TI1 ADS8370IBRHPRG4 16-bit, 600-khz, pseudo-differential input, micropower sampling analog-to-digital converter with serial interface and reference Datasheet

 ADS8370
SLAS450 – JUNE 2005
16-BIT, 600-kHz, PSEUDO-DIFFERENTIAL INPUT, MICROPOWER SAMPLING
ANALOG-TO-DIGITAL CONVERTER WITH SERIAL INTERFACE AND REFERENCE
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FEATURES
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•
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600-kHz Sample Rate
±0.5 LSB Typ, ±1.25 LSB Max INL
±0.4 LSB Typ, ±0.75 LSB Max DNL
16-Bit NMC
SINAD 89.5 dB, SFDR 119 dB at fi = 1 kHz
High-Speed Serial Interface up to 40 MHz
Onboard Reference Buffer
Onboard 4.096-V Reference
Pseudo-Differential Input, 0 V to 4.2 V
Onboard Conversion Clock
Selectable Output Format, 2's Complement or
Straight Binary
Zero Latency
Wide Digital Supply
Low Power:
– 110 mW at 600 kHz
– 15 mW During Nap Mode
– 10 µW During Power Down
28-Pin 6 x 6 QFN Package
Pin compatible With 18-Bit ADS8380
APPLICATIONS
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Medical Instruments
Optical Networking
Transducer Interface
High Accuracy Data Acquisition Systems
Magnetometers
DESCRIPTION
The ADS8370 is a high performance 16-bit, 600-kHz
A/D converter with single-ended (pseudo-differential)
input. The device includes an 16-bit capacitor-based
SAR A/D converter with inherent sample and hold.
The ADS8370 offers a high-speed CMOS serial
interface with clock speeds up to 40 MHz.
The ADS8370 is available in a 28 lead 6 × 6 QFN
package and is characterized over the industrial
–40°C to 85°C temperature range.
High Speed SAR Converter Family
Type/Speed
18-Bit Pseudo-Diff
500 kHz
~ 600 kHz
ADS8383
750 kHZ
1 MHz
1.25 MHz
2 MHz
3 MHz
4 MHz
ADS8381
ADS8380 (S)
18-Bit Pseudo-Bipolar, Fully Diff
ADS8382 (S)
16-Bit Pseudo-Diff
ADS8370 (S)
16-Bit Pseudo-Bipolar, Fully Diff
ADS8372 (S)
ADS8371
14-Bit Pseudo-Diff
ADS8401/05
ADS8411
ADS8402/06
ADS8412
ADS7890 (S)
12-Bit Pseudo-Diff
ADS7891
ADS7886
SAR
+IN
−IN
+
_
CDAC
ADS7881
Output
Latches
and
3-State
Drivers
FS
SCLK
SB/2C
SDO
Comparator
REFIN
REFOUT
4.096-V
Internal
Reference
Clock
Conversion
and
Control Logic
CS
CONVST
BUSY
PD
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
ADS8370
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SLAS450 – JUNE 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
MODEL
MAXIMUM
INTEGRAL
LINEARITY
(LSB)
ADS8370I
ADS8370IB
(1)
MAXIMUM
DIFFERENTIAL
LINEARITY
(LSB)
±2
NO MISSING
CODES
RESOLUTION
(BIT)
PACKAGE
TYPE
16
28 Pin
6×6 QFN
–1/1.5
±1.25
±0.75
PACKAGE
DESIGNATOR
28 Pin
6×6 QFN
16
RHP
RHP
TEMPERATURE
RANGE
ORDERING
INFORMATION
TRANSPORT
MEDIA
QUANTITY
ADS8370IRHPT
Small Tape and
reel 250
ADS8370IRHPR
Tape and reel
2500
ADS8370IBRHPT
Small Tape and
reel 250
ADS8370IBRHPR
Tape and reel
2500
–40°C to 85°C
–40°C to 85°C
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
UNIT
Voltage
+IN to AGND
–0.3 V to +VA + 0.3 V
–IN to AGND
–0.3 V to +VA + 0.3 V
+VA to AGND
–0.3 V to 6 V
+VBD to BDGND
–0.3 V to 6 V
Digital input voltage to BDGND
–0.3 V to +VBD + 0.3 V
Digital input voltage to +VA
+0.3 V
Operating free-air temperature range, TA
–40°C to 85°C
Storage temperature range, Tstg
–65°C to 150°C
Junction temperature (TJ max)
QFN package
Lead temperature, soldering
(1)
2
150°C
Power dissipation
(TJmax – TA)/θJA
θJA thermal impedance
86°C/W
Vapor phase (60 sec)
215°C
Infrared (15 sec)
220°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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SPECIFICATIONS
At –40°C to 85°C, +VA = +5 V, +VBD = +5 V or +VBD = +2.7 V, using internal or external reference, fSAMPLE = 600 kHz,
unless otherwise noted. (All performance parameters are valid only after device has properly resumed from power down, see
Table 2.)
PARAMETER
TEST CONDITIONS
ADS8370IB
MIN
TYP
ADS8370I
MAX
MIN
TYP
MAX
0
Vref
0
Vref
+IN
–0.2
Vref + 0.2
–0.2
Vref + 0.2
–IN
–0.2
0.2
–0.2
0.2
UNIT
ANALOG INPUT
Full-scale
input voltage (1)
Absolute input voltage
+IN – (–IN)
Sampling capacitance
(measured from ±IN to
AGND)
Input leakage current
V
V
40
40
pF
1
1
nA
16
Bits
SYSTEM PERFORMANCE
Resolution
16
No missing codes
Integral linearity (2) (3) (4)
INL
DNL
Differential linearity (3)
EO
Offset error
16
Quiet zones observed
–1.25
Quiet zones not observed
Quiet zones observed
–0.75
PSRR
±0.4
±0.4
–0.075
Gain temperature drift (3) (5)
CMRR
–2
2
LSB
(16 bit)
0.75
–1
1.5
LSB
(16 bit)
0.75
–1.5
±0.4
Gain error (3) (5)
Bits
1.25
±0.75
Offset temperature drift (3)
EG
±0.5
±0.8
–0.75
Quiet zones not observed
(3)
16
1.5
±0.4
0.075
–0.15
mV
ppm/°C
0.15
%FS
±1.25
±1.25
ppm/°C
At DC
80
80
Common-mode rejection ratio
[+IN – (–IN)] = Vref/2 with
50 mVp-p common mode
signal at 1 MHz
55
55
Noise
At 0 V analog input
40
40
µV RMS
DC Power supply rejection
ratio
At full scale analog input
55
55
dB
dB
SAMPLING DYNAMICS
Conversion time
1.0
Acquisition time
0.50
1.16
Throughput rate
1.16
µs
600
kHz
µs
600
Aperture delay
10
10
ns
Aperture jitter
12
12
ps RMS
400
400
ns
400
400
ns
Step response
Overvoltage recovery
(1)
(2)
(3)
(4)
(5)
(6)
1.0
0.50
(6)
Ideal input span; does not include gain or offset error.
