Excel ES35P16-75CC2Y 16mbit cmos 3.0 volt flash memory with 75mhz spi bus interface Datasheet

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Excel Semiconductor inc.
ES25P16
16Mbit CMOS 3.0 Volt Flash Memory
with 75Mhz SPI Bus Interface
ARCHITECTURAL ADVANTAGES
PERFORMANCE CHARACTERISTICS
• Single power supply operation
- 2.7V -3.6V for read and program operations
• Speed
- 75Mhz clock rate (maximum)
• Memory Architecture
- Thirty-two sectors with 512 Kb each
• Power Saving Standby Mode
- Standby mode 50uA (max)
- Deep Power Down Mode 1uA (typical)
• Program
- Page program ( up to 256 bytes) in 1.5ms (typical)
- Program cycles are on a page by page basis
MEMORY PROTECTION FEATURES
• Erase
- 0.5s typical sector erase time
- 12s typical bulk erase time
• Memory Protection
- W# pin works in conjunction with Status Register Bits
to protect specified memory areas
- Status Register Block Protection Bits (BP2, BP1, BP0)
in status register configure parts of memory as read
only
• Endurance
- 100,000 cycles per sector (typical)
• Data Retention
- 20 years (typical)
SOFTWARE FEATURES
• Parameter Page
- 256 Byte page independent from main memory
for parameter storage
- Seperate from array, erase time < 20ms
• SPI Bus Compatible Serial Interface
• Device ID
- JEDEC standard two-byte electronic signature
- RES instruction one-byte electronic signature for
backward compatibility
- Manufacturer and device type ID
• Process Technology
- Manufactured on 0.18um process technology
• Package Option
- Industry Standard Pinouts
- 8-pin SO (208mil) package
- All Pb-Free devices are RoHS Compliant
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GENERAL PRODUCT DESCRIPTION
The memory supports Sector Erase and Bulk Erase
instructions.
The ES25P16 device is a 3.0 volt (2.7V to 3.6V)
single power flash memory device. ES25P16 consists of thirty-two sectors, each with 512 Kb memory.
Each device requires only a 3.0 volt power supply
(2.7V to 3.6V) for both read and write functions.
Internally generated and regulated voltages are provided for program operations. This device does not
require Vpp supply.
Data appears on SI input pin when inputting data
into the memory and on the SO output pin when
outputting data from the memory. The devices are
designed to be programmed in-system with the
standard system 3.0 volt Vcc supply.
The memory can be programmed 1 to 256 bytes at
a time, using the Page Program instruction.
BLOCK DIAGRAM
PS
SRAM
XDEC
Array - L
Array - R
Logic
RD
DATA PATH
IO
HOLD#
W#
2
VCC
GND
SO
SI
SCK
CS#
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PIN DESCRIPTIONS
Pin
Description
SCK
Serial Clock Input
SI
Serial Data Input
SO
Serial Data Output
CS#
Chip Select Input
W#
Write Protect Input
HOLD#
Hold Input
Vcc
Supply Voltage Input
GND
Ground Input
Connection Diagrams
8-pin Plastic Small Outline Package (SO)
ES25P16
CS#
1
5
VCC
SO
2
6
HOLD#
W#
3
7
SCK
GND
4
8
SI
3
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SIGNAL DESCRIPTION
SPI MODES
Serial Data Output (SO)
These devices can be driven by a microcontroller
with its SPI peripheral running in either of the two following modes :
This output signal is used to transfer data serially
out of the device. Data is shifted out on the falling
edge of Serial Clock (SCK).
CPOL = 0, CPHA = 0
CPOL = 1, CPHA = 1
Serial Data Input (SI)
For these two modes, input data is latched in on the
rising edge of Serial Clock (SCK), and output data is
available from the falling edge of Serial Clock (SCK).
This input signal is used to transfer data serially into
the device. It receives instructions, addresses, and
the data to be programmed. Values are latched on
the rising edge of Serial Clock (SCK).
The difference between the two modes, as shown in
Figure 1, is the clock polarity when the bus master is
in Standby and not transferring data:
Serial Clock (SCK)
SCK remains at 0 for (CPOL = 0, CPHA = 0)
SCK remains at 1 for (CPOL = 1, CPHA = 1)
This input signal provides the timing of the serial
interface. Instructions, addresses, and data present
at the Serial Data Input (SI) are latched on the rising edge of Serial Clock (SCK). Data on Serial Data
Output (SO) changes after the falling edge of Serial
Clock (SCK).
OPERATING FEATURES
All data into and out of the device is shifted in 8-bit
chunks.
Chip Select (CS#)
When this input signal is high, the device is deselected and Serial Data Output (SO) is at high
impedance. Unless an internal Program, Erase or
Write Status Register cycle is in progress, the
device will be in Standby mode. Driving Chip Select
(CS#) Low enables the device, placing it in the
active power mode.
After power-up, a falling edge on Chip Select (CS#)
is required prior to the start of any instruction.
Page Programming
To program one data byte, two instructions are
required : Write Enable (WREN), which is one byte,
and a Page Program (PP) sequence, which consists
of four bytes plus data. This is followed by the internal program cycle. To spread this overhead, the
Page Program (PP) instruction allows up to 256
bytes to be programmed at a time (changing bits
from 1 to 0), provided that they lie in consecutive
addresses on the same page of memory.
Hold (HOLD#)
The Hold (HOLD#) signal is used to pause any
serial communications with the device without
deselecting the device.
During the Hold instruction, the Serial Data Output
(SO) is high impedance, and Serial Data Input (SI)
and Serial Clock (SCK) are Don’t Care.
To start the Hold condition, the device must be
selected, with Chip Select (CS#) driven Low.
Sector Erase, or Bulk Erase
The Page Program (PP) instruction allows bits to be
programmed from 1 to 0. Before this can be applied,
the bytes of the memory need to be first erased to all
1’s (FFh) before any programming. This can be
achieved in two ways :1) a sector at a time using the
Sector Erase (SE) instruction, or 2) throughout the
entire memory, using the Bulk Erase (BE) instruction.
Write Protect (W#)
The main purpose of this input signal is to freeze
the size of the area of memory that is protected
against program or erase instructions (as specified
by the values in the BP2, BP1 and BP0 bits of the
Status Register).
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SO
SPI Interface with
(CPOL, CPHA) =
(0,0) or (1,1)
SI
SCK
SCK
SO
SCK
SI
SO
SCK
SI
SO
SI
Bus Master
SPI Memory
Device
SPI Memory
Device
CS1 CS2
SPI Memory
Device
CS3
CS#
W#
HOLD#
CS#
W#
HOLD#
CS#
W#
HOLD#
Figure 1. Bus Master and Memory Devices on the SPI Bus
Note : The Write Protect (W#) and Hold (HOLD#) signals should be driven, High or Low as appropriate
CS#
CPOL CPHA
0
0
SCK
1
1
SCK
SI
MSB
SO
MSB
Figure 2. SPI Modes Supported
ES25P16
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Polling During a Write, Program, or
Erase Cycle
WEL bit
The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
A further improvement in the time to Write Status
Register (WRSR), Program(PP) or Erase (SE or BE)
can be achieved by not waiting for the worst-case
delay. The Write in Progress (WIP) bit is provided in
the Status Register so that the application program
can monitor its value, polling it to establish when the
previous Write cycle, Program cycle, or Erase cycle
is complete.
BP2, BP1, BP0 bits
The Block Protect (BP2, BP1, BP0) bits are non-volatile. They define the size of the area to be software
protected against Program and Erase instructions.
SRWD bit
The Status Register Write Disable (SRWD) bit is
operated in conjunction with the Write Protect (W#)
signal. The Status Register Write Disable (SRWD)
bit and Write Protect (W#) signal allow the device to
be put in the Hardware Protected mode. In this
mode, the non-volatile bits of the Status Register
(SRWD, BP2, BP1, BP0) become read-only bits.
