Anpec APA2613RI-TRG 6w stereo class-d audio power amplifier Datasheet

APA2613
6W Stereo Class-D Audio Power Amplifier
Features
•
•
General Description
Supply Voltage is 8V ~ 26V
The APA2613 is a stereo, high efficiency, Class-D audio
Class D operation eliminates heat sink & reduce
power supply requirement
amplifier available in TSSOP-28Pand QFN4x4-28A pins
packages.
20,26, 32, 36, 4 steps gain setting
6W per channel (THD+N=10%)output power into
The Class-D power amplifier has higher efficiency compare to the tradition Class-AB power amplifier. The filter-
•
8Ω load at 10V, Class D output
MONO function combines two channels’output to
free Class-D architecture eliminates the external low pass
filters. The internal gain setting can minimum the exter-
•
supply 12W into a 4Ω load at 12V (THD+N=10%)
Adjustable Power limit function plus DC Protec-
nal component counts, and for the flexible application the
gain can be set to 4-step 20, 26, 32, 36dB by gain control
•
tion
Thermal and Over-Current Protections with Auto-
ins (GAIN0 and GAIN1). The power limit function cans
protection the speaker when output signal excess the
Recovery option
TSSOP-28P with thermal pad packages
speaker limit rating.
The integration of Class-D power amplifier is a best so-
QFN4x4-28 with thermal pad packages
lution for power efficiency and lower the total BOM costs.
The operating voltage is from 8V to 26V. The APA2613
•
•
•
•
power amplifiers are capable of driving 6 W at VDD=10V
into 8Ω speaker, and provides thermal and over-current
protections also can detection the DC that prevent to destroy the speaker voice coil.
Applications
•
•
Pin Configuration
LCD Monitor
AIO
Simplified Application Circuit
SD 1
28 LPVDD
FLAG 2
27 LPVDD
26 LBSP
LINP 3
25 LOUTP
LINN 4
GAIN0 5
APA2613
LOUTP
Left
Channel
Input
Right
Channel
Input
LINP
LINN
RINN
LOUTN
ROUTN
RINP
ROUTP
24 PGND
23 LOUTN
GAIN1 6
FERRITE
BEAD
FILTER
FERRITE
BEAD
FILTER
AVDD 7
Left
Channel
Speaker
AGND 8
VCLAMP 9
Right
Channel
Speaker
APA2613
TSSOP-28P
22 LBSN
21 RBSN
20 ROUTN
PLIMT 10
19 PGND
RINN 11
18 ROUTP
RINP 12
17 RBSP
NC 13
16 RPVDD
MONO 14
15 RPVDD
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
1
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APA2613
22 PGND
23 ROUTN
24 RBSN
25 NC
26 LBSN
28 PGND
27 LOUTN
Pin Configuration(Cont.)
21 ROUTP
LOUTP 1
LBSP 2
LPVDD 3
20 RBSP
19 RPVDD
APA2613
QFN4x4-28
SD 4
FLAG 5
LINP 6
18 MONO
17 NC
16 RINP
PLIMIT 14
AGND 12
VCLAMP 13
GAIN1 10
AVDD 11
NC 8
15 RINN
GAIN0 9
LINN 7
Ordering and Marking Information
APA2613
Package Code
R : TSSOP-28P QA : QFN4x4-28
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
Assembly Material
Handling Code
Temperature Range
Package Code
APA2613 R :
APA2613 QA :
APA2613
XXXXX
XXXXX - Date Code
XXXXX - Date Code
APA2613
XXXXX
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
2
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APA2613
Absolute Maximum Ratings (Note 1)
(Over operating free-air temperature range unless otherwise noted.)
Symbol
VDD
Parameter
Rating
Supply Voltage (PVDD, AVDD)
Unit
-0.3 to 30
-0.3 to VDD+0.3
Input Voltage ( SD , GAIN0 and GAIN1, MONO and FLAG )
VI
PLIMIT
-0.3 to 6.3
LINP, LINN, RINP, RINN
-0.3 to 6.3
TJ
Maximum Junction Temperature
V
ο
150
TSTG
Storage Temperature Range
TSDR
Soldering Temperature Range, 10 Seconds
260
STEREO Mode : VDD>15V
4.8
RL
STEREO Mode: VDD ≦15V
3.2
PD
Power Dissipation
C
-65 to +150
MONO mode
Ω
3.2
Internally Limited
W
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol
θJA
θJC
Parameter
Typical Value
Unit
Thermal Resistance -Junction to Ambient (Note 2)
TSSOP-28P
QFN4x4-28
45
40
TSSOP-28P
QFN4x4-28
8
7
ο
C/W
Thermal Resistance -Junction to Case (Note 3)
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
of TSSOP-28P is soldered directly on the PCB.
Note 3: The case temperature is measured at the center of the exposed pad on the underside of the TSSOP-28P package.
Recommended Operating Conditions
Symbol
Parameter
Min.