LSB means least significant bit.
Measured using analog input circuit in Figure 51 and digital stimulus in Figure 56 and Figure 57 and reference voltage of 4.096 V.
This is endpoint INL, not best fit.
Measured using external reference source so does not include internal reference voltage error or drift.
Defined as sampling time necessary to settle an initial error of Vref on the sampling capacitor to a final error of 1 LSB at 16-bit level.
Measured using the input circuit in Figure 51.
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SPECIFICATIONS (continued)
At –40°C to 85°C, +VA = +5 V, +VBD = +5 V or +VBD = +2.7 V, using internal or external reference, fSAMPLE = 600 kHz,
unless otherwise noted. (All performance parameters are valid only after device has properly resumed from power down, see
Table 2.)
PARAMETER
TEST CONDITIONS
ADS8370IB
MIN
ADS8370I
TYP
MAX
MIN
TYP
MAX
UNIT
DYNAMIC CHARACTERISTICS
Total harmonic
distortion (7) (8)
THD
Signal-to-noise ratio (7)
SNR
SINAD
SFDR
Signal-to-noise
+ distortion (7) (8)
Spurious free dynamic
range (7)
VIN = 4 Vp-p at 1 kHz
–112
–111
VIN = 4 Vp-p at 10 kHz
–111
–111
VIN = 4 Vp-p at 100 kHz
–92
–92
VIN = 4 Vp-p at 1 kHz
89.5
89.5
VIN = 4 Vp-p at 10 kHz
89.5
89
VIN = 4 Vp-p at 100 kHz
89.5
88.5
VIN = 4 Vp-p at 1 kHz
89.5
89.5
VIN = 4 Vp-p at 10 kHz
89.5
89
VIN = 4 Vp-p at 100 kHz
87.5
87
VIN = 4 Vp-p at 1 kHz
119
119
VIN = 4 Vp-p at 10 kHz
117
117
VIN = 4 Vp-p at 100 kHz
92
92
75
75
–3dB Small signal bandwidth
dB
dB
dB
dB
MHz
REFERENCE INPUT
Vref
Reference voltage input range
2.5
Resistance (9)
4.096
4.2
2.5
10
4.096
4.2
10
V
MΩ
INTERNAL REFERENCE OUTPUT
Vref
Reference voltage range
IOUT = 0 A, TA = 30°C
Source current
Static load
4.088
4.096
4.104
4.088
4.096
Line regulation
+VA = 4.75 V to 5.25 V
2.5
2.5
mV
Drift
IOUT = 0 A
25
25
ppm/°C
10
4.104
V
10
µA
DIGITAL INPUT/OUTPUT
Logic family CMOS
VIH
High level input voltage
+VBD – 1
+VBD + 0.3
+VBD – 1
+VBD + 0.3
V
VIL
Low level input voltage
–0.3
0.8
–0.3
0.8
V
VOH
High level output voltage
IOH = 2 TTL loads
VOL
Low level output voltage
IOL = 2 TTL loads
+VBD –0.6
+VBD –0.6
V
0.4
0.4
V
Data format: MSB first, 2's complement or straight binary (selectable via the SB/2C pin)
POWER SUPPLY REQUIREMENTS
Power supply
voltage
+VA
+VBD
Supply current, 600-kHz
sample rate (10)
ICC
4.75
5
5.25
4.75
5
5.25
V
2.7
3.3
5.25
2.7
3.3
5.25
V
22
25
22
25
+VA = 5 V
mA
POWER DOWN
ICC(PD)
Supply current, power down
2
µA
2
NAP MODE
ICC(NAP)
Supply current, nap mode
3
Power-up time from nap
3
300
mA
300
ns
85
°C
TEMPERATURE RANGE
Specified performance
(7)
(8)
(9)
(10)
4
–40
85
–40
Measured using analog input circuit in Figure 51 and digital stimulus in Figure 56 and Figure 57 and reference voltage of 4.096 V.
Calculated on the first nine harmonics of the input frequency.
Can vary +/-30%.
This includes only +VA current. With +VBD = 5 V, +VBD current is typically 1 mA with a 10-pF load capacitance on the digital output
pins.
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TIMING REQUIREMENTS
(1) (2) (3) (4) (5) (6)
ADS8370I/ADS8370IB
PARAMETER
MIN
1000
TYP
MAX
1160
UNIT
REF
FIGURE
tconv
Conversion time
ns
41 – 44
tacq1
Acquisition time in normal mode
0.5
µs
41,42,44
tacq2
Acquisition time in nap mode (tacq2 = tacq1 + td18)
0.8
µs
43
CONVERSION AND SAMPLING
tquiet1
Quite sampling time (last toggle of interface signals to convert start
command) (6)
30
ns
40 – 43,
45 – 47
tquiet2
Quite sampling time (convert start command to first toggle of interface
signals) (6)
10
ns
40 – 43,
45 – 47
600
ns
40 – 43,
45,47
tquiet3
Quite conversion time (last toggle of interface signals to fall of BUSY) (6)
tsu1
Setup time, CONVST before BUSY fall
15
ns
41
tsu2
Setup time, CS before BUSY fall (only for conversion/sampling control)
20
ns
40,41
tsu4
Setup time, CONVST before CS rise (so CONVST can be recognized)
5
ns
41,43,44
th1
Hold time, CS after BUSY fall (only for conversion/sampling control)
0
ns
41
th3
Hold time, CONVST after CS rise
7
ns
43
th4
Hold time, CONVST after CS fall (to ensure width of CONVST_QUAL) (4)
20
ns
42
tw1
CONVST pulse duration
20
ns
43
tw2
CS pulse duration
10
ns
41,42
tw5
Pulse duration, time between conversion start command and conversion
abort command to successfully abort the ongoing conversion
ns
44
ns
45 – 47
1000
DATA READ OPERATION
tcyc
SCLK period
25
SCLK duty cycle
40%
60%
tsu5
Setup time, CS fall before first SCLK fall
10
ns
45
tsu6
Setup time, CS fall before FS rise
7
ns
46,47
tsu7
Setup time, FS fall before first SCLK fall
7
ns
46,47
th5
Hold time, CS fall after SCLK fall
3
ns
45
th6
Hold time, FS fall after SCLK fall
7
ns
46,47
tsu2
Setup time, CS fall before BUSY fall (only for read control)
20
ns
40,45
tsu3
Setup time, FS fall before BUSY fall (only for read control)
20
ns
40,47
th2
Hold time, CS fall after BUSY fall (only for read control)
15
ns
40,45
th8
Hold time, FS fall after BUSY fall (only for read control)
15
ns
40,47
tw2
CS pulse duration
10
ns
45
tw3
FS pulse duration
10
ns
46,47
PD pulse duration for reset and power down
60
ns
53,54
All unspecified pulse durations
10
ns
MISCELLANEOUS
tw4
(1)
(2)
(3)
(4)
(5)
(6)
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
All specifications typical at –40°C to 85°C, +VA = +4.75 V to +5.25 V, +VBD = +2.7 V to +5.25 V.
