Microsemi APT60S20B2CTG High voltage schottky diode Datasheet

1
3
T-
Ma
2
1 - Anode 1
2 - Common Cathode
Back of Case - Cathode
3 - Anode 2
x
APT60S20B2CT(G) 200V 2X75A
1
*G Denotes RoHS Compliant, Pb Free Terminal Finish.
2
3
HIGH VOLTAGE SCHOTTKY DIODE
PRODUCT APPLICATIONS
PRODUCT FEATURES
PRODUCT BENEFITS
• Parallel Diode
• Ultrafast Recovery Times
• Low Losses
• Soft Recovery Characteristics
• Low Noise Switching
• Popular T-MAX™ Package
• Cooler Operation
• Low Forward Voltage
• Higher Reliability Systems
• High Blocking Voltage
• Increased System Power
•
•
•
•
•
-Switchmode Power Supply
-Inverters
Free Wheeling Diode
-Motor Controllers
-Converters
Snubber Diode
Uninterruptible Power Supply (UPS)
48 Volt Output Rectifiers
High Speed Rectifiers
• Low Leakage Current
MAXIMUM RATINGS
Symbol
VR
All Ratings Are Per Leg: TC = 25°C unless otherwise specified.
Characteristic / Test Conditions
APT60S20B2CT(G)
Maximum Peak Repetitive Reverse Voltage
VRWM
Maximum Working Peak Reverse Voltage
IF(AV)
Maximum Average Forward Current (TC = 123°C, Duty Cycle = 0.5)
IFSM
TJ,TSTG
UNIT
Maximum D.C. Reverse Voltage
VRRM
IF(RMS)
Density
200
Volts
75
RMS Forward Current (Square wave, 50% duty)
208
Non-Repetitive Forward Surge Current (TJ = 45°C, 8.3ms)
600
Amps
-55 to 150
Operating and StorageTemperature Range
TL
Lead Temperature for 10 Sec.
300
EVAL
Avalanche Energy (2A, 30mH)
60
°C
mJ
STATIC ELECTRICAL CHARACTERISTICS
MAX
IF = 60A
.83
.90
Forward Voltage
IF = 120A
.98
IF = 60A, TJ = 125°C
.72
IRM
Maximum Reverse Leakage Current
CT
Junction Capacitance, VR = 200V
VR = 200V
Microsemi Website - http://www.microsemi.com
Volts
1
VR = 200V, TJ = 125°C
25
300
UNIT
mA
pF
7-2006
VF
TYP
MIN
053-6043 Rev C
Symbol
APT60S20B2CT(G)
DYNAMIC CHARACTERISTICS
Characteristic
Symbol
Test Conditions
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
MIN
TYP
-
55
ns
-
160
nC
-
5
-
100
ns
-
490
nC
-
10
-
80
ns
-
1100
nC
-
27
Amps
MIN
TYP
IF = 60A, diF/dt = -200A/µs
VR = 133V, TC = 25°C
Maximum Reverse Recovery Current
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
IF = 60A, diF/dt = -200A/µs
VR = 133V, TC = 125°C
Maximum Reverse Recovery Current
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
IF = 60A, diF/dt = -700A/µs
VR = 133V, TC = 125°C
Maximum Reverse Recovery Current
MAX
-
-
UNIT
Amps
Amps
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol
Characteristic / Test Conditions
MAX
RθJC
Junction-to-Case Thermal Resistance
.30
RθJA
Junction-to-Ambient Thermal Resistance
40
WT
Package Weight
oz
5.9
g
D = 0.9
0.25
0.7
0.20
0.5
PDM
0.3
0.10
0.05
0
Note:
t2
SINGLE PULSE
0.1
Peak TJ = PDM x ZθJC + TC
0.05
10-5
10-4
10-3
10-2
10-1
1.0
RECTANGULAR PULSE DURATION (seconds)
FIGURE 1a. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION
7-2006
TJ ( C)
053-6043 Rev C
t1
Duty Factor D = t1/t2
TC ( C)
0.0218
0.119
0.160
Dissipated Power
(Watts)
0.00450
0.0119
ZEXT
Z JC, THERMAL IMPEDANCE (°C/W)
θ
0.35
0.15
0.121
ZEXT are the external thermal
impedances: Case to sink,
sink to ambient, etc. Set to
zero when modeling only
the case to junction.