Max.
8.0
26.0
SD
2.2
-
GAIN0, GAIN1, MONO
2.0
-
SD
-
0.8
GAIN0, GAIN1, MONO
-
0.8
Unit
VDD
Supply Voltage
VIH
High Level Threshold Voltage
VIL
Low Level Threshold Voltage
TA
Ambient Temperature Range
-40
85
o
TJ
Junction Temperature Range
-40
125
o
RL
Speaker Resistance
3.5
-
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
3
V
C
C
Ω
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APA2613
Electrical Characteristics
VDD=12V, GND=0V, AV=36dB, TA= 25οC (unless otherwise noted).
Symbol
Parameter
Test Conditions
APA2613
Min.
Typ.
Max.
Unit
Regulated Voltage
IO=2mA, VDD=8~26V
TJ = -40oC ~ 125oC
4.5
5
5.5
Maximum Output Voltage
Under PLIMIT Control
VPLIMIT = 1V, Vl = 1Vrms
4.6
5.5
6.1
TSD(ON)
Shutdown Turn-On Time
SD =2.2V
-
16
-
ms
TSD(OFF)
Shutdown Turn-Off Time
SD =0.8V
-
2
-
µs
IDD
Quiescent Supply Current
No Load
-
20
35
mA
ISD
Quiescent Supply Current in
shutdown mode
SD = 0V
-
10
100
Input Current
SD , GAIN0, GAIN1, MONO
-
5
50
400
500
600
kHz
VDD = 12V, IL= 0.5A
-
400
-
mΩ
Gain 0 = 0, Gain 1 = 0
-
20
-
Gain 0 = 1, Gain 1 = 0
-
26
-
Gain 0 = 0, Gain 1 = 1
-
32
-
Gain 0 = 1, Gain 1 = 1
-
36
-
VCLAMP
VO
II
FOSC
Internal Oscillator Frequency
RDSON
Static Drain-Source On-State
Resistance
AV
Gain
V
µA
dB
Stereo Mode
VDD=12V, GND=0V, AV=36dB, TA= 25οC (unless otherwise noted).
Symbol
Parameter
Test Conditions
APA2613
Min.
Typ.
Max.
Unit
VDD = 24V, TA = 25°
C
Channel Separation
VO=1Vrms, FIN =1kHz, Gain=20dB
-
-85
-
SNR
Signal-To-Noise Ratio
Maximum output at THD+N<1%,
FIN=1kHz, Gain = 20dB, A-weighted
-
95
-
Attshutdown
Shutdown Attenuation
FIN=1kHz, RL = 8Ω, Vin = 1VPP
-
-100
-
Offset Voltage
AV=20dB
-
-
15
mV
Noise Output Voltage
With A-weighted Filter (AV = 20dB)
-
120
-
µV
(rms)
RL=8Ω
-
7
-
RL=8Ω
-
8.5
-
RL = 8Ω
PO = 4W
-
0.1
-
Crosstalk
I VOS I
Vn
dB
dB
VDD = 12V TA = 25°
C
PO
THD+N
Output Power
Total Harmonic Distortion Plus Noise
THD+N = 1%
FIN=1kHz
THD+N = 10%
FIN=1kHz
FIN=1kHz
W
%
Channel Separation
VO=1Vrms, FIN =1kHz, Gain=20dB
-
-90
-
SNR
Signal-To-Noise Ratio
Maximum output at THD+N<1%,
FIN=1kHz, Gain = 20dB, A-weighted
-
95
-
Attshutdown
Shutdown Attenuation
FIN=1kHz, RL = 8Ω, Vin = 1VPP
-
-100
-
Offset Voltage
AV=20dB
-
-
15
mV
Noise Output Voltage
With A-weighted Filter (AV = 20dB)
-
120
-
µV (rms)
Crosstalk
I VOS I
Vn
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
4
dB
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APA2613
Mono Mode
VDD=12V, GND=0V, AV=36dB, TA= 25οC (unless otherwise noted).
Symbol
Parameter
Test Conditions
APA2613
Min.
Typ.
Max.
