclone Programmable Delay Chain
Programmable Delays
Input pin to logic array delay
Quartus II Logic Option
Decrease input delay to internal cells
Input pin to input register delay
Decrease input delay to input registers
Output pin delay
Increase delay to output pin
There are two paths in the IOE for a combinatorial input to reach the logic
array. Each of the two paths can have a different delay. This allows you
adjust delays from the pin to internal LE registers that reside in two
different areas of the device. The designer sets the two combinatorial
input delays by selecting different delays for two different paths under
the Decrease input delay to internal cells logic option in the Quartus II
software. When the input signal requires two different delays for the
combinatorial input, the input register in the IOE is no longer available.
The IOE registers in Cyclone devices share the same source for clear or
preset. The designer can program preset or clear for each individual IOE.
The designer can also program the registers to power up high or low after
configuration is complete. If programmed to power up low, an
asynchronous clear can control the registers. If programmed to power up
high, an asynchronous preset can control the registers. This feature
prevents the inadvertent activation of another device's active-low input
upon power up. If one register in an IOE uses a preset or clear signal then
all registers in the IOE must use that same signal if they require preset or
clear. Additionally a synchronous reset signal is available to the designer
for the IOE registers.
External RAM Interfacing
Cyclone devices support DDR SDRAM and FCRAM interfaces at up to
133 MHz through dedicated circuitry.
DDR SDRAM and FCRAM
Cyclone devices have dedicated circuitry for interfacing with DDR
SDRAM. All I/O banks support DDR SDRAM and FCRAM I/O pins.
However, the configuration input pins in bank 1 must operate at 2.5 V
because the SSTL-2 VCCIO level is 2.5 V. Additionally, the configuration
2–46
Preliminary
Altera Corporation
May 2008
I/O Structure
output pins (nSTATUS and CONF_DONE) and all the JTAG pins in I/O
bank 3 must operate at 2.5 V because the VCCIO level of SSTL-2 is 2.5 V.
I/O banks 1, 2, 3, and 4 support DQS signals with DQ bus modes of × 8.
For × 8 mode, there are up to eight groups of programmable DQS and DQ
pins, I/O banks 1, 2, 3, and 4 each have two groups in the 324-pin and
400-pin FineLine BGA packages. Each group consists of one DQS pin, a
set of eight DQ pins, and one DM pin (see Figure 2–33). Each DQS pin
drives the set of eight DQ pins within that group.
Figure 2–33. Cyclone Device DQ and DQS Groups in ×8 Mode Note (1)
Top, Bottom, Left, or Right I/O Bank
DQ Pins
DQS Pin
DM Pin
Note to Figure 2–33:
(1)
Each DQ group consists of one DQS pin, eight DQ pins, and one DM pin.
Table 2–10 shows the number of DQ pin groups per device.
Table 2–10. DQ Pin Groups (Part 1 of 2)
Device
EP1C3
EP1C4
Altera Corporation
May 2008
Number of × 8 DQ
Pin Groups
Total DQ Pin
Count
100-pin TQFP (1)
3
24
144-pin TQFP
4
32
324-pin FineLine BGA
8
64
400-pin FineLine BGA
8
64
Package
2–47
Preliminary
Cyclone Device Handbook, Volume 1
Table 2–10. DQ Pin Groups (Part 2 of 2)
Number of × 8 DQ
Pin Groups
Total DQ Pin
Count
144-pin TQFP
4
32
240-pin PQFP
4
32
256-pin FineLine BGA
4
32
240-pin PQFP
4
32
256-pin FineLine BGA
4
32
Device
EP1C6
EP1C12
EP1C20
Package
324-pin FineLine BGA
8
64
324-pin FineLine BGA
8
64
400-pin FineLine BGA
8
64
Note to Table 2–10:
(1)
EP1C3 devices in the 100-pin TQFP package do not have any DQ pin groups in
I/O bank 1.
A programmable delay chain on each DQS pin allows for either a 90°
phase shift (for DDR SDRAM), or a 72° phase shift (for FCRAM) which
automatically center-aligns input DQS synchronization signals within the
data window of their corresponding DQ data signals. The phase-shifted
DQS signals drive the global clock network. This global DQS signal clocks
DQ signals on internal LE registers.
These DQS delay elements combine with the PLL’s clocking and phase
shift ability to provide a complete hardware solution for interfacing to
high-speed memory.
The clock phase shift allows the PLL to clock the DQ output enable and
output paths. The designer should use the following guidelines to meet
133 MHz performance for DDR SDRAM and FCRAM interfaces:
■
■
■
The DQS signal must be in the middle of the DQ group it clocks
Resynchronize the incoming data to the logic array clock using
successive LE registers or FIFO buffers
LE registers must be placed in the LAB adjacent to the DQ I/O pin
column it is fed by
Figure 2–34 illustrates DDR SDRAM and FCRAM interfacing from the
I/O through the dedicated circuitry to the logic array.
2–48
Preliminary
Altera Corporation
May 2008
I/O Structure
Figure 2–34. DDR SDRAM and FCRAM Interfacing
DQS
OE
OE LE
Register
DQ
OE
OE LE
Register
Output LE
Register
OE LE
Register
VCC
Output LE
Registers
Δt
clk
OE LE
Register
Input LE
Registers
DataA
Output LE
Register
Adjacent
LAB LEs
-90˚ clk
GND
Output LE
Registers
DataB
Input LE
Registers
Programmable
Delay Chain
PLL
Global Clock
Phase Shifted -90˚
LE
Register
LE
Register
Adjacent LAB LEs
Resynchronizing
Global Clock
Programmable Drive Strength
The output buffer for each Cyclone device I/O pin has a programmable
drive strength control for certain I/O standards. The LVTTL and
LVCMOS standards have several levels of drive strength that the designer
can control. SSTL-3 class I and II, and SSTL-2 class I and II support a
minimum setting, the lowest drive strength that guarantees the IOH/IOL
Altera Corporation
May 2008
2–49
Preliminary
Cyclone Device Handbook, Volume 1
of the standard. Using minimum settings provides signal slew rate
control to reduce system noise and signal overshoot. Table 2–11 shows the
possible settings for the I/O standards with drive strength control.
Table 2–11. Programmable Drive Strength Note (1)
I/O Standard
LVTTL (3.3 V)
IOH/IOL Current Strength Setting (mA)
4
8
12
16
24(2)
LVCMOS (3.3 V)
2
4
8
12(2)
LVTTL (2.5 V)
2
8
12
16(2)
LVTTL (1.8 V)
2
8
12(2)
LVCMOS (1.5 V)
2
4
8(2)
Notes to Table 2–11:
(1)
(2)
SSTL-3 class I and II, SSTL-2 class I and II, and 3.3-V PCI I/O Standards do not
support programmable drive strength.
This is the default current strength setting in the Quartus II software.
Open-Drain Output
Cyclone devices provide an optional open-drain (equivalent to an
open-collector) output for each I/O pin. This open-drain output enables
the device to provide system-level control signals (e.g., interrupt and
write-enable signals) that can be asserted by any of several devices.
2–50
Preliminary
Altera Corporation
May 2008
I/O Structure
Slew-Rate Control
The output buffer for each Cyclone device I/O pin has a programmable
output slew-rate control that can be configured for low noise or
high-speed performance. A faster slew rate provides high-speed
transitions for high-performance systems. However, these fast transitions
may introduce noise transients into the system. A slow slew rate reduces
system noise, but adds a nominal delay to rising and falling edges. Each
I/O pin has an individual slew-rate control, allowing the designer to
specify the slew rate on a pin-by-pin basis. The slew-rate control affects
both the rising and falling edges.
Bus Hold
Each Cyclone device I/O pin provides an optional bus-hold feature. The
bus-hold circuitry can hold the signal on an I/O pin at its last-driven
state. Since the bus-hold feature holds the last-driven state of the pin until
the next input signal is present, an external pull-up or pull-down resistor
is not necessary to hold a signal level when the bus is tri-stated.
The bus-hold circuitry also pulls undriven pins away from the input
threshold voltage where noise can cause unintended high-frequency
switching. The designer can select this feature individually for each I/O
pin. The bus-hold output will drive no higher than VCCIO to prevent
overdriving signals. If the bus-hold feature is enabled, the device cannot
use the programmable pull-up option. Disable the bus-hold feature when
the I/O pin is configured for differential signals.
The bus-hold circuitry uses a resistor with a nominal resistance (RBH) of
approximately 7 kΩ to pull the signal level to the last-driven state.
Table 4–15 on page 4–6 gives the specific sustaining current for each
VCCIO voltage level driven through this resistor and overdrive current
used to identify the next-driven input level.
The bus-hold circuitry is only active after configuration. When going into
user mode, the bus-hold circuit captures the value on the pin present at
the end of configuration.
Programmable Pull-Up Resistor
Each Cyclone device I/O pin provides an optional programmable
pull-up resistor during user mode. If the designer enables this feature for
an I/O pin, the pull-up resistor (typically 25 kΩ) holds the output to the
VCCIO level of the output pin's bank. Dedicated clock pins do not have the
optional programmable pull-up resistor.
Altera Corporation
May 2008
2–51
Preliminary
Cyclone Device Handbook, Volume 1
Advanced I/O Standard Support
Cyclone device IOEs support the following I/O standards:
■
■
■
■
■
■
■
■
■
■
3.3-V LVTTL/LVCMOS
2.5-V LVTTL/LVCMOS
1.8-V LVTTL/LVCMOS
1.5-V LVCMOS
3.3-V PCI
LVDS
RSDS
SSTL-2 class I and II
SSTL-3 class I and II
Differential SSTL-2 class II (on output clocks only)
Table 2–12 describes the I/O standards supported by Cyclone devices.
Table 2–12. Cyclone I/O Standards
I/O Standard
3.3-V LVTTL/LVCMOS
Type
Single-ended
Output Supply
Input Reference
Voltage (VREF) (V) Voltage (VCCIO) (V)
N/A
3.3
Board
Termination
Voltage (VTT) (V)
N/A
2.5-V LVTTL/LVCMOS
Single-ended
N/A
2.5
N/A
1.8-V LVTTL/LVCMOS
Single-ended
N/A
1.8
N/A
1.5-V LVCMOS
Single-ended
N/A
1.5
N/A
3.3-V PCI (1)
Single-ended
N/A
3.3
N/A
LVDS (2)
Differential
N/A
2.5
N/A
RSDS (2)
Differential
N/A
2.5
N/A
SSTL-2 class I and II
Voltage-referenced
1.25
2.5
1.25
SSTL-3 class I and II
Voltage-referenced
1.5
3.3
1.5
Differential SSTL-2 (3)
Differential
1.25
2.5
1.25
Notes to Table 2–12:
(1)
(2)
(3)
There is no megafunction support for EP1C3 devices for the PCI compiler. However, EP1C3 devices support PCI
by using the LVTTL 16-mA I/O standard and drive strength assignments in the Quartus II software. The device
requires an external diode for PCI compliance.
EP1C3 devices in the 100-pin TQFP package do not support the LVDS and RSDS I/O standards.
This I/O standard is only available on output clock pins (PLL_OUT pins). EP1C3 devices in the 100-pin package
do not support this I/O standard as it does not have PLL_OUT pins.
