CC3000MOD www.ti.com SWRS126 – NOVEMBER 2012 TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor FEATURES 1 • Wireless network processor – IEEE 802.11 b/g – Embedded IPv4 TCP/IP stack • Best-in-class radio performance Wi-Fi™ – TX power: +18.0 dBm at 11 Mbps, CCK – RX sensitivity: –88 dBm, 8% PER, 11 Mbps • Works with low MIPS and low-cost MCUs with compact memory footprint • FCC, IC, and CE certified with a chip antenna • HW design files and design guide available from TI • Integrated crystal and power management • Small form factor: 16.3 mm × 13.5 mm × 2 mm 234 • • • Operating temperature: –20°C to 70°C Based on TI's seventh generation of proven Wi-Fi solutions Complete platform solution including user and porting guides, API guide, sample applications, and support community APPLICATIONS • • • • • Home automation Home security Connected appliances Smart energy M2M communication DESCRIPTION The TI CC3000 module is a self-contained wireless network processor that simplifies the implementation of Internet connectivity (see Figure 1). TI's SimpleLink™ Wi-Fi solution minimizes the software requirements of the host microcontroller (MCU) and is thus the ideal solution for embedded applications using any low-cost and lowpower MCU. The TI CC3000 module reduces development time, lowers manufacturing costs, saves board space, eases certification, and minimizes the RF expertise required. This complete platform solution includes software drivers, sample applications, API guide, user documentation, and a world-class support community. For more information on TI’s wireless platform solutions for Wi-Fi, go to TI's Wireless Connectivity wiki (www.ti.com/connectivitywiki). SWRS126-013 Figure 1. Wi-Fi Solution for TI SimpleLink CC3000 Module 1 2 3 4 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SimpleLink, Smart Config are trademarks of Texas Instruments. Wi-Fi is a trademark of Wi-Fi Alliance. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated CC3000MOD SWRS126 – NOVEMBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. FEATURES WLAN • • • • • 802.11b/g integrated radio, modem, and MAC supporting WLAN communication as a BSS station with CCK and OFDM rates from 1 to 54 Mbps in the 2.4-GHz ISM band Auto-calibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna without requiring expertise in radio circuit design. Advanced connection manager with seven user-configurable profiles stored in an NVMEM allows automatic fast connection to an access point without user or host intervention. Supports all Wi-Fi security modes for personal networks: WEP, WPA, and WPA2 with on-chip security accelerators Smart Config™ WLAN provisioning tools allow customers to connect a headless device to a WLAN network using a smart phone, tablet, or PC. Network Stack • Integrated IPv4 TCP/IP stack with BSD socket APIs enables simple internet connectivity with any microcontroller, microprocessor, or ASIC. • Supports four simultaneous TCP or UDP sockets • Built-in network protocols: ARP, ICMP, DHCP client, and DNS client enable easy connection to the local network and to the Internet. Host Interface and Driver • Interfaces over 4-wire serial peripheral interface (SPI) with any microcontroller, or processor at clock speed up to16 MHz • Low footprint driver provided for TI MCUs and easily ported to any processor or ASIC • Simple APIs enable easy integration with any single-threaded or multi-threaded application. System • Works from a single, preregulated power supply or connects directly to a battery • Separated I/O voltage rail allows flexible integration with host processors • Ultra-low leakage shut-down mode with current <5 µA • Integrated clock sources EEPROM • Integrated EEPROM stores firmware patch, network configuration, and MAC address. • Programmable through an I2C interface or over APIs from the host, allowing over-the-air firmware upgrades • Can store 5 KB of user data accessible to the host application, enhancing the MCU NVM 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated CC3000MOD www.ti.com SWRS126 – NOVEMBER 2012 PACKAGE INFORMATION Module Outline For the PCB layout of your applications, TI recommends the footprint shown in Figure 2. 