Active Power and Standby Power Modes
When Chip Select (CS#) is Low, the device is
enabled, and in the Active Power mode. When Chip
Select (CS#) is High, the device is disabled, but
could remain in the Active Power mode until all internal cycles have completed (Program, Erase, Write
Status Register). The device then goes into the
Standby Power mode. The device consumption
drops to ISB. This can be used as an extra Deep
Power Down on mechanism, when the device is not
in active use, to protect the device from inadvertent
Write, Program, or Erase instructions.
Hold Condition Modes
The Hold (HOLD#) signal is used to pause any serial
communications with the device without resetting the
clocking sequence. Hold (HOLD#) signal gates the
clock input to the device. However, taking this signal
Low does not terminate any Write Status Register,
Program or Erase cycle that is currently in progress.
Status Register
To enter the Hold condition, the device must be
selected, with Chip Select (CS#) Low. The Hold condition starts on the falling edge of the Hold (HOLD#)
signal, provided that this coincides with Serial Clock
(SCK) being Low (as shown in Figure 3).
The Status Register contains a number of status and
control bits, as shown in Figure 7, that can be read
or set (as appropriate) by specific instructions
WIP bit
The Write In Progress (WIP) bit indicates whether
the memory is busy with a Write Status Register,
Program or Erase cycle.
The Hold condition ends on the rising edge of the
Hold (HOLD#) signal, provided that this coincides
with Serial Clock (SCK) being Low.
SCK
HOLD#
Hold Condition
(non-standard use)
Hold Condition
(Standard use)
Figure 3. Hold Condition Activation
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Protection Modes
If the falling edge does not coincide with Serial Clock
(SCK) being Low, the Hold condition starts after
Serial Clock (SCK) next goes Low. Similarly, If the
rising edge does not coincide with Serial Clock
(SCK) being Low, the Hold condition ends after
Serial Clock (SCK) next goes Low (Figure 3).
The SPI memory device boasts the following data
protection mechanisms
1) All instructions that modify data must be preceded
by a Write Enable(WREN) instruction to set the
Write Enable Latch (WEL) bit. This bit is returned to
its reset state by the following events :
- Power-up
- WRDI instruction completion
- WRSR instruction completion
- PP instruction completion
- SE instruction completion
- BE instruction completion
During the Hold condition, the Serial Data Output
(SO) is high impedance, and Serial Data Input (SI)
and Serial Clock (SCK) are Don’t Care.
Normally, the device remains selected, with Chip
Select (CS#) driven Low, for the entire duration of
the Hold condition. This ensures that the state of the
internal logic remains unchanged from the moment
of entering the Hold condition.
2) The Block Protect (BP2, BP1, BP0) bits allow part
of the memory to be configured as read-only. This is
the Software Protected Mode (SPM).
If Chip Select (CS#) goes High while the device is in
the Hold condition, this has the effect of resetting the
internal logic of the device. To restart communication
with the device, it is necessary to drive Hold
(HOLD#) High, and then to drive Chip Select (CS#)
Low. This prevents the device from going back to the
Hold condition.
3) The Write Protect (W#) signal works in cooperation with the Status Register Write Disable (SRWD)
bit to enable write-protection. This is the Hardware
Protected Mode (HPM).
4) Program, Erase and Write Status Register instructions are checked to verify that they consist of a
number of clock pulses that is a multiple of eight,
before they are accepted for execution.
Table 1. Protected Area Sizes
Protected Memory
Area (Top Level)
Status Register Content
Memory Content
BP2 Bit
BP1 Bit
BP0 Bit
Protected Area
Unprotected Area
0
0
0
0
none
000000 ~ 1FFFFF
1 / 32
0
0
1
1F0000 ~ 1FFFFF
000000 ~ 1EFFFF
1 / 16
0
1
0
1E0000 ~ 1FFFFF
000000 ~ 1DFFFF
1/8
0
1
1
1C0000 ~ 1FFFFF
000000 ~ 1BFFFF
1/4
1
0
0
180000 ~ 1FFFFF
000000 ~ 17FFFF
1/2
1
0
1
100000 ~ 1FFFFF
000000 ~ 0FFFFF
All
1
1
0
000000 ~ 1FFFFF
+ parameter page
none
All
1
1
1
000000 ~ 1FFFFF
+ parameter page
none
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MEMORY ORGANIZATION
The memory is organized as :
- ES25P16 : Thirty-two sectors of 512 Kbit each
- Each page can be individually programmed (bits are programmed from 1 to 0).
- The device is Sector or Bulk erasable (bits are erased from 0 to 1)
Table 2. Sector Address
Sector
ES25P16
Address Range
SA31
1F0000h
1FFFFFh
SA30
1E0000h
1EFFFFh
SA29
1D0000h
1DFFFFh
SA28
1C0000h
1CFFFFh
SA27
1B0000h
1BFFFFh
SA26
1A0000h
1AFFFFh
SA25
190000h
19FFFFh
SA24
180000h
18FFFFh
SA23
170000h
17FFFFh
SA22
160000h
16FFFFh
SA21
150000h
15FFFFh
SA20
140000h
14FFFFh
SA19
130000h
13FFFFh
SA18
120000h
12FFFFh
SA17
110000h
11FFFFh
SA16
100000h
10FFFFh
SA15
0F0000h
0FFFFFh
SA14
0E0000h
0EFFFFh
SA13
0D0000h
0DFFFFh
SA12
0C0000h
0CFFFFh
SA11
0B0000h
0BFFFFh
SA10
0A0000h
0AFFFFh
SA9
090000h
09FFFFh
SA8
080000h
08FFFFh
SA7
070000h
07FFFFh
SA6
060000h
06FFFFh
SA5
050000h
05FFFFh
SA4
040000h
04FFFFh
SA3
030000h
03FFFFh
SA2
020000h
02FFFFh
SA1
010000h
01FFFFh
SA0
000000h
00FFFFh
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INSTRUCTIONS
Chip Select (CS#) can be driven High after any bit
of the data-out sequence is being shifted out to terminate the transaction.
All instructions, addresses, and data are shifted in
and out of the device, starting with the most significant bit. Serial Data Input (SI) is sampled on the first
rising edge of Serial Clock (SCK) after Chip Select
(CS#) is driven Low. Then, the one byte instruction
code must be shifted in to the device, most significant bit first, on Serial Data Input (SI), each bit being
latched on the rising edges of Serial Clock (SCK).
The instruction set is listed in Table 3.
In the case of a Page Program (PP), Program
Parameter Page (PPP), Sector Erase (SE), Bulk
Erase (BE), Parameter Page Erase(PE), Write Status Register (WRSR), Write Enable (WREN), Deep
Power Down (DP) or Write Disable (WRDI) instruction, Chip Select (CS#) must be driven High exactly
at a byte boundary, otherwise the instruction is
rejected, and is not executed. That is, Chip Select
(CS#) must driven High when the number of clock
pulses after Chip Select (CS#) being driven Low is
an exact multiple of eight.
Every instruction sequence starts with a one byte
instruction code. Depending on the instruction, this
might be followed by address bytes, or by data
bytes, or by both or none. Chip Select (CS#) must be
driven High after the last bit of the instruction
sequence has been shifted in.
All attempts to access the memory array during a
Write Status Register cycle, Program cycle or Erase
cycle are ignored, and the internal Write Status
Register cycle, Program cycle or Erase cycle continues unaffected.
In the case of a Read Data Bytes (READ), Read Status Register (RDSR), Read Data Bytes at higher
speed (FAST_READ), Read Identification (RDID) ,
Read Manufacturer and Device ID (RDMD), Read
Parameter Page (RDPARA) and Fast Read Parameter Page (FRDPARA) instructions, the shifted-in
instruction sequence is followed by a data-out
sequence.
