MINI EP2W-D Power splitter/combiner die Datasheet

MMIC
Power Splitter/Combiner Die
2 Way-0°
EP2W-D+
50Ω 0.5 to 9.5 GHz
The Big Deal
• Ultra-Wide Bandwidth, 0.5 to 9.5 GHz
• High Power Handling, 2.5W as a splitter
Product Overview
Mini-Circuits’ EP2W-D+ is a MMIC 2-way 0˚ splitter/combiner Die designed for wideband operation from 0.5
to 9.5 GHz supporting many applications requiring high performance across a wide frequency range including all the LTE bands through WiMax an WiFi, as well as instrumentation and more. This model provides
excellent power handling up to 2.5W (as a splitter) with low insertion loss, good isolation, and low phase
and amplitude unbalance. Manufactured using GaAs IPD technology, the EP2W-D+ provides a high level
of ESD protection and excellent repeatability.
Key Features
Feature
Advantages
Wideband, 0.5 to 9.5 GHz
One power splitter can be used in all the LTE bands through WiMAX and WiFi, saving
component count. Also ideal for wideband applications such as military and instrumentation.
Excellent power handling
• 2.5W as a splitter
• 1.7W internal dissipation as a combiner
In power combiner applications, half the power is dissipated internally. EP2W-D+ is
designed to handle 1.7W internal dissipation as a combiner allowing reliable operation
without excessive temperature rise. Similar splitters implemented as Wilkinson splitters
on PCB require big resistors and additional heat sinking.
As a splitter, EP2W-D+ can handle up to 2.5W.
DC Passing
DC current passing is helpful in applications where both RF & DC need to pass through
the DUT, such as antenna mounted hardware.
Unpackaged Die
Enables user to integrate it directly into hybrids.
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits
®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
Page 1 of 5
MMIC
Power Splitter/Combiner Die
2 Way-0°
EP2W-D+
50Ω 0.5 to 9.5 GHz
Product Features
• Wide bandwidth, 0.5 to 9.5 GHz
• Excellent amplitude unbalance, 0.1 dB typ. to 6 GHz
• Good phase unbalance, 1 to 3 deg. typ.
• DC passing
• High ESD level
Typical Applications
+RoHS Compliant
The +Suffix identifies RoHS Compliance. See our web site
for RoHS Compliance methodologies and qualifications
• WIMAX
• ISM
• Instrumentation
• Radar
• WLAN
• Satellite communications
• LTE
Ordering Information: Refer to Last Page
General Description
Mini-Circuits’ EP2W-D+ is a MMIC 2-way 0˚ splitter/combiner Die designed for wideband operation from 0.5
to 9.5 GHz supporting many applications requiring high performance across a wide frequency range including all the LTE bands through WiMax an WiFi, as well as instrumentation and more. This model provides
excellent power handling up to 2.5W (as a splitter) with low insertion loss, good isolation, and low phase
and amplitude unbalance. Manufactured using GaAs IPD technology, the EP2W-D+ provides a high level
of ESD protection and excellent repeatability.
Simplified Schematic and Pad Description
Bonding Pad Position
L4
H2
H1
Pad#
Function
1
SUM PORT (RF IN 1)
2
PORT 1 (RF OUT 1)
3
PORT 2 (RF OUT 2)
Note: 1. Bond Pad material - Gold
2. Bottom of Die is ground - Gold plated
2
W2
3
W1
1
L2 L3
L1
Dimensions in µm, Typical
L1
L2
112
3426
L3
L4
W1
3550 3426
W2
H1
H2
124 3426 1775 3550
Thickness
Width
Length
200
3550
3550
Bond Pad
Bond Pad
Size, RF-IN Size, RF-OUT
150 x 175
175 x 175
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits
®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
REV. OR
M163099
EP2W-D+
MCL NY
171011
Page 2 of 5
EP2W-D+
MMIC Power Splitter/Combiner Die
Electrical Specifications at 25°C1
Parameter
Frequency
(GHz)
Frequency Range
Insertion Loss, above 3.0 dB
Isolation
Phase Unbalance
Amplitude Unbalance
VSWR (Port S)
VSWR (Port 1-2)
Min.
