ESD8V0L... Dual Channel TVS Diode • ESD / transient protection for data and power lines to IEC61000-4-2 (ESD): ± 15 KV (contact) IEC61000-4-4 (EFT): 40 A (5/50 ns) • Working voltage: -8 / +14 V • Low capacitance • Low reverse current ESD8V0L2B-03L 3 D1 D2 1 2 Type ESD8V0L2B-03L* Package TSLP-3-1 Configuration 2 channel, bi-directional Marking B3 * Preliminary data Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol ESD contact discharge1) VESD 15 kV Peak pulse current (tp = 8 / 20 µs)2) I pp 1 A Operating temperature range T op -55...125 °C Storage temperature T stg -65...150 Thermal Resistance Parameter Symbol Value Unit Junction - soldering point3) RthJS ≤ tbd K/W 1V ESD according to IEC61000-4-2 2I according to IEC61000-4-5 pp 3For calculation of R thJA please refer Value Unit to Application Note Thermal Resistance 1 2006-02-02 ESD8V0L... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. -8 - 14 14.5 - - 8.5 - - - <1 100 Characteristics Reverse working voltage VRWM Breakdown voltage V(BR) I(BR) = 1 mA, from pin 1 or 2 to pin 3 I(BR) = 1 mA, from pin 3 to pin 1 or pin 2 Reverse current IR V nA VR = 3 V, between all pins Clamping voltage V VCL VESD = +15 kV (contact)1) - 26 - VESD = -15 kV (contact)1) - 20 - - 4 7 Diode capacitance CT pF VR = 0 V, f = 1 MHz, from pin 1 or pin 2 to pin 3 1V ESD according to IEC61000-4-2 2 2006-02-02 ESD8V0L... Reverse current IR = ƒ(VR) TA = Parameter Diode capacitance CT = ƒ (VR) f = 1MHz 10 1 7 pF nA TA = 85°C 5 IR CT 10 0 4 TA = 25°C 3 10 -1 2 1 10 -2 0 2 4 6 8 10 V 0 0 14 VR 2 4 6 8 10 V 14 VR 3 2006-02-02 ESD8V0L... Application example ESD8V0L2B-03L 2 channel, bi-directional Connector Protected signal line 1 Protected signal line 2 3 The protection diode should be placed very closely to the location where the ESD can occur to keep loops and inductances as small as possible. 4 2006-02-02 Package TSLP-3-1 ESD8V0L... Package Outline Bottom view 0.4 +0.1 0.6 ±0.05 0.5 ±0.035 2 1 ±0.05 3 0.65 ±0.05 3 1) 2 1 1) 0.05 MAX. 0.35 ±0.05 Pin 1 marking 2 x 0.15 ±0.035 2 x 0.25 ±0.035 1 0.25 ±0.035 1) Top view 1) 1) Dimension applies to plated terminal Foot Print R0.1 0.2 0.225 0.2 0.225 0.315 0.35 1 0.3 0.945 0.35 0.45 0.275 0.6 0.355 For board assembly information please refer to Infineon website "Packages" 0.17 0.15 Copper Solder mask Stencil apertures Marking Layout Type code BFR193L3 Laser marking Pin 1 marking Example Standard Packing Reel ø180 mm = 15.000 Pieces/Reel 0.5 1.16 Pin 1 marking 8 4 0.76 5 2006-02-02 ESD8V0L... Published by Infineon Technologies AG, 81726 München © Infineon Technologies AG 2006. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.Infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2006-02-02