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Table 3. Instruction Set
Instruction
One-Byte
Instruction Code
Description
Address
Bytes
Dummy
Byte
Data Bytes
Status Register Operations
WREN
Write Enable
06H (0000 0110)
0
0
0
WRDI
Write Disable
04H (0000 0100)
0
0
0
RDSR
Read from Status Register
05H (0000 0101)
0
0
1 to Infinity
WRSR
Write to Status Register
01H (0000 0001)
0
0
1
Read Operations
READ
Read Data Bytes
03H (0000 0011)
3
0
1 to Infinity
FAST_READ
Read Data Bytes at Higher Speed
0BH (0000 1011)
3
1
1 to Infinity
RDID
Read Identification
9FH (1001 1111)
0
0
1 to 3
RDMD
Read Manufacturer and Device ID
90H (1001 0000)
0
3
1 to Infinity
RDPARA
Read Parameter Page
53H (0101 0011)
3
0
1 to Infinity
FRDPARA
Fast Read Parameter Page
5BH (0101 1011)
3
1
1 to Infinity
Erase Operations
SE
Sector Erase
D8H (1101 1000)
3
0
0
BE
Bulk (Chip) Erase
C7H (1100 0111)
0
0
0
PE
Erase Parameter Page
D5H (1101 0101)
0
0
0
Program Operations
PP
Page Program
02H (0000 0010)
3
0
1 to 256
PPP
Program Parameter Page
52H (0101 0010)
3
0
1 to 256
Deep Power Down Savings Mode Operations
DP
RES
ES25P16
Deep Power Down
B9H (1011 1001)
0
0
0
Release from Deep Power Down
ABH (1010 1011)
0
0
0
Release from Deep Power Down and
Read Electronic Signature
ABH (1010 1011)
0
3
1 to Infinity
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Write Enable (WREN)
Write Disable (WRDI)
The Write Enable (WREN) instruction (Figure 4) sets
the Write Enable Latch (WEL) bit. The Write Enable
Latch (WEL) bit must be set prior to every Page Program (PP or PPP), Erase (SE, BE or PE) and Write
Status Register (WRSR) instruction. The Write
Enable (WREN) instruction is entered by driving
Chip Select (CS#) Low, sending the instruction code,
and then driving Chip Select (CS#) High.
The Write Disable (WRDI) instruction (Figure 5)
resets the Write Enable Latch (WEL) bit. The Write
Disable (WRDI) instruction is entered by driving Chip
Select (CS#) Low, sending the instruction code, and
then driving Chip Select (CS#) High.
The Write Enable (WEL) bit is reset under the following conditions :
-
Power-up
WRDI instruction completion
WRSR instruction completion
PP instruction completion
SE instruction completion
BE instruction completion
CS#
0
1
2
3
4
5
6
7
SCK
Instruction
SI
0
0
0
0
0
1
1
0
High Impedance
SO
Figure 4. Write Enable ( WREN ) Instruction Sequence
CS#
0
1
2
3
4
5
6
7
SCK
Instruction
SI
0
0
0
0
0
1
0
0
High Impedance
SO
Figure 5. Write Disable ( WRDI ) Instruction Sequence
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Read Status Register (RDSR)
BP2, BP1, BP0 bits
The Block Protect (BP2, BP1, BP0) bits are non-volatile. They define the size of the area to be software
protected against Program and Erase instructions.
These bits are written with the Write Status Register
(WRSR) instruction. When one or both of the Block
Protect (BP2, BP1, BP0) bits is set to 1, the relevant
memory area (as defined in Table 1) becomes protected against Page Program (PP), and Sector
Erase (SE) instructions. The Block Protect (BP2,
BP1, BP0) bits can be written provided that the
Hardware Protected mode has not been set. The
Bulk Erase (BE) instruction is executed if, and only
if, all Block Protect (BP2, BP1, BP0) bits are 0.
The Read Status Register (RDSR) instruction allows
the Status Register to be read. The Status Register
may be read at any time, even while a Program,
Erase, or Write Status Register cycle is in progress.
When one of these cycles is in progress, it is recommended to check the Write In Progress (WIP) bit
before sending a new instruction to the device. It is
also possible to read the Status Register continuously, as shown in Figure 6.
The status and control bits of the Status Register are
as follows :
SRWD bit
The Status Register Write Disable (SRWD) bit is
operated in conjunction with the Write Protect (W#)
signal. The Status Register Write Disable (SRWD)
bit and Write Protect (W#) signal allow the device to
be put in the Hardware Protected mode (when the
Status Register Write Disable (SRWD) bit is set to 1,
and Write Protect (W#) is driven Low). In this mode,
the non-volatile bits of the Status Register (SRWD,
BP2, BP1, BP0) become read-only bits and the
Write Status Register (WRSR) instruction is no
longer accepted for execution.
WIP bit
The Write In Progress (WIP) bit indicates whether
the memory is busy with a Write Status Register,
Program or Erase cycle. This bit is a read only bit
and is read by executing a RDSR instruction. If this
bit is 1, such a cycle is in progress, if it is 0, no such
cycle is in progress.
WEL bit
The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch. When set to 1,
the internal Write Enable Latch is set; when set to 0,
the internal Write Enable Latch is reset and no Write
Status Register, Program or Erase instruction is
accepted.
CS#
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
Instruction
SI
0
0
0
0
0
1
0
1
Status Register Out
SO
Status Register Out
High Impedance
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
MSB
MSB
Figure 6. Read Status Register (RDSR) Instruction Sequence
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b7
b6
SRWD
0
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b5
b4
0
b3
BP2
Status Register Write Disable
b2
BP1
b1
BP0
b0
WEL
WIP
Block Protect Bits
Write Enable Latch Bit
Write In Progress Bit
Figure 7. Status Register Format
As soon as Chip Select (CS#) is driven High, the
self-timed Write Status Register cycle (whose duration is tw ) is initiated. While the Write Status Register cycle is in progress, the Status Register may still
be read to check the value of the Write In Progress
(WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Write Status Register cycle, and
is 0 when it is completed. At some unspecified time
before the cycle is completed, the Write Enable
Latch (WEL) is reset.
Write Status Register (WRSR)
The Write Status Register (WRSR) instruction
allows new values to be written to the Status Register. Before it can be accepted, a Write Enable
(WREN) instruction must previously have been
executed. After the Write Enable (WREN) instruction has been decoded and executed, the device
sets the Write Enable Latch (WEL).
The Write Status Register (WRSR) instruction is
entered by driving Chip Select (CS#) Low, followed
by the instruction code and the data byte on Serial
Data Input (SI).
The Write Status Register (WRSR) instruction
allows the user to change the values of the Block
Protect (BP2, BP1, BP0) bits, to define the size of
the area that is to be treated as read-only, as
defined in Table 1. The Write Status Register
(WRSR) instruction also allows the user to set or
reset the Status Register Write Disable (SRWD) bit
in accordance with the Write Protect (W#) signal.
The Status Register Write Disable (SRWD) bit and
Write Protect (W#) signal allow the device to be put
in the Hardware Protected Mode (HPM). The Write
Status Register (WRSR) instruction cannot be executed once the Hardware Protected Mode (HPM) is
entered.
The instruction sequence is shown in Figure 8.
The Write Status Register (WRSR) instruction has
no effect on bits b6, b5, b1 and b0 of the Status
Register. Bits b6, b5 are always read as 0.
Chip Select (CS#) must be driven High after the
eighth bit of the data byte has been latched in. If
not, the Write Status Register (WRSR) instruction is
not executed.
