ON CM1624 Emi filter for t-flash / microsd interface Datasheet

CM1624
EMI Filter for T-Flash /
MicroSD Interfaces
Description
The CM1624 is a combination EMI filter and line termination
device with integrated TVS diodes for use on Multimedia Card
interfaces. This state−of−the−art device utilizes solid−state, silicon−
avalanche technology for superior clamping performance and DC
electrical characteristics. The CM1624 has been optimized for
protection of T−Flash/MicroSD interfaces in cellular phones and other
portable electronics.
The CM1624 consists of six circuits that includes series impedance
matching resistors and pull−up resistors as required by the SD
specification. TVS diodes are included on each line for ESD
protection. An additional TVS diode connection is included for
protection of the voltage (Vcc) bus. Termination resistor value of 40 W
is provided on the SDData0, SDData1, SDData2, SDData3, CMD, and
CLK lines.
Pull−up resistors of 25 kW are included on the SDData0, SDData1,
SDData2, SDData3 and CMD lines, as well. These may be configured
for devices operating in SD or SPI mode. The TVS diodes provide
effective suppression of ESD voltages in excess of ±15 kV (contact
discharge) per IEC 61000−4−2, level 4. The CM1624 is in a 16−pin,
RoHS/WEEE compliant, UDFN 16−pin package. It measures 3.30 x
1.35 x 0.50 mm. The leads are spaced at a pitch of 0.4 mm and are
finished with lead−free NiPd.
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16
1
UDFN16
DE SUFFIX
CASE 517BE
MARKING DIAGRAM
1624 MG
G
1
1624
= Specific Device Code
M
= Single Character Date Code
G
= Pb−Free Package
(*Note: Microdot may be in either location)
PINOUT DIAGRAM
Features
• Bidirectional EMI/RFI Filtering and Line Termination with
•
SDData1
Data1
SDData0
Data0
SDCLK
ESD1
ESD3
GND PAD
•
•
•
•
•
•
Integrated ESD Protection
Provides ESD Protection to IEC61000−4−2:
±15 kV Contact Discharge
TVS Working Voltage: 5 V
Termination Resistors: 40 W
Pull−up Resistors: 25 kW
Typical Capacitance per Line: 12 pF (VIN = 2.5 V)
Protection and Termination for Six Lines + Vcc
Solid−state Technology
CLK
ESD1
VCC
SDCMD
CMD
SDData3
Data3
SDData2
Data2
(Top View)
Applications
• T−Flash / MicroSD Interfaces
• MMC Interfaces
• CDMA, GSM, 3G Cell Phones
ORDERING INFORMATION
Mechanical Characteristics
•
•
•
•
•
0.40 mm, uDFN 16−pin Package
Nominal Dimensions: 3.30 x 1.35 x 0.50 mm
Pitch: 0.4 mm
Pin−lead Finish: NiPd
RoHS/WEEE Compliance, Lead−free Finish
© Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. 3
Device
Package
Shipping†
CM1624−08DE
UDFN16
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1
Publication Order Number:
CM1624/D
CM1624
ELECTRICAL SCHEMATIC
Table 1. PIN DESCRIPTIONS
Pin
Name
Description
1
SDData1
Data line #1 input/output with pull−up resistor
2
SDData0
Data line #0 input/output with pull−up resistor
3
SDCLK
Clock line Input/Output
4
ESD1
Single ESD
5
ESD3
Single ESD
6
SDCMD
Command Line Input/Output
7
SDData3
Data line #3 input/output with pull−up resistor
8
SDData2
Data line #2 input/output with pull−up resistor
9
Data2
Data line #2 input/output with pull−up resistor
10
Data3
Data line #3 input/output with pull−up resistor
11
CMD
Command Line Input/Output
12
VCC
Power Supply ESD Protection
13
ESD1
Single ESD
14
CLK
Clock line Input/Output
15
Data0
Data line #0 input/output with pull−up resistor
16
Data1
Data line #1 input/output with pull−up resistor
GND PAD
GND
Ground return to shield
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2
CM1624
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
Operating Temperature Range
−40 to +85
°C
Storage Temperature Range
−55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
RCH
Channel Resistance (R1 to R6)
LCH
Channel Inductance
C
Conditions
Min
Typ
Max
Units
34
40
46
W
20
Capacitance per Channel
VIN = 0 V; 1 MHz; 30 mVRMS
16
VIN = 2.5 V; 1 MHz; 30 mVRMS;
(Note 2)
RUP
Pull−up Resistance (R7 to R11)
ILEAK
Diode Leakage Current per Channel
VIN = 3 V
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
VESD
fC
20
nH
24
12
21
pF
pF
25
29
kW
0.1
0.5
mA
6.8
−0.8
9.0
−0.4
V
ESD Protection − Peak Discharge Voltage at any
channel input, in system:
a) Contact discharge per IEC 61000−4−2 Standard
and
b) Air discharge per IEC 61000−4−2 Standard
5.6
−1.5
kV
(Note 2)
±15
(Note 2)
±15
Cut−off frequency
ZSOURCE = 50 W, ZLOAD = 50 W
300
1. All parameters specified at TA = 25°C unless otherwise noted.
2. This parameter is guaranteed by design and verified by device characterization
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3
MHz
CM1624
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (Pins 1 and 16)
Figure 2. Insertion Loss vs. Frequency (Pins 2 and 15)
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4
CM1624
PERFORMANCE INFORMATION (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 3. Insertion Loss vs. Frequency (Pins 3 and 14)
Figure 4. Insertion Loss vs. Frequency (Pins 6 and 11)
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5
CM1624
PERFORMANCE INFORMATION (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 5. Insertion Loss vs. Frequency (Pins 7 and 10)
Figure 6. Insertion Loss vs. Frequency (Pins 8 and 9)
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6
CM1624
PACKAGE DIMENSIONS
UDFN16, 3.3x1.35, 0.4P
CASE 517BE−01
ISSUE O
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
0.10 C
L1
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
TOP VIEW
EXPOSED Cu
A
DETAIL B
0.05 C
(A3)
16X
A1
0.05 C
NOTE 4
16X
A1
SIDE VIEW
K
1
8
16
9
e
C
SEATING
PLANE
ÇÇ
ÇÇ
ÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MOLD CMPD
A3
DETAIL B
OPTIONAL
CONSTRUCTION
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
3.30 BSC
2.70
2.90
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−−
0.05
DETAIL A
D2
L
L
L
E2
16X
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
b
BOTTOM VIEW
3.00
16X
0.40
0.10 C A B
0.05 C
NOTE 3
1.55
0.50
16X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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For additional information, please contact your local
Sales Representative
CM1624/D
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