TI BQ29413 Voltage protection for 2-, 3-, or 4-cell li-ion batteries (2nd-level protection) Datasheet

bq29410, bq29411, bq29412
bq29413, bq29414, bq29415
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SLUS669D – AUGUST 2005 – REVISED OCTOBER 2006
VOLTAGE PROTECTION FOR 2-, 3-, OR 4-CELL Li-Ion BATTERIES
(2nd-LEVEL PROTECTION)
FEATURES
•
•
•
•
•
•
2-, 3-, or 4-Cell Secondary Protection
Low Power Consumption ICC < 2 µA
[VCELL(ALL) < V(PROTECT)]
Fixed High Accuracy Overvoltage Protection
Threshold
– bq29410 = 4.35 V
– bq29411 = 4.40 V
– bq29412 = 4.45 V
– bq29413 = 4.50 V
– bq29414 = 4.55 V
– bq29415 = 4.60 V
Programmable Delay Time of Detection
High Power Supply Ripple Rejection
Stable During Pulse Charge Operation
FUNCTION
Each cell in a multiple-cell pack is compared to an
internal reference voltage. If one cell reaches an
overvoltage condition, the protection sequence
begins. The bq2941x device starts charging an
external capacitor through the CD pin. When the CD
pin voltage reaches 1.2 V, the OUT pin changes
from a low level to a high level.
DCT PACKAGE
(TOP VIEW)
OUT
VDD
CD
1
8
2
7
3
6
VC1
VC2
VC3
VC4
4
5
GND
PW PACKAGE
(TOP VIEW)
APPLICATIONS
•
2nd-Level Overvoltage Protection in Li-Ion
Battery Packs in:
– Notebook Computers
– Portable Instrumentation
– Portable Equipment
VC1
VC2
VC3
GND
1
2
3
4
8
7
6
5
OUT
VDD
CD
VC4
DESCRