PCA EPF8209S-RC 10/100base-tx interface pcmcia module Datasheet

10/100Base-TX
Interface PCMCIA Module
ELECTRONICS INC.
EPF8209S-RC
• Designed to work with Broadcom BCM5201, BCM5221 Chipsets
• Complies with or exceeds IEEE 802.3, 10/100Base-TX Standards
• Robust design allows for toughest soldering processes
• Add “-RC” after part number for RoHS Compliant
• 1500 Vrms Isolation
• Lead-Free
Electrical Parameters @ 25° C
OCL
(µH Min.)
@ 8 mA DC Bias
Interwinding
Capacitance
(pF Max.)
Leakage
Inductance
(µH Max.)
100 KHz,
0.1 Vrms
@ 100 KHz,
0.1 Vrms
@ 100 KHz,
0.1 Vrms
1
MHz
Xmit & Rcv
Xmit & Rcv
Xmit & Rcv
Xmit/Rcv
350 @ Pins 16-15 & 10-9
25
0.3
-27/-27
CMRR
(dB Min.)
30
MHz
60
MHz
Xmit/Rcv Xmit/Rcv
-17/-9
-16/-4
Primary
DCR
(Ω Max.)
Return
Loss
(dB Min.)
80
MHz
100
MHz
1-30
MHz
Xmit/Rcv
Xmit/Rcv
-14/-2
-12/-1
30-60
MHz
60-80
MHz
Xmit Rcv
Xmit & Rcv
-10
-14
-10
1.5
1.0
• Insertion Loss : -1 dB Max., 1 MHz to 100 MHz •
Package
Schematic
.500
(12.70)
.050
(1.27)
.070
(1.78)
PCA
EPF8209S-RC
Date Code
Pin 1
I.D.
.270
(6.86)
Pri.
1
.105
(2.67)
Pad
Layout
.420
(10.67)
2
6
.030
(.762)
.007/.012
(.178/.305)
15
14
Transmit
7
.008/.012
(.203/.305)
0°-6°
Sec.
16
1CT:1CT
3
.350
(8.89)
.080/.088
(2.03/2.23)
Receive
11
10
8
9
1CT:1CT
.018/.022
(.457/.559)
.050
(1.27)
.021
Typ.
(.533)
.374
Max.
(9.50)
Notes :
EPF8209S-RC
1. Lead Finish
Hot Tin Dip (Sn) †
2. Peak Temperature Rating
245°C
3. Moisture Sensitive Levels
MSL = 1
(Unlimited, ≤30°C/85%RH)
4. Weight
TBD gram
(Tube)
5. Packaging Information
(Tape & Reel)
TBD pieces/tube
1500 pieces/13” reel
† Lead Material : Ni Barrier over Cu
Unless Otherwise Specified Dimensions are in Inches /mm ± .010 /.25
PCA ELECTRONICS, INC.
16799 SCHOENBORN ST.
NORTH HILLS, CA 91343
Product performance is limited to specified parameters. Data is subject to change without prior notice.
CSF8209S -RC Rev. 1
4/9/07 JDG
TEL: (818) 892-0761
FAX: (818) 894-5791
http://www.pca.com
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