ASM3P18S19B August 2005 rev 2.1 Notebook LCD Panel EMI Reduction IC Features allows significant system cost savings by reducing the FCC approved method of EMI attenuation. number of circuit board layers, ferrite beads, shielding, and Provides up to 15dB EMI reduction. other passive components that are traditionally required to Generates a low EMI Spread Spectrum clock and a pass EMI regulations. non-spread reference clock of the input frequency. Optimized for Frequency range from 20 to 40MHz. The ASM3P18S19B modulates the output of a single PLL Internal loop filter minimizes external components and in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its board space. Low Inherent Cycle-to-Cycle jitter. harmonics. This results in significantly lower system EMI Two spread % selections: -1.25% to -1.75%. compared to the typical narrow band signal produced by 3.3V Operating Voltage. oscillators and most frequency generators. Lowering EMI Low power CMOS design. by increasing a signal’s bandwidth is called ‘Spread Supports notebook VGA and other LCD timing Spectrum Clock Generation’. controller applications. Power Down function for mobile application. The ASM3P18S19B uses the most efficient and optimized Available in Commercial temperature range. modulation Available in 8-pin SOIC and TSSOP Packages. implemented in a proprietary all digital method. RoHS Compliant profile approved by the FCC and is Applications Product Description The ASM3P18S19B is targeted towards EMI management The ASM3P18S19B is a Versatile Spread Spectrum for memory and LVDS interfaces in mobile graphic chipsets Frequency Modulator designed specifically for input clock and high-speed digital applications such as PC peripheral frequencies from 20 to 40MHz. (Refer Input Frequency and devices, consumer electronics, and embedded controller Modulation Rate Table). The ASM3P18S19B reduces systems. electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of down stream clock and data dependent signals. The ASM3P18S19B Block Diagram PD# VDD SRS PLL Modulation XIN/CLKIN XOUT Crystal Oscillator Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider ModOUT REF VSS Alliance Semiconductor 2575 Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com Notice: The information in this document is subject to change without notice. ASM3P18S19B August 2005 rev 2.1 Pin Configuration XIN/ CLKIN 1 8 XOUT 7 VDD VSS 2 SRS 3 6 PD# ModOUT 4 5 REF ASM3P18S19B Pin Description Pin# Pin Name Type Description 1 XIN / CLKIN I Crystal Connection or external frequency input.This pin has dual functions. It can be connected to either an external crystal or an external reference clock 2 VSS P Ground Connection. Connect to system ground. 3 SRS I 4 ModOUT O 5 REF O Non-modulated Reference clock output of the input frequency. 6 PD# I Power down control pin. Pull LOW to enable Power-Down mode. This pin has an internal pull-up resistor. 7 VDD P Power Supply for the entire chip. 8 XOUT O Crystal Connection. Input connection for an external crystal. If using an external reference, this pin must be left unconnected. Spread range select. Digital logic input used to select frequency deviation (Refer Spread Deviation Selection Table). This pin has an internal pull-up resistor. Spread spectrum clock output. (Refer Input Frequency and Modulation Rate Table and Spread Deviation Selection Table) Input Frequency and Modulation Rate Part Number Input Frequency Range Output Frequency range Modulation rate ASM3P18S19B 20MHz to 40MHz 20MHz to 40MHz Input Frequency / 512 Spread Deviation Selection Part Number ASM3P18S19B SRS Spread Deviation 0 -1.25% (DOWN) 1 -1.75% (DOWN) Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 7 ASM3P18S19B