All digital output signals loaded with 10-pF capacitors.
CONVST_QUAL is CONVST latched by a low value on CS (see Figure 39).
Reference figure indicated is only a representative of where the timing is applicable and is not exhaustive.
Quiet time zones are for meeting performance and not functionality.
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TIMING CHARACTERISTICS (1) (2) (3) (4)
ADS8370I/ADS8370IB
PARAMETER
MIN
TYP
UNIT
REF
FIGURE
10
ns
41,43
MAX
CONVERSION AND SAMPLING
td1
Delay time, conversion start command to conversion start (aperture delay)
td2
Delay time, conversion end to BUSY fall
td4
Delay time, conversion start command to BUSY rise
td3
Delay time, CONVST rise to sample start
td5
td6
5
ns
41 – 43
20
ns
41
5
ns
43
Delay time, CS fall to sample start
10
ns
43
Delay time, conversion abort command to BUSY fall
10
ns
44
DATA READ OPERATION
td12 Delay time, CS fall to MSB valid
3
15
ns
45
td15 Delay time, FS rise to MSB valid
6
18
ns
46,47
18
ns
47
10
ns
45– 47
6
ns
45
55
ns
53,54
300
ns
55
td7
Delay time, BUSY fall to MSB valid (if FS is high when BUSY falls)
td13 Delay time, SCLK rise to bit valid
2
td14 Delay time, CS rise to SDO 3-state
MISCELLANEOUS
td10 Delay time, PD rise to SDO 3-state
Nap mode
td18
Delay time, total
device resume
time
Full power down (external reference used with or without
1-µF||0.1-µF capacitor on REFOUT)
td11 + 2x
conversions
Full power down (internal reference used with or without
1-µF||0.1-µF capacitor on REFOUT)
25 (4)
ms
53
1
td11 Delay time, untrimmed circuit full power-down resume time
td16
Delay time, device
power-down time
td17
Delay time, trimmed internal reference settling (either by turning on supply or
resuming from full power-down mode), with 1-µF||0.1-µF capacitor on REFOUT
(1)
(2)
(3)
(4)
6
Nap
Full power down (internal/external reference used)
ms
53,54
200
ns
55
10
µs
53,54
ms
53
4
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
All specifications typical at –40°C to 85°C, +VA = +4.75 V to +5.25 V, +VBD = +2.7 V to +5.25 V.
All digital output signals loaded with 10-pF capacitors.
Including td11, two conversions (time to cycle CONVST twice), and td17.
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PIN ASSIGNMENTS
28
27
26
25
24
23
22
PD
FS
CS
CONVST
SCLK
SDO
BUSY
TOP VIEW
1
SB/2C
BDGND
21
2
AGND
+VBD
20
3
+VA
AGND
19
4
AGND
AGND
18
5
AGND
+VA
17
6
+VA
+VA
16
7
REFM
AGND
15
Note:
+VA
−IN
12
14
+IN
11
NC
NC
10
13
REFOUT
9
8
REFIN
ADS8370
The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
TERMINAL FUNCTIONS
PIN
NAME
AGND
NO.
I/O
DESCRIPTION
2, 4, 5, 15, 18, 19
–
Analog ground pins. AGND must be shorted to analog ground plane below the device.
BDGND
21
–
Digital ground for all digital inputs and outputs. BDGND must be shorted to the analog ground plane
below the device.
BUSY
22
O
Status output. This pin is high when conversion is in progress.
CONVST
25
I
Convert start. This signal is qualified with CS internally.
CS
26
I
Chip select
FS
27
I
Frame sync. This signal is qualified with CS internally.
+IN
11
I
Noninverting analog input channel
–IN
12
I
Inverting analog input channel
NC
10, 13
–
No connection
PD
28
I
Power down. Device resets and powers down when this signal is high.
REFIN
8
I
Reference (positive) input. REFIN must be decoupled with REFM pin using 0.1-µF bypass capacitor
and 1-µF storage capacitor.
REFM
7
I
Reference ground. To be connected to analog ground plane.
REFOUT
9
O
Internal reference output. Shorted to REFIN pin only when internal reference is used.
SB/2C
1
I
Straight binary or 2's complement output data format. When low the device output is straight binary
format; when high the device output is 2's complement format. See Table 1.
SCLK
24
I
Serial clock. Data is shifted onto SDO with the rising edge of this clock. This signal is qualified with CS
internally.
SDO
23
O
Serial data out. All bits except MSB are shifted out at the rising edge of SCLK.
+VA
3, 6, 14, 16, 17
–
Analog power supplies
20
–
Digital power supply for all digital inputs and outputs.
+VBD
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TYPICAL CHARACTERISTICS
SIGNAL-TO-NOISE
AND DISTORTION
vs
REFERENCE VOLTAGE
SIGNAL-TO-NOISE RATIO
vs
REFERENCE VOLTAGE
SINAD − Signal-to-Noise and Distortion − dB
SNR − Signal-to-Noise Ratio − dB
91
+VA = 5 V,
+VBD = 5 V,
fi = 1 kHz,
TA = 25°C
90
89
88
87
86
85
2.5
3
3.5
4
91
+VA = 5 V,
+VBD = 5 V,
fi = 1 kHz,
TA = 25°C
90
89
88
87
86
85
2.5
4
Figure 2.
SPURIOUS FREE DYNAMIC RANGE
vs
REFERENCE VOLTAGE
TOTAL HARMONIC DISTORTION
vs
REFERENCE VOLTAGE
120
−106
+VA = 5 V,
+VBD = 5 V,
fi = 1 kHz,
TA = 25°C
119
118
117
116
115
114
113
112
111
2.5
3
3.5
−107
−108
−109
−110
+VA = 5 V,
+VBD = 5 V,
fi = 1 kHz,
TA = 25°C
−111
−112
4
2.5
3
3.5
4
Vref − Reference Voltage − V
Figure 3.
Figure 4.
EFFECTIVE NUMBER OF BITS
vs
REFERENCE VOLTAGE
EFFECTIVE NUMBER OF BITS
vs
FREE-AIR TEMPERATURE
14.7
ENOB − Effective Number of Bits − Bits
14.6
ENOB − Effective Number of Bits − Bits
3.5
Figure 1.
Vref − Reference Voltage − V
+VA = 5 V,
+VBD = 5 V,
fi = 1 kHz,
TA = 25°C
14.5
14.4
14.3
14.2
14.1
14
14.6
14.5
14.4
14.3
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
fi = 1 kHz,
14.2
13.9
2.5
3
3.5
Vref − Reference Voltage − V
4
−40 −25 −10 5
20
35
50
65
TA − Free-Air-Temperature − 5C
Figure 5.
8
3
Vref − Reference Voltage − V
THD − Total Harmonic Distortion − dB
SFDR − Spurious Free Dynamic Range − dB
Vref − Reference Voltage − V
Figure 6.
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TYPICAL CHARACTERISTICS (continued)
SIGNAL-TO-NOISE
AND DISTORTION
vs
FREE-AIR TEMPERATURE
SIGNAL-TO-NOISE RATIO
vs
FREE-AIR TEMPERATURE
SINAD − Signal-to-Noise and Distortion − dB
SNR − Signal-to-Noise Ratio − dB
90
89.5
89
88.5
88
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
fi = 1 kHz,
87.5
87
80
89.5
89
88.5
88
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
fi = 1 kHz,
87.5
87
−40 −25 −10
20
35
50
65
80
Figure 7.
Figure 8.
SPURIOUS FREE DYNAMIC RANGE
vs
FREE-AIR TEMPERATURE
TOTAL HARMONIC DISTORTION
vs
FREE-AIR TEMPERATURE
−100
120
119
118
117
116
115
114
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
fi = 1 kHz,
113
112
5
20
35
50
65
−102
−104
−106
−108
−110
80
20
35
50
Figure 9.
Figure 10.
EFFECTIVE NUMBER OF BITS
vs
INPUT FREQUENCY
SIGNAL-TO-NOISE
AND DISTORTION
vs
INPUT FREQUENCY
SINAD − Signal-to-Noise and Distortion − dB
14.6
14.55
14.5
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
TA = 25°C
14.4
1
5
10
65
80
TA − Free-Air-Temperature − 5C
TA − Free-Air-Temperature − 5C
14.45
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
fi = 1 kHz,
−112
−40 −25 −10
111
−40 −25 −10
ENOB − Effective Number of Bits − Bits
5
TA − Free-Air-Temperature − 5C
THD − Total Harmonic Distortion − dB
SFDR − Spurious Free Dynamic Range − dB
−40 −25 −10 5
20 35 50 65
TA − Free-Air-Temperature − 5C
90
100
fi − Input Frequency − kHz
Figure 11.
89.6
89.4
89.2
89
88.8
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
TA = 25°C
88.6
88.4
1
10
fi − Input Frequency − kHz
100
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
SIGNAL-TO-NOISE RATIO
vs
INPUT FREQUENCY
SPURIOUS FREE DYNAMIC RANGE
vs
INPUT FREQUENCY
SFDR − Spurious Free Dynamic Range − dB
SNR − Signal-to-Noise Ratio − dB
89.6
89.4
89.2
89
88.8
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
TA = 25°C
88.6
88.4
1
10
fi − Input Frequency − kHz
140
120
100
80
60
40
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
TA = 25°C
20
0
100
10
1
100
fi − Input Frequency − kHz
Figure 13.
Figure 14.
TOTAL HARMONIC DISTORTION
vs
INPUT FREQUENCY
THD − Total Harmonic Distortion − dB
0
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
TA = 25°C
−20
−40
−60
−80
−100
−120
1
10
100
fi − Input Frequency − kHz
Figure 15.
HISTOGRAM
65536 CONVERSIONS
WITH A DC INPUT AT ZERO SCALE (0 V)
40000
35000
30000
HISTOGRAM
100000 CONVERSIONS
WITH A DC INPUT CLOSE TO FULL SCALE (4 V)
60000
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
TA = 25°C
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V,
TA = 25°C
50000
40000
Hits
Hits
25000
20000
15000
30000
20000
10000
10000
65430
Code Out
(Straight Binary Code in Decimal)
Figure 16.
10
Figure 17.
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65431
65428
65429
65426
65427
65424
65425
65422
0
65423
49 50 51 52 53 54 55 56 57 58 59 60
Code Out
(Straight Binary Code in Decimal)
65420
0
65421
5000
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TYPICAL CHARACTERISTICS (continued)
GAIN ERROR
vs
REFERENCE VOLTAGE
GAIN ERROR
vs
ANALOG SUPPLY VOLTAGE
1
4
EG − Gain Error − mV
0.6
EG − Gain Error − mV
6
+VA = 5 V,
+VBD = 5 V,
TA = 25°C
0.8
0.4
0.2
0
−0.2
−0.4
2
0
−2
−0.6
+VBD = 5 V,
REFIN = 4.096 V,
TA = 25°C
−4
−0.8
−6
4.75
−1
2.5
3
3.5
Vref − Reference Voltage − V
4
Figure 18.
Figure 19.
GAIN ERROR
vs
FREE-AIR TEMPERATURE
OFFSET ERROR
vs
REFERENCE VOLTAGE
2
1
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V
+VA = 5 V,
+VBD = 5 V,
TA = 25°C
EO − Offset Error − mV
0.75
1
EG − Gain Error − mV
5.25
5
+VA − Analog Supply Voltage − V
0
0.5
0.25
0
−0.25
−1
−0.5
−0.75
−2
−1
−40 −25 −10
5
20
35
50
65
2.5
80
Figure 21.
OFFSET ERROR
vs
FREE-AIR TEMPERATURE
OFFSET ERROR
vs
SUPPLY VOLTAGE
4
0.2
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V
0.1
EO − Offset Error − mV
EO − Offset Error − mV
3.5
Figure 20.
1
0.75
3
Vref − Reference Voltage − V
TA − Free-Air-Temperature − 5C
0.5
0.25
0
−0.25
−0.5
−0.75
+VBD = 5 V,
REFIN = 4.096 V,
TA = 25°C
0
−0.1
−0.2
−0.3
−0.4
−0.5
−1
−40 −25 −10
−0.6
5
20
35
50
65
80
TA − Free-Air-Temperature − 5C
Figure 22.
4.75
5
+VA − Analog Supply Voltage − V
5.25
Figure 23.
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TYPICAL CHARACTERISTICS (continued)
POWER DISSIPATION
vs
SUPPLY VOLTAGE
POWER DISSIPATION
vs
SAMPLE RATE
140
116
PD − Power Dissipation − mW
114
112
PD − Power Dissipation − mW
+VBD = 5 V,
fs = 600 KSPS
TA = 25°C
110
108
106
104
102
Normal Mode Current
100
80
60
NAP Mode Current
40
+VA = 5 .25 V,
+VBD = 5.25 V,
TA = 25°C
20
0
100
4.75
5
+VA − Analog Supply Voltage − V
0
5.25
300
400
500
600
Figure 25.
POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
DIFFERENTIAL NONLINEARITY
vs
REFERENCE VOLTAGE
1
DNL − Diffreential Nonlinearity − LSB
+VA = 5 V,
+VBD = 5 V,
fs = 600 KSPS
115
110
105
−40 −25 −10 5
20
35
50
65
0.8
0.6
MAX
0.4
0.2
0
−0.2
MIN
−0.4
+VA = 5 V,
+VBD = 5 V,
TA = 25°C
−0.6
−0.8
−1
2.5
80
TA − Free-Air Temperature − °C
3
3.5
Vref − Reference Voltage − V
4
Figure 26.
Figure 27.
INTEGRAL NONLINEARITY
vs
REFERENCE VOLTAGE
DIFFERENTIAL NONLINEARITY
vs
FREE-AIR TEMPERATURE
1
DNL − Diffreential Nonlinearity − LSB
1
INL − Integral Nonlinearity − LSB
200
Figure 24.
100
0.8
MAX
0.6
0.4
+VA = 5 V,
+VBD = 5 V,
TA = 25°C
0.2
0
−0.2
−0.4
MIN
−0.6
−0.8
−1
2.5
3
3.5
4
0.8
0.6
MAX
0.4
0.2
0
−0.2
MIN
−0.4
−0.6
−0.8
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V
−1
−40 −25 −10 5
20
35
50
65
TA − Free-Air-Temperature − 5C
Vref − Reference Voltage − V
Figure 28.
12
100
fs − Sample Rate − KSPS
120
PD − Power Dissipation − mW
120
Figure 29.
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TYPICAL CHARACTERISTICS (continued)
INTEGRAL NONLINEARITY
vs
FREE-AIR TEMPERATURE
INTERNAL VOLTAGE REFERENCE
vs
FREE-AIR TEMPERATURE
4.126
MAX
Internal Reference Output Voltage − V
INL − Integral Nonlinearity − LSB
1
0.8
0.6
0.4
0.2
+VA = 5 V,
+VBD = 5 V,
REFIN = 4.096 V
0
−0.2
MIN
−0.4
−0.6
−0.8
−1
−40 −25 −10
+VA = 5 V,
+VBD = 5 V,
4.116
4.106
4.096
4.086
4.076
4.066
5
20
35
50
65
80
−40 −25 −10 5
35
50
Figure 30.
Figure 31.
INTERNAL VOLTAGE REFERENCE
vs
SUPPLY VOLTAGE
DELAY TIME
vs
LOAD CAPACITANCE
4.126
65
80
9.5
SCLK to SDO Delay Time (td13 ) − ns
+VBD = 5 V,
TA = 25°C
4.116
4.106
4.096
4.086
4.076
4.066
4.75
5
+VA = 5 V,
TA = 85°C
9
8.5
8
+VBD = 2.7 V
7.5
7
+VBD = 5 V
6.5
6
5.5
5
4.5
5.25
5
+VA − Analog Supply Voltage − V
10
15
20
CL − Load Capacitance − pF
Figure 32.
Figure 33.
DIFFERENTIAL NONLINEARITY
1
0.8
0.6
DNL − LSBs
Internal Reference Output Voltage − V
20
TA − Free-Air Temperature − °C
TA − Free-Air-Temperature − 5C
0.4
0.2
0
−0.2
+VA = 5 V, +VBD = 5 V,
REFIN = 4.096 V,
fS = 600 KSPS,
TA = 25°C
−0.4
−0.6
−0.8
−1
0
16384
32768
49152
65536
Code
(Straight Binary Code in Decimal)
Figure 34.
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TYPICAL CHARACTERISTICS (continued)
INTEGRAL NONLINEARITY
1
0.8
INL − LSB
0.6
0.4
0.2
0
−0.2
−0.4
−0.6
−0.8
+VA = 5 V, +VBD = 5 V,
REFIN = 4.096 V,
fS = 600 KSPS,
TA = 25°C
−1
0
16384
32768
Code
(Straight Binary Code in Decimal)
49152
65536
Figure 35.
FFT (100 kHz Input)
0
+VA = 5 V, +VBD = 5 V,
REFIN = 4.096 V,
fS = 600 KSPS,
TA = 25°C
−20
Amplitude − dB
−40
−60
−80
−100
−120
−140
−160
−180
−200
0
50000
100000
150000
200000
250000
300000
f − Frequency − Hz
Figure 36.
FFT (10 kHz Input)
20
+VA = 5 V, +VBD = 5 V,
REFIN = 4.096 V,
fS = 600 KSPS,
TA = 25°C
0
−20
Amplitude − dB
−40
−60
−80
−100
−120
−140
−160
−180
−200
0
50000
100000
150000
200000
f − Frequency − Hz
Figure 37.
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300000
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Power
On
BUSY=0
+VA and +VBD Reach Operation Range
and PD = 0
Sample
BUSY=0
CS = 0 and CONVST = 1
Falling Edge of CONVST_QUAL
SOC
BUSY=0 −> 1
CS = 0 and CONVST = 1
Back to Back Cycle
CS = 0 and CONVST = 1
Falling Edge of
CONVST_QUAL
and BUSY = 1
CONVERSION
Abort
EOC
BUSY= 1−>0
CONVST_QUAL = 0
A.
CONVST_QUAL = 1
and CS = 1
NAP
Wait
BUSY=0
BUSY=0
EOC = End of conversion, SOC = Start of conversion, CONVST_QUAL is CONVST latched by CS = 0, see
Figure 39.
Figure 38. Device States and Ideal Transitions
CONVST
Q
D
CONVST_QUAL
LATCH
CS
LATCH
Figure 39. Relationship Between CONVST_QUAL, CS, and CONVST
TIMING DIAGRAMS
In the following descriptions, the signal CONVST_QUAL represents CONVST latched by a low value on CS (see
Figure 39).
To avoid performance degradation, there are three quiet zones to be observed (tquiet1 and tquiet2 are zones before
and after the falling edge of CONVST_QUAL while tquiet3 is a time zone before the falling edge of BUSY) where
there should be no I/O activities. Interface control signals, including the serial clock should remain steady.
Typical degradation in performance if these quiet zones are not observed is depicted in the specifications
section.
To avoid data loss a read operation should not start around the BUSY falling edge. This is constrained by tsu2,
tsu3, th2, and th8.