13.5000 Unit: mm 0.5000 0.7000 36 43 1.2000 2.1000 29 46 PIN-1 28 1.9000 1.9000 37 40 38 41 39 42 0.3000 1.7000 16.3000 1.9000 2.4000 1.9000 1.9000 19 10 2.1000 1.2000 44 45 18 11 0.7000 1.2000 SWRS126-002 Figure 2. CC3000 Module Footprint and Pinouts Pin Description Table 1 describes the CC3000 module pins. Table 1. CC3000 Module Pins Description Pin Signal Name Type State at Reset State After Reset 1 GND GND — — — 2 Reserved_1 — — — 1.8 V 3 NC — — — — 4 Reserved_2 — — — 1.8 V 5 WL_EN2 (1) I Hi-Z — — O Hi-Z Force 1 1.8 V I Hi-Z — — I Hi-Z PU 1.8 V 6 7 8 (1) (2) WL_RS232_TX (2) WL_EN1 WL_RS232_RX (2) Voltage Level Description Ground Reserved. Connect to test point. Not connected Reserved. Connect to test point. Mode setting RS232 test-mode signal (1.8-V logic). Connect to test point. Serial connection for CC3000 radio tool. Mode setting RS232 test-mode signal (1.8-V logic). Connect to test point. Serial connection for CC3000 radio tool. 9 GND GND — — — Ground 10 GND GND — — — Ground 11 GND GND — — — Ground 12 SPI_CS I Hi-Z PU VIO_HOST Host interface SPI chip-select (CS) 13 SPI_DOUT O Hi-Z PU VIO_HOST Host interface SPI data out 14 SPI_IRQ O Hi-Z Force 1 VIO_HOST Host interface SPI interrupt Connect WL_EN1 to WL_EL2 for proper operation of the module. Leave unconnected in function module. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 CC3000MOD SWRS126 – NOVEMBER 2012 www.ti.com Table 1. CC3000 Module Pins Description (continued) (3) (4) 4 Pin Signal Name Type State at Reset State After Reset Voltage Level 15 16 SPI_DIN I Hi-Z PU VIO_HOST GND GND — — — 17 SPI_CLK I Hi-Z PD VIO_HOST Description Host interface SPI data in Ground Host interface SPI clock 18 GND GND — — — 19 VBAT_IN Power — — VBAT 20 GND GND — — — Ground 21 EXT_32K — — — — Not used. Connect to ground. 22 GND GND — — — Ground 23 VIO_HOST Power — — VIO_HOST 24 Reserved 3 — — — — Reserved. Connect to test point. 25 GND GND — — — Ground 26 VBAT_SW_EN I — — VIO_HOST 27 SDA_EEPROM (3) I/O 1.8 V I2C data line from EEPROM (3) Ground Power supply input, 2.7 to 4.8 V VIO host supply voltage Module enable. Connect to host GPIO. 28 SDA_CC3000 I/O 1.8 V I2C data line from the CC3000 module 29 SCL_EEPROM (4) I/O 1.8 V I2C clock line from EEPROM 30 SCL_CC3000 (4) I/O 1.8 V I2C clock line from the CC3000 module 31 GND GND — — — Ground 32 GND GND — — — Ground 33 GND GND — — — Ground 34 GND GND — — — Ground 35 RF_ANT RF — — — WLAN antenna port, 50-Ω single 36 GND GND — — — Ground 37 GND GND — — — Ground 38 GND GND — — — Ground 39 GND GND — — — Ground 40 GND GND — — — Ground 41 GND GND — — — Ground 42 GND GND — — — Ground 43 GND GND — — — Ground 44 GND GND — — — Ground 45 GND GND — — — Ground 46 GND GND — — — Ground Connect SDA_EEPROM and SDA_CC3000 through a 0-Ω resistor. Connect SLC_EEPROM and SLC_CC3000 through a 0-Ω resistor. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated CC3000MOD www.ti.com SWRS126 – NOVEMBER 2012 ESD PERFORMANCE Because electrostatic discharge (ESD) can damage this integrated circuit, TI recommends handling all integrated circuits (ICs) with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision ICs can be more susceptible to damage because very small parametric changes can cause devices not to meet their published specifications. Table 2 describes the ESD performance. Table 2. ESD Performance HDM (1) CDM (2) 1000 V (1) (2) 500 V JEDEC ESD HBM spec JS-001-2012 JEDEC ESD CDM spec 22C101E space MODULE SPECIFICATIONS Absolute Maximum Ratings Parameters VBAT_IN VIO_HOST Pin Min Max Unit 19 –0.5 +6.0 V 23 –0.5 +4.6 V I2C