Cyclone devices contain four I/O banks, as shown in Figure 2–35. I/O
banks 1 and 3 support all the I/O standards listed in Table 2–12. I/O
banks 2 and 4 support all the I/O standards listed in Table 2–12 except the
3.3-V PCI standard. I/O banks 2 and 4 contain dual-purpose DQS, DQ,
2–52
Preliminary
Altera Corporation
May 2008
I/O Structure
and DM pins to support a DDR SDRAM or FCRAM interface. I/O bank 1
can also support a DDR SDRAM or FCRAM interface, however, the
configuration input pins in I/O bank 1 must operate at 2.5 V. I/O bank 3
can also support a DDR SDRAM or FCRAM interface, however, all the
JTAG pins in I/O bank 3 must operate at 2.5 V.
Figure 2–35. Cyclone I/O Banks
Notes (1), (2)
I/O Bank 2
I/O Bank 1
Also Supports
the 3.3-V PCI
I/O Standard
I/O Bank 1
I/O Bank 3
Also Supports
the 3.3-V PCI
I/O Standard
All I/O Banks Support
■ 3.3-V LVTTL/LVCMOS
■ 2.5-V LVTTL/LVCMOS
■ 1.8-V LVTTL/LVCMOS
■ 1.5-V LVCMOS
■ LVDS
■ RSDS
■ SSTL-2 Class I and II
■ SSTL-3 Class I and II
I/O Bank 3
Individual
Power Bus
I/O Bank 4
Notes to Figure 2–35:
(1)
(2)
Figure 2–35 is a top view of the silicon die.
Figure 2–35 is a graphic representation only. Refer to the pin list and the Quartus II software for exact pin locations.
Each I/O bank has its own VCCIO pins. A single device can support 1.5-V,
1.8-V, 2.5-V, and 3.3-V interfaces; each individual bank can support a
different standard with different I/O voltages. Each bank also has
dual-purpose VREF pins to support any one of the voltage-referenced
standards (e.g., SSTL-3) independently. If an I/O bank does not use
voltage-referenced standards, the VREF pins are available as user I/O pins.
Altera Corporation
May 2008
2–53
Preliminary
Cyclone Device Handbook, Volume 1
Each I/O bank can support multiple standards with the same VCCIO for
input and output pins. For example, when VCCIO is 3.3-V, a bank can
support LVTTL, LVCMOS, 3.3-V PCI, and SSTL-3 for inputs and outputs.
LVDS I/O Pins
A subset of pins in all four I/O banks supports LVDS interfacing. These
dual-purpose LVDS pins require an external-resistor network at the
transmitter channels in addition to 100-Ω termination resistors on
receiver channels. These pins do not contain dedicated serialization or
deserialization circuitry; therefore, internal logic performs serialization
and deserialization functions.
Table 2–13 shows the total number of supported LVDS channels per
device density.
Table 2–13. Cyclone Device LVDS Channels
Device
Pin Count
Number of LVDS Channels
EP1C3
100
(1)
144
34
EP1C4
324
103
400
129
EP1C6
144
29
240
72
256
72
240
66
256
72
EP1C12
EP1C20
324
103
324
95
400
129
Note to Table 2–13:
(1)
EP1C3 devices in the 100-pin TQFP package do not support the LVDS I/O
standard.
MultiVolt I/O Interface
The Cyclone architecture supports the MultiVolt I/O interface feature,
which allows Cyclone devices in all packages to interface with systems of
different supply voltages. The devices have one set of VCC pins for
internal operation and input buffers (VCCINT), and four sets for I/O
output drivers (VCCIO).
2–54
Preliminary
Altera Corporation
May 2008
Power Sequencing and Hot Socketing
The Cyclone VCCINT pins must always be connected to a 1.5-V power
supply. If the VCCINT level is 1.5 V, then input pins are 1.5-V, 1.8-V, 2.5-V,
and 3.3-V tolerant. The VCCIO pins can be connected to either a 1.5-V, 1.8-V,
2.5-V, or 3.3-V power supply, depending on the output requirements. The
output levels are compatible with systems of the same voltage as the
power supply (i.e., when VCCIO pins are connected to a 1.5-V power
supply, the output levels are compatible with 1.5-V systems). When VCCIO
pins are connected to a 3.3-V power supply, the output high is 3.3-V and
is compatible with 3.3-V or 5.0-V systems. Table 2–14 summarizes
Cyclone MultiVolt I/O support.
Table 2–14. Cyclone MultiVolt I/O Support
Note (1)
Input Signal
VCCIO (V)
Output Signal
1.5 V
1.8 V
2.5 V
3.3 V
5.0 V
1.5 V
1.8 V
2.5 V
3.3 V
5.0 V
1.5
v
v
v (2)
v (2)
—
v
—
—
—
—
1.8
v
v
v (2)
v (2)
—
v (3)
v
—
—
—
2.5
—
—
v
v
—
v (5)
v (5)
v
—
—
3.3
—
—
v (4)
v
v (6)
v (7)
v (7)
v (7)
v
v (8)
Notes to Table 2–14:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
The PCI clamping diode must be disabled to drive an input with voltages higher than VCCIO.
When VCCIO = 1.5-V or 1.8-V and a 2.5-V or 3.3-V input signal feeds an input pin, higher pin leakage current is
expected. Turn on Allow voltage overdrive for LVTTL / LVCMOS input pins in the Assignments > Device >
Device and Pin Options > Pin Placement tab when a device has this I/O combinations.
When VCCIO = 1.8-V, a Cyclone device can drive a 1.5-V device with 1.8-V tolerant inputs.
When VCCIO = 3.3-V and a 2.5-V input signal feeds an input pin, the VCCIO supply current will be slightly larger
than expected.
When VCCIO = 2.5-V, a Cyclone device can drive a 1.5-V or 1.8-V device with 2.5-V tolerant inputs.
Cyclone devices can be 5.0-V tolerant with the use of an external resistor and the internal PCI clamp diode.
When VCCIO = 3.3-V, a Cyclone device can drive a 1.5-V, 1.8-V, or 2.5-V device with 3.3-V tolerant inputs.
When VCCIO = 3.3-V, a Cyclone device can drive a device with 5.0-V LVTTL inputs but not 5.0-V LVCMOS inputs.
Power
Sequencing and
Hot Socketing
Because Cyclone devices can be used in a mixed-voltage environment,
they have been designed specifically to tolerate any possible power-up
sequence. Therefore, the VCCIO and VCCINT power supplies may be
powered in any order.
Signals can be driven into Cyclone devices before and during power up
without damaging the device. In addition, Cyclone devices do not drive
out during power up. Once operating conditions are reached and the
device is configured, Cyclone devices operate as specified by the user.
Altera Corporation
May 2008
2–55
Preliminary
Cyclone Device Handbook, Volume 1
Referenced
Documents
This chapter references the following document:
Document
Revision History
Table 2–15 shows the revision history for this chapter.
■
Using PLLs in Cyclone Devices chapter in the Cyclone Device Handbook
Table 2–15. Document Revision History
Date and
Document
Version
Changes Made
May 2008
v1.6
Minor textual and style changes. Added “Referenced
Documents” section.
January 2007
v1.5
●
August 2005
v1.4
Minor updates.
February 2005
v1.3
●
●
●
●
Added document revision history.
Updated Figures 2–17, 2–18, 2–19, 2–20, 2–21, and 2–32.
Summary of Changes
—
—
—
Updated JTAG chain limits. Added test vector information.
Corrected Figure 2-12.
Added a note to Tables 2-17 through 2-21 regarding violating
the setup or hold time.
—
Updated phase shift information.
Added 64-bit PCI support information.
—
October 2003
v1.2
●
September
2003 v1.1
Updated LVDS data rates to 640 Mbps from 311 Mbps.
—
May 2003 v1.0
Added document to Cyclone Device Handbook.
—
2–56
Preliminary
●
Altera Corporation
May 2008
3. Configuration and Testing
C51003-1.4
IEEE Std. 1149.1
(JTAG) Boundary
Scan Support
All Cyclone® devices provide JTAG BST circuitry that complies with the
IEEE Std. 1149.1a-1990 specification. JTAG boundary-scan testing can be
performed either before or after, but not during configuration. Cyclone
devices can also use the JTAG port for configuration together with either
the Quartus® II software or hardware using either Jam Files (.jam) or Jam
Byte-Code Files (.jbc).
Cyclone devices support reconfiguring the I/O standard settings on the
IOE through the JTAG BST chain. The JTAG chain can update the I/O
standard for all input and output pins any time before or during user
mode. Designers can use this ability for JTAG testing before configuration
when some of the Cyclone pins drive or receive from other devices on the
board using voltage-referenced standards. Since the Cyclone device
might not be configured before JTAG testing, the I/O pins might not be
configured for appropriate electrical standards for chip-to-chip
communication. Programming those I/O standards via JTAG allows
designers to fully test I/O connection to other devices.
The JTAG pins support 1.5-V/1.8-V or 2.5-V/3.3-V I/O standards. The
TDO pin voltage is determined by the VCCIO of the bank where it resides.
The bank VCCIO selects whether the JTAG inputs are 1.5-V, 1.8-V, 2.5-V, or
3.3-V compatible.
Cyclone devices also use the JTAG port to monitor the operation of the
device with the SignalTap® II embedded logic analyzer. Cyclone devices
support the JTAG instructions shown in Table 3–1.
Table 3–1. Cyclone JTAG Instructions (Part 1 of 2)
JTAG Instruction
Instruction Code
Description
SAMPLE/PRELOAD
00 0000 0101
Allows a snapshot of signals at the device pins to be captured and
examined during normal device operation, and permits an initial
data pattern to be output at the device pins. Also used by the
SignalTap II embedded logic analyzer.
EXTEST (1)
00 0000 0000
Allows the external circuitry and board-level interconnects to be
tested by forcing a test pattern at the output pins and capturing test
results at the input pins.
BYPASS
11 1111 1111
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through selected
devices to adjacent devices during normal device operation.
Altera Corporation
May 2008
3–1
Preliminary
Cyclone Device Handbook, Volume 1
Table 3–1. Cyclone JTAG Instructions (Part 2 of 2)
JTAG Instruction
Instruction Code
Description
USERCODE
00 0000 0111
Selects the 32-bit USERCODE register and places it between the
TDI and TDO pins, allowing the USERCODE to be serially shifted
out of TDO.
IDCODE
00 0000 0110
Selects the IDCODE register and places it between TDI and TDO,
allowing the IDCODE to be serially shifted out of TDO.
HIGHZ (1)
00 0000 1011
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through selected
devices to adjacent devices during normal device operation, while
tri-stating all of the I/O pins.
CLAMP (1)
00 0000 1010
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through selected
devices to adjacent devices during normal device operation while
holding I/O pins to a state defined by the data in the boundary-scan
register.
ICR instructions
—
Used when configuring a Cyclone device via the JTAG port with a
MasterBlasterTM or ByteBlasterMVTM download cable, or when
using a Jam File or Jam Byte-Code File via an embedded
processor.
PULSE_NCONFIG
00 0000 0001
Emulates pulsing the nCONFIG pin low to trigger reconfiguration
even though the physical pin is unaffected.
CONFIG_IO
00 0000 1101
Allows configuration of I/O standards through the JTAG chain for
JTAG testing. Can be executed before, after, or during
configuration. Stops configuration if executed during configuration.