CS#
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
Instruction
SI
0
0
0
0
0
Status Register In
0
0
7
1
6
5
4
3
2
1
0
MSB
High Impedance
SO
Figure 8. Write Status Register (WRSR) Instruction Sequence
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Table 4. Protection Modes
W# Signal
SRWD Bit
1
1
1
0
0
0
0
1
Mode
Write Protection of the Status Register
Protected Area
(See Note)
Software
Protected
(SPM)
Status Register is Writable
(if the WREN instruction has
set the WEL bit).
The values in the SRWD,
BP2, BP1 and BP0 bits can
be changed.
Protected against
Page Program and
Erase(SE, BE,PE)
Ready to accept Page
Program and Sector
Erase Instructions
Hardware
Protected
(HPM)
Status Register is Hardware
write protected.
The values in the SRWD,
BP2, BP1 and BP0 bits cannot be changed
Protected against
Page Program and
Erase (SE,BE,PE)
Ready to accept Page
Program and Sector
Erase Instructions
Unprotected Area
(See Note)
Note:
1. As defined by the values in the Block Protected (BP2, BP1, BP0) bits of the Status Register, as shown in Table 1.
The protection features of the device are summarized in Table 4.
As a consequence, all the data bytes in the memory
area that are software protected (SPM) by the
Block Protect (BP2, BP1, BP0) bits of the Status
Register, are also hardware protected against data
modification.
When the Status Register Write Disable (SRWD) bit
of the Status Register is 0 (its initial delivery state),
it is possible to write to the Status Register provided
that the Write Enable Latch (WEL) bit has previously been set by a Write Enable (WREN) instruction, regardless of the whether Write Protect (W#) is
driven High or Low.
Regardless of the order of the two events, the
Hardware Protected Mode (HPM) can be entered :
1) by setting the Status Register Write Disable
(SRWD) bit after driving Write Protect (W#) Low
When the Status Register Write Disable (SRWD) bit
of the Status Register is set to 1, two cases need to
be considered, depending on the state of Write Protect (W#).
2) or by driving Write Protect (W#) Low after setting
the Status Register Write Disable (SRWD) bit.
The only way to exit the Hardware Protected Mode
(HPM) once entered is to pull Write Protect (W#)
High.
1) If Write Protect (W#) is driven High, it is possible
to write to the Status Register provided that the
Write Enable Latch (WEL) bit has previously been
set by a Write Enable (WREN) instruction.
If Write Protect (W#) is permanently tied High, the
Hardware Protected Mode (HPM) can never be
activated, and only the Software Protected Mode
(SPM), using the Block Protect (BP2, BP1, BP0)
bits of the Status Register, can be used.
2) If Write Protect (W#) is driven Low, it is not possible to write to the Status Register even if the Write
Enable Latch (WEL) bit has previously been set by
a Write Enable (WREN) instruction. (Attempts to
write to the Status Register are rejected, and are
not accepted for execution).
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CS#
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31 32
33
34 35
36
37 38
39
SCK
24-Bit Address
Instruction
SI
0
0
0
0
0
0
1
1 23
22
21
3
2
1
0
MSB
SO
Data Out 2
Data Out 1
High Impedance
7
6
5
4
3
2
1
0
7
MSB
Figure 9. Read Data Bytes (READ) Instruction Sequence
Read Data Bytes (READ)
Read Data Bytes at Higher Speed
(FAST_ READ)
The READ instruction reads the memory at the
specified SCK frequency (fsck) with a maximum
speed of 40MHz.
The device is first selected by driving Chip Select
(CS#) Low. The instruction code for the Read Data
Bytes (READ) instruction is followed by a 3-byte
address (A23 - A0), each bit being latched-in during
the rising edge of Serial Clock (SCK). Then the
memory contents, at the address, are shifted out on
Serial Data Output (SO), each bit being shifted out,
at a frequency fsck, during the falling edge of Serial
Clock (SCK).
The FAST_READ instruction reads the memory at
the specified SCK frequency (fsck) with a maximum
speed of 75 MHz. The device is first selected by
driving Chip Select (CS#) Low. The instruction code
for FAST_READ instruction is followed by a 3-byte
address (A23 - A0) and a dummy byte, each bit
being latched in during the rising edge of Serial
Clock (SCK). Then the memory contents, at that
address, are shifted out on Serial Data Output
(SO), each bit being shifted out. at a maximum frequency Fsck, during the falling edge of Serial Clock
(SCK).
The instruction sequence is shown in Figure 9. The
first byte addressed can be at any location. The
address automatically increments to the next higher
address after each byte of data is shifted out. The
whole memory can, therefore, be read with a single
Read Data Bytes (READ) instruction. When the
highest address is reached, the address counter
rolls over to 00000h, allowing the read sequence to
be continued indefinitely.
The instruction sequence is shown in Figure 10.
The first byte addressed can be at any location.
The address automatically increments to the next
higher address after each byte of data is shifted
out. The whole memory can, therefore, be read with
a single FAST_READ instruction.
When the highest address is reached, the address
counter rolls over to 00000h, allowing the read
sequence to be continued indefinitely
The Read Data Bytes (READ) instruction is terminated by driving Chip Select (CS#) High. Chip Select
(CS#) can be driven High at any time during data
output. Any Read Data Bytes (READ) instruction,
while a Program, Erase, or Write cycle is in
progress, is rejected without having any effect on the
cycle that is in progress.
The FAST_READ instruction is terminated by driving Chip Select (CS#) High. Chip Select (CS#) can
be driven High at any time during data output. Any
FAST_READ instruction, while an Erase, Program
or Write cycle is in progress, is rejected without
having any effects on the cycle that is in progress.
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CS#
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
SI
0
0
0
0
1
0
Dummy Byte
24-Bit Address
Instruction
1
1 23 22 21
3
2
0
1
7
6
5
4
3
2
1
0
MSB
SO
Data Out 2
Data Out 1
High Impedance
7
6
5
4
3
2
1
0
7
MSB
Figure 10. Read Data Bytes at Higher Speed (FAST_READ) Instruction Sequence
Read Identification (RDID)
The Read Identification (RDID) instruction allows the
8-bit manufacturer identification to be read, followed
by two bytes of the device identification.
This is followed by the 24-bit device identification,
stored in the memory, being shifted out on Serial
Data Output (SO), with each bit being shifted out
during the falling edge of Serial Clock (SCK).
The instruction sequence is shown in Figure 11.
The manufacturer identification byte is assigned by
JEDEC, and has a value of 4Ah for ESI products.
The device identification is assigned by the device
manufacturer, and indicates the memory type in the
first byte (20h), and the memory capacity of the
device in the second byte (15h).
Any Read Identification (RDID) instruction executed
while an Erase, Program, or Write Status Register
cycle is in progress is not decoded, and has no
effect on the cycle that is in progress.
The device is first selected by driving Chip Select
(CS#) Low. Then, the 8-bit instruction code for the
instruction is shifted in, with each bit being latched in
on SI during the rising edge of SCK.
ES25P16
16
Driving CS# high after the Device Identification has
been read at least once terminates the READ_ID
instruction. The Read Identification (RDID) instruction can also be terminated by driving CS# High at
any time during data output. When Chip Select
(CS#) is driven High, the device is put in the Standby Power mode. Once in the Stand-by Power
mode, the device waits to be selected, so that it can
receive, decode and execute instructions
Manufacturer
Identification
4Ah
Device Identification
Memory Type Memory Capacity
20h
15h
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CS#
0
1
2
3
4
5
6
7
8
9
10
11
12 13 14
15 16
17 18
28
29
30
31
SCK
Instruction
SI
1
0
0
1
1
1
1
1
Manufacturer Identification
Device Identification
High Impedance
SO
15
13
14
2
0
1
MSB
Figure 11. Read Identification (RDID) Instruction Sequence and Data-Out Sequence
Read Manufacturer ID & Device ID
(RDMD)
The instruction is initiated by driving the CS# pin low
and shift the instruction code “90h” followed by three
dummy bytes. After which, the Manufacturer ID for
ESI (4Ah) and the Device ID (14h) are shifted out on
the falling edge SCLK with most significant bit (MSB)
first as shown in Figure 12. The Manufacturer and
Device IDs can be read continuously, alternating
from one to the other. The instruction is completed
by driving CS# pin.