and WL_RS232 27, 28, 29, 30, 6, 8 –0.5 +2.1 V SPI interface 12, 13, 14, 15, 17 –0.5 +4.6 V VBAT_SW_EN 26 –0.3 +6.0 V Storage temperature range – –40 +85 °C Recommended Operating Conditions Min Max Unit Operating ambient temperature Rating Condition Sym –20 +70 °C VBAT_IN 2.7 4.8 V VIO_HOST supply voltage 1.8 3.6 V SPI interface High-level input voltage VIO_HOST = 1.8 to 1.95 V VIH 1.95 to 2.7 V VIO_HOST = 1.8 to 1.95 V 2 VIL VIO_HOST × 0.35 1.95 to 2.7 V Output voltage Active state Input transition rise or fall rate V 0.7 2.7 to 3.6 V Input voltage V 1.6 2.7 to 3.6 V Low-level input voltage VIO_HOST x 0.65 0.8 VI 0 3.6 VO 0 VIO_HOST V 5 ns/V △t/△v V VBAT SW EN High-level input voltage VIH 1.1 5.5 V Low-level input voltage VIL 0 0.4 V Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 5 CC3000MOD SWRS126 – NOVEMBER 2012 www.ti.com Power Consumption Parameters Typ Max Unit 802.11b TX current VBAT = 3.6 V Tamb = +25°C Po = 18 dBm, 11 Mbps L = 2048 bytes tdelay (idle) = 40 µs 260 275 mA 802.11g TX current VBAT = 3.6 V Tamb = +25°C Po = 14 dBm, 54 Mbps L = 2048 tdelay (idle) = 40 µs 190 207 mA VBAT = 3.6 V 92 103 mA 5 µA 802.11bg RX current Shut-down mode Test Conditions VBAT = 3.6 V VBAT_SW_EN = 0 V WLAN Transmitter RF Characteristics (TA = +25°C, VBAT = 3.6 V) Characteristics Condition (Mbps) Maximum RMS output power Min Typ 1 18.3 2 18.2 11 18.1 6 17.0 9 17.0 18 17.0 36 15.5 54 14.0 Max Unit dBm In-band power variation ±1 Transmit center frequency accuracy ±20 ppm Max Unit Receiver RF Characteristics (TA = +25°C, VBAT = 3.6 V) Characteristics Sensitivity Maximum input level 6 Condition (Mbps) Min Typ 1 DSSS –97.5 2 DSSS –95.0 11 CCK –89.0 6 OFDM –91.0 9 OFDM –91.0 18 OFDM –87.0 36 OFDM –81.0 54 OFDM –75.0 dBm 802.11b –10 802.11g –20 Submit Documentation Feedback dBm Copyright © 2012, Texas Instruments Incorporated CC3000MOD www.ti.com SWRS126 – NOVEMBER 2012 SPI HOST CONTROLLER INTERFACE The SPI is the primary host interface to the CC3000 module. The SPI interface contains the five-line, master and slave communication model shown in Figure 3. SPI_CLK SPI_CS SPI_IRQ SPI_DOUT MCU SPI master CC3000 SPI slave SPI_DIN SWRS126-016 Figure 3. SPI Host Connectivity Table 3 highlights the CC3000 SPI pin names and functions. Table 3. SPI Line Description Pin Name Description SPI_CLK Clock (0 to 16 MHz) from host to slave SPI_CS (1) CS (active low) signal from host to slave SPI_DIN (1) (2) Data from host to slave SPI_IRQ (2) Interrupt from slave to host SPI_DOUT Data from slave to host SPI_CS selects a CC3000 module, indicating that a master wants to communicate to the device. SPI_IRQ is a dual-purpose slave to the master direction line: in SPI IDLE state while no data transfer is active, driving SPI_IRQ low indicates to the master that the CC3000 module has data to pass to it; driving SPI_IRQ low following SPI_CS deassertion indicates that the CC3000 module is ready to receive data. SPI Timing Figure 4 shows the SPI timing sequence. Tclk Tp Host launch CC3000 capture CC3000 launch Host capture SPI_CLK (at device die) tis tin SPI_DIN (data from host to device) toh tos SPI_DOUT (data from device to host) SWRS126-004 Figure 4. SPI Timing Sequence Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 7 CC3000MOD SWRS126 – NOVEMBER 2012 www.ti.com Table 4 lists the SPI timing parameters. Table 4. SPI Timing Parameters Symbol (1) (2) (3) 8 Parameter (1) (2) Min Tclk Clock period 62.5 Tp High pulse width (including jitter and duty cycle) 25 (3) tis RX setup time; minimum time in which data is stable before capture edge 5 tih RX hold time; minimum time in which data is stable after capture edge 5 tos TX setup propagation time; maximum time from launch edge until data is stable toh TX hold propagation time; minimum time of data stable after launch edge CL Capacitive load on interface Max Unit ns 37.5 (3) ns ns 10.2 3 20 pF The SPI_CS signal is considered to be asynchronous. In this example, launch is on the rising edge, and capture is on the falling edge. The opposite scheme can be configured. 40% to 60% DC (valid for the minimum clock period) Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated CC3000MOD www.ti.com SWRS126 – NOVEMBER 2012 POWER-UP SEQUENCE Figure 5 demonstrates the wake-up sequence of the CC3000 module. VBAT_IN VIO_HOST VBAT_SW_EN SPI_IRQ SPI_CS T0 T1 T2 SWRS126-005 Figure 5. CC3000 Module Power-On Sequences • • • NOTE VBAT_IN and VIO_HOST must be available before VBAT_SW_EN is asserted. At wake-up time (T1): The CC3000 module powers up after SPI_IRQ changes state to LOW. T1 is approximately 53 ms. At T2: The normal master SPI write sequence is SPI_CS low, followed by SPI_IRQ low (CC3000 host), indicating that the CC3000 core module is ready to accept data. T2 duration is approximately 7 ms. CC3000 Enable Pins Configuration Table 5 describes the CC3000 mode of operation based on the enable (EN) pins setting. Table 5. CC3000 EN Pins Configuration Mode Test mode (1) Functional mode (2) (1) (2) State WL_EN1: Leave disconnected. WL_EN2: Connect to ground. WL_EN1 and WL_EN2 are shorted together. For CC3000 radio tool operation For normal operation Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 9 CC3000MOD SWRS126 – NOVEMBER 2012 www.ti.com Test Mode Serial Interface The CC3000 module contains a dedicated WLAN serial interface to connect to the CC3000 radio tests tool, an external PC-based software test utility, during development and evaluation phase (see Figure 6 and Table 6). The CC3000 radio test tool utility can be obtained from the CC3000 TI wiki (www.ti.com/connectivitywiki). CC3000 USB cable USB to serial bridge PC 1.8 V WL_RS232_TX WL_EN2 WL_RS232_RX SWRS126-017 Figure 6. CC3000 Test Mode Serial Interface Connection Table 6. CC3000 Test Mode Debug Interface Description Signal Name WL_RS232_TX WL_RS232_RX (1) Function Connection with CC3000 radio PC-based software (1) WL_EN2 pins must be grounded while bringing up the CC3000 radio tool. SURFACE MOUNT INFORMATION The CC3000 module uses a flat shield cover designed for a fully automated assembly process. For baking and reflow recommendations, follow MSL level 4 found in the JEDEC/IPC Standard J-STD-20b. The classification temperature (TC) for the module is 250°C. MECHANICAL INFORMATION Module Mechanical Outline Figure 7 shows the mechanical outline for the CC3000 module. 13.50 2.00 16.30 TOP VIEW 16.30 SIDE VIEW CC3000MOD Module Size: 16.3 x 13.5 x 2.0 mm SWRS126-007 Figure 7. CC3000 Module Mechanical Outline 10 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated CC3000MOD www.ti.com SWRS126 – NOVEMBER 2012 Package Marking Figure 8 shows the CC3000 module package marking. CC3000MOD YYWWSSF 6.0 mm SWRS126-008 Figure 8. CC3000 Module Package Marking Table 7 defines the marking code. Table 7. Package Marking Definitions Code Definition YYWWSSF Date YY Year (for example, 2012 = 12) WW Week (01 through 53) SS Serial number from 01 to 99 to match manufacturer lot number F Reserved for internal use Ordering Information Table 8 lists the CC3000 module part numbers. Table 8. CC3000 Module Part Numbers Order Number CC3000MOD CC3000MODR Copyright © 2012, Texas Instruments Incorporated Description CC3000 module, 44 modules per tray CC3000 module reel, 1200 modules per reel Submit Documentation Feedback 11 CC3000MOD SWRS126 – NOVEMBER 2012 www.ti.com REFERENCE SCHEMATICS AND BILL OF MATERIALS Figure 9 shows the schematics for the CC3000 to host reference design. ANT1 AT8010-E2R9HAA 8.0x1.0x1.0mm 1 C1 2.2pF CAP1005 2 L1 NL IND1005 The value of antenna matching components are match for CC3000MOD EM board L2 2.2nH IND1005 TI CC3000MOD Module Reference Design C2 10pF CAP1005 46 45 44 43 42 41 30 31 32 33 29 SCL_EEPROM SCL_CC3000 GND GND 34 26 GND 25 U1 5 WL_EN2 6 WL_RS232_TX CC3000MOD