RL = 4Ω
-
9
-
RL = 4Ω
-
12
-
RL = 4Ω
PO = 6W
Maximum output at THD+N<1%,
FIN=1kHz, Gain = 20dB, A-weighted
-
0.1
-
-
95
-
Unit
VDD = 12V TA = 25°
C
PO
THD+N
Output Power
Total Harmonic Distortion Plus Noise
THD+N = 1%
FIN=1kHz
THD+N = 10%
FIN=1kHz
W
FIN=1kHz
%
SNR
Signal-To-Noise Ratio
Attshutdown
Shutdown Attenuation
FIN=1kHz, RL = 8Ω, Vin = 1Vrms
-
-100
-
VOS
Offset Voltage
AV = 20dB
-
-
15
mV
Vn
Noise Output Voltage
With A-weighted Filter (AV = 20dB)
-
120
-
µV (rms)
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
5
dB
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APA2613
Typical Operating Characteristics
10
10
PO=5W
PO=2.5W
0.01
VDD=18V
RL=8Ω
Ci=1µF
Gain=20dB
AES-17(20kHz)
1
THD+N (%)
THD+N (%)
0.1
THD+N vs. Frequency
THD+N vs. Frequency
VDD=12V
RL=8Ω
Ci=1µF
Gain=20dB
1 AES-17(20kHz)
PO=5W
0.1
0.01
PO=0.5W
PO=1W
0.001
20
0.001
50 100 200
500 1k
2k
5k 10k 20k
50 100 200
20
10
1
THD+N vs. Frequency
VDD=24V
RL=8Ω
Ci=1µF
Gain=20dB
AES-17(20kHz)
1
THD+N (%)
0.1
0.01
VDD=12V
RL=6Ω
Ci=1µF
Gain=20dB
AES-17(20kHz)
0.1
PO=2.5W
0.01
50 100 200
500 1k
PO=0.5W
2k
0.001
20
5k 10k 20k
THD+N vs. Frequency
2k
5k 10k 20k
10
VDD=12V
RL=4Ω
Ci=1µF
Gain=20dB
1
AES-17(20kHz)
VDD=18V
RL=6Ω
Ci=1µF
Gain=20dB
AES-17(20kHz)
THD+N (%)
PO=5W
0.1
0.01
0.1
PO=5W
0.01
PO=1W
PO=1W
0.001
20
500 1k
THD+N vs. Frequency
10
THD+N (%)
50 100 200
Frequency (Hz)
Frequency (Hz)
1
5k 10k 20k
PO=5W
PO=1W
0.001
20
2k
THD+N vs. Frequency
10
PO=5W
THD+N (%)
500 1k
Frequency (Hz)
Frequency (Hz)
50 100 200
500 1k
2k
0.001
20
5k 10k 20k
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
50 100 200
500 1k
2k
5k 10k 20k
Frequency (Hz)
6
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APA2613
Typical Operating Characteristics
THD+N vs. Output Power
THD+N vs. Output Power
10
VDD=12V
RL=8Ω
Ci=1µF
AV=20dB
AUX-0025
AES-17(20kHz)
fin=1kHz
THD+N (%)
THD+N (%)
1
10
fin=20Hz
1
VDD=18V
RL=8Ω
Ci=1µF
AV=20dB
AUX-0025
AES-17(20kHz)
fin=1kHz
fin=10kHz
0.1
0.01
0.01
1
0.1
0.01
0.01
10
10
Output Power (W)
THD+N vs. Output Power
THD+N vs. Output Power
10
10
VDD=24V
RL=8Ω
Ci=1µF
AV=20dB
AUX-0025
AES-17(20kHz)
VDD=12V
RL=6Ω
Ci=1µF
AV=20dB
AUX-0025
AES-17(20kHz)
1
THD+N (%)
THD+N (%)
fin=20Hz
1
0.1
Output Power (W)
1
fin=10kHz
0.1
fin=20Hz
fin=1kHz
fin=10kHz
0.1
fin=20Hz
fin=1kHz
fin=10kHz
0.1
0.01
0.01
0.01
0.1
1
0.006
0.01
10
0.1
THD+N vs. Output Power
THD+N vs. Output Power
VDD=18V
RL=6Ω
Ci=1µF
AV=20dB
AUX-0025
AES-17(20kHz)
1
THD+N (%)
THD+N (%)
10
10
10
1
1
Output Power (W)
Output Power (W)
fin=20Hz
fin=1kHz
fin=10kHz
0.1
VDD=12V
RL=4Ω
Ci=1µF
AV=20dB
AUX-0025
AES-17(20kHz)
fin=20Hz
fin=1kHz
fin=10kHz
0.1
0.01
0.006
0.01
0.1
1
0.01
0.01
10
Output Power (W)
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
0.1
1
10
Output Power (W)
7
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APA2613
Typical Operating Characteristics
Frequency Response
THD+N vs. Output Power
+28
10
Gain,
AV=26dB
+24
VDD=24V
Gain,
AV=20dB
+20
+0
+18
Phase,
AV=26dB
+16
0.1
VDD=12V
RL=8Ω
PO=0.6W
Ci=1µF
AUX-0025
+14
VDD=12V
VDD=18V
+12
0.01
0.01
0.1
10
1
+10
20
40
Frequency Response
90
VDD=12V
RL=8Ω
PO=0.6W
Ci=1µF
AUX-0025
+20
20
Phase,
AV=20dB
Efficiency (%)
Phase,
AV=26dB
Phase (Degree)
Gain (dB)
70
+0
+22
80
+100
Gain,
AV=32dB
+30
+24
VDD=12V
60
VDD=18V
50
VDD=24V
40
RL=8Ω+33µH
fin=1kHz
THD+N≦10%
AV=20dB
AUX-0025
AES-17(20kHz)
30
-100
20
10
100
1k
-200
100k
10k 20k
0
0
1
2