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CONVST_QUAL
tquiet1
tquiet2
BUSY
tquiet3
CS
Quiet Zones
FS
tsu3
CS
th8
tsu2
BUSY
th2
No Read Zone (FS Initiated)
BUSY
No Read Zone (CS Initiated)
Figure 40. Quiet Zones and No-Read Zones
CONVERSION AND SAMPLING
1. Convert start command:
The device enters the conversion phase from the sampling phase when a falling edge is detected on
CONVST_QUAL. This is shown in Figure 41, Figure 42, and Figure 43.
2. Sample (acquisition) start command:
The device starts sampling from the wait state or at the end of a conversion if CONVST_QUAL is detected
as high and CS as low. This is shown in Figure 41, Figure 42, and Figure 43.
Maintaining this condition when the device has just finished a conversion (as shown in Figure 41) takes the
device immediately into the sampling phase after the conversion phase (back-to-back conversion) and
hence achieves maximum throughput. Otherwise, the device enters the wait state.
tsu2
tw2
th1
CS
tsu4
CONVST
tsu1
td1
CONVST_QUAL
(Device Internal)
tquiet2
tquiet2
tquiet1
tquiet1
SAMPLE
CONVERT
DEVICE STATE
SAMPLE
tacq1
tCONV
td2
td4
BUSY
tquiet3
Figure 41. Back-To-Back Conversion and Sample
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3. Wait/Nap entry stimulus:
The device enters the wait phase at the end of the conversion if the sample start command is not given.
This is shown in Figure 42.
tw2
tsu4
CS
th4
CONVST
CONVST_QUAL
(Device Internal)
tquiet2
tquiet2
tquiet1
tquiet1
DEVICE STATE
SAMPLE
CONVERT
SAMPLE
WAIT
tCONV
tacq1
td2
BUSY
tquiet3
Figure 42. Convert and Sample with Wait
If lower power dissipation is desired and throughput can be compromised, a nap state can be inserted in
between cycles (as shown in Figure 43). The device enters a low power (3 mA) state called nap if the end of
the conversion happens when CONVST_QUAL is low. The cost for using this special wait state is a longer
sampling time (tacq2) plus the nap time.
th3
CS
td5
tw1
CONVST
td1
CONVST_QUAL
td3
tquiet2
tquiet2
(Device Internal) tquiet1
tquiet1
DEVICE STATE
NAP
SAMPLE
CONVERT
NAP
tCONV
SAMPLE
CONVERT
NAP
SAMPLE
tacq2
td2
BUSY
tquiet3
tquiet3
td4
Figure 43. Convert and Sample with Nap
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4. Conversion abort command
An ongoing conversion can be aborted by using the conversion abort command. This is done by forcing
another start of conversion (a valid CONVST_QUAL falling edge) onto an ongoing conversion as shown in
Figure 44. The device enters the wait state after an aborted conversion. If the previous conversion was
successfully aborted, the device output reads 0xFF00 on SDO.
tw5
CS
tw5
tsu4
CONVST
CONVST_QUAL
(Device Internal)
DEVICE STATE
SAMPLE
CONVERT
WAIT
SAMPLE
CONVERT
tacq1
tCONV
WAIT
Incomplete
Conversion
Incomplete
Conversion
tCONV
BUSY
td6
td6
Figure 44. Conversion Abort
DATA READ OPERATION
Data read control is independent of conversion control. Data can be read either during conversion or during
sampling. Data that is read during a conversion involves latency of one sample. The start of a new data frame
around the fall of BUSY is constrained by tsu2, tsu3, th2, and th8.
1. SPI Interface:
A data read operation in SPI interface mode is shown in Figure 45. FS must be tied high for operating in this
mode. The MSB of the output data is available at the falling edge of CS. MSB – 1 is shifted out at the first
rising edge after the first falling edge of SCLK after CS falling edge. Subsequent bits are shifted at the
subsequent rising edges of SCLK. If another data frame is attempted (by pulling CS high and subsequently
low) during an active data frame, then the ongoing frame is aborted and a new frame is started.
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2
1
SCLK
3
4
16
tsu5
th5
17
18
19
tcyc
td14
CS
tw2
tquiet2
CONVST
tquiet1
td13
SDO
MSB
D15
BUSY
LSB
D14
D13
D12 D1
D0
D0
D15 Repeated
If There is 19th SCLK
td12
tquiet3
D0
Don’t Care
(D0 Repeated)
Conversion N
Conversion N+1
th2
tsu2
CS Fall Before This
Point Reads Data
From Conversion
N−1
CS Fall After This
Point Reads Data
From Conversion
N
No CS
Fall
Zone
Figure 45. Read Frame Controlled via CS (FS = 1)
If another data frame is attempted (by pulling CS high and then low) during an active data frame, then the
ongoing frame is aborted and a new frame is started.
2. Serial interface using FS:
A data read operation in this mode is shown in Figure 46 and Figure 47. The MSB of the output data is
available at the rising edge of FS. MSB – 1 is shifted out at the first rising edge after the first falling edge of
SCLK after the FS falling edge. Subsequent bits are shifted at the subsequent rising edges of SCLK.
1
SCLK
4
16
17
18
19
tcyc
th6
tsu7
CS
tsu6
3
2
tw3
FS
CONVST
tquiet1
td13
td15
MSB of Conversion N
SDO
D15
D14
D13
D12 D1
D0
D0
LSB
D0
tquiet2
D15 Repeated
If There is 19th SCLK
BUSY
Don’t Care
(D0 Repeated)
Conversion N+1
Conversion N
Figure 46. Read Frame Controlled via FS (FS is Low When BUSY Falls)
If FS is high when BUSY falls, the SDO is updated again with the new MSB when BUSY falls. This is shown in
Figure 47.
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1
SCLK
2
4
16
17
18
19
tcyc
th6
tsu7
CS
tsu6
3
tw3
FS
CONVST
MSB of Conversion N−1
MSB of Conversion N
td15
tquiet1
td13
SDO
D15
D14
D13
D12 D1
D0
D0
LSB
D0
D15 Repeated
If There is 19th SCLK
td7
Don’t Care
(D0 Repeated)
tquiet3
BUSY
Conversion N
Conversion N+1
th8
tsu3
FS Fall Before This
Point Reads Data
From Conversion
N−1
tquiet2
No FS
Fall
Zone
FS Fall After This
Point Reads Data
From Conversion
N
Figure 47. Read Frame Controlled via FS (FS is High When BUSY Falls)
If another data frame is attempted by pulling up FS during an active data frame, then the ongoing frame is
aborted and a new frame is started.
PRINCIPLES OF OPERATION
The ADS8370 is a high-speed successive approximation register (SAR) analog-to-digital converter (ADC). The
architecture is based on charge redistribution, which inherently includes a sample/hold function.
The device includes a built-in conversion clock, internal reference, and 40-MHz SPI compatible serial interface.