The Read Manufacturer ID & Device ID (RDMD)
instruction is an alternative to the Release from
Power-down/Device ID instruction that provides both
the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer ID & Device ID (RDMD)
instruction is very similar to the Release from Powerdown/Device ID instruction.
CS#
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31 32
33
34 35
36
37 38
39
SCK
3 Dummy bytes
Instruction
SI
1
0
0
1
0
0
0
0
23
22
21
3
2
1
0
MSB
Manufacturer ID
High Impedance
SO
7
6
5
4
3
2
1
Device ID
0
7
MSB
Figure 12. Read Manufacturer ID & Device ID (RDMD) Instruction Sequence and
Data-Out Sequence
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Page Program (PP)
If fewer than 256 data bytes are sent to device, they
are correctly programmed at the requested
addresses without having any effects on the other
bytes of the same page.
The Page Program (PP) instruction allows bytes to
be programmed in the memory (changing from 1 to
0). Before it can be accepted, a Write Enable
(WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction
has been decoded, the device sets the Write Enable
Latch (WEL).
Chip Select (CS#) must be driven High after the
eighth bit of the last data byte has been latched in,
otherwise the Page Program (PP) instruction is not
executed. As soon as Chip Select (CS#) is driven
High, the self-timed Page Program cycle (whose
duration is tPP) is initiated. While the Page Program
cycle is in progress, the Status Register may be
read to check the value of the Write In Progress
(WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Page Program cycle, and is 0
when it is completed. At some unspecified time
before the cycle is completed, the Write Enable
Latch (WEL) bit is reset.
The Page Program (PP) instruction is entered by
driving Chip Select (CS#) Low, followed by the
instruction code, three address bytes and at least
one data byte on Serial Data Input (SI). Chip Select
(CS#) must be driven Low for the entire duration of
the sequence.
The instruction sequence is shown in Figure 13.
A Page Program (PP) instruction applied to a page
that is protected by the Block Protect (BP2, BP1,
BP0) bits (see Table 1) is not executed.
If more that 256 data bytes are sent to the device,
the addressing will wrap to the beginning of the
same page, previously latched data are discarded
and the last 256 data bytes are guaranteed to be
programmed correctly within the same page.
CS#
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
32
33
34
35
36
37
38
39
1
0
SCK
Instruction
SI
0
0
0
0
0
Data Byte1
24-Bit Address
0
1
0
23 22 21
1
2
MSB
7
0
4
5
6
2
3
MSB
2078
2079
55
2077
53 54
2076
50 51 52
2075
47 48 49
2074
41 42 43 44 45 46
2073
40
2072
CS#
1
0
SCK
Data Byte 2
SI
7
MSB
6
5
4
3
2
Data Byte256
Data Byte 3
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
MSB
MSB
Figure 13. Page Program (PP) Instruction Sequence
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Sector Erase (SE)
Chip Select (CS#) must be driven High after the
eighth bit of the last address byte has been latched
in, otherwise the Sector Erase (SE) instruction is
not executed. As soon as Chip Select (CS#) is
driven High, the self-timed Sector Erase cycle
(whose duration is tSE) is initiated. While the Sector
Erase cycle is in progress, the Status Register may
be read to check the value of the Write In Progress
(WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Sector Erase cycle, and is 0 when
it is completed. At some unspecified time before the
cycle is completed, the Write Enable Latch (WEL)
bit is reset.
The Sector Erase (SE) instruction sets to 1 (FFh) all
bits inside the chosen sector. Before it can be
accepted, a Write Enable (WREN) instruction must
previously have been executed. After the Write
Enable (WREN) instruction has been decoded, the
device sets the Write Enable Latch (WEL).
The Sector Erase (SE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, and three address bytes on Serial Data
Input (SI). Any address inside the Sector (see Table
1) is a valid address for the Sector Erase (SE)
instruction. Chip Select (CS#) must be driven Low for
the entire duration of the sequence.
A Sector Erase (SE) instruction applied to any
memory area that is protected by the Block Protect
(BP2, BP1, BP0) bits (see Table 1) is not executed.
The instruction sequence is shown in Figure 14.
CS#
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
SCK
Instruction
SI
1
1
0
1
1
24-Bit Address
0
0
0
23 22 21
3
2
1
0
MSB
Figure 14. Sector Erase (SE) Instruction Sequence
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Bulk Erase (BE)
The Bulk Erase (BE) instruction sets to 1(FFh) all bits
inside the entire memory. Before it can be accepted,
a Write Enable (WREN) instruction must previously
have been executed. After the Write Enable (WREN)
instruction has been decoded, the device sets the
Write Enable Latch (WEL).
The Bulk Erase (BE) instruction is entered by driving
Chip Select (CS#) Low, followed by the instruction
code, Serial Data Input (SI). No address is required
for the Bulk Erase (BE). Chip Select (CS#) must be
driven Low for the entire duration of the sequence.
As soon as Chip Select (CS#) is driven High, the
self-timed Bulk Erase cycle (whose duration is tBE)
is initiated. While the Bulk Erase cycle is in
progress, the Status Register may be read to check
the value of the Write In Progress (WIP) bit. The
Write In Progress (WIP) bit is 1 during the selftimed Bulk Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is
completed, the Write Enable Latch (WEL) bit is
reset.
A Bulk Erase (BE) instruction is executed only if all
the Block Protect (BP2, BP1, BP0) bits (see Table
1) are set to 0. The Bulk Erase (BE) instruction is
ignored if one or more sectors are protected.
The instruction sequence is shown in Figure 15.
CS#
0
1
2
3
4
5
6
7
1
1
1
SCK
Instruction
SI
1
1
0
0
0
Figure 15. Bulk Erase ( BE ) Instruction Sequence
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Deep Power Down (DP)
The Deep Power Down mode can only be entered
by executing the Deep Power Down (DP) instruction to reduce the standby current (from ISB to IDP
as specified in Table 6). As soon as Chip Select
(CS#) is driven high, it requires a delay of tDP currently in progress before Deep Power Down mode
is entered.
The Deep Power Down (DP) instruction puts the
device in the lowest current mode of 1uA typical.
It is recommended that the standard Standby mode
be used for the lowest power current draw, as well as
the Deep Power Down (DP) as an extra software
protection mechanism when this device is not in
active use. In this mode, the device ignores all Write,
Program and Erase instructions. Chip Select (CS#)
must be driven Low for the entire duration of the
sequence.
Once the device has entered the Deep Power
Down mode, all instructions are ignored except the
Release from Deep Power Down (RES) and Read
Electronic Signature. This releases the device from
the Deep Power Down mode. The Release from
Deep Power Down and Read Electronic Signature
(RES) instruction also allows the Electronic Signature of the device to be output on Serial Data Output (SO).
The Deep Power Down (DP) instruction is entered by
driving Chip Select (CS#) Low, followed by the
instruction code on Serial Data Input (SI). Chip
Select (CS#) must be driven Low for the entire duration of the sequence.
The Deep Power Down mode automatically stops
at Power-down, and the device always powers up
in the Standby mode.
The instruction sequence is shown in Figure 16.
Driving Chip Select (CS#) High after the eighth bit of
the instruction code has been latched puts the device
in Deep Power Down mode.
Any Deep Power Down (DP) instruction, while an
Erase, Program or WRSR cycle is in progress, is
rejected without having any effect on the cycle in
progress.