Once issued, the CONFIG_IO instruction will hold nSTATUS low
to reset the configuration device. nSTATUS is held low until the
device is reconfigured.
SignalTap II
instructions
—
Monitors internal device operation with the SignalTap II embedded
logic analyzer.
Note to Table 3–1:
(1)
Bus hold and weak pull-up resistor features override the high-impedance state of HIGHZ, CLAMP, and EXTEST.
In the Quartus II software, there is an Auto Usercode feature where you
can choose to use the checksum value of a programming file as the JTAG
user code. If selected, the checksum is automatically loaded to the
USERCODE register. Choose Assignments > Device > Device and Pin
Options > General. Turn on Auto Usercode.
3–2
Preliminary
Altera Corporation
May 2008
IEEE Std. 1149.1 (JTAG) Boundary Scan Support
The Cyclone device instruction register length is 10 bits and the
USERCODE register length is 32 bits. Tables 3–2 and 3–3 show the
boundary-scan register length and device IDCODE information for
Cyclone devices.
Table 3–2. Cyclone Boundary-Scan Register Length
Device
Boundary-Scan Register Length
EP1C3
339
EP1C4
930
EP1C6
582
EP1C12
774
EP1C20
930
Table 3–3. 32-Bit Cyclone Device IDCODE
IDCODE (32 bits) (1)
Device
Version (4 Bits)
Part Number (16 Bits)
Manufacturer Identity
(11 Bits)
LSB (1 Bit) (2)
EP1C3
0000
0010 0000 1000 0001
000 0110 1110
1
EP1C4
0000
0010 0000 1000 0101
000 0110 1110
1
EP1C6
0000
0010 0000 1000 0010
000 0110 1110
1
EP1C12
0000
0010 0000 1000 0011
000 0110 1110
1
EP1C20
0000
0010 0000 1000 0100
000 0110 1110
1
Notes to Table 3–3:
(1)
(2)
The most significant bit (MSB) is on the left.
The IDCODE’s least significant bit (LSB) is always 1.
Altera Corporation
May 2008
3–3
Preliminary
Cyclone Device Handbook, Volume 1
Figure 3–1 shows the timing requirements for the JTAG signals.
Figure 3–1. Cyclone JTAG Waveforms
TMS
TDI
t JCP
t JCH
t JCL
t JPSU
t JPH
TCK
tJPZX
t JPXZ
t JPCO
TDO
tJSH
tJSSU
Signal
to Be
Captured
Signal
to Be
Driven
tJSCO
tJSZX
tJSXZ
Table 3–4 shows the JTAG timing parameters and values for Cyclone
devices.
Table 3–4. Cyclone JTAG Timing Parameters and Values
Symbol
3–4
Preliminary
Min
Max
Unit
TCK clock period
100
—
ns
tJ C H
TCK clock high time
50
—
ns
tJ C L
TCK clock low time
50
—
ns
tJ P S U
JTAG port setup time
20
—
ns
tJ P H
JTAG port hold time
45
—
ns
tJ P C O
JTAG port clock to output
—
25
ns
tJ P Z X
JTAG port high impedance to valid output
—
25
ns
tJ P X Z
JTAG port valid output to high impedance
—
25
ns
tJ S S U
Capture register setup time
20
—
ns
tJ S H
Capture register hold time
45
—
ns
tJ S C O
Update register clock to output
—
35
ns
tJ S Z X
Update register high impedance to valid output
—
35
ns
tJ S X Z
Update register valid output to high impedance
—
35
ns
tJ C P
Parameter
Altera Corporation
May 2008
SignalTap II Embedded Logic Analyzer
1
f
Cyclone devices must be within the first 8 devices in a JTAG
chain. All of these devices have the same JTAG controller. If any
of the Cyclone devices are in the 9th or after they will fail
configuration. This does not affect the SignalTap® II logic
analyzer.
For more information on JTAG, refer to the following documents:
■
■
AN 39: IEEE Std. 1149.1 (JTAG) Boundary-Scan Testing in Altera Devices
Jam Programming & Test Language Specification
SignalTap II
Embedded Logic
Analyzer
Cyclone devices feature the SignalTap II embedded logic analyzer, which
monitors design operation over a period of time through the IEEE
Std. 1149.1 (JTAG) circuitry. A designer can analyze internal logic at speed
without bringing internal signals to the I/O pins. This feature is
particularly important for advanced packages, such as FineLine BGA
packages, because it can be difficult to add a connection to a pin during
the debugging process after a board is designed and manufactured.
Configuration
The logic, circuitry, and interconnects in the Cyclone architecture are
configured with CMOS SRAM elements. Altera FPGAs are
reconfigurable and every device is tested with a high coverage
production test program so the designer does not have to perform fault
testing and can instead focus on simulation and design verification.
Cyclone devices are configured at system power-up with data stored in
an Altera configuration device or provided by a system controller. The
Cyclone device's optimized interface allows the device to act as controller
in an active serial configuration scheme with the new low-cost serial
configuration device. Cyclone devices can be configured in under 120 ms
using serial data at 20 MHz. The serial configuration device can be
programmed via the ByteBlaster II download cable, the Altera
Programming Unit (APU), or third-party programmers.
In addition to the new low-cost serial configuration device, Altera offers
in-system programmability (ISP)-capable configuration devices that can
configure Cyclone devices via a serial data stream. The interface also
enables microprocessors to treat Cyclone devices as memory and
configure them by writing to a virtual memory location, making
reconfiguration easy. After a Cyclone device has been configured, it can
be reconfigured in-circuit by resetting the device and loading new data.
Real-time changes can be made during system operation, enabling
innovative reconfigurable computing applications.
Altera Corporation
May 2008
3–5
Preliminary
Cyclone Device Handbook, Volume 1
Operating Modes
The Cyclone architecture uses SRAM configuration elements that require
configuration data to be loaded each time the circuit powers up. The
process of physically loading the SRAM data into the device is called
configuration. During initialization, which occurs immediately after
configuration, the device resets registers, enables I/O pins, and begins to
operate as a logic device. Together, the configuration and initialization
processes are called command mode. Normal device operation is called
user mode.
SRAM configuration elements allow Cyclone devices to be reconfigured
in-circuit by loading new configuration data into the device. With realtime reconfiguration, the device is forced into command mode with a
device pin. The configuration process loads different configuration data,
reinitializes the device, and resumes user-mode operation. Designers can
perform in-field upgrades by distributing new configuration files either
within the system or remotely.
A built-in weak pull-up resistor pulls all user I/O pins to VCCIO before
and during device configuration.
The configuration pins support 1.5-V/1.8-V or 2.5-V/3.3-V I/O
standards. The voltage level of the configuration output pins is
determined by the VCCIO of the bank where the pins reside. The bank
VCCIO selects whether the configuration inputs are 1.5-V, 1.8-V, 2.5-V, or
3.3-V compatible.
Configuration Schemes
Designers can load the configuration data for a Cyclone device with one
of three configuration schemes (see Table 3–5), chosen on the basis of the
target application. Designers can use a configuration device, intelligent
controller, or the JTAG port to configure a Cyclone device. A low-cost
configuration device can automatically configure a Cyclone device at
system power-up.
3–6
Preliminary
Altera Corporation
May 2008
Referenced Documents
Multiple Cyclone devices can be configured in any of the three
configuration schemes by connecting the configuration enable (nCE) and
configuration enable output (nCEO) pins on each device.
Table 3–5. Data Sources for Configuration
Configuration Scheme
Data Source
Active serial
Low-cost serial configuration device
Passive serial (PS)
Enhanced or EPC2 configuration device,
MasterBlaster or ByteBlasterMV download cable,
or serial data source
JTAG
MasterBlaster or ByteBlasterMV download cable
or a microprocessor with a Jam or JBC file
Referenced
Documents
This chapter references the following document:
Document
Revision History
Table 3–6 shows the revision history for this chapter.
■
■
AN 39: IEEE Std. 1149.1 (JTAG) Boundary-Scan Testing in Altera Devices
Jam Programming & Test Language Specification
Table 3–6. Document Revision History
Date and
Document
Version
Changes Made
Summary of Changes
May 2008
v1.4
Minor textual and style changes. Added “Referenced
Documents” section.
January 2007
v1.3
●
August 2005
V1.2
Minor updates.
—
February 2005
V1.1
Updated JTAG chain limits. Added information concerning test
vectors.
—
May 2003 v1.0
Added document to Cyclone Device Handbook.
—
●
Altera Corporation
May 2008
Added document revision history.
Updated handpara note below Table 3–4.
—
—
3–7
Preliminary
Cyclone Device Handbook, Volume 1
3–8
Preliminary
Altera Corporation
May 2008
4. DC and Switching
Characteristics
C51004-1.7
Operating
Conditions
Cyclone® devices are offered in both commercial, industrial, and
extended temperature grades. However, industrial-grade and extendedtemperature-grade devices may have limited speed-grade availability.
Tables 4–1 through 4–16 provide information on absolute maximum
ratings, recommended operating conditions, DC operating conditions,
and capacitance for Cyclone devices.