Typ.
0.5
Max.
Unit
9.5
GHz
0.5 - 1.5
­—
1.0
—
1.5 - 3.0
—
1.3
—
3.0 - 6.0
—
1.8
—
6.0 - 9.5
—
3.4
—
0.5 - 1.5
—
9.3
—
1.5 - 3.0
—
19.8
—
3.0 - 6.0
—
19.4
—
6.0 - 9.5
—
10.2
—
0.5 - 1.5
—
0.5
—
1.5 - 3.0
—
0.9
—
3.0 - 6.0
—
1.7
—
6.0 - 9.5
—
2.5
—
0.5 - 1.5
—
0.1
—
1.5 - 3.0
—
0.1
—
3.0 - 6.0
—
0.1
—
6.0 - 9.5
—
0.5
—
0.5 - 1.5
—
1.6
—
1.5 - 3.0
—
1.5
—
3.0 - 6.0
—
1.6
—
6.0 - 9.5
—
1.7
—
0.5 - 1.5
—
1.3
—
1.5 - 3.0
—
1.3
—
3.0 - 6.0
—
1.4
—
6.0 - 9.5
—
1.5
—
dB
dB
Degree
dB
:1
:1
1. Measured on Mini-Circuits Die Characterization Test Board. Die packaged in 5x5 mm, 32-lead MCLP package.
Maximum Ratings
Parameter
Ratings
Operating Temperature
-40°C to 85°C
Power Input (as a splitter)
Internal Dissipation
DC Current
2.5W2 max.
1.75W3 max.
0.4A max
2. Derate linearly to 1.25W at 85°C
3. Derate linearly to 1.1W at 85°C
Permanent damage may occur if any of these limits are exceeded.
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits
®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
Page 3 of 5
EP2W-D+
MMIC Power Splitter/Combiner Die
Assembly Diagram
Assembly and Handling Procedure
1. Storage
Dice should be stored in a dry nitrogen purged desiccators or equivalent.
2. ESD
MMIC dice are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic protected material, which
should be opened in clean room conditions at an appropriately grounded anti-static workstation. Devices need careful handling
using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter
ESD damage to dice.
3. Die Attach
The Die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat
DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet
height and epoxy coverage around total Die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s
cure condition. It is recommended to use antistatic Die pick up tools only.
4. Wire Bonding
Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond
pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are
all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the Die to
the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due
to undesirable series inductance.
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits
®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
Page 4 of 5
EP2W-D+
MMIC Power Splitter/Combiner Die
Additional Detailed Technical Information
additional information is available on our dash board.
Data Table
Performance Data
Swept Graphs
S-Parameter (S2P Files) Data Set with and without port extension(.zip file)
Case Style
Die
Die Ordering and packaging
information (Note 5)
Quantity, Package
Model No.
Small, Gel - Pak: 5,10
Medium†, Partial wafer: 160 Max.
Large†, Full wafer
EP2W-DG+
EP2W-DP+
EP2W-DF+
Available upon request contact sales representative
†
Refer to AN-60-067
Environmental Ratings
ENV-80
5. Dice taken from PCM good wafer. No RF or DC test performed.
ESD Rating**
Human Body Model (HBM): Class 2 (2000V to <4000V) in accordance with ANSI/ESD STM 5.1 - 2001
** Tested in industry standard, 5x5mm, 32-lead MCLP package.
Additional Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended
to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms
and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits
contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder,
please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults.
E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known Good Dice (including, without limitation, proper ESD preventative measures, Die preparation, Die attach, wire bond
ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental
effects on Known Good Dice.
F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini-
Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party Notes
trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
third-partyand
of Mini-Circuits
orcontained
its products.
B. Electrical specifications
performance data
in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits
®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
Page 5 of 5
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