The maximum conversion time is 1.16 µs which is capable of sustaining a 600-kHz throughput.
The analog input is provided to the two input pins: +IN and –IN. When a conversion is initiated, the differential
input on these pins is sampled on the internal capacitor array. While a conversion is in progress, both inputs are
disconnected from any internal function.
REFERENCE
The ADS8370 has a built-in 4.096-V (nominal value) reference but can operate with an external reference also.
When the internal reference is used, pin 9 (REFOUT) should be shorted to pin 8 (REFIN) and a 0.1-µF
decoupling capacitor and a 1-µF storage capacitor must be connected between pin 8 (REFIN) and pin 7 (REFM)
(see Figure 48). The internal reference of the converter is buffered.
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PRINCIPLES OF OPERATION (continued)
ADS8370
REFOUT
REFIN
1 mF
0.1 mF
REFM
AGND
Figure 48. ADS8370 Using Internal Reference
The REFIN pin is also internally buffered. This eliminates the need to put a high bandwidth buffer on the board
to drive the ADC reference and saves system area and power. When an external reference is used, the
reference must be of low noise, which may be achieved by the addition of bypass capacitors from the REFIN pin
to the REFM pin. See Figure 49 for operation of the ADS8370 with an external reference. REFM must be
connected to the analog ground plane.
ADS8370
REFOUT
50 W
REF3240
REFIN
0.1 mF
22 mF
1 mF
REFM
AGND
AGND
Figure 49. ADS8370 Using External Reference
+VA
ADS8370
+IN
53 W
−IN
53 W
40 pF
AGND
+
_
40 pF
AGND
Figure 50. Simplified Analog Input
ANALOG INPUT
When the converter enters hold mode, the voltage difference between the +IN and –IN inputs is captured on the
internal capacitor array. The +IN input has a range of –0.2 V to (+VREF + 0.2 V), whereas the –IN input has a
range of –0.2 V to +0.2 V. The input span [+IN – (–IN)] is limited from 0 V to VREF.
The input current on the analog inputs depends upon throughput and the frequency content of the analog input
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PRINCIPLES OF OPERATION (continued)
signals. Essentially, the current into the ADS8370 charges the internal capacitor array during the sampling
(acquisition) time. After this capacitance has been fully charged, there is no further input current. The source of
the analog input voltage must be able to charge the device sampling capacitance (40 pF each from +IN/–IN to
AGND) to an 16-bit settling level within the sampling (acquisition) time of the device. When the converter goes
into hold mode, the input resistance is greater than 1 GΩ.
Care must be taken regarding the absolute analog input voltage. To maintain the linearity of the converter, the
+IN, –IN inputs and the span [+IN – (–IN)] should be within the limits specified. Outside of these ranges, the
converter's linearity may not meet specifications.
Care should be taken to ensure that the output impedance of the sources driving +IN and –IN inputs are
matched. If this is not observed, the two inputs can have different settling times. This can result in offset error,
gain error, and linearity error which vary with temperature and input voltage.
A typical input circuit using TI's THS4031 is shown in Figure 52. In the figure, input from a bipolar source is
converted to a unipolar signal for the ADS8370. In the case where the source signal is in range for the
ADS8370, the circuit in Figure 51 may be used. Most of the specified performance figure were measured using
the circuit in Figure 51.
Input
Signal
(0 V to 4 V)
ADS8370
THS4031
20 W
+IN
1.5 nF
−IN
50 W
20 W
Figure 51. Unipolar Input Drive Configuration
ADS8370
1 V DC
600 W
THS4031
20 W
+IN
1.5 nF
Input
Signal
(−2V to 2 V)
−IN
600 W
20 W
Figure 52. Bipolar Input Drive Configuration
DIGITAL INTERFACE
TIMING AND CONTROL
Conversion and sampling are controlled by the CONVST and CS pins. See the timing diagrams for detailed
information on timing signals and their requirements. The ADS8370 uses an internally generated clock to control
the conversion rate and in turn the throughput of the converter. SCLK is used for reading converted data only. A
clean and low jitter conversion start command is important for the performance of the converter. There is a
minimal quiet zone requirement around the conversion start command as mentioned in the timing requirements
table.
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DIGITAL INTERFACE (continued)
READING DATA
The ADS8370 offers a high speed serial interface that is compatible with the SPI protocol. The device outputs
data in either 2's complement format or straight binary format depending on the state of the SB/2C pin. Refer to
Table 1 for the ideal output codes.
Table 1. Input Voltages and Ideal Output Codes
DESCRIPTION
ANALOG VALUE +IN – (–IN)
Full-scale range
(+VREF)
Least significant bit
(LSB)
(+VREF)/216
Full scale
Mid scale
DIGITAL OUTPUT (HEXADECIMAL)
SB/2C Pin = 0
SB/2C Pin = 1
VREF – 1 LSB
FFFF
7FFF
(+VREF)/2
8000
0000
Mid scale – 1 LSB
(+VREF)/2 – 1 LSB
7FFF
FFFF
0
0
0000
8000
To avoid performance degradation due to the toggling of device buffers, read operation must not be performed
in the specified quiet zones (tquiet1, tquiet2, and tquiet3). Internal to the device, the previously converted data is
updated with the new data near the fall of BUSY. Hence, the fall of CS and the fall of FS around the fall of BUSY
is constrained. This is specified by tsu2, tsu3, th2, and th8 in the timing requirements table.
POWER SAVING
The converter provides two power saving modes, full power down and nap. Refer to Table 2 for information on
activation/deactivation and resumption time for both modes.
Table 2. Power Save
TYPE OF POWER DOWN
SDO
POWER
CONSUMPTION
ACTIVATED BY
ACTIVATION TIME (td16)
RESUME POWER BY
Normal operation
Not 3 stated
22 mA
NA
NA
NA
Full power down
(Int Ref, 1-µF capacitor on REFOUT pin)
3 Stated (td10
timing)
2 µA
PD = 1
10 µs
PD = 0
Full power down
3 Stated (td10
(Ext Ref, 1-µF capacitor on REFOUT pin) timing)
2 µA
PD = 1
10 µs
PD = 0
Nap power down
3 mA
At EOC and
CONVST_QUAL = 0
200 ns
Sample Start command
Not 3 stated
FULL POWER-DOWN MODE
Full power-down mode is activated by turning off the supply or by asserting PD to 1. See Figure 53 and
Figure 54. The device can be resumed from full power down by either turning on the power supply or by
de-asserting the PD pin. The first two conversions produce inaccurate results because during this period the
device loads its trim values to ensure the specified accuracy.