Table 4–1. Cyclone Device Absolute Maximum Ratings
Symbol
VCCINT
Parameter
Notes (1), (2)
Conditions
With respect to ground (3)
Supply voltage
VCCIO
With respect to ground (3)
Minimum
Maximum
Unit
–0.5
2.4
V
–0.5
4.6
V
VCCA
Supply voltage
–0.5
2.4
V
VI
DC input voltage
–0.5
4.6
V
IOUT
DC output current, per pin
–25
25
mA
TSTG
Storage temperature
No bias
–65
150
°C
TAMB
Ambient temperature
Under bias
–65
135
°C
TJ
Junction temperature
BGA packages under bias
—
135
°C
Table 4–2. Cyclone Device Recommended Operating Conditions (Part 1 of 2)
Conditions
Minimum
Maximum
Unit
VCCINT
Symbol
Supply voltage for internal logic
and input buffers
(4)
1.425
1.575
V
VCCIO
Supply voltage for output buffers,
3.3-V operation
(4)
3.00
3.60
V
Supply voltage for output buffers,
2.5-V operation
(4)
2.375
2.625
V
Supply voltage for output buffers,
1.8-V operation
(4)
1.71
1.89
V
Supply voltage for output buffers,
1.5-V operation
(4)
1.4
1.6
V
(3), (5)
–0.5
4.1
V
VI
Parameter
Input voltage
Altera Corporation
May 2008
4–1
Preliminary
Cyclone Device Handbook, Volume 1
Table 4–2. Cyclone Device Recommended Operating Conditions (Part 2 of 2)
Symbol
Parameter
Conditions
VO
Output voltage
TJ
Operating junction temperature
Minimum
Maximum
Unit
0
VCCIO
V
0
85
° C
For industrial use
–40
100
° C
For extendedtemperature use
–40
125
° C
For commercial
use
Table 4–3. Cyclone Device DC Operating Conditions
Symbol
Parameter
Note (6)
Conditions
Minimum Typical Maximum Unit
II
Input pin leakage current
VI = VC C I O m a x to 0 V (8)
–10
—
10
μA
IOZ
Tri-stated I/O pin leakage
current
VO = VC C I O m a x to 0 V (8)
–10
—
10
μA
ICC0
VCC supply current (standby)
(All M4K blocks in power-down
mode) (7)
EP1C3
—
4
—
mA
EP1C4
—
6
—
mA
EP1C6
—
6
—
mA
EP1C12
—
8
—
mA
EP1C20
—
12
—
mA
RCONF (9) Value of I/O pin pull-up resistor VI = 0 V; VCCI0 = 3.3 V
before and during configuration
VI = 0 V; VCCI0 = 2.5 V
15
25
50
kΩ
20
45
70
kΩ
VI = 0 V; VCCI0 = 1.8 V
30
65
100
kΩ
VI = 0 V; VCCI0 = 1.5 V
50
100
150
kΩ
—
1
2
kΩ
Recommended value of I/O pin
external pull-down resistor
before and during configuration
—
Table 4–4. LVTTL Specifications
Conditions
Minimum
Maximum
Unit
VCCIO
Symbol
Output supply voltage
—
3.0
3.6
V
VIH
High-level input voltage
—
1.7
4.1
V
VIL
Low-level input voltage
—
–0.5
0.7
V
VOH
High-level output voltage
IOH = –4 to –24 mA (11)
2.4
—
V
VOL
Low-level output voltage
IOL = 4 to 24 mA (11)
—
0.45
V
4–2
Preliminary
Parameter
Altera Corporation
May 2008
Operating Conditions
Table 4–5. LVCMOS Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Unit
VCCIO
Output supply voltage
—
3.0
3.6
V
VIH
High-level input voltage
—
1.7
4.1
V
VIL
Low-level input voltage
VOH
High-level output voltage
VCCIO = 3.0,
IOH = –0.1 mA
VOL
Low-level output voltage
VCCIO = 3.0,
IOL = 0.1 mA
—
–0.5
0.7
V
VCCIO – 0.2
—
V
—
0.2
V
Conditions
Minimum
Maximum
Unit
Table 4–6. 2.5-V I/O Specifications
Symbol
Parameter
VCCIO
Output supply voltage
—
2.375
2.625
V
VIH
High-level input voltage
—
1.7
4.1
V
VIL
Low-level input voltage
—
–0.5
0.7
V
VOH
High-level output voltage
IOH = –0.1 mA
2.1
—
V
IOH = –1 mA
2.0
—
V
IOH = –2 to –16 mA (11)
1.7
—
V
IOL = 0.1 mA
—
0.2
V
IOH = 1 mA
—
0.4
V
IOH = 2 to 16 mA (11)
—
0.7
V
Minimum
Maximum
Unit
VOL
Low-level output voltage
Table 4–7. 1.8-V I/O Specifications
Symbol
Parameter
Conditions
VCCIO
Output supply voltage
—
1.65
1.95
V
VI H
High-level input voltage
—
0.65 ×
VCCIO
2.25 (12)
V
VIL
Low-level input voltage
—
–0.3
0.35 ×
VCCIO
V
VOH
High-level output voltage
IOH = –2 to –8 mA (11)
VCCIO – 0.45
—
V
VOL
Low-level output voltage
IOL = 2 to 8 mA (11)
—
0.45
V
Altera Corporation
May 2008
4–3
Preliminary
Cyclone Device Handbook, Volume 1
Table 4–8. 1.5-V I/O Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Unit
VCCIO
Output supply voltage
—
1.4
1.6
V
VI H
High-level input voltage
—
0.65 ×
VCCIO
VCCIO + 0.3
(12)
V
VIL
Low-level input voltage
—
–0.3
0.35 ×
VCCIO
V
VOH
High-level output voltage
IOH = –2 mA (11)
0.75 ×
VCCIO
—
V
VOL
Low-level output voltage
IOL = 2 mA (11)
—
0.25 ×
VCCIO
V
Table 4–9. 2.5-V LVDS I/O Specifications
Symbol
Parameter
Note (13)
Conditions
Minimum
Typical
Maximum
Unit
—
2.375
2.5
2.625
V
VCCIO
I/O supply voltage
VOD
Differential output voltage
RL = 100 Ω
250
—
550
mV
Δ VOD
Change in VOD between
high and low
RL = 100 Ω
—
—
50
mV
VOS
Output offset voltage
RL = 100 Ω
1.125
1.25
1.375
V
Δ VOS
Change in VOS between
high and low
RL = 100 Ω
—
—
50
mV
VTH
Differential input threshold
VCM = 1.2 V
–100
—
100
mV
VIN
Receiver input voltage
range
—
0.0
—
2.4
V
RL
Receiver differential input
resistor
—
90
100
110
Ω
Conditions
Minimum
Typical
Maximum
Unit
Table 4–10. 3.3-V PCI Specifications (Part 1 of 2)
Symbol
Parameter
VCCIO
Output supply voltage
—
3.0
3.3
3.6
V
VIH
High-level input voltage
—
0.5 ×
VCCIO
—
VCCIO +
0.5
V
VIL
Low-level input voltage
—
–0.5
—
0.3 ×
VCCIO
V
4–4
Preliminary
Altera Corporation
May 2008
Operating Conditions
Table 4–10. 3.3-V PCI Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VOH
High-level output voltage
IOUT = –500 μA
0.9 ×
VCCIO
—
—
V
VOL
Low-level output voltage
IOUT = 1,500 μA
—
—
0.1 ×
VCCIO
V
Table 4–11. SSTL-2 Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
—
2.375
2.5
2.625
V
VTT
Termination voltage
—
VR E F – 0.04
VR E F
VR E F + 0.04
V
VREF
Reference voltage
—
1.15
1.25
1.35
V
VIH
High-level input voltage
—
VR E F + 0.18
—
3.0
V
VIL
Low-level input voltage
—
–0.3
—
VR E F – 0.18
V
VOH
High-level output voltage
IOH = –8.1 mA
(11)
VTT + 0.57
—
—
V
VOL
Low-level output voltage
IOL = 8.1 mA (11)
—
—
VT T – 0.57
V
Conditions
Minimum
Typical
Maximum
Unit
Table 4–12. SSTL-2 Class II Specifications
Symbol
Parameter
VCCIO
Output supply voltage
—
2.3
2.5
2.7
V
VTT
Termination voltage
—
VR E F – 0.04
VR E F
VR E F + 0.04
V
VREF
Reference voltage
—
1.15
1.25
1.35
V
VIH
High-level input voltage
—
VR E F + 0.18
—
VCCIO + 0.3
V
VIL
Low-level input voltage
—
–0.3
—
VR E F – 0.18
V
VOH
High-level output voltage
IOH = –16.4 mA
(11)
VTT + 0.76
—
—
V
VOL
Low-level output voltage
IOL = 16.4 mA
(11)
—
—
VT T – 0.76
V
Minimum
Typical
Maximum
Unit
Table 4–13. SSTL-3 Class I Specifications (Part 1 of 2)
Symbol
Parameter
Conditions
VCCIO
Output supply voltage
—
3.0
3.3
3.6
V
VTT
Termination voltage
—
VR E F – 0.05
VR E F
VR E F + 0.05
V
Altera Corporation
May 2008
4–5
Preliminary
Cyclone Device Handbook, Volume 1
Table 4–13. SSTL-3 Class I Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VREF
Reference voltage
—
1.3
1.5
1.7
V
VIH
High-level input voltage
—
VR E F + 0.2
—
VCCIO + 0.3
V
VIL
Low-level input voltage
—
–0.3
—
VR E F – 0.2
V
VOH
High-level output voltage
IOH = –8 mA (11)
VTT + 0.6
—
—
V
VOL
Low-level output voltage
IOL = 8 mA (11)
—
—
VT T – 0.6
V
Conditions
Minimum
Typical
Maximum
Unit
Table 4–14. SSTL-3 Class II Specifications
Symbol
Parameter
VCCIO
Output supply voltage
—
3.0
3.3
3.6
V
VTT
Termination voltage
—
VR E F – 0.05
VR E F
VR E F + 0.05
V
VREF
Reference voltage
—
1.3
1.5
1.7
V
VIH
High-level input voltage
—
VR E F + 0.2
—
VCCIO + 0.3
V
VIL
Low-level input voltage
—
–0.3
—
VR E F – 0.2
V
VOH
High-level output voltage
IOH = –16 mA
(11)
VT T + 0.8
—
—
V
VOL
Low-level output voltage
IOL = 16 mA (11)
—
—
VTT – 0.8
V
Table 4–15. Bus Hold Parameters
VC C I O Level
Parameter
Conditions
Min
Max
Min
Max
Min
Max
Min
Max
Low sustaining
current
VIN > VIL
(maximum)
—
—
30
—
50
—
70
—
μA
High sustaining VIN < VIH
current
(minimum)
—
—
–30
—
–50
—
–70
—
μA
Low overdrive
current
0 V < VIN <
VCCIO
—
—
—
200
—
300
—
500
μA
High overdrive
current
0 V < VIN <
VCCIO
—
—
—
–200
—
–300
—
–500
μA
4–6
Preliminary
1.5 V
1.8 V
2.5 V
Unit
3.3 V
Altera Corporation
May 2008
Operating Conditions
Table 4–16. Cyclone Device Capacitance
Symbol
Note (14)
Parameter
Typical
Unit
CIO
Input capacitance for user I/O pin
4.0
pF
CLVDS
Input capacitance for dual-purpose LVDS/user I/O pin
4.7
pF
CVREF
Input capacitance for dual-purpose VR E F /user I/O pin.
12.0
pF
CDPCLK
Input capacitance for dual-purpose DPCLK/user I/O pin.
4.4
pF
CCLK
Input capacitance for CLK pin.
4.7
pF
Notes to Tables 4–1 through 4–16:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
Refer to the Operating Requirements for Altera Devices Data Sheet.
Conditions beyond those listed in Table 4–1 may cause permanent damage to a device. Additionally, device
operation at the absolute maximum ratings for extended periods of time may have adverse affects on the device.
Minimum DC input is –0.5 V. During transitions, the inputs may undershoot to –2.0 V or overshoot to 4.6 V for
input currents less than 100 mA and periods shorter than 20 ns.
Maximum VCC rise time is 100 ms, and VCC must rise monotonically.
All pins, including dedicated inputs, clock, I/O, and JTAG pins, may be driven before VCCINT and VCCIO are
powered.
Typical values are for TA = 25° C, VCCINT = 1.5 V, and VCCIO = 1.5 V, 1.8 V, 2.5 V, and 3.3 V.
VI = ground, no load, no toggling inputs.
This value is specified for normal device operation. The value may vary during power-up. This applies for all
VCCIO settings (3.3, 2.5, 1.8, and 1.5 V).
RCONF is the measured value of internal pull-up resistance when the I/O pin is tied directly to GND. RCONF value
will be lower if an external source drives the pin higher than VC C I O .
Pin pull-up resistance values will lower if an external source drives the pin higher than VCCIO.
Drive strength is programmable according to values in Cyclone Architecture chapter in the Cyclone Device Handbook.
Overdrive is possible when a 1.5 V or 1.8 V and a 2.5 V or 3.3 V input signal feeds an input pin. Turn on “Allow
voltage overdrive” for LVTTL/LVCMOS input pins in the Assignments > Device > Device and Pin Options > Pin
Placement tab when a device has this I/O combination. However, higher leakage current is expected.
The Cyclone LVDS interface requires a resistor network outside of the transmitter channels.
Capacitance is sample-tested only. Capacitance is measured using time-domain reflections (TDR). Measurement
accuracy is within ±0.5 pF.