Frequency (Hz)
100
90
90
80
80
Efficiency (%)
VDD=12V
60
VDD=18V
RL=6Ω+33µH
fin=1kHz
THD+N≦10%
AV=20dB
AUX-0025
AES-17(20kHz)
30
20
10
5
6
7
8
9
10
VDD=12V
70
70
40
4
Efficiency vs. Output Power
Efficiency vs. Output Power
Efficiency (%)
3
Output Power (W)
100
50
-200
100k
100
Gain,
AV=32dB
+34
+26
10k 20k
Efficiency vs. Output Power
+200
+28
1k
-100
Frequency (Hz)
+38
+32
Phase,
AV=20dB
100
Output Power (W)
+36
+100
+22
Gain (dB)
THD+N (%)
+26
Phase (Degree)
1
RL=4Ω
Ci=1µF
AV=20dB
AUX-0025
AES-17(20kHz)
mono mode
+200
60
50
40
RL=4Ω+33µH
fin=1kHz
THD+N≦10%
AV=20dB
AUX-0025
AES-17(20kHz)
30
20
10
0
0
0
1
2
3
4
5
6
7
8
9
0
10
Output Power (W)
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
1
2
3
4
5
6
7
8
9
10
Output Power (W)
8
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APA2613
Typical Operating Characteristics
Crosstalk vs. Frequency
Efficiency vs. Output Power
100
+0
90
-10
80
-20
-30
VDD=12V
60
Crosstalk
Efficiency (%)
70
VDD=18V
50
RL=4Ω+33µH
fin=1kHz
THD+N≦10%
AV=20dB
AUX-0025
AES-17(20kHz)
Mono mode
40
30
20
10
2
4
6
8
10
12
14
-50
-60
L-ch to R-ch
-70
-80
R-ch to L-ch
-90
-100
-110
-120
20
0
0
-40
VDD=12V
VO=1V
RL=8Ω
AV=20dB
AUX-0025
AES-17(20kHz)
16
100
Output Power (W)
PSRR vs. Frequency
+0
-20
VDD=12V
RL=8Ω
AV=20dB
Vrr=0.2Vrms
AUX-0025
AES-17(20kHz)
-20
-30
L-channel
-40
-50
VDD=12V
RL=4Ω
AV=20dB
Vrr=0.2Vrms
AUX-0025
AES-17(20kHz)
Mono mode
-10
PSRR (dB)
-10
PSRR (dB)
10k 20k
PSRR vs. Frequency
+0
R-channel
-30
-40
-50
-60
-60
-70
20
100
1k
-70
20
10k 20k
100
Shutdown Attenuation vs.
Frequency
-50
10k 20k
1k
Frequency (Hz)
Frequency (Hz)
Supply Current vs. Supply Voltage
24
No Load
-60
20
-70
Supply Current (mA)
Shutdown Attenuation (dB)
1k
Frequency (Hz)
-80
L-channel
-90
-100
R-channel
-110
16
12
8
4
-120
0
20
100
1k
10k 20k
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
Supply Voltage (V)
Frequency (Hz)
9
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APA2613
Typical Operating Characteristics
5
Shutdown Current vs. Supply
Voltage
No Load
Shutdown Current (µA)
4
3
2
1
0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
Supply Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
10
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APA2613
Pin Description
PIN
I/O/P
FUNCTION
NO.
TSSOP
-28P
QFN4x4
-28
NAME
1
4
SD
I
2
5
FLAG
O
3
6
LINP
I
Positive audio input for left channel. Biased at VCLAMP/2.
4
7
LINN
I
Negative audio input for left channel. Biased at VCLAMP/2.
5
9
GAIN0
I
Gain select least significant bit. TTL logic levels with compliance to AVDD.
6
10
GAIN1
I
Gain select least significant bit. TTL logic levels with compliance to AVDD.
Shutdown logic input for audio amp (Low=outputs disabled, High=output
enabled). TTL logic levels with compliance to AVDD.
Protection flag output (open drain). Connecting FLAG and SD can be set to
auto-recovery. Otherwise need to reset by cyding AVDD
7
11
AVDD
P
Analog supply.
8
12
AGND
P
Analog signal ground. Connect to the thermal pad.
9
13
VCLAMP
O
10
14
PLIMIT
I
Regulated voltage, Nominal voltage is 5V.
Power limit level adjust. Connect a resistor divider from VCLAMP to GND to
set power limit. Connect directly to VCLAMP for no power limit.
11
15
RINN
I
Negative audio input for right channel. Biased at VCLAMP/2.
12
16
RINP
I
Positive audio input for right channel. Biased at VCLAMP/2.
13
8, 17
NC
14
18
MONO
I
Parallel BTL mode switch.