CS#
tDP
0
1
2
3
4
5
6
7
SCK
Instruction
SI
1
0
1
1
1
0
0
1
Standby Mode
Deep Power
Down Mode
Figure 16. Deep Power Down ( DP ) Instruction Sequence
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Release from Deep Power Down (RES)
Release from Deep Power Down and
Read Electronic Signature (RES)
The Release from Deep Power Down (RES) instruction provides the only way to exit the Deep Power
Down mode. Once the device has entered the Deep
Power Down mode, all instructions are ignored
except the Release from Deep Power Down (RES)
instruction. Executing this instruction takes the
device out of Deep Power Down mode.
Once the device has entered Deep Power Down
mode, all instructions are ignored except the RES
instruction. The RES instruction can also be used to
read the old style 8-bit Electronic Signature of the
device on the SO pin. The RES instruction always
provides access to the Electronic Signature of the
device (except while an Erase, Program or WRSR
cycle is in progress), and can be applied even if DP
mode has not been entered. Any RES instruction
executed while an Erase, Program or WRSR cycle
is in progress is not decoded, and has no effect on
the cycle in progress.
The Release from Deep Power Down (RES) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code on Serial Data Input
(SI). Chip Select (CS#) must be driven Low for the
entire duration of the sequence.
The instruction sequence is shown in Figure 17.
The device features an 8-bit Electronic Signature,
whose value for the ES25P16 is 14h. This can be
read using RES instruction.
Driving Chip Select (CS#) High after the 8-bit instruction byte has been received by the device, but before
the whole of the 8-bit Electronic Signature has been
transmitted for the first time, still insures that the
device is put into Standby mode. If the device was
previously in the Deep Power Down mode, though,
the transition to the Stand-by Power mode is delayed
by tRES, and Chip Select (CS#) must remain High for
at least tRES(max) , as specified in Table 8. Once in
the Stand-by Power mode, the device waits to be
selected, so that it can receive, decode and execute
instructions.
The device is first selected by driving Chip Select
(CS#) Low. The instruction code is followed by 3
dummy bytes, each bit being latched-in on Serial
Data Input (SI) during the rising edge of Serial Clock
(SCK). Then, the 8-bit Electronic Signature, stored
in the memory, is shifted out on Serial Data Output
(SO), each bit being shifted out during the falling
edge of Serial Clock (SCK).
The instruction sequence is shown in Figure 18.
CS#
tRES
0
1
2
3
4
5
6
7
SCK
Instruction
SI
1
0
1
0
1
0
1
1
Deep Power Down Mode
Standby Mode
Figure 17. Release from Deep Power Down Instruction Sequence
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CS#
0
1
2
3
4
5
6
7
8
9
10
28
29 30 31 32 33 34 35
36 37 38 39
SCK
Instruction
SI
1
0
1
0
1
0
tRES
3 Dummy bytes
1
1
23 22 21
3
2
1
0
MSB
Device ID
High Impedance
SO
7
6
5
4
3
2
1
0
MSB
Deep Power Down Mode
Standby Mode
Figure 18. Release from Deep Power Down and Read Electronic
Signature (RES) Instruction Sequence
This makes it convenient for more frequent updates.
The Release from Deep Power Down and Read
Electronic Signature (RES) is terminated by driving
Chip Select (CS#) High after the Electronic Signature has been read at least once. Sending additional clock cycles on Serial Clock (SCK), while
Chip Select (CS#) is driven Low, causes the Electronic Signature to be output repeatedly.
The Read Parameter Page instruction allows one or
more bytes of the Parameter page to be read. The
instruction is initiated by driving the CS# low and
then shifting the instruction code “53h” followed by a
24-bit address (A23-A0) into the SI pin. Only the
lower 8 address bits (A7-A0) are used, the 16 upper
most address bis (A23-A8) are ignored. The code
and address bits are latched on the rising edge of
the CLK pin. After the address is received, the data
byte of the addressed memory location will be
shifted out on the SO pin at the falling edge of CLK
with most significant bit (MSB) first. The address is
automatically incremented to the next higher
address after each byte of data is shifted out allowing for a continuous stream of data. When the end of
the Parameter page is reached the address will wrap
to the beginning. The Read Parameter Page instruction is shown in Figure 19. The Read Parameter
Page (RDPARA) instruction is terminated by driving
Chip Select (CS#) High. Chip Select (CS#) can be
driven High at any time during data output. Any
Read Parameter Page (RDPARA) instruction, while
a Program, Erase, or Write cycle is in progress, is
rejected without having any effect on the cycle that is
in progress.
When Chip Select (CS#) is driven High, the device
is put in the Stand-by Power mode. If the device
was not previously in the Deep Power Down mode,
the transition to the Stand-by Power mode is immediate. If the device was previously in the Deep
Power Down mode, though, the transition to the
Stand-by mode is delayed by tRES, and Chip Select
(CS#) must remain High for at least tRES(max) , as
specified in Table 8. Once in the Stand-by Power
mode, the device waits to be selected, so that it can
receive, decode and execute instructions.
Read Parameter Page(RDPARA)
The Parameter Page is a 256-byte page of Flash
Memory that can be used for storing serial numbers, revision information and configuration data
that might typically be stored in an additional memory. Because the Parameter Page is relatively small
and separate from the array, the erase time is significantly shorter than that of a sector erase (see
tPE in Table.8)
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CS#
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31 32
33
34 35
36
37 38
39
SCK
24-Bit Address
Instruction
SI
0
1
0
1
0
0
1 23
1
22
21
3
2
1
0
MSB
Data Out 1
High Impedance
SO
7
6
5
4
3
Data Out 2
2
1
7
0
MSB
Figure 19. Read Parameter Page (RDPARA) Instruction Sequence
Fast Read Parameter Page(FRDPARA)
This is accomplished by adding a dummy byte after
the 24-bit address, as shown in figure 20. The
dummy byte allows the devices internal circuits
additional time for setting up the initial address. the
dummy byte data value on the SI pin is a don’t care.
The Fast Read Parameter Page instruction is basically the same as the Read Parameter Page
instruction except that it allows for a faster clock
rate to be used. The Fast Read Parameter Page
instruction can opperate at clock frequency D.C. to
a maximum of FSCK .
CS#
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
SI
0
1
0
1
1
0
Dummy Byte
24-Bit Address
Instruction
1
1 23 22 21
3
2
1
0
7
6
5
4
3
2
1
0
MSB
Data Out 2
Data Out 1
High Impedance
SO
7
6
5
4
3
2
1
0
7
MSB
Figure 20. Fast Read Parameter Page (FRDPARA) Instruction Sequence
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In most application it is best to read the full 256-byte
contents of the page into a temporary RAM. Data
can then be modified as needed and the entire 256
bytes can then be reprogrammed into the Parameter
Page at one time.
Program Parameter Page (PPP)
The Program Parameter Page instruction allows up
to 256 bytes to be programmed at memory word
locations that have been previously erased to all 1s
“FFFFh” A Write Enable(WREN) instruction must
be executed before the device will accept the Program Parameter Page instruction(Status Register
bit WEL must equal 1). The instruction is initiated
by driving the CS# pin low then shifting the instruction code “52h” followed by a 24-bit address(A23A0) and at least one bytes, into the SI pin. Only the
lower 8 address bits (A7-A0) are used, the 16 upper
most address bit (A23-A8) are ignored. The CS#
pin must be held low for the entire length of the
instruction while data is being sent to the device.
The Program Parameter Page instruction sequence
is shown in Figure 21.
As with the write and erase instruction, the CS#
must be driven high after the eighth bit of the last
byte has been latched. If this is not doen the Parameter Page Program instruction will not be executed.
