Philips Semiconductors Product Specification PowerMOS transistor GENERAL DESCRIPTION N-channel enhancement mode field-effect power transistor in a plastic envelope. The device is intended for use in Switched Mode Power Supplies (SMPS), motor control, welding, DC/DC and AC/DC converters, and in general purpose switching applications. PINNING - TO220AB PIN QUICK REFERENCE DATA SYMBOL PARAMETER MAX. MAX. UNIT VDS ID Ptot RDS(ON) BUK454 Drain-source voltage Drain current (DC) Total power dissipation Drain-source on-state resistance -800A 800 2.4 85 6 -800B 800 2.0 85 8 V A W Ω PIN CONFIGURATION DESCRIPTION 1 gate 2 drain 3 source tab BUK454-800A/B SYMBOL d tab g drain s 1 23 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS VDGR ±VGS Drain-source voltage Drain-gate voltage Gate-source voltage RGS = 20 kΩ - - 800 800 30 V V V ID ID IDM Drain current (DC) Drain current (DC) Drain current (pulse peak value) Tmb = 25 ˚C Tmb = 100 ˚C Tmb = 25 ˚C - Ptot Tstg Tj Total power dissipation Storage temperature Junction Temperature Tmb = 25 ˚C - - 55 - -800A 2.4 1.5 9.5 -800B 2.0 1.25 8 A A A 85 150 150 W ˚C ˚C THERMAL RESISTANCES SYMBOL PARAMETER Rth j-mb Thermal resistance junction to mounting base Thermal resistance junction to ambient Rth j-a April 1993 CONDITIONS 1 MIN. TYP. MAX. UNIT - - 1.47 K/W - 60 - K/W Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor BUK454-800A/B STATIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)DSS Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Zero gate voltage drain current Gate source leakage current Drain-source on-state resistance VGS = 0 V; ID = 0.25 mA 800 - - V VDS = VGS; ID = 1 mA VDS = 800 V; VGS = 0 V; Tj = 25 ˚C VDS = 800 V; VGS = 0 V; Tj =125 ˚C VGS = ±30 V; VDS = 0 V VGS = 10 V; BUK454-800A BUK454-800B ID = 1.0 A 2.1 - 3.0 2 0.1 10 5 6 4.0 20 1.0 100 6 8 V µA mA nA Ω Ω MIN. TYP. MAX. UNIT VGS(TO) IDSS IDSS IGSS RDS(ON) DYNAMIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS gfs Forward transconductance VDS = 25 V; ID = 1.0 A 1.0 2.3 - S Ciss Coss Crss Input capacitance Output capacitance Feedback capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 450 42 15 750 70 30 pF pF pF td on tr td off tf Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time VDD = 30 V; ID = 1.9 A; VGS = 10 V; RGS = 50 Ω; Rgen = 50 Ω - 15 25 50 30 20 40 65 40 ns ns ns ns Ld Internal drain inductance - 3.5 - nH Ld Internal drain inductance - 4.5 - nH Ls Internal source inductance Measured from contact screw on tab to centre of die Measured from drain lead 6 mm from package to centre of die Measured from source lead 6 mm from package to source bond pad - 7.5 - nH MIN. TYP. MAX. UNIT REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS IDR - - - 2.6 A IDRM VSD Continuous reverse drain current Pulsed reverse drain current Diode forward voltage IF = 2.6 A ; VGS = 0 V - 1.0 10 1.3 A V trr Qrr Reverse recovery time Reverse recovery charge IF = 2.6 A; -dIF/dt = 100 A/µs; VGS = 0 V; VR = 100 V - 230 1.9 - ns µC April 1993 2 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor Normalised Power Derating PD% 120 BUK454-800A/B 10 Zth / (K/W) BUKx54-hv 110 100 90 D= 80 1 0.5 70 60 50 0.2 0.1 40 0.1 0.05 30 PD 0.02 20 10 0 0 0 20 40 60 80 100 Tmb / C 120 Fig.1. Normalised power dissipation. PD% = 100⋅PD/PD 25 ˚C = f(Tmb) 1E-05 1E-03 t/s tp T t 1E-01 1E+01 Fig.4. Transient thermal impedance. Zth j-mb = f(t); parameter D = tp/T Normalised Current Derating ID% 120 D= T 0.01 1E-07 140 tp 4 ID / A BUK454-800A 10 110 6 100 90 3 5 80 70 4.8 60 50 2 4.6 40 30 4.4 1 4.2 20 10 4 0 0 20 40 60 80 Tmb / C 100 120 0 140 BUK454-800A,B ID / A 4 20 10 N) = 4.2 16 VDS / V 24 VGS / V = 4.8 tp = 10 us 10 5 100 us 1 DC 10 10 1 ms 100 0 0 VDS / V Fig.3. Safe operating area. Tmb = 25 ˚C ID & IDM = f(VDS); IDM single pulse; parameter tp April 1993 6 5 10 ms 100 ms 1000 0.1 28 4.4 B (O S RD 20 BUK454-800A 4.6 15 A S VD 12 RDS(ON) / Ohm 4 /ID 8 Fig.5. Typical output characteristics, Tj = 25 ˚C. ID = f(VDS); parameter VGS Fig.2. Normalised continuous drain current. ID% = 100⋅ID/ID 25 ˚C = f(Tmb); conditions: VGS ≥ 10 V 100 0 1 2 ID / A 3 4 Fig.6. Typical on-state resistance, Tj = 25 ˚C. RDS(ON) = f(ID); parameter VGS 3 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor 4 BUK454-800A/B VGS(TO) / V BUK454-800A ID / A max. 4 Tj / C = 25 3 typ. 3 150 2 min. 2 1 1 0 0 0 2 4 6 8 -60 10 -40 -20 0 VGS / V gfs / S 40 60 Tj / C 80 100 120 140 Fig.10. Gate threshold voltage. VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS Fig.7. Typical transfer characteristics. ID = f(VGS) ; conditions: VDS = 25 V; parameter Tj 3 20 BUK454-800A SUB-THRESHOLD CONDUCTION ID / A 1E-01 1E-02 2 2% 1E-03 typ 98 % 1E-04 1 1E-05 0 1E-06 0 1 2 ID / A 3 4 0 Fig.8. Typical transconductance, Tj = 25 ˚C. gfs = f(ID); conditions: VDS = 25 V 2 VGS / V 3 4 Fig.11. Sub-threshold drain current. ID = f(VGS); conditions: Tj = 25 ˚C; VDS = VGS Normalised RDS(ON) = f(Tj) a 1 10000 C / pF BUK4y4-800 2 1000 Ciss 1 100 Coss 0 -60 -40 -20 0 20 40 60 Tj / C 80 10 100 120 140 20 40 VDS / V Fig.9. Normalised drain-source on-state resistance. a = RDS(ON)/RDS(ON)25 ˚C = f(Tj); ID = 1.0 A; VGS = 10 V April 1993 Crss 0 Fig.12. Typical capacitances, Ciss, Coss, Crss. C = f(VDS); conditions: VGS = 0 V; f = 1 MHz 4 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor 12 BUK454-800A/B BUK454-800 VGS / V 6 VDS / V =160 10 IF / A 5 Tj / C = 150 640 8 3 4 2 2 1 0 0 2 4 6 8 10 12 QG / nC 14 16 18 20 Fig.13. Typical turn-on gate-charge characteristics. VGS = f(QG); conditions: ID = 2.4 A; parameter VDS April 1993 25 4 6 0 BUK454-800A 0 1 VSDS / V 2 Fig.14. Typical reverse diode current. IF = f(VSDS); conditions: VGS = 0 V; parameter Tj 5 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor BUK454-800A/B MECHANICAL DATA Dimensions in mm 4,5 max Net Mass: 2 g 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 0,9 max (3x) 2,54 2,54 0,6 2,4 Fig.15. TO220AB; pin 2 connected to mounting base. Notes 1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to mounting instructions for TO220 envelopes. 3. Epoxy meets UL94 V0 at 1/8". April 1993 6 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor BUK454-800A/B DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. April 1993 7 Rev 1.100