15,16
19
RPVDD
P
Power supply for right channel H-bridge. Right channel and left channel power
supply inputs are connected internally.
17
20
RBSP
I
Bootstrap I/O for right channel, positive high-side FET.
18
21
ROUTP
O
Class-D H-bridge positive output for right channel.
19, 24
22, 28, 25
PGND
P
Power ground for the H-bridges.
20
23
ROUTN
O
Class-D H-bridge negative output for right channel.
21
24
RBSN
I
Bootstrap I/O for right channel, negative high-side FET.
22
26
LBSN
I
Bootstrap I/O for left channel, negative high-side FET.
23
27
LOUTN
O
Class-D H-bridge negative output for left channel.
25
1
LOUTP
O
Class-D H-bridge positive output for left channel.
26
2
LBSP
I
Bootstrap I/O for left channel, positive high-side FET.
27,28
3
LPVDD
P
Power supply for left channel H-bridge. Right channel and left channel power
supply inputs are connected internally.
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
Not connected.
11
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APA2613
Block Diagram
LBSP
VCLAMP
LPVDD
LPVDD
LOUTP FB
MONO Select
Gate
Drive
LOUTP FB
LOUTP
LINP
Gain
Control
PWM
Logic
PLIMIT
PGND
VCLAMP
LPVDD
LINN
LBSN
LPVDD
LOUTN FB
LOUTN FB
Gate
Drive
LOUTN
FLAG
Biases and
References
SD
TTL
Buffer
GAIN0
GAIN1
GAIN
Control
PLIMIT
Reference
PLIMIT
PGND
SD Detect
DC Detect
LPVDD
Thermal
Detect
RPVDD
Startup
Protection
Logic
RAMP
GEN.
UVLO/OCL
O
RBSN
VCLAMP
LDO
Regulator
AVDD
RPVDD
RPVDD
VCLAMP
VCLAMP
Gate
Drive
ROUTN FB
ROUTN
ROUTN FB
RINN
Gain
Control
PLIMIT
PWM
Logic
PGND
VCLAMP
RPVDD
RBSP
RPVDD
RINP
ROUTP FB
MONO Select
Gate
Drive
ROUTP
ROUTP FB
MONO
TTL
Buffer
MONO
Select
PGND
AGND
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
12
www.anpec.com.tw
APA2613
Typical Application Circuit
VDD
100µF
0.1µF
1000pF
100kΩ
(Recommmanded)
1kΩ
(Recommmanded)
Shutdown Control
1µF
Left Channel
Input Signal
1µF
Gain Setting
SD 1
28 LPVDD
FLAG 2
LINP 3
27 LPVDD
26 LBSP
LINN 4
25 LOUTP
GAIN0 5
24 PGND
GAIN1 6
23 LOUTN
AVDD 7
22 LBSN
1µF
AGND 8
1µF
1µF
10kΩ
10kΩ
1µF
Right Channel
Input Signal
VCLAMP 9
APA2613
1000pF
BEAD
0.22µF
0.22µF
21 RBSN
BEAD
1000pF
BEAD
20 ROUTN
PLIMIT 10
1000pF
19 PGND
RINN 11
18 ROUTP
RINP 12
17 RBSP
1µF
0.22µF
NC 13
16 RPVDD
MONO 14
15 RPVDD
BEAD
1000pF
0.22µF
100µF
0.1µF
1000pF
29
GND
Stereo
VDD
VDD
100µF
1kΩ
(Recommmanded)
Shutdown Control
Gain Setting
SD 1
28 LPVDD
FLAG 2
27 LPVDD
LINP 3
26 LBSP
LINN 4
25 LOUTP
GAIN0 5
24 PGND
GAIN1 6
23 LOUTN
AVDD 7
22 LBSN
1µF
AGND 8
1µF
VCLAMP 9
APA2613
1000pF
0.47µF
BEAD
1000pF
21 RBSN
BEAD
20 ROUTN
PLIMIT 10
Right Channel
Input Signal
0.1µF
100kΩ
(Recommmanded)
10Ω
1000pF
19 PGND
1µF
RINN 11
18 ROUTP
1µF
RINP 12
17 RBSP
NC 13
16 RPVDD
MONO 14
15 RPVDD
0.47µF
100µF
0.1µF
1000pF
MONO
VDD
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
13
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APA2613
Function Description
Class-D Operation
the switching period, reducing the switching current, which
reduces any I2R losses in the load.
Output = 0
Gain Setting Operation
VOUTP
VOUTN
VOUT
(VOUTP-VOUTN)
GAIN1
GAIN0
Gain
Ri(Ω)
0
0
20dB
60k
0
1
26dB
30k
1
0
32dB
15k
1
1
36dB
9k
Table 1 : The Gain Setting
The APA2613’s gain can be set by GAIN0, GAIN1. The
detail gain setting value is list at table 1.