Altera Corporation
May 2008
4–7
Preliminary
Cyclone Device Handbook, Volume 1
Power
Consumption
Designers can use the Altera web Early Power Estimator to estimate the
device power.
Cyclone devices require a certain amount of power-up current to
successfully power up because of the nature of the leading-edge process
on which they are fabricated. Table 4–17 shows the maximum power-up
current required to power up a Cyclone device.
Table 4–17. Cyclone Maximum Power-Up Current (ICCINT) Requirements (In-Rush Current)
Device
Commercial Specification
Industrial Specification
Unit
EP1C3
150
180
mA
EP1C4
150
180
mA
EP1C6
175
210
mA
EP1C12
300
360
mA
EP1C20
500
600
mA
Notes to Table 4–17:
(1)
(2)
(3)
The Cyclone devices (except for the EP1C20 device) meet the power up specification for Mini PCI.
The lot codes 9G0082 to 9G2999, or 9G3109 and later comply to the specifications in Table 4–17 and meet the Mini
PCI specification. Lot codes appear at the top of the device.
The lot codes 9H0004 to 9H29999, or 9H3014 and later comply to the specifications in this table and meet the Mini
PCI specification. Lot codes appear at the top of the device.
Designers should select power supplies and regulators that can supply
this amount of current when designing with Cyclone devices. This
specification is for commercial operating conditions. Measurements were
performed with an isolated Cyclone device on the board. Decoupling
capacitors were not used in this measurement. To factor in the current for
decoupling capacitors, sum up the current for each capacitor using the
following equation:
I = C (dV/dt)
The exact amount of current that is consumed varies according to the
process, temperature, and power ramp rate. If the power supply or
regulator can supply more current than required, the Cyclone device may
consume more current than the maximum current specified in Table 4–17.
However, the device does not require any more current to successfully
power up than what is listed in Table 4–17.
The duration of the ICCINT power-up requirement depends on the VCCINT
voltage supply rise time. The power-up current consumption drops when
the VCCINT supply reaches approximately 0.75 V. For example, if the
VCCINT rise time has a linear rise of 15 ms, the current consumption spike
drops by 7.5 ms.
4–8
Preliminary
Altera Corporation
May 2008
Timing Model
Typically, the user-mode current during device operation is lower than
the power-up current in Table 4–17. Altera recommends using the
Cyclone Power Calculator, available on the Altera web site, to estimate
the user-mode ICCINT consumption and then select power supplies or
regulators based on the higher value.
Timing Model
The DirectDrive technology and MultiTrack interconnect ensure
predictable performance, accurate simulation, and accurate timing
analysis across all Cyclone device densities and speed grades. This
section describes and specifies the performance, internal, external, and
PLL timing specifications.
All specifications are representative of worst-case supply voltage and
junction temperature conditions.
Preliminary and Final Timing
Timing models can have either preliminary or final status. The
Quartus® II software issues an informational message during the design
compilation if the timing models are preliminary. Table 4–18 shows the
status of the Cyclone device timing models.
Preliminary status means the timing model is subject to change. Initially,
timing numbers are created using simulation results, process data, and
other known parameters. These tests are used to make the preliminary
numbers as close to the actual timing parameters as possible.
Final timing numbers are based on actual device operation and testing.
These numbers reflect the actual performance of the device under
worst-case voltage and junction temperature conditions.
Table 4–18. Cyclone Device Timing Model Status
Altera Corporation
May 2008
Device
Preliminary
Final
EP1C3
—
v
EP1C4
—
v
EP1C6
—
v
EP1C12
—
v
EP1C20
—
v
4–9
Preliminary
Cyclone Device Handbook, Volume 1
Performance
The maximum internal logic array clock tree frequency is limited to the
specifications shown in Table 4–19.
Table 4–19. Clock Tree Maximum Performance Specification
-6 Speed Grade
Parameter
Clock tree
fM A X
-7 Speed Grade
-8 Speed Grade
Definition
Units
Maximum frequency
that the clock tree
can support for
clocking registered
logic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
—
—
405
—
—
320
—
—
275
MHz
Table 4–20 shows the Cyclone device performance for some common
designs. All performance values were obtained with the Quartus II
software compilation of library of parameterized modules (LPM)
functions or megafunctions. These performance values are based on
EP1C6 devices in 144-pin TQFP packages.
Table 4–20. Cyclone Device Performance
Resources Used
Resource
Used
LE
4–10
Preliminary
Design Size and
Function
LEs
M4K
Memory
Bits
Mode
Performance
M4K
-6 Speed -7 Speed -8 Speed
Memory
Grade
Grade
Grade
Blocks
(MHz)
(MHz)
(MHz)
16-to-1
multiplexer
—
21
—
—
405.00
320.00
275.00
32-to-1
multiplexer
—
44
—
—
317.36
284.98
260.15
16-bit counter
—
16
—
—
405.00
320.00
275.00
64-bit counter (1)
—
66
—
—
208.99
181.98
160.75
Altera Corporation
May 2008
Timing Model
Table 4–20. Cyclone Device Performance
Resources Used
Resource
Used
M4K
memory
block
Design Size and
Function
Mode
RAM 128 × 36 bit
Performance
LEs
M4K
Memory
Bits
Single port
—
4,608
1
256.00
222.67
197.01
RAM 128 × 36 bit
Simple
dual-port
mode
—
4,608
1
255.95
222.67
196.97
RAM 256 × 18 bit
True dualport mode
—
4,608
1
255.95
222.67
196.97
FIFO 128 × 36 bit
—
40
4,608
1
256.02
222.67
197.01
11
4,536
1
255.95
222.67
196.97
Shift register
9 × 4 × 128
Shift
register
M4K
-6 Speed -7 Speed -8 Speed
Memory
Grade
Grade
Grade
Blocks
(MHz)
(MHz)
(MHz)
Note to Table 4–20:
(1)
The performance numbers for this function are from an EP1C6 device in a 240-pin PQFP package.
Internal Timing Parameters
Internal timing parameters are specified on a speed grade basis
independent of device density. Tables 4–21 through 4–24 describe the
Cyclone device internal timing microparameters for LEs, IOEs, M4K
memory structures, and MultiTrack interconnects.
Table 4–21. LE Internal Timing Microparameter Descriptions
Symbol
Altera Corporation
May 2008
Parameter
tSU
LE register setup time before clock
tH
LE register hold time after clock
tCO
LE register clock-to-output delay
tLUT
LE combinatorial LUT delay for data-in to data-out
tCLR
Minimum clear pulse width
tPRE
Minimum preset pulse width
tCLKHL
Minimum clock high or low time
4–11
Preliminary
Cyclone Device Handbook, Volume 1
Table 4–22. IOE Internal Timing Microparameter Descriptions
Symbol
Parameter
tSU
IOE input and output register setup time before clock
tH
IOE input and output register hold time after clock
tCO
IOE input and output register clock-to-output delay
tPIN2COMBOUT_R
Row input pin to IOE combinatorial output
tPIN2COMBOUT_C
Column input pin to IOE combinatorial output
tCOMBIN2PIN_R
Row IOE data input to combinatorial output pin
tCOMBIN2PIN_C
Column IOE data input to combinatorial output pin
tCLR
Minimum clear pulse width
tPRE
Minimum preset pulse width
tCLKHL
Minimum clock high or low time
Table 4–23. M4K Block Internal Timing Microparameter Descriptions
Symbol
4–12
Preliminary
Parameter
tM4KRC
Synchronous read cycle time
tM4KWC
Synchronous write cycle time
tM4KWERESU
Write or read enable setup time before clock
tM4KWEREH
Write or read enable hold time after clock
tM4KBESU
Byte enable setup time before clock
tM4KBEH
Byte enable hold time after clock
tM4KDATAASU
A port data setup time before clock
tM4KDATAAH
A port data hold time after clock
tM4KADDRASU
A port address setup time before clock
tM4KADDRAH
A port address hold time after clock
tM4KDATABSU
B port data setup time before clock
tM4KDATABH
B port data hold time after clock
tM4KADDRBSU
B port address setup time before clock
tM4KADDRBH
B port address hold time after clock
tM4KDATACO1
Clock-to-output delay when using output registers
tM4KDATACO2
Clock-to-output delay without output registers
tM4KCLKHL
Minimum clock high or low time
tM4KCLR
Minimum clear pulse width
Altera Corporation
May 2008
Timing Model
Table 4–24. Routing Delay Internal Timing Microparameter Descriptions
Symbol
Parameter
tR4
Delay for an R4 line with average loading; covers a distance
of four LAB columns
tC4
Delay for an C4 line with average loading; covers a distance
of four LAB rows
tLOCAL
Local interconnect delay
Figure 4–1 shows the memory waveforms for the M4K timing parameters
shown in Table 4–23.
Figure 4–1. Dual-Port RAM Timing Microparameter Waveform
wrclock
tWEREH
tWERESU
wren
tWADDRH
tWADDRSU
wraddress
an-1
an
a0
a1
a2
a3
a4
a5
a6
din4
din5
din6
tDATAH
data-in
din-1
din
tDATASU
rdclock
tWEREH
tWERESU
rden
tRC
bn
rdaddress
b1
b0
b2
b3
tDATACO1
reg_data-out
doutn-2
doutn-1
doutn
dout0
tDATACO2
unreg_data-out
Altera Corporation
May 2008
doutn-1
doutn
dout0
4–13
Preliminary
Cyclone Device Handbook, Volume 1
Internal timing parameters are specified on a speed grade basis
independent of device density. Tables 4–25 through 4–28 show the
internal timing microparameters for LEs, IOEs, TriMatrix memory
structures, DSP blocks, and MultiTrack interconnects.
Table 4–25. LE Internal Timing Microparameters
-6
-7
-8
Symbol
Unit
Min
Max
Min
Max
Min
Max
tSU
29
—
33
—
37
—
ps
tH
12
—
13
—
15
—
ps
tCO
—
173
—
198
—
224
ps
tLUT
—
454
—
522
—
590
ps
tCLR
129
—
148
—
167
—
ps
tPRE
129
—
148
—
167
—
ps
1,234
—
1,562
—
1,818
—
ps
tCLKHL
Table 4–26. IOE Internal Timing Microparameters
-6
-7
-8
Symbol
Max
Min
Max
Min
Max
tSU
348
—
400
—
452
—
ps
tH
0
—
0
—
0
—
ps
tCO
—
511
—
587
—
664
ps
tPIN2COMBOUT_R
—
1,130
—
1,299
—
1,469
ps
tPIN2COMBOUT_C
—
1,135
—
1,305
—
1,475
ps
tCOMBIN2PIN_R
—
2,627
—
3,021
—
3,415
ps
tCOMBIN2PIN_C
—
2,615
—
3,007
—
3,399
ps
tCLR
280
—
322
—
364
—
ps
tPRE
280
—
322
—
364
—
ps
1,234
—
1,562
—
1,818
—
ps
tCLKHL
4–14
Preliminary
Unit
Min
Altera Corporation
May 2008
Timing Model
Table 4–27. M4K Block Internal Timing Microparameters
-6
-7
-8
Symbol
Unit
Min
Max
—
4,379
tM4KWC
—
2,910
3,783
ps
tM4KWERESU
72
—
82
—
93
—
ps
tM4KWEREH
43
—
49
—
55
—
ps
tM4KBESU
72
—
82
—
93
—
ps
tM4KBEH
43
—
49
—
55
—
ps
tM4KDATAASU
72
—
82
—
93
—
ps
tM4KDATAAH
43
—
49
—
55
—
ps
tM4KADDRASU
72
—
82
—
93
—
ps
tM4KADDRAH
43
—
49
—
55
—
ps
tM4KDATABSU
72
—
82
—
93
—
ps
tM4KDATABH
43
—
49
—
55
—
ps
tM4KADDRBSU
72
—
82
—
93
—
ps
tM4KADDRBH
43
—
49
—
55
—
ps
tM4KDATACO1
—
621
—
714
—
807
ps
tM4KDATACO2
—
4,351
—
5,003
—
5,656
ps
1,234
—
1,562
—
1,818
—
ps
286
—
328
—
371
—
ps
tM4KRC
tM4KCLKHL
tM4KCLR
Min
Max
Min
Max
5,035
5,691
3,346
ps
Table 4–28. Routing Delay Internal Timing Microparameters
-6
-7
-8
Symbol
Unit
Min
Max
Min
Max
Min
Max
tR4
—
261
—
300
—
339
ps
tC4
—
338
—
388
—
439
ps
tLOCAL
—
244
—
281
—
318
ps
External Timing Parameters
External timing parameters are specified by device density and speed
grade. Figure 4–2 shows the timing model for bidirectional IOE pin
timing. All registers are within the IOE.