RESERVED_3 24 VIO_HOST 23 GND 22 WL_EN1 21 GND 20 10 GND VBAT_IN 19 R2 0R RES1005 Internal Power FET Switch Enable. Connect to Host GPIO. VBAT_SW_EN TP3 VIO_HOST VIO_HOST = level of the Host Interface. Voltage C4 1uF CAP1005 VBAT_IN VBAT_IN: 2.7V~4.8V => 3.6V TYP GND GND GND GND 37 38 39 40 GND C5 1uF CAP1005 18 17 11 SPI_CLK EXT_32K GND GND WL_RS232_RX 9 GND 8 16 TP5 GND VBAT_SW_EN RESERVED_2 7 TP4 and TP5 CC3000 Radio Tool Connection 1.8V. 35 NC 4 SPI_DIN TP4 3 15 R5 0R RES1005 SDA_EEPROM SPI_IRQ 0R NC RESERVED_1 27 SPI_DOUT NC 0R Test Mode for Radio Tool Operation TP2 28 GND 14 Function mode R4 NL RES1005 GND 36 R5 SDA_CC3000 2 SPI_CS R4 RF_ANT GND 1 TP1 Mode R1 0R RES1005 NL_10pF CAP1005 13 C3 12 2 1 3 J1 NL_U.FL-R-SMT(10) U.FL GND GND GND GND GND GND Optional for conductive measurment WL_SPI_CLK_HOST WL_SPI_DIN_HOST WL_SPI_IRQ_HOST WL_SPI_DOUT_HOST WL_SPI_CS_HOST Connect to Host SPI Interface. SWRS126-009 Figure 9. CC3000 Module to Host Reference Design NOTE For flexibility, VIO_HOST supports both cases in which the VBAT and VIO voltages of the MCU can be the same or different. Table 9 lists the bill of materials. Table 9. Bill of Materials Part Reference ANT1 C1 C0402, 2.2 pF Manufacturer PN ACX AT8010-E2R9HAA Walsin 0402N2R2C500LT Hl1005-1C2N2SMT L2 L0402, 2.2 nH ACX C0402, 10 pF Walsin 0402N100J500LT C4, C5 (1) C0402, 1 µF Murata GRM155R60J105KE19D R0402, 0R Walsin WR04X000PTL RF coaxial U.FL, SMD Hirose U.FL-R-SMT-1(10) J1 12 Manufacturer C2 (1) R1, R2, R5 (1) (1) Description 2.4-GHz chip antenna, 8.0 × 1.0 mm Any component with similar values can be used. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated CC3000MOD www.ti.com SWRS126 – NOVEMBER 2012 DESIGN RECOMMENDATIONS This section describes the layout recommendations for the CC3000 module, RF trace, and antenna. Antenna The ACX ceramic antenna is mounted on the CC3000 EVM board with a specific layout and matching circuit for the radiation test conducted in FCC, CE and IC certifications. Figure 10 shows the location of the antenna on the EVM board as well as the RF trace routing from the CC3000 module. No trace and Via stitching beside RF trace ground under Antenna on antenna section the edge of PCB Top layer Bottom layer Constant No sharp impedance for corner RF trace SWRS126-015 Figure 10. RF Trace and Antenna Design for PCB Layout Module Layout Recommendations Observe the following module layout recommendations (see also Figure 11): • Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. • Do not run signal traces underneath the module on a layer where the module is mounted. • Signal traces can be run on a third layer under the solid ground layer and beneath the module mounting layer. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 13 CC3000MOD SWRS126 – NOVEMBER 2012 www.ti.com Signal trace Solid ground plane and vias run on third layer No trace under module Top layer Bottom layer SWRS126-014 Figure 11. Module Layout RF Trace and Antenna Layout Recommendations Observe the following recommendations for RF trace and antenna layout (see also Figure 10): • RF traces must have 50-Ω impedance (microstrip transmission line). • RF trace bends must be gradual with a maximum bend of approximately 45 degrees and with trace mitered. RF traces must not have sharp corners. • There must be no traces or ground under the antenna section. • RF traces must have via stitching on the ground plane beside the RF trace on both sides. • RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. 14 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 13-Feb-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) CC3000MOD ACTIVE 46 84 TBD Call TI Call TI -20 to 70 CC3000MODR ACTIVE 46 1 TBD Call TI Call TI -20 to 70 XCC3000MOD PREVIEW 46 TBD Call TI Call TI -20 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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