IOUT
Output > 0
Shutdown Operation
VOUTP
In order to reduce power consumption while not in use,
the APA2613 contains a shutdown function to externally
turn off the amplifier bias circuitry. This shutdown feature
VOUTN
turns the amplifier off when logic low is placed on the SD
pin for APA2613. The trigger point between a logic high
VOUT
(VOUTP-VOUTN)
and logic low level is typically 2.2V. It is best to switch
between ground and the supply voltage VDD to provide
IOUT
maximum device performance. By switching the SD pin
to low level, the amplifier enters a low-consumption- cur-
Output < 0
VOUTP
rent state, IDD for APA2613 is in shutdown mode. On normal operating, APA2613’s SD pin should pull to high level
VOUTN
to keeping the IC out of the shutdown mode. The SD pin
should be tied to a definite voltage to avoid unwanted
state changes.
VOUT
(VOUTP-VOUTN)
Power Limit Operation
The voltage at pin 10 can used to limit the power to levels
below that which is possible based on the supply rail.
IOUT
Add a resistor divider from Vclamp to ground to set the
voltage at the PLIMIT pin. An external reference may also
Figure1. The APA2613 Output Waveform
be used if tighter tolerance is required. Also add a 1µF
capacitor from pin 10 to ground.
The APA2613 uses a modulation scheme that allows
operation without the classic LC reconstruction filter when
the amp is driving an inductive load. Each output is switching from 0 volts to the supply voltage. The VOUTP and VOUTN
are in phase with each other with no input so that there is
little or no current in the speaker. The duty cycle of VOUTP is
greater than 50% and VOUTN is less than 50% for positive
output voltages. The duty cycle of VOUTP is less than 50%
and VOUTN is greater than 50% for negative output voltages.
The voltage across the load sits at 0V throughout most of
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
14
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APA2613
Function Description (Cont.)
Power Limit Operation (Cont.)
DC Detect
The PLIMIT circuit sets a limit on the output peak-to-peak
voltage. The limiting is done by limiting the duty cycle to
When a DC signal applies to the input of APA2613 and
the time excesses 500ms, the APA2613’s DC detect fault
fixed maximum value. This limit can be thought of as a
“virtual” voltage rail which is lower than the supply con-
will be reported on the FLAG pin as a low state. The DC
Detect fault will also cause the amplifier to shutdown by
nected to PVDD. This “virtual” rail is 5.6 times the voltage
at the PLIMIT pin. This output voltage can be used to
changing the state of the outputs to Hi-Z. To clear the DC
Detect it is necessary to cycle the PVDD supply. Cycling
calculate the maximum output power for a given maximum input voltage and speaker impedance.
SD will NOT clear a DC detect fault.
.
Over-Current Protection
APA2613 has protection from over-current conditions
VP = 5.6 × PLIMIT voltage if PLIMIT < 2.5 V
PVDD=12V, Rl=8Ω
PLIMIT
Voltage
1.05V
MAX Output Power @
THD+N=10%
2W
caused by a short circuit on the output stage. The short
circuit protection fault is reported on the FLAG pin as a
PVDD=12V, Rl=8 Ω
1.37V
3W
PVDD=12V, Rl=8 Ω
1.59V
4W
low state. The amplifier outputs are switched to a Hi-Z
state when the short circuit protection latch is engaged.
PVDD=12V, Rl=8 Ω
1.78V
5W
PVDD=12V, Rl=4 Ω
0.77V
2W
PVDD=12V, Rl=4 Ω
0.96V
3W
PVDD=12V, Rl=4 Ω
1.15V
4W
PVDD=12V, Rl=4 Ω
1.3V
5W
Test Conditions
The latch can be cleared by cycling the SD pin through
the low state.
Connect FLAG to SD pin, the over current protection will
be auto recovery.
Thermal Protection
Table2. PLIMIT Typical Operation
Thermal protection on the APA2613 prevents damage to
VCLAMP Supply
the device when the internal die temperature exceeds
150°C. There is a ±15°C tolerance on this trip point from
The VCLAMP is used to power the gates of the output full
bridge transistors. It can also be used to supply the PLIMIT
device to device. Once the die temperature exceeds the
thermal set point, the device enters into the shutdown
voltage divider circuit. Add a 1µF capacitor to ground at
this pin.
state and the outputs are disabled. This is not a latched
fault. The thermal fault is cleared once the temperature of
Stereo/mono switching Operation
the die is reduced by 15°C. The device begins normal
operation at this point with no external system interaction.
APA2613 offers the feature of Stereo operation with two
outputs of each channel connected directly. If the MONO
pin (pin 14) is tied high, the positive and negative outputs
of each channel (left and right) are synchronized and in
Thermal protection faults are NOT reported on the
FLAG terminal.
phase. To operate in this mono mode, apply the input
signal to the RIGHT input and place the speaker between
the LEFT and RIGHT outputs. Connect the positive and
negative output together for best efficiency.