After CS# is driven high, the self timed Page Program instruction will commence for a time duration of
tPP, as specified in Table 8. While The Page Program
cycle is in progress, the Read Status Register
instruction may still be accessed for checking the
status of the WIP bit. The WIP bit is a 1 during the
program cycle and becomes a 0 when the cycle is
finished and the device is ready to accept other
instruction again. After the program cycle has
started the Write Enable Latch(WEL) bit in the Status
Register is cleared to 0. The Program Parameter
Page instruction will not be excecuted if the
addressed page is protected by the Block Protect(BP2, BP1, BP0) bits
Less than 256 bytes can be programmed without
having any effect on other data within the page. If
more than 256 bytes are sent to the device the
addressing will wrap to the beginning of the page. If
previously written data bytes are over-written the
data will not be valid.
CS#
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
32
33
34
35
36
37
38
39
1
0
SCK
Instruction
SI
0
1
0
1
0
Data Byte1
24-Bit Address
0
1
0
23 22 21
1
2
MSB
7
0
4
5
6
2
3
MSB
2078
2079
55
2077
53 54
2076
50 51 52
2075
47 48 49
2074
41 42 43 44 45 46
2073
40
2072
CS#
1
0
SCK
Data Byte 2
SI
7
MSB
6
5
4
3
2
Data Byte256
Data Byte 3
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
MSB
MSB
Figure 21. Program Parameter Page (PPP) Instruction Sequence
ES25P16
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CS#
0
1
2
3
4
5
6
7
1
0
1
SCK
Instruction
SI
1
1
0
1
0
Figure 22. Erase Parameter Page( PE ) Instruction Sequence
1) Vcc (min) at power-up, and then for a further
delay of tPU (as described in Table 5)
2) Vss at power-down
Erase Parameter Page(PE)
The Erase Parameter Page Instruction sets all 256
bytes of memory in the Parameter Page to the
erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept
the Erase Parameter Page instruction(Status Register bit WEL must equal 1). The instruction is initiated
by driving the CS# pin low and shifting the instruction code “D5h”. The Erase Parameter Page instruction sequence is shown in Figure 22.
A simple pull-up resistor on Chip Select (CS#) can
usually be used to insure safe and proper power-up
and power-down.
The device ignores all instructions until a time delay
of tPU (as described in Table 5) has elapsed after the
moment that Vcc rises above the minimum Vcc
threshold. However, correct operation of the device
is not guaranteed if by this time Vcc is still below Vcc
(min). No Write Status Register, Program or Erase
instructions should be sent until tPU after Vcc
reaches the minimum Vcc threshold (See Figure
23).
The CS# pin must be driven high after the eighth has
been latched. If this is not done the Erase Parameter
Page instruction will not be executed. After CS# is
driven high, the self-timed Erase Parameter Page
instuction will commence for a time duration of tPE.
While the Erase Parameter Page Cycle is in
progress, the Read Status Register instruction may
still be accessed to check the status of the WIP bit.
The WIP bit is a 1 during the Erase Parameter Page
cycel and becomes a 0 when finished and the device
is ready to accept other instructions again. After the
Erase Parameter Page cycle has started the Write
Enable Latch(WEL) bit in the Status Register is
cleared to 0. The Erase Parameter Page instruction
will not be executed if any page is protected by the
Block Protect(BP2, BP1, BP0) bits.
At power-up, the device is in Standby mode (not
Deep Power Down mode) and the WEL bit is reset.
Normal precautions must be taken for supply rail
decoupling to stabilize the Vcc feed. Each device in
a system should have the Vcc rail decoupled by a
suitable capacitor close to the package pins (this
capacitor is generally of the order of 0.1uF).
At power-down, when Vcc drops from the operating
voltage to below the minimum Vcc threshold, all
operations are disabled and the device does not
respond to any instructions. (The designer needs to
be aware that if a power-down occurs while a Write,
Program or Erase cycle is in progress, data corruption can result.)
Power-up and Power-down
The device must not be selected at power-up or
power-down (that is, CS# must follow the voltage
applied on Vcc) until Vcc reaches the correct value
as follows:
ES25P16
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Vcc
Vccmax
Vccmin
tPU
Full Device Access
Time
Figure 23. Power-Up Timing
Table 5. Power-Up Timing
Symbol
Parameter
Min.
Max.
Unit
Vcc (min)
Vcc (minimum)
2.7
V
tPU
Vcc (min) to device operation
10
ms
Initial Delivery State
Absolute Maximum Ratings
The device is delivered with all bits set to 1 (each
byte contains FFh). The Status Register contains
00h (all Status Register bits are 0).
Ambient Storage Temperature .... -65oC to +150oC
Maximum Rating
Operating Ranges
Stressing the device above the rating listed in the
Absolute Maximum Ratings section below may
cause permanent damage to the device. Theses
are stress ratings only and operation of the device
at these or any other conditions above those indicated in the Operating sections of this specification
is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect
device reliability.
Ambient Operating Temperature (TA)
ES25P16
Voltage with Respect to Ground
All inputs and I/Os ........................... - 0.3V to 4.5V
Commercial .......................................... 0oC to +70oC
Industrial .............................................. -40oC to +85oC
Positive Power Supply
Voltage Range ........................................... 2.7V to 3.6V
Note:Operating ranges define those limits between
which the functionality of the device is guaranteed
27
Rev. 0E May 11 , 2006
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DC CHARACTERISTICS
This section summarizes the DC and AC Characteristics of the device. Designers should check that the operating conditions in their circuit match the measurement conditions specified in the Test Specifications in Table
7, when relying on the quoted parameters.
Table.6 DC Characteristics
Symbol
Vcc
Description
Test Conditions
Supply Voltage
Min.
Typ.
Max.
Unit
2.7
3
3.6
V
ILI
Input Leakage Current
VIN = GND to Vcc
1
uA
ISB
Standby Current
CS# = Vcc
50
uA
IDP
Deep Power Down Current
CS# = Vcc
10
uA
ILO
Output Leakage Current
VIN = GND to Vcc
1
uA
Active Read Current
SCK = 0.1 Vcc / 0.9 Vcc
SO = Open
40MHz
ICCI
SCK = 0.1Vcc / 0.9 Vcc
SO= Open
75 MHz
1
6
mA
12
ICC2
Active Page Program Current
CS# = Vcc
24
mA
ICC3
Active WRSR Current
CS# = Vcc
24
mA
ICC4
Active Sector Erase Current
CS# = Vcc
24
mA
ICC5
Active Bulk Erase Current
CS# = Vcc
24
mA
VIL
Input Low Voltage
- 0.3
0.3 Vcc
V
VIH
Input High Voltage
0.7 Vcc
Vcc + 0.5
V
VOL
Output Low Voltage
IOL = 1.6 mA, Vcc = Vcc min
0.4
V
VOH
Output High Voltage
IOH = -0.1mA,
Vcc - 0.2
V
Notes:
1. Typical values are at TA = 25oC and Vcc = 3V
ES25P16
28
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TEST CONDITIONS
Input and Output
Timing Reference levels
Input levels
0.8Vcc
0.7Vcc
0.5Vcc
0.3Vcc
0.2Vcc
Figure 24. AC Measurements I/O Waveform
Table 7. Test Specifications
Symbol
CL
Parameter
Min
Load Capacitance
Max
30
Input Rise and Fall Times
pF
5
ns
Input Pulse Voltage
0.2Vcc to 0.8Vcc
V
Input Timing Reference Voltage
0.3Vcc to 0.7Vcc
V
0.5Vcc
V
Output Timing Reference Voltage
ES25P16
Unit
29
Rev. 0E May 11 , 2006
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AC CHARACTERISTICS
Table 8. AC Characteristics
Symbol
Description
Min
Typ
Max
Unit
FSCK
SCK Clock Frequency READ instruction
D.C
40
MHz
FSCK
SCK Clock Frequency for Fast Read
and all other instructions except Read
instruction
D.C
75
MHz
tCRT
Clock Rise Time (Slew Rate)
0.1
V/ns
tCFT
Clock Fall Time (Slew Rate)
0.1
V/ns
tWH
SCK High Time
6
ns
tWL
SCK Low Time
6
ns
tCS
CS# High Time
100
ns
tCSS (Note 3)
CS# Setup Time
5
ns
tCSH (Note 3)
CS# Hold Time
5
ns
tHD (Note 3)
HOLD# Setup Time (relative to SCK)
5
ns
tCD (Note 3)
HOLD# Hold Time (relative to SCK)
5
ns
tHC
HOLD# Setup Time (relative to SCK)
5
ns
tCH
HOLD# Hold Time (relative to SCK)
5
ns
tV
Output Valid
6
ns
tHO
Output Hold Time
0
ns
tHD:DAT
Data in Hold Time
3
ns
tSU:DAT
Data in Setup Time
3
ns
tR
Input Rise Time
5
ns
tF
Input Fall Time
5
ns
tLZ (Note 3)
HOLD# to Output Low Z
6
ns
tHZ (Note 3)
HOLD# to Output High Z
6
ns
tDIS (Note 3)
Output Disable Time
8
ns
tWPS (Note 3)
Write Protect Setup Time
15
ns
tWPH (Note 3)
Write Protect Hold Time
15
ns
tRES
Release DP Mode
3
us
tDP
CS# High to Deep Power Down Mode
3
us
tW
Write Status Register Time
5
ms
tPP
Page Programming Time
1.5 (Note 1)
3 (Note 2)
ms
tSE
Sector Erase Time
0.5 (Note 1)
3 (Note 2)
sec
tBE
Bulk Erase Time
12 (Note 1)
24 (Note 2)
sec
tPE
Parameter Page Erase Time
20 (Note 1)
100 (Note 2)
ms
Notes:
1. Typical program and erase times assume the following conditions : 25’C, Vcc = 3.0V ; 10,000 cycles ; checkerboard data pattern