If an internal reference is used (with a 1-µF capacitor installed between the REFOUT and REFM pins), the total
resume time (td18) is 25 ms. After the first two conversions, td17 (4 ms) is required for the trimmed internal
reference voltage to settle to the specified accuracy. Only then the converted results match the specified
accuracy.
Submit Documentation Feedback
23
ADS8370
www.ti.com
SLAS450 – JUNE 2005
PD
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
tw4
td10
Valid Data
Invalid Data
SDO
td11
1
td18
2
3
BUSY
REFOUT
ICC
td17
td16
Full ICC
ICC PD
Full ICC
Figure 53. Device Full Power Down/Resume (Internal Refernce Used)
PD
tw4
td10
SDO
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
Invalid Data
td11
td18
1
2
Valid Data
3
BUSY
tacq1
td16
ICC
Full ICC
ICC PD
Full ICC
Figure 54. Device Full Power Down/Resume (External Reference Used)
NAP MODE
Nap mode is automatically inserted at the end of a conversion if CONVST_QUAL is held low at EOC. The
device can be operated in nap mode at the end of every conversion for saving power at lower throughputs.
Another way to use this mode is to convert multiple times and then enter nap mode. The minimum sampling
time after a nap state is tacq1 + td18 = tacq2.
24
Submit Documentation Feedback
ADS8370
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SLAS450 – JUNE 2005
PD = 0
CONVST
CS
CONVST_QUAL
DEVICE
STATE
SAMPLE
CONVERT
NAP
SAMPLE
Hi−Z
SDO LSB+1
LSB
MSB
MSB−1
tCONV
BUSY
REFIN
(or REFOUT)
td18
td16
ICC
Full ICC
ICC NAP
Full ICC
Figure 55. Device Nap Power Down/Resume
LAYOUT
For optimum performance, care should be taken with the physical layout of the ADS8370 circuitry.
Since the ADS8370 offers single-supply operation, it is often used in close proximity with digital logic,
microcontrollers, microprocessors, and digital signal processors. The more the digital logic in the design and the
higher the switching speed, the greater the need for better layout and isolation of the critical analog signals from
these switching digital signals.
The basic SAR architecture is sensitive to glitches or sudden changes on the power supply, reference, ground
connections and digital inputs that occur just prior to the end of sampling and just prior to the latching of the
analog comparator. Such glitches might originate from switching power supplies, nearby digital logic, or high
power devices. Noise during the end of sampling and the latter half of the conversion must be kept to a
minimum (the former half of the conversion is not very sensitive since the device uses a proprietary error
correction algorithm to correct for the transient errors made here).
The degree of error in the digital output depends on the reference voltage, layout, and the exact timing and
degree of the external event.
On average, the ADS8370 draws very little current from an external reference as the reference voltage is
internally buffered. If the reference voltage is external, it must be ensured that the reference source can drive
the bypass capacitor without oscillation. A 0.1-µF bypass capacitor is recommended from pin 8 directly to pin 7
(REFM).
The AGND and BDGND pins should be connected to a clean ground point. In all cases, this should be the
analog ground. Avoid connections that are too close to the grounding point of a microcontroller or digital signal
processor. If required, run a ground trace directly from the converter to the power supply entry point. The ideal
layout consists of an analog ground plane dedicated to the converter and associated analog circuitry.
As with the AGND connections, +VA should be connected to a +5-V power-supply plane or trace that is
separate from the connection for digital logic until they are connected at the power entry point. Power to the
ADS8370 should be clean and well bypassed. A 0.1-µF ceramic bypass capacitor should be placed as close to
the device as possible. See Table 3 for the placement of these capacitors. In addition, a 1-µF capacitor is
recommended. In some situations, additional bypassing may be required, such as a 100-µF electrolytic capacitor
or even a Pi filter made up of inductors and capacitors—all designed to essentially low-pass filter the +5-V
supply, removing the high frequency noise.
Submit Documentation Feedback
25
ADS8370
www.ti.com
SLAS450 – JUNE 2005
Table 3. Power Supply Decoupling Capacitor Placement
SUPPLY PINS
Pair of pins requiring a shortest path to
decoupling capacitors
CONVERTER ANALOG SIDE
CONVERTER DIGITAL
SIDE
(2,3); (5,6); (15,16); (17,18)
(20,21)
Pins requiring no decoupling
4, 14, 19
When using the internal reference, ensure a shortest path from REFOUT (pin 9) to REFIN (pin 8) with the
bypass capacitor directly between pins 8 and 7.
APPLICATION INFORMATION
EXAMPLE DIGITAL STIMULUS
The use of the ADS8370 is very straightforward. The following timing diagram shows one example of how to
achieve a 600-KSPS throughput using a SPI compatible serial interface.
BUSY
DEVICE STATE
CONVERT
SAMPLE
CONVERT
485 ns
CONVST
Frequency = 600 kHz
15 ns
15 ns
80 ns
50 ns
CS
25 ns
2
15 16
3
SCLK
12.5 ns
SDO
MSB
D15
LSB
D14
D13 D2
D1
D0
Figure 56. Example Stimulus in SPI Mode (FS =1), Back-To-Back Conversion that Achieves 600 KSPS
26
Submit Documentation Feedback
ADS8370
www.ti.com
SLAS450 – JUNE 2005
APPLICATION INFORMATION (continued)
It is also possible to use the frame sync signal, FS. The following timing diagram shows how to achieve a
600-KSPS throughput using a modified serial interface with FS active.
BUSY
DEVICE STATE
CONVERT
SAMPLE
CONVERT
485 ns
Frequency = 600 kHz
CONVST
50 ns
CS = 0
15 ns
15 ns
80 ns
FS
25 ns
1
2
3
15 16
SCLK
12.5 ns
SDO
LSBn−1
D0
MSBn
D15
LSBn
D14
D13 D2
D1
D0
Figure 57. Example Stimulus in Serial Interface With FS Active, Back-To-Back Conversion that Achieves
600 KSPS
Submit Documentation Feedback
27
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
TBD
Call TI
Call TI
-40 to 85
Device Marking
(4/5)
ADS8370IBRHPR
OBSOLETE
VQFN
RHP
28
ADS8370I
B
ADS8370IBRHPRG4
OBSOLETE
VQFN
RHP
28
TBD
Call TI
Call TI
-40 to 85
ADS8370IBRHPT
ACTIVE
VQFN
RHP
28
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS8370I
B
ADS8370IRHPT
ACTIVE
VQFN
RHP
28
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS8370I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Aug-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ADS8370IBRHPT
VQFN
RHP
28
250
180.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
ADS8370IRHPT
VQFN
RHP
28
250
180.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Aug-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS8370IBRHPT
VQFN
RHP
28
250
213.0
191.0
55.0
ADS8370IRHPT
VQFN
RHP
28
250
213.0
191.0
55.0
Pack Materials-Page 2
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