MONO mode can increase more output power compare
to the stereo mode single channel’s output power.
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
15
www.anpec.com.tw
APA2613
Application Information
Input Resistance, Ri
A ferrite bead may need if it’s failing the test for FCC or CE
tested without the LC filter. The figure 2 is the sample for
Changing the gain setting can vary the input resistance
of the amplifier from its smallest value, 9 kΩ ±20%, to the
added ferrite bead; the ferrite show choosing high impedance in high frequency.
largest value, 60 kΩ ±20%. As a result, if a single capacitor is used in the input high-pass filter, the -3 dB or cutoff
frequency may change when changing gain steps.
Ferrite
OUTP Bead
Input Capacitor, Ci
1nF
In the typical application, an input capacitor Ci is required
to allow the amplifier to bias the input signal to the proper
Ferrite
OUTN Bead
dc level for optimum operation. In this case, Ci and the
input impedance of the amplifier (RI) form a high-pass
4Ω
1nF
filter with the corner frequency determined in Equation 1.
fC(hipass ) =
1
2πRiCi
(1)
Figure 3. Ferrite Bead Output Filter
The value of CI is important, as it directly affects the bass
(low-frequency) performance of the circuit. Consider the
Figure 4 and Figure 5 are examples for added the LC
filter (Butterworth), it’s recommended for the situation that
the trace form amplifier to speaker is too long, and needs
example where RI is 60 kΩ and the specification calls for
a flat bass response down to 20 Hz. Equation 1 is
to eliminate the radiated emission or EMI.
reconfigured as Equation 2.
Ci =
1
2πRi fc
(2)
In this example, CI is 0.13 µF; so, one would likely choose
a value of 0.15 µF as this value is commonly used. If the
OUTP
33µH
1µF
gain is known and is constant, use RI from Table 1 to
calculate CI. A further consideration for this capacitor is
OUTN 33µH
the leakage path from the input source through the input
network CI and the feedback network to the load. This
8Ω
1µF
leakage current creates a dc offset voltage at the input to
the amplifier that reduces useful headroom, especially
Figure 4. Typical LC Output Filter, Cutoff Frequency of
27 kHz, Speaker Impedance = 8Ω
in high gain applications. For this reason, a low-leakage
tantalum or ceramic capacitor is the best choice. When
polarized capacitors are used, the positive side of the
capacitor should face the amplifier input in most applications as the dc level there is held at V
/2, which is
CLAMP
likely higher than the source dc level. Note that it is impor-
OUTP
2.2µF
tant to confirm the capacitor polarity in the application.
Additionally, lead-free solder can create dc offset volt-
OUTN 15µH
ages and it is important to ensure that boards are cleaned
properly.
4Ω
2.2µF
Output Low-Pass Filter
If the traces form APA2613 to speaker are short, it doesn’t
require output filter for FCC & CE standard.
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
15µH
Figure 5. Typical LC Output Filter, Cutoff Frequency of
27 kHz, Speaker Impedance = 4Ω
16
www.anpec.com.tw
APA2613
Application Information (Cont.)
1.The high frequency decoupling capacitors should be
Power-Supply Decoupling Capacitor, CS
placed as close to the PVDD and AVDD terminals as
possible. Large (100µF or greater) bulk power supply
The APA2613 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to
decoupling capacitors should be placed near the
APA2613 on the LPVDD and RPVDD supplies. Local,
ensure the output total harmonic distortion (THD) is as
low as possible. Power supply decoupling also prevents
high-frequency bypass capacitors should be placed
as close to the PVDD pins as possible. These caps
the oscillations being caused by long lead length between the amplifier and the speaker.
can be connected to the thermal pad directly for an
excellent ground connection. Consider adding a small,
The optimum decoupling is achieved by using two different types of capacitors that target on different types of
good quality low ESR ceramic capacitor between 1000
pF and 10nF and a larger mid-frequency cap of value
noise on the power supply leads. For higher frequency
transients, spikes, or digital hash on the line, a good low
between 0.1µF and 1µF also of good quality to the PVDD
connections at each end of the chip.
equivalent-series-resistance (ESR) ceramic capacitor,
typically 1µF placed as close as possible to the device
2.Keep the current loop from each of the outputs through
the ferrite bead and the small filter cap and back to
AVDD pin .
PGND as small and tight as possible. The size of this
current loop determines its effectiveness as an
BSN and BSP Capactiors
The full H-bridge output stages use only NMOS
transistors. Therefore, they require bootstrap capacitors
antenna.
3.Grounding— The AVDD (pin 7) decoupling capacitor
for the high side of each output to turn on correctly. A 0.
22µF ceramic capacitor, rated for at least 25 V, must be
should be grounded to analog ground (AGND). The
PVDD decoupling capacitors should connect to PGND.
connected from each output to its corresponding bootstrap input. Specifically, one 0.22µF capacitor must be
connected from OUTP to BSP, and one 0.22µF capacitor
Analog ground and power ground should be connected
at the thermal pad, which should be used as a central
ground connection or star ground for the APA2613.
must be connected from OUTN to BSN.