Altera Corporation
May 2008
4–15
Preliminary
Cyclone Device Handbook, Volume 1
Figure 4–2. External Timing in Cyclone Devices
OE Register
Dedicated
Clock
D
PRN
Q
tXZ
tZX
tINSU
tINH
tOUTCO
CLRN
Output Register
D
PRN
Q
Bidirectional
Pin
CLRN
Input Register
PRN
D
Q
CLRN
All external I/O timing parameters shown are for 3.3-V LVTTL I/O
standard with the maximum current strength and fast slew rate. For
external I/O timing using standards other than LVTTL or for different
current strengths, use the I/O standard input and output delay adders in
Tables 4–40 through 4–44.
Table 4–29 shows the external I/O timing parameters when using global
clock networks.
Table 4–29. Cyclone Global Clock External I/O Timing Parameters
Symbol
Notes (1), (2) (Part 1 of 2)
Parameter
Conditions
tI N S U
Setup time for input or bidirectional pin using IOE input
register with global clock fed by CLK pin
—
tI N H
Hold time for input or bidirectional pin using IOE input
register with global clock fed by CLK pin
—
tO U T C O
Clock-to-output delay output or bidirectional pin using IOE
output register with global clock fed by CLK pin
tI N S U P L L
Setup time for input or bidirectional pin using IOE input
register with global clock fed by Enhanced PLL with default
phase setting
—
tI N H P L L
Hold time for input or bidirectional pin using IOE input
register with global clock fed by enhanced PLL with default
phase setting
—
4–16
Preliminary
CLOAD = 10 pF
Altera Corporation
May 2008
Timing Model
Table 4–29. Cyclone Global Clock External I/O Timing Parameters
Symbol
tO U T C O P L L
Notes (1), (2) (Part 2 of 2)
Parameter
Conditions
Clock-to-output delay output or bidirectional pin using IOE
output register with global clock enhanced PLL with default
phase setting
CLOAD = 10 pF
Notes to Table 4–29:
(1)
(2)
These timing parameters are sample-tested only.
These timing parameters are for IOE pins using a 3.3-V LVTTL, 24-mA setting. Designers should use the Quartus II
software to verify the external timing for any pin.
Tables 4–30 through 4–31 show the external timing parameters on column
and row pins for EP1C3 devices.
Table 4–30. EP1C3 Column Pin Global Clock External I/O Timing
Parameters
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
Unit
Min
Max
Min
Max
Min
Max
tI N S U
3.085
—
3.547
—
4.009
—
ns
tI N H
0.000
—
0.000
—
0.000
—
ns
tO U T C O
2.000
4.073
2.000
4.682
2.000
5.295
ns
tI N S U P L L
1.795
—
2.063
—
2.332
—
ns
tI N H P L L
0.000
—
0.000
—
0.000
—
ns
tO U T C O P L L
0.500
2.306
0.500
2.651
0.500
2.998
ns
Table 4–31. EP1C3 Row Pin Global Clock External I/O Timing Parameters
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
Altera Corporation
May 2008
Unit
Min
Max
Min
Max
Min
Max
tI N S U
3.157
—
3.630
—
4.103
—
ns
tI N H
0.000
—
0.000
—
0.000
—
ns
tO U T C O
2.000
3.984
2.000
4.580
2.000
5.180
ns
tI N S U P L L
1.867
—
2.146
—
2.426
—
ns
tI N H P L L
0.000
—
0.000
—
0.000
—
ns
tO U T C O P L L
0.500
2.217
0.500
2.549
0.500
2.883
ns
4–17
Preliminary
Cyclone Device Handbook, Volume 1
Tables 4–32 through 4–33 show the external timing parameters on column
and row pins for EP1C4 devices.
Table 4–32. EP1C4 Column Pin Global Clock External I/O Timing
Parameters Note (1)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
Unit
Min
Max
Min
Max
Min
Max
tI N S U
2.471
—
2.841
—
3.210
—
ns
tI N H
0.000
—
0.000
—
0.000
—
ns
tO U T C O
2.000
3.937
2.000
4.526
2.000
5.119
ns
tI N S U P L L
1.471
—
1.690
—
1.910
—
ns
tI N H P L L
0.000
—
0.000
—
0.000
—
ns
tO U T C O P L L
0.500
2.080
0.500
2.392
0.500
2.705
ns
Table 4–33. EP1C4 Row Pin Global Clock External I/O Timing
Parameters Note (1)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
Unit
Min
Max
Min
Max
Min
Max
tI N S U
2.600
—
2.990
—
3.379
—
ns
tI N H
0.000
—
0.000
—
0.000
—
ns
tO U T C O
2.000
3.991
2.000
4.388
2.000
5.189
ns
tI N S U P L L
1.300
—
1.494
—
1.689
—
ns
tI N H P L L
0.000
—
0.000
—
0.000
—
ns
tO U T C O P L L
0.500
2.234
0.500
2.569
0.500
2.905
ns
Note to Tables 4–32 and 4–33:
(1)
4–18
Preliminary
Contact Altera Applications for EP1C4 device timing parameters.
Altera Corporation
May 2008
Timing Model
Tables 4–34 through 4–35 show the external timing parameters on column
and row pins for EP1C6 devices.
Table 4–34. EP1C6 Column Pin Global Clock External I/O Timing Parameters
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
Unit
Min
Max
Min
Max
Min
Max
tI N S U
2.691
—
3.094
—
3.496
—
ns
tI N H
0.000
—
0.000
—
0.000
—
ns
tO U T C O
2.000
3.917
2.000
4.503
2.000
5.093
ns
tI N S U P L L
1.513
—
1.739
—
1.964
—
ns
tI N H P L L
0.000
—
0.000
—
0.000
—
ns
tO U T C O P L L
0.500
2.038
0.500
2.343
0.500
2.651
ns
Table 4–35. EP1C6 Row Pin Global Clock External I/O Timing Parameters
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
Unit
Min
tI N S U
2.774
tI N H
tO U T C O
Max
Min
—
3.190
0.000
—
2.000
3.817
tI N S U P L L
1.596
tI N H P L L
tO U T C O P L L
Max
Min
—
3.605
0.000
—
2.000
4.388
—
1.835
0.000
—
0.500
1.938
Max
—
ns
0.000
—
ns
2.000
4.963
ns
—
2.073
—
ns
0.000
—
0.000
—
ns
0.500
2.228
0.500
2.521
ns
Tables 4–36 through 4–37 show the external timing parameters on column
and row pins for EP1C12 devices.
Table 4–36. EP1C12 Column Pin Global Clock External I/O Timing
Parameters (Part 1 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
Altera Corporation
May 2008
Unit
Min
Max
Min
Max
Min
Max
tI N S U
2.510
—
2.885
—
3.259
—
ns
tI N H
0.000
—
0.000
—
0.000
—
ns
tOU T C O
2.000
3.798
2.000
4.367
2.000
4.940
ns
tI N S U P L L
1.588
—
1.824
—
2.061
—
ns
4–19
Preliminary
Cyclone Device Handbook, Volume 1
Table 4–36. EP1C12 Column Pin Global Clock External I/O Timing
Parameters (Part 2 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
Unit
Min
Max
Min
Max
Min
Max
tI N H P L L
0.000
—
0.000
—
0.000
—
ns
tO U T C O P L L
0.500
1.663
0.500
1.913
0.500
2.164
ns
Table 4–37. EP1C12 Row Pin Global Clock External I/O Timing Parameters
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
Unit
Min
Max
Min
Max
Min
Max
tI N S U
2.620
—
3.012
—
3.404
—
ns
tI N H
0.000
—
0.000
—
0.000
—
ns
tO U T C O
2.000
3.671
2.000
4.221
2.000
4.774
ns
tI N S U P L L
1.698
—
1.951
—
2.206
—
ns
tI N H P L L
0.000
—
0.000
—
0.000
—
ns
tO U T C O P L L
0.500
1.536
0.500
1.767
0.500
1.998
ns
Tables 4–38 through 4–39 show the external timing parameters on column
and row pins for EP1C20 devices.
Table 4–38. EP1C20 Column Pin Global Clock External I/O Timing
Parameters
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
4–20
Preliminary
Unit
Min
Max
Min
Max
Min
Max
tI N S U
2.417
—
2.779
—
3.140
—
ns
tI N H
0.000
—
0.000
—
0.000
—
ns
tO U T C O
2.000
3.724
2.000
4.282
2.000
4.843
ns
tI N S U P L L
1.417
—
1.629
—
1.840
—
ns
tI N H P L L
0.000
—
0.000
—
0.000
—
ns
tO U T C O P L L
0.500
1.667
0.500
1.917
0.500
2.169
ns
Altera Corporation
May 2008
Timing Model
Table 4–39. EP1C20 Row Pin Global Clock External I/O Timing Parameters
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Symbol
Unit
Min
Max
Min
Max
Min
Max
tI N S U
2.417
—
2.779
—
3.140
—
ns
tI N H
0.000
—
0.000
—
0.000
—
ns
tO U T C O
2.000
3.724
2.000
4.282
2.000
4.843
ns
—
3.645
—
4.191
—
4.740
ns
tX Z
tZ X
—
3.645
—
4.191
—
4.740
ns
tI N S U P L L
1.417
—
1.629
—
1.840
—
ns
tI N H P L L
0.000
—
0.000
—
0.000
—
ns
tO U T C O P L L
0.500
1.667
0.500
1.917
0.500
2.169
ns
tX Z P L L
—
1.588
—
1.826
—
2.066
ns
tZ X P L L
—
1.588
—
1.826
—
2.066
ns
External I/O Delay Parameters
External I/O delay timing parameters for I/O standard input and output
adders and programmable input and output delays are specified by
speed grade independent of device density.
Tables 4–40 through 4–45 show the adder delays associated with column
and row I/O pins for all packages. If an I/O standard is selected other
than LVTTL 4 mA with a fast slew rate, add the selected delay to the
external tCO and tSU I/O parameters shown in Tables 4–25 through
4–28.