FIGURE 1b, TRANSIENT THERMAL IMPEDANCE MODEL
°C/W
0.22
Microsemi reserves the right to change, without notice, the specifications and information contained herein.
0.30
UNIT
TYPICAL PERFORMANCE CURVES
200
TJ = 25°C
140
120
100
80
60
TJ = 125°C
40
0
0
1400
120A
1000
60A
800
600
400
30A
200
20
1.2
60A
15
10
30A
5
Duty cycle = 0.5
TJ = 150°C
150
100
0.4
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6. Dynamic Parameters vs. Junction Temperature
0
75
100
125
150
Case Temperature (°C)
Figure 7. Maximum Average Forward Current vs. CaseTemperature
100
3000
50
PEAK AVALANCHE CURRENT
(A)
3500
2500
2000
1500
1000
25
50
10
5
7-2006
0.0
Lead Temperature
Limited
50
0.2
CJ, JUNCTION CAPACITANCE
(pF)
20
200
Qrr
t rr
0.6
120A
25
250
IF(AV) (A)
I RRM
30
0
200
400
600
800
-diF /dt, CURRENT RATE OF CHANGE (A/µs)
Figure 5. Reverse Recovery Current vs. Current Rate of Change
t rr
Qrr
1.0
TJ = 125°C
VR = 133V
0
200
400
600
800
-diF /dt, CURRENT RATE OF CHANGE (A/µs)
Figure 4. Reverse Recovery Charge vs. Current Rate of Change
Kf, DYNAMIC PARAMETERS
(Normalized to 700A/µs)
40
0
200
400
600
800
-diF /dt, CURRENT RATE OF CHANGE(A/µs)
Figure 3. Reverse Recovery Time vs. Current Rate of Change
0
0.8
30A
35
1200
0
60
0
0.2
0.4
0.6
0.8
1
1.2
VF, ANODE-TO-CATHODE VOLTAGE (V)
Figure 2. Forward Current vs. Forward Voltage
TJ = 125°C
VR = 133V
1600
60A
50
0
1
10
100 200
VR, REVERSE VOLTAGE (V)
Figure 8. Junction Capacitance vs. Reverse Voltage
1
1
10
100
1000 2200
Time in Avalanche (µs)
Figure 9. Single Pulse UIS SOA
053-6043 Rev C
Qrr, REVERSE RECOVERY CHARGE
(nC)
1800
120A
80
TJ = 150°C
20
TJ = 125°C
VR = 133V
100
IRRM, REVERSE RECOVERY CURRENT
(A)
IF, FORWARD CURRENT
(A)
160
trr, REVERSE RECOVERY TIME
(ns)
TJ = -55°C
180
APT60S20B2CT(G)
120
APT60S20B2CT(G)
Vr
diF /dt Adjust
+18V
APT20M36BLL
0V
D.U.T.
30µH
trr/Qrr
Waveform
PEARSON 2878
CURRENT
TRANSFORMER
Figure 9. Diode Test Circuit
1
IF - Forward Conduction Current
2
diF /dt - Rate of Diode Current Change Through Zero Crossing.
3
IRRM - Maximum Reverse Recovery Current.
4
trr - Reverse Recovery Time, measured from zero crossing where diode
current goes from positive to negative, to the point at which the straight
line through IRRM and 0.25 IRRM passes through zero.
5
1
4
Zero
5
3
2
Qrr - Area Under the Curve Defined by IRRM and trr.
Figure 10, Diode Reverse Recovery Waveform and Definitions
T-MAXTM (B2) Package Outline
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
e1 SAC: Tin, Silver, Copper
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
Common Cathode
20.80 (.819)
21.46 (.845)
4.50 (.177) Max.
19.81 (.780)
20.32 (.800)
1.65 (.065)
2.13 (.084)
1.01 (.040)
1.40 (.055)
053-6043 Rev C
7-2006
0.40 (.016)
0.79 (.031)
2.21 (.087)
2.59 (.102)
2.87 (.113)
3.12 (.123)
5.45 (.215) BSC
2-Plcs.
Dimensions in Millimeters and (Inches)
Anode 1
Common Cathode
Anode 2
0.25 IRRM
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