2. Under worst-case conditions of 90’C ; Vcc = 2.7V ; 100,000 cycles.
3. Not 100% tested.
ES25P16
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tCS
CS#
tCSS
tCSH
tCSS
tCSH
SCK
tCFT
tCRT
tSU:DAT tHD:DAT
SI
MSB IN
LSB IN
SO
Figure 25. SPI Mode 0 (0,0) Input Timing
CS#
tWH
SCK
tV
tHD
tV
tWL
tDIS
tHD
LSB OUT
SO
Figure 26. SPI Mode 0 (0,0) Output Timing
ES25P16
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CS#
tCH
tHD
tHC
SCK
tCD
tHZ
tLZ
SO
SI
HOLD#
Figure 27. HOLD# Timing
W#
tWPH
tWPS
CS#
SCK
SI
High Impedance
SO
Figure 28. Write Protect Setup and Hold Timing during WRSR when SRWD = 1
ES25P16
32
Rev. 0E May 11 , 2006
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PHYSICAL DIMENSIONS
S08 wide - 8 pin Plastic Small Outline 208 mils Body Width Package
0.20 C A-B
4
3
D
A
H
SEE
DETAIL B
D
5
b
WITH
PLATING
9
(c)
BASE
METAL
b1
4
3
c1
7
E
E1
SECTION A-A
E1/2
E/2
e
θ2
0.33 C
b
0.07 R MIN.
0.25 M C A-B D
B
H
5
GAUGE
PLANE
A
// 0.10 C
C
A
A2
SEATING
PLANE
θ1
A
L2
L
0.10 C
SEATING PLANE
C
A1
θ
L1
DETAIL B
NOTES:
Package
SOC 008 (inches)
SOC 008 (mm)
1. All dimensions are in both inches and millimeters.
2. Dimensioning and tolerancing per ASME Y 14.5M - 1994.
3. Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per
end. Dimension E1 does not include interlead flash or protrusion
interlead flash or protrusion shall not exceed 0.25mm per side.
D and E1 dimensions are determined at datum H.
4. The package top may be smaller than the package bottom. Dime-nsions D and E1 are determined at the outmost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs and
interlead flash. But including any mismatch between the top and
bottom of the plastic body.
5. Datums A and B to be determined at datum H.
6. “N” is the maximum number of terminal positions for the specified
package length H.
7. The dimensions apply to the flat section of the lead between 0.10 to
0.25 mm from the lead tip.
8. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.10 mm total in excess of the “b” dimension
at maximum material condition. The dambar cannot not be located
on the lower radius of the lead foot.
9. This chamfer feature is optional. If it is not present, then a pin 1
idenfifier must be located within the index area indicated.
10.Lead coplanarity shall be within 0.10 mm. As measured from the
seating plane.
JEDEC
Symbol
MIN
MAX
MIN
MAX
A
0.069
0.085
1.753
2.159
A1
0.002
0.0098
0.051
0.249
A2
0.067
0.075
1.70
1.91
b
0.014
0.018
0.356
0.483
b1
0.013
0.018
0.330
0.457
c
0.0075
0.0095
0.191
0.241
c1
0.006
0.008
0.152
0.203
D
0.208 BSC
5.283 BSC
E
0.315 BSC
8.001 BSC
E1
0.208 BSC
5283 BSC
e
0.050 BSC
1.27 BSC
L
0.020
0.508
L1
0.055 REF
0.030
0.762
1.40 REF
L2
0.010 BSC
0.25 BSC
N
8
8
θ
θ1
θ2
0’
8’
0’
8’
5’
15’
5’
15’
0’
ES25P16
0’
33
Rev. 0E May 11 , 2006
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Excel Semiconductor inc.
ORDERNG INFORMATION
Standard Products
ESI standard products are available in several package and operating ranges. The order number (Valid Combination) is formed by a combination of the following:
ES25P 16 - 75 C G 2 T
PACKING TYPE
T : Tube (standard) (Note)
R : 13” Tape and Reel (Note)
Y : Tray
PACKAGE TYPE
2 : 8 pin 208 mil SOP
PACKAGE MATERIALS
C : Standard
G : Lead (Pb) - free (Note)
TEMPERATURE RANGE
I : Industrial (- 40oC to + 85oC)
C : Commercial ( 0oC to + 70oC)
SPEED OPTION
75 : 75 Mhz
DENSITY
16 : 16 Mb
DEVICE FAMILY
ES25P : ESI Memory 3.0 Volt-only, Serial Peripheral
Interface (SPI) Flash Memory
Table 1. ES25P Valid Combinations
ES25P Valid Combinations
Base Ordering
Part Number
ES25P16
Speed Option
75
Temperature &
Package Material
CG, CC, IG,IC
(Note)
Package Type
2, 7
Packing Type
Package Marking
T, R,Y
(Note)
P16 + (Speed) + (Temp)
+(Package Material)
Notes:
Contact your local sales office for availability.
ES25P16
34
Rev. 0E May 11 , 2006
EE SS II
ADVANCED INFORMATION
Excel Semiconductor inc.
Document Title
16M Serial Flash Memory
Revision History
Revision Number
Data
Items
Rev. 0A
JUN. 27,2005
Initial Release Version.
Rev.0B
JAN. 18,2006
Added Parameter Page data to Features, and Read Manufacturer ID & Device ID
Rev.0C
Mar. 14, 2006
Device Name Changed
Rev.0D
May. 01, 2006
The Clock Frequency was changed from 66MHz to 75MHz
Rev.0E
May.11, 2006
WSON package not supported
Excel Semiconductor Inc.
1010 Keumkang Hightech Valley, Sangdaewon1-Dong 133-1, Jungwon-Gu, Seongnam-Si, Kyongki-Do, Rep.
of Korea. Zip Code : 462-807 Tel : +82-31-777-5060 Fax : +82-31-740-3798 / Homepage : www.excelsemi.com
The attached datasheets are provided by Excel Semiconductor.inc (ESI). ESI reserves the right to change the specifications and products. ESI will answer to your questions about device. If you have any questions, please contact the
ESI office.
ES25P16
35
Rev. 0E May 11 , 2006