Table 4–40. Cyclone I/O Standard Column Pin Input Delay Adders (Part 1 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Max
Min
Max
Min
Max
LVCMOS
—
0
—
0
—
0
ps
3.3-V LVTTL
—
0
—
0
—
0
ps
2.5-V LVTTL
—
27
—
31
—
35
ps
1.8-V LVTTL
—
182
—
209
—
236
ps
1.5-V LVTTL
—
278
—
319
—
361
ps
I/O Standard
Unit
SSTL-3 class I
—
–250
—
–288
—
–325
ps
SSTL-3 class II
—
–250
—
–288
—
–325
ps
SSTL-2 class I
—
–278
—
–320
—
–362
ps
Altera Corporation
May 2008
4–21
Preliminary
Cyclone Device Handbook, Volume 1
Table 4–40. Cyclone I/O Standard Column Pin Input Delay Adders (Part 2 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Max
Min
Max
Min
Max
SSTL-2 class II
–278
—
–320
—
–362
ps
LVDS
–261
—
–301
—
–340
ps
I/O Standard
Unit
Table 4–41. Cyclone I/O Standard Row Pin Input Delay Adders
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Max
Min
Max
Min
Max
LVCMOS
—
0
—
0
—
0
ps
3.3-V LVTTL
—
0
—
0
—
0
ps
2.5-V LVTTL
—
27
—
31
—
35
ps
1.8-V LVTTL
—
182
—
209
—
236
ps
1.5-V LVTTL
—
278
—
319
—
361
ps
3.3-V PCI (1)
—
0
—
0
—
0
ps
I/O Standard
Unit
SSTL-3 class I
—
–250
—
–288
—
–325
ps
SSTL-3 class II
—
–250
—
–288
—
–325
ps
SSTL-2 class I
—
–278
—
–320
—
–362
ps
SSTL-2 class II
—
–278
—
–320
—
–362
ps
LVDS
—
–261
—
–301
—
–340
ps
Table 4–42. Cyclone I/O Standard Output Delay Adders for Fast Slew Rate on Column Pins (Part 1 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Max
Min
Max
Min
Max
2 mA
—
0
—
0
—
0
ps
4 mA
—
–489
—
–563
—
–636
ps
8 mA
—
–855
—
–984
—
–1,112
ps
Standard
LVCMOS
3.3-V LVTTL
4–22
Preliminary
Unit
12 mA
—
–993
—
–1,142
—
–1,291
ps
4 mA
—
0
—
0
—
0
ps
8 mA
—
–347
—
–400
—
–452
ps
12 mA
—
–858
—
–987
—
–1,116
ps
16 mA
—
–819
—
–942
—
–1,065
ps
24 mA
—
–993
—
–1,142
—
–1,291
ps
Altera Corporation
May 2008
Timing Model
Table 4–42. Cyclone I/O Standard Output Delay Adders for Fast Slew Rate on Column Pins (Part 2 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Standard
2.5-V LVTTL
1.8-V LVTTL
1.5-V LVTTL
Unit
Max
Max
Max
2 mA
—
329
—
378
—
427
ps
8 mA
—
–661
—
–761
—
–860
ps
12 mA
—
–655
—
–754
—
–852
ps
16 mA
—
–795
—
–915
—
–1034
ps
2 mA
—
4
—
4
—
5
ps
8 mA
—
–208
—
–240
—
–271
ps
12 mA
—
–208
—
–240
—
–271
ps
2 mA
—
2,288
—
2,631
—
2,974
ps
4 mA
—
608
—
699
—
790
ps
8 mA
—
292
—
335
—
379
ps
SSTL-3 class I
—
–410
—
–472
—
–533
ps
SSTL-3 class II
—
–811
—
–933
—
–1,055
ps
SSTL-2 class I
—
–485
—
–558
—
–631
ps
SSTL-2 class II
—
–758
—
–872
—
–986
ps
LVDS
—
–998
—
–1,148
—
–1,298
ps
Table 4–43. Cyclone I/O Standard Output Delay Adders for Fast Slew Rate on Row Pins (Part 1 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Max
Min
Max
Min
Max
2 mA
—
0
—
0
—
0
ps
4 mA
—
–489
—
–563
—
–636
ps
8 mA
—
–855
—
–984
—
–1,112
ps
Standard
LVCMOS
3.3-V LVTTL
2.5-V LVTTL
Unit
12 mA
—
–993
—
–1,142
—
–1,291
ps
4 mA
—
0
—
0
—
0
ps
8 mA
—
–347
—
–400
—
–452
ps
12 mA
—
–858
—
–987
—
–1,116
ps
16 mA
—
–819
—
–942
—
–1,065
ps
24 mA
—
–993
—
–1,142
—
–1,291
ps
2 mA
—
329
—
378
—
427
ps
8 mA
—
–661
—
–761
—
–860
ps
12 mA
—
–655
—
–754
—
–852
ps
16 mA
—
–795
—
–915
—
–1,034
ps
Altera Corporation
May 2008
4–23
Preliminary
Cyclone Device Handbook, Volume 1
Table 4–43. Cyclone I/O Standard Output Delay Adders for Fast Slew Rate on Row Pins (Part 2 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Max
Min
Max
Min
Max
Standard
1.8-V LVTTL
Unit
2 mA
—
1,290
—
1,483
—
1,677
ps
8 mA
—
4
—
4
—
5
ps
12 mA
—
–208
—
–240
—
–271
ps
2 mA
—
2,288
—
2,631
—
2,974
ps
4 mA
—
608
—
699
—
790
ps
8 mA
—
292
—
335
—
379
ps
3.3-V PCI (1)
—
–877
—
–1,009
—
–1,141
ps
SSTL-3 class I
—
–410
—
–472
—
–533
ps
SSTL-3 class II
—
–811
—
–933
—
–1,055
ps
SSTL-2 class I
—
–485
—
–558
—
–631
ps
SSTL-2 class II
—
–758
—
–872
—
–986
ps
LVDS
—
–998
—
–1,148
—
–1,298
ps
1.5-V LVTTL
Table 4–44. Cyclone I/O Standard Output Delay Adders for Slow Slew Rate on Column Pins (Part 1 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
I/O Standard
LVCMOS
3.3-V LVTTL
2.5-V LVTTL
1.8-V LVTTL
4–24
Preliminary
Unit
Max
Max
Max
2 mA
—
1,800
—
2,070
—
2,340
ps
4 mA
—
1,311
—
1,507
—
1,704
ps
8 mA
—
945
—
1,086
—
1,228
ps
12 mA
—
807
—
928
—
1,049
ps
4 mA
—
1,831
—
2,105
—
2,380
ps
8 mA
—
1,484
—
1,705
—
1,928
ps
12 mA
—
973
—
1,118
—
1,264
ps
16 mA
—
1,012
—
1,163
—
1,315
ps
24 mA
—
838
—
963
—
1,089
ps
2 mA
—
2,747
—
3,158
—
3,570
ps
8 mA
—
1,757
—
2,019
—
2,283
ps
12 mA
—
1,763
—
2,026
—
2,291
ps
16 mA
—
1,623
—
1,865
—
2,109
ps
2 mA
—
5,506
—
6,331
—
7,157
ps
8 mA
—
4,220
—
4,852
—
5,485
ps
12 mA
—
4,008
—
4,608
—
5,209
ps
Altera Corporation
May 2008
Timing Model
Table 4–44. Cyclone I/O Standard Output Delay Adders for Slow Slew Rate on Column Pins (Part 2 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
I/O Standard
1.5-V LVTTL
Unit
Max
Max
Max
2 mA
—
6,789
—
7,807
—
8,825
ps
4 mA
—
5,109
—
5,875
—
6,641
ps
8 mA
SSTL-3 class I
—
4,793
—
5,511
—
6,230
ps
—
1,390
—
1,598
—
1,807
ps
SSTL-3 class II
—
989
—
1,137
—
1,285
ps
SSTL-2 class I
—
1,965
—
2,259
—
2,554
ps
SSTL-2 class II
—
1,692
—
1,945
—
2,199
ps
LVDS
—
802
—
922
—
1,042
ps
Table 4–45. Cyclone I/O Standard Output Delay Adders for Slow Slew Rate on Row Pins (Part 1 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
I/O Standard
LVCMOS
3.3-V LVTTL
2.5-V LVTTL
1.8-V LVTTL
1.5-V LVTTL
Unit
Max
Max
Max
2 mA
—
1,800
—
2,070
—
2,340
ps
4 mA
—
1,311
—
1,507
—
1,704
ps
8 mA
—
945
—
1,086
—
1,228
ps
12 mA
—
807
—
928
—
1,049
ps
4 mA
—
1,831
—
2,105
—
2,380
ps
8 mA
—
1,484
—
1,705
—
1,928
ps
12 mA
—
973
—
1,118
—
1,264
ps
16 mA
—
1,012
—
1,163
—
1,315
ps
24 mA
—
838
—
963
—
1,089
ps
2 mA
—
2,747
—
3,158
—
3,570
ps
8 mA
—
1,757
—
2,019
—
2,283
ps
12 mA
—
1,763
—
2,026
—
2,291
ps
16 mA
—
1,623
—
1,865
—
2,109
ps
2 mA
—
5,506
—
6,331
—
7,157
ps
8 mA
—
4,220
—
4,852
—
5,485
ps
12 mA
—
4,008
—
4,608
—
5,209
ps
2 mA
—
6,789
—
7,807
—
8,825
ps
4 mA
—
5,109
—
5,875
—
6,641
ps
8 mA
—
4,793
—
5,511
—
6,230
ps
—
923
—
1,061
—
1,199
ps
3.3-V PCI
Altera Corporation
May 2008
4–25
Preliminary
Cyclone Device Handbook, Volume 1
Table 4–45. Cyclone I/O Standard Output Delay Adders for Slow Slew Rate on Row Pins (Part 2 of 2)
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Max
Min
Max
Min
Max
SSTL-3 class I
—
1,390
—
1,598
—
1,807
ps
SSTL-3 class II
—
989
—
1,137
—
1,285
ps
I/O Standard
Unit
SSTL-2 class I
—
1,965
—
2,259
—
2,554
ps
SSTL-2 class II
—
1,692
—
1,945
—
2,199
ps
LVDS
—
802
—
922
—
1,042
ps
Note to Tables 4–40 through 4–45:
(1)
EP1C3 devices do not support the PCI I/O standard.
Tables 4–46 through 4–47 show the adder delays for the IOE
programmable delays. These delays are controlled with the Quartus II
software options listed in the Parameter column.
