Seoul FCW320G Chip led device Datasheet

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*Customer:
SPECIFICATION
ITEM
MODEL
REVISION DATE
CHIP LED DEVICE
FCW320G
Rev0.4(061127)
[Contents]
1. Features
2. Absolute maximum ratings
3. Electro-optical characteristics
4. Characteristic Diagrams
5. Soldering profile
6. Outline dimension
7. Packing
8. Reel packing structure
9. Label
10. Precaution for use
11. Ranks
Supplier
SSC-QP-0401-06(REV.0)
Drawn by
Checked by
Approved by
11/27
11/27
11/27
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 1/10 -
FCW320G
Seoul Semiconductor
1. Features
Package : 3.5 × 2.8 × 0.6 mm
Color coordinates: according to CIE 1931
Tape and reel packing
2. Absolute Maximum Ratings
(Ta=25℃)
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
306
㎽
Forward Current
IF
90
㎃
Peak Forward Current
IFM*1
250
㎃
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-30 ~ 80
℃
Storage Temperature
Tstg
-40 ~ 100
℃
*1 IFM conditions: Pulse width Tw≤ 300ms, Duty ratio≤ 1/10
3. Electro-Optical Characteristics
Characteristics
(Ta=25℃)
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage
VF
IF=90㎃
3.0
3.4
4.0
V
Reverse Current
IR
VR=5V
-
-
30
㎂
IF=60㎃
-
4800
-
IF=90㎃
4500
7000
-
IF=250㎃
(Flash mode) *3
-
16000
-
X
IF=90㎃
0.247
0.300
0.340
Y
IF=90㎃
0.260
0.300
0.340
Δ 1/2θ
IF=90㎃
-
X = 120
Y = 120
-
Luminous Intensity *2
IV
Chromaticity Coordinates *4
Viewing Angle
: X, Y Direction
mcd
˚
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
*3 Flash mode condition is Pulse width Tw≤ 300ms, Duty ratio≤ 1/10
*4 The CIE standard colorimetric system
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 2/10 -
FCW320G
[Note] ( Tolerance : IV±10%, color coordinate ±0.01, VF ±0.1 )
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 3/10 -
FCW320G
4. Characteristic Diagrams
Forward Current vs Forward Voltage
Relative Intensity vs Forward Current
2.0
Relative Luminosity [a.u.]
1.8
Forward Current [mA]
100
10
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
1
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
4.6
4.8
0
20
40
60
80
100 120 140 160 180 200 220 240
Foward Current [mA]
Forward Voltage [V]
Allowable Forward Current vs ambient Temperature
Forward Current vs Chromaticity Coordinate
100
0.35
X
Y
Chromaticity Coordinate [X, Y]
Forward Current [mA]
80
60
40
20
0
-20
0
20
40
60
80
100
0.34
0.33
0.32
0.31
0
20
40
o
SSC-QP-0401-06(REV.0)
60
80
100 120 140 160 180 200 220 240
Forward Current [mA]
Temperature [ C]
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 4/10 -
FCW320G
Radiation Diagram
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
120
110
100
90
80
70
60
130
50
140
40
30
150
160
20
170
10
180
0
Spectrum
o
Ta = 25 C
1.0
Intensity [a.u.]
0.8
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
750
Wavelength [nm]
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 5/10 -
FCW320G
5. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
LED Surface temperature
°C
Operation heating
240
150
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
~
120
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 260℃max. for 10 seconds max.
LED Surface temperature
°C
Operation heating
260
150
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
~
120
0
60 to 120 sec.
5 to 10 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280℃, under Soldering iron.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 6/10 -
FCW320G
6. Outline Dimension
Tolerance: ±0.1,
Unit: ㎜
Marking
[TOP VIEW]
[SIDE VIEW]
[BOTTOM VIEW]
[INNER CIRCUIT]
* Recommend solder pad pattern
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 7/10 -
FCW320G
7. Packing
MAX
=5°
0.25±0.05
*R
3.7±0.1
(2.75)
3.5±0.05
2.0±0.05
8.0±0.1
+0.1
-0
1.75±0.1
4.0±0.1
1.5
1.5
4.0±0.1
*R
±0.1
0.85±0.1
180
11.4
+0
-3
9
±0.2
60
+0.2
-0
2
±0.3
22
13 ±0.2
Label
Tolerance: ±0.2 [Unit:㎜]
(1) Quantity : 2000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 8/10 -
FCW320G
from the carrier tape at 10℃ angle to be the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 9/10 -
FCW320G
8. Reel packing structure
Reel
#
#
#
#
#
#
#
#
#
#
:
N
/
P
#
제품명 SSC-FCW320G
#
#
#
#
#
#
#
#
#
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N
t
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L
수량 : 2000
Aluminum Vinyl Bag
#
#
#
#
#
#
#
#
#
#
:
N
/
P
#
제품명 SSC-FCW320G
#
#
#
#
#
#
#
#
#
o
N
t
o
L
수량 : 2000
Outer Box
*Material: Paper(SW3B(B))
TYPE
SIZE(mm)
a
7inch 245
b
220
c
142
c
CHIP LED
G
0
2
3
W
C
F
C
S
S
: :
E
D
O
C
T
R
A
P
b
SSC-QP-0401-06(REV.0)
D
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L
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CHIP LED
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 10/10 -
FCW320G
9. Label
#
P/N : ##########
제품명
SSC-FCW320G
Lot No CAA060810#######-##
수량 : 2000
Rank
Day
Month
Year
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 11/10 -
FCW320G
10. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desicator)
with a desiccant . Otherwise, to store them in the following environment is recommended.
Temperature : 5℃~30℃
Humidity : 60%HR max.
(2) Attention after opened
However LED is corresponded SMD, when LED be soldered dip, interfacial separation may affect the
light transmission efficiency, causing the light intensity to drop. Attention in followed.
a. After opened and mounted, the soldering shall be quickly.
Temperature : 5 ~ 40℃
b. Keeping of a fraction
Humidity : less than 30%
(3) In case of more than 1 week passed after opening or change color of indicator on desiccant
components shall be dried 10-12hr. at 60±5℃.
(4) In case of supposed the components is humid, shall be dried dip-solder just before.
100Hr at 80±5℃ or 12Hr at 100±5℃.
(5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temp. after soldering.
(6) Quick cooling shall not be avoid.
(7) Components shall not be mounted on warped direction of PCB.
(8) Anti radioactive ray design is not considered for the products listed here in.
(9) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When
washing is required, IPA should be used.
(10) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
(11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more
after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage.
(12) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry
place.
(14) The appearance and specifications of the product may be modified for improvement without notice.
(15) Static Electricity and surge damages the Blue LEDs.
It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs.
All devices, equipment and machinery must be properly grounded.
(16) It is recommended to use individual resistor separately when the LEDs applies in parallel circuit
so that it may improve the light deviations.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 12/10 -
FCW320G
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