The bootstrap capacitors connected between the BSP or
4.Output filter— The ferrite EMI filter (Figure 3) should be
placed as close to the output terminals as possible for
BSN pins and corresponding output function as a floating power supply for the high-side N-channel power
the best EMI performance. The LC filter (Figure 4 and
Figure 5) should be placed close to the outputs. The
MOSFET gate drive circuitry. During each high-side switching cycle, the bootstrap capacitors hold the gate-to-source
capacitors used in both the ferrite and LC filters should
be grounded to power ground.
voltage high enough to keep the high-side MOSFETs
turned on.
5.Thermal Pad— The thermal pad must be soldered to
the PCB for proper thermal performance and optimal
reliability. The dimensions of the thermal pad and thermal land should be 6.46 mm by 2.35mm. Seven rows
Layout Recommendation
of solid vias (three vias per row, 0,3302 mm or 13 mils
diameter) should be equally spaced underneath the
The APA2613 can be used with a small, inexpensive ferrite bead output filter for most applications. However,
since the Class-D switching edges are fast, it is neces-
thermal land. The vias should connect to a solid copper plane, either on an internal layer or on the bottom
sary to take care when planning the layout of the printed
circuit board. The following suggestions will help to meet
layer of the PCB. The vias must be solid vias, not thermal relief or webbed vias.
EMC requirements.
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
17
www.anpec.com.tw
APA2613
Package Information
TSSOP-28P
D
SEE VIEW A
E2
EXPOS
ED PAD
E1
E
D1
c
0.25
b
S
Y
M
B
O
L
VIEW A
L
GAUGE PLANE
SEATING PLANE
0
A1
A2
A
e
TSSOP-28P
INCHES
MILLIMETERS
MIN.
MAX.
A
MIN.
MAX.
1.20
0.047
A1
0.05
0.15
0.002
0.006
A2
0.80
1.05
0.031
0.041
b
0.19
0.30
0.007
0.012
0.008
c
0.09
0.20
0.004
D
9.60
9.80
0.378
0.386
D1
4.50
6.00
0.177
0.236
0.260
E
6.20
6.60
0.244
E1
4.30
4.50
0.169
0.177
E2
2.50
3.50
0.098
0.138
0.75
0.018
8o
0o
e
0.65 BSC
L
0.45
0
0o
0.026 BSC
0.030
8o
Note : 1. Followed from JEDEC MO-153 AET.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
18
www.anpec.com.tw
APA2613
Package Information
QFN4x4-28
D
b
E
A
Pin 1
A1
A3
D2
L K
E2
Pin 1 Corner
e
S
Y
M
B
O
L
A
A1
QFN4x4-28
MILLIMETERS
INCHES
MIN.
MAX.
0.80
0.00
A3
MIN.
MAX.
1.00
0.031
0.039
0.05
0.000
0.002
0.008 REF
0.20 REF
b
0.17
0.27
0.007
0.011
D
3.90
4.10
0.154
0.161
D2
2.10
2.50
0.083
0.098
E
3.90
4.10
0.154
0.161
E2
2.10
2.50
0.083
0.098
0.45
0.014
e
0.45 BSC
L
0.35
K
0.20
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
0.016 BSC
0.018
0.008
19
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APA2613
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
QFN4x4-28
A
H
T1
C
d
D
W
E1
F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
4.30±0.20
4.30±0.20
1.30±0.20
(mm)
Devices Per Unit
Package Type
QFN4x4-28
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
Unit
Tape & Reel
Quantity
3000
20
www.anpec.com.tw
APA2613
Carrier Tape & Reel Dimensions
P1
P2
P0
D0
B0
W
F
E1
A
D1
K0
A0
B
A
B
SECTION A-A
SECTION B-B
H
A
d
T1
Application
TSSOP-28P
A
H
T1
C
d
D
W
E1
F
330.0±2.00
50 MIN.
16.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
16.0±0.30
1.75±0.10
7.50±0.10
P0
P1
P2
D0
D1
T
A0
B0
K0
4.00±0.10
12.00±0.10
2.00±0.10
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.9±0.20 10.20.±0.20
1.50±0.20
(mm)
Devices Per Unit
Package Type
TSSOP-28P
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
Unit
Tape & Reel
Quantity
2000
21
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APA2613
Taping Direction Information
TSSOP-28P
USER DIRECTION OF FEED
QFN4x4-28
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
22
www.anpec.com.tw
APA2613
Classification Profile
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
23
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APA2613
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3 °C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
3
Package
Thickness
<2.5 mm
Volume mm
<350
235 °C
Volume mm
≥350
220 °C
≥2.5 mm
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
24
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
www.anpec.com.tw
APA2613
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.5 - Jul., 2012
25
www.anpec.com.tw
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