Table 4–46. Cyclone IOE Programmable Delays on Column Pins
-6 Speed Grade
Parameter
-8 Speed Grade
Unit
Min
Decrease input delay to
internal cells
-7 Speed Grade
Setting
Max
Min
Max
Min
Max
Off
—
155
—
178
—
201
ps
Small
—
2,122
—
2,543
—
2,875
ps
Medium
—
2,639
—
3,034
—
3,430
ps
Large
—
3,057
—
3,515
—
3,974
ps
On
—
155
—
178
—
201
ps
Decrease input delay to
input register
Off
—
0
—
0
—
0
ps
On
—
3,057
—
3,515
—
3,974
ps
Increase delay to output
pin
Off
—
0
—
0
—
0
ps
On
—
552
—
634
—
717
ps
4–26
Preliminary
Altera Corporation
May 2008
Timing Model
Table 4–47. Cyclone IOE Programmable Delays on Row Pins
-6 Speed Grade
Parameter
-8 Speed Grade
Unit
Min
Decrease input delay to
internal cells
-7 Speed Grade
Setting
Max
Min
Max
Min
Max
Off
—
154
—
177
—
200
ps
Small
—
2,212
—
2,543
—
2,875
ps
Medium
—
2,639
—
3,034
—
3,430
ps
Large
—
3,057
—
3,515
—
3,974
ps
On
—
154
—
177
—
200
ps
Decrease input delay to input Off
register
On
—
0
—
0
—
0
ps
—
3,057
—
3,515
—
3,974
ps
Increase delay to output pin
Off
—
0
—
0
—
0
ps
On
—
556
—
639
—
722
ps
Note to Table 4–47:
(1)
EPC1C3 devices do not support the PCI I/O standard.
Maximum Input and Output Clock Rates
Tables 4–48 and 4–49 show the maximum input clock rate for column and
row pins in Cyclone devices.
Table 4–48. Cyclone Maximum Input Clock Rate for Column Pins
-6 Speed
Grade
-7 Speed
Grade
-8 Speed
Grade
Unit
LVTTL
464
428
387
MHz
2.5 V
392
302
207
MHz
1.8 V
387
311
252
MHz
I/O Standard
Altera Corporation
May 2008
1.5 V
387
320
243
MHz
LVCMOS
405
374
333
MHz
SSTL-3 class I
405
356
293
MHz
SSTL-3 class II
414
365
302
MHz
SSTL-2 class I
464
428
396
MHz
SSTL-2 class II
473
432
396
MHz
LVDS
567
549
531
MHz
4–27
Preliminary
Cyclone Device Handbook, Volume 1
Table 4–49. Cyclone Maximum Input Clock Rate for Row Pins
-6 Speed
Grade
-7 Speed
Grade
-8 Speed
Grade
Unit
LVTTL
464
428
387
MHz
2.5 V
392
302
207
MHz
1.8 V
387
311
252
MHz
I/O Standard
1.5 V
387
320
243
MHz
LVCMOS
405
374
333
MHz
SSTL-3 class I
405
356
293
MHz
SSTL-3 class II
414
365
302
MHz
SSTL-2 class I
464
428
396
MHz
SSTL-2 class II
473
432
396
MHz
3.3-V PCI (1)
464
428
387
MHz
LVDS
567
549
531
MHz
Note to Tables 4–48 through 4–49:
(1)
EP1C3 devices do not support the PCI I/O standard. These parameters are only
available on row I/O pins.
Tables 4–50 and 4–51 show the maximum output clock rate for column
and row pins in Cyclone devices.
Table 4–50. Cyclone Maximum Output Clock Rate for Column Pins
-6 Speed
Grade
-7 Speed
Grade
-8 Speed
Grade
Unit
LVTTL
304
304
304
MHz
2.5 V
220
220
220
MHz
1.8 V
213
213
213
MHz
1.5 V
166
166
166
MHz
I/O Standard
LVCMOS
304
304
304
MHz
SSTL-3 class I
100
100
100
MHz
SSTL-3 class II
100
100
100
MHz
SSTL-2 class I
134
134
134
MHz
SSTL-2 class II
134
134
134
MHz
LVDS
320
320
275
MHz
Note to Table 4–50:
(1)
4–28
Preliminary
EP1C3 devices do not support the PCI I/O standard.
Altera Corporation
May 2008
Timing Model
Table 4–51. Cyclone Maximum Output Clock Rate for Row Pins
-6 Speed
Grade
-7 Speed
Grade
-8 Speed
Grade
Unit
LVTTL
296
285
273
MHz
2.5 V
381
366
349
MHz
1.8 V
286
277
267
MHz
I/O Standard
1.5 V
219
208
195
MHz
LVCMOS
367
356
343
MHz
SSTL-3 class I
169
166
162
MHz
SSTL-3 class II
160
151
146
MHz
SSTL-2 class I
160
151
142
MHz
SSTL-2 class II
131
123
115
MHz
3.3-V PCI (1)
66
66
66
MHz
LVDS
320
303
275
MHz
Note to Tables 4–50 through 4–51:
(1)
EP1C3 devices do not support the PCI I/O standard. These parameters are only
available on row I/O pins.
PLL Timing
Table 4–52 describes the Cyclone FPGA PLL specifications.
Table 4–52. Cyclone PLL Specifications (Part 1 of 2)
Symbol
Min
Max
Unit
Input frequency (-6 speed
grade)
15.625
464
MHz
Input frequency (-7 speed
grade)
15.625
428
MHz
Input frequency (-8 speed
grade)
15.625
387
MHz
fIN DUTY
Input clock duty cycle
40.00
60
%
tIN JITTER
Input clock period jitter
—
± 200
ps
fOUT_EXT (external PLL
clock output)
PLL output frequency
(-6 speed grade)
15.625
320
MHz
PLL output frequency
(-7 speed grade)
15.625
320
MHz
PLL output frequency
(-8 speed grade)
15.625
275
MHz
fIN
Altera Corporation
May 2008
Parameter
4–29
Preliminary
Cyclone Device Handbook, Volume 1
Table 4–52. Cyclone PLL Specifications (Part 2 of 2)
Symbol
Min
Max
Unit
PLL output frequency
(-6 speed grade)
15.625
405
MHz
PLL output frequency
(-7 speed grade)
15.625
320
MHz
PLL output frequency
(-8 speed grade)
15.625
275
MHz
tOUT DUTY
Duty cycle for external clock
output (when set to 50%)
45.00
55
%
tJITTER (1)
Period jitter for external clock
output
—
±300 (2)
ps
tLOCK (3)
Time required to lock from end
of device configuration
10.00
100
μs
fVCO
PLL internal VCO operating
range
500.00
1,000
MHz
-
Minimum areset time
10
—
ns
N, G0, G1, E
Counter values
1
32
integer
fOUT (to global clock)
Parameter
Notes to Table 4–52:
(1)
(2)
(3)
The tJITTER specification for the PLL[2..1]_OUT pins are dependent on the I/O pins in its VCCIO bank, how many
of them are switching outputs, how much they toggle, and whether or not they use programmable current strength
or slow slew rate.
fOUT ≥ 100 MHz. When the PLL external clock output frequency (fOUT) is smaller than 100 MHz, the jitter
specification is 60 mUI.
fIN/N must be greater than 200 MHz to ensure correct lock detect circuit operation below –20 C. Otherwise, the PLL
operates with the specified parameters under the specified conditions.
4–30
Preliminary
Altera Corporation
May 2008
Referenced Document
Referenced
Document
This chapter references the following documents:
Document
Revision History
Table 4–53 shows the revision history for this chapter.
■
■
Cyclone Architecture chapter in the Cyclone Device Handbook
Operating Requirements for Altera Devices Data Sheet
Table 4–53. Document Revision History
Date and
Document
Version
Changes Made
Summary of Changes
May 2008
v1.7
Minor textual and style changes. Added “Referenced Document”
section.
—
January 2007
v1.6
●
●
●
●
●
●
●
Added document revision history.
Added new row for VCCA details in Table 4–1.
—
Updated RCONF information in Table 4–3.
Added new Note (12) on voltage overdrive information to
Table 4–7 and Table 4–8.
Updated Note (9) on RCONF information to Table 4–3.
Updated information in “External I/O Delay Parameters”
section.
Updated speed grade information in Table 4–46 and
Table 4–47.
●
Updated LVDS information in Table 4–51.
August 2005
v1.5
Minor updates.
February 2005
v1.4
●
●
●
●
January 2004
v.1.3
●
●
October 2003
v.1.2
●
●
●
Altera Corporation
May 2008
—
Updated information on Undershoot voltage. Updated Table
4-2.
Updated Table 4-3.
Updated the undershoot voltage from 0.5 V to 2.0 V in Note 3
of Table 4-16.
Updated Table 4-17.
—
Added extended-temperature grade device information.
Updated Table 4-2.
Updated IC C 0 information in Table 4-3.
—
Added clock tree information in Table 4-19.
Finalized timing information for EP1C3 and EP1C12 devices.
Updated timing information in Tables 4-25 through 4-26 and
Tables 4-30 through 4-51.
Updated PLL specifications in Table 4-52.
—
4–31
Preliminary
Cyclone Device Handbook, Volume 1
July 2003
v1.1
Updated timing information. Timing finalized for EP1C6 and
EP1C20 devices. Updated performance information. Added PLL
Timing section.
—
May 2003
v1.0
Added document to Cyclone Device Handbook.
—
4–32
Preliminary
Altera Corporation
May 2008
5. Reference and Ordering
Information
C51005-1.4
Software
Cyclone® devices are supported by the Altera® Quartus® II design
software, which provides a comprehensive environment for system-on-aprogrammable-chip (SOPC) design. The Quartus II software includes
HDL and schematic design entry, compilation and logic synthesis, full
simulation and advanced timing analysis, SignalTap® II logic analysis,
and device configuration.
f
For more information about the Quartus II software features, refer to the
Quartus II Handbook.
The Quartus II software supports the Windows 2000/NT/98, Sun Solaris,
Linux Red Hat v7.1 and HP-UX operating systems. It also supports
seamless integration with industry-leading EDA tools through the
NativeLink® interface.
Device Pin-Outs
Device pin-outs for Cyclone devices are available on the Altera website
(www.altera.com) and in the Cyclone Device Handbook.
Ordering
Information
Figure 5–1 describes the ordering codes for Cyclone devices. For more
information about a specific package, refer to the Package Information for
Cyclone Devices chapter in the Cyclone Device Handbook.
Altera Corporation
May 2008
5–1
Preliminary
Cyclone Device Handbook, Volume 1
Figure 5–1. Cyclone Device Packaging Ordering Information
EP1C
20
F
400
C
7
ES
Family Signature
Optional Suffix
EP1C: Cyclone
Indicates specific device options or
shipment method.
ES: Engineering sample
Device Type
3
4
6
12
20
Speed Grade
6, 7, or 8 , with 6 being the fastest
Operating Temperature
C: Commercial temperature (tJ = 0˚ C to 85˚ C)
I: Industrial temperature (tJ = -40˚ C to 100˚ C)
Package Type
T: Thin quad flat pack (TQFP)
Q: Plastic quad flat pack (PQFP)
F: FineLine BGA
Referenced
Documents
Pin Count
Number of pins for a particular package
This chapter references the following documents:
■
■
Document
Revision History
Package Information for Cyclone Devices chapter in the Cyclone Device
Handbook
Quartus II Handbook
Table 5–1 shows the revision history for this chapter.
Table 5–1. Document Revision History
Date and
Document
Version
Changes Made
Summary of Changes
May 2008
v1.4
Minor textual and style changes. Added “Referenced
Documents” section.
—
January 2007
v1.3
Added document revision history.
—
August 2005
v1.2
Minor updates.
—
5–2
Preliminary
Altera Corporation
May 2008
Document Revision History
February 2005
v1.1
Updated Figure 5-1.
—
May 2003
v1.0
Added document to Cyclone Device Handbook.
—
Altera Corporation
May 2008
5–3
Preliminary
Cyclone Device Handbook, Volume 1
5–4
Preliminary
Altera Corporation
May 2008