PHILIPS BF421 Pnp high-voltage transistor Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D186
BF421; BF423
PNP high voltage transistors
Product specification
Supersedes data of 1996 Dec 09
2004 Nov 10
Philips Semiconductors
Product specification
PNP high voltage transistors
BF421; BF423
FEATURES
PINNING
• Low feedback capacitance.
PIN
DESCRIPTION
1
base
APPLICATIONS
2
collector
• Class-B video output stages in colour television and
professional monitor equipment.
3
emitter
DESCRIPTION
PNP transistors in a TO-92 plastic package.
NPN complements: BF420 and BF422.
handbook, halfpage1
2
2
3
1
3
MAM285
Fig.1
Simplified outline (TO-92) and symbol.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
BF421
SC-43A
DESCRIPTION
VERSION
plastic single-ended leaded (through hole) package; 3 leads
SOT54
BF423
QUICK REFERENCE DATA
SYMBOL
VCBO
PARAMETER
collector-base voltage
CONDITIONS
MAX.
UNIT
open emitter
−
−300
V
−
−250
V
BF421
−
−300
V
BF423
−
−250
V
BF421
BF423
VCEO
MIN.
collector-emitter voltage
open base
ICM
peak collector current
−
−100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
−
830
mW
hFE
DC current gain
VCE = −20 V; IC = −25 mA
50
−
Cre
feedback capacitance
VCE = −30 V; IC = ic = 0 A; f = 1 MHz
−
1.6
pF
fT
transition frequency
VCE = −10 V; IC = −10 mA; f = 100 MHz
60
−
MHz
2004 Nov 10
2
Philips Semiconductors
Product specification
PNP high voltage transistors
BF421; BF423
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VCBO
PARAMETER
CONDITIONS
collector-base voltage
MAX.
UNIT
open emitter
−
−300
V
−
−250
V
BF421
−
−300
V
BF423
−
−250
V
BF421
BF423
VCEO
MIN.
collector-emitter voltage
open base
VEBO
emitter-base voltage
−
−5
V
IC
collector current (DC)
−
−50
mA
ICM
peak collector current
−
−100
mA
IBM
peak base current
−
−50
mA
Ptot
total power dissipation
−
830
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
ambient temperature
−65
+150
°C
open collector
Tamb ≤ 25 °C; note 1
Note
1. Transistor mounted on a printed-circuit board.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
VALUE
UNIT
150
K/W
note 1
Note
1. Transistor mounted on a printed-circuit board.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
collector-base cut-off current
CONDITIONS
MIN.
MAX.
UNIT
VCB = −200 V; IE = 0 A
−
−10
nA
VCB = −200 V; IE = 0 A; Tj = 150 °C
−
−10
µA
VEB = −5 V; IC = 0 A
−
−50
nA
IEBO
emitter-base cut-off current
hFE
DC current gain
VCE = −20 V; IC = −25 mA
50
−
VCEsat
collector-emitter saturation voltage
IC = −30 mA; IB = −5 mA
−
−0.6
V
Cre
feedback capacitance
VCE = −30 V; IC = ic = 0 A; f = 1 MHz
−
1.6
pF
fT
transition frequency
VCE = −10 V; IC = −10 mA; f = 100 MHz
60
−
MHz
2004 Nov 10
3
Philips Semiconductors
Product specification
PNP high voltage transistors
BF421; BF423
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
e1
2
D
e
3
b1
L1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
b1
c
D
d
E
mm
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
e
2.54
e1
L
L1(1)
1.27
14.5
12.7
2.5
max.
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
SOT54
2004 Nov 10
REFERENCES
IEC
JEDEC
JEITA
TO-92
SC-43A
4
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
04-06-28
Philips Semiconductors
Product specification
PNP high voltage transistors
BF421; BF423
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no license or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Nov 10
5
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA76
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/03/pp6
Date of release: 2004
Nov 10
Document order number:
9397 750 13583
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