August 2005 rev 2.1 Absolute Maximum Ratings Symbol VDD, VIN TSTG Parameter Rating Unit Voltage on any pin with respect to Ground -0.5 to +7.0 V Storage temperature -65 to +125 °C 0 to 70 °C TA Operating temperature Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. DC Electrical Characteristics (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated) Symbol Parameter Min Typ Max Unit VIL Input Low voltage VSS - 0.3 - 0.8 V VIH Input High voltage 2.0 - VDD + 0.3 V IIL Input Low current (inputs PD#, SRS) -60.0 - -20.0 µA IIH Input High current - - 1.0 µA IXOL XOUT Output low current @ 0.4V, VDD = 3.3V - 3 - mA IXOH XOUT Output high current @ 2.5V, VDD = 3.3V - 3 - mA VOL Output Low voltage VDD = 3.3V, IOL = 20mA - - 0.4 V VOH Output High voltage VDD = 3.3V, IOH = 20mA 2.5 - - V ICC Dynamic supply current normal mode 3.3V and 25pF probe loading 7.1 fIN - min - 26.9 fIN - max mA IDD Static supply current standby mode - 4.5 - mA VDD Operating Voltage - 3.3 - V tON Power up time (first locked clock cycle after power up) - 0.18 - mS ZOUT Clock Output impedance - 50 - Ω AC Electrical Characteristics Symbol Parameter Min Typ Max Unit fIN Input Frequency 20 - 40 MHz fOUT Output Frequency 20 - 40 MHz tLH* Output Rise time Measured from 0.8V to 2.0V - 0.66 - nS tHL* Output Fall time Measured from 0.8V to 2.0V - 0.65 - nS tJC Jitter (Cycle to Cycle) -200 - 200 pS tD Output Duty cycle 45 50 55 % *tLH and tHL are measured into a capacitive load of 15pF Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 7 ASM3P18S19B August 2005 rev 2.1 Package Information 8-lead (150-mil) SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.01 0.18 0.25 D 0.193 BSC 4.9 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters SOIC – 0.074 grams unit weight Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 7 ASM3P18S19B August 2005 rev 2.1 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 C 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters TSSOP – 0.0325 grams unit weight Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 7 ASM3P18S19B August 2005 rev 2.1 Ordering Information Part Number Marking Package Type Temperature ASM3P18S19BF-08TT 3P18S19BF 8-Pin TSSOP, TUBE, RoHS Compliant Commercial ASM3P18S19BF-08TR 3P18S19BF 8-Pin TSSOP, TAPE & REEL ,RoHS Compliant Commercial ASM3P18S19BF-08ST 3P18S19BF 8-Pin SOIC, TUBE, RoHS Compliant Commercial ASM3P18S19BF-08SR 3P18S19BF 8-Pin SOIC, TAPE & REEL, RoHS Compliant Commercial ASM3P18S19B-08TT 3P18S19B 8-Pin TSSOP, TUBE Commercial ASM3P18S19B-08TR 3P18S19B 8-Pin TSSOP, TAPE & REEL Commercial ASM3P18S19B-08ST 3P18S19B 8-Pin SOIC, TUBE Commercial ASM3P18S19B-08SR 3P18S19B 8-Pin SOIC, TAPE & REEL Commercial ASM3P18S19BG-08TT 3P18S19BG 8-Pin TSSOP, TUBE, Green Commercial ASM3P18S19BG-08TR 3P18S19BG 8-Pin TSSOP, TAPE & REEL, Green Commercial ASM3P18S19BG-08ST 3P18S19BG 8-Pin SOIC, TUBE, Green Commercial ASM3P18S19BG-08SR 3P18S19BG 8-Pin SOIC, TAPE & REEL, Green Commercial Products are available for industrial temperature range operation. Please contact factory for more information. Device Ordering Information A S M 3 P 1 8 S 1 9 B F - 0 8 T R R = Tape & reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 7 ASM3P18S19B August 2005 rev 2.1 Alliance Semiconductor Corporation 2575 Augustine Drive, Santa Clara, CA 95054 Tel# 408-855-4900 Fax: 408-855-4999 www.alsc.com Copyright © Alliance Semiconductor All Rights Reserved Preliminary Information Part Number: ASM3P18S19B Document Version: v2.1 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003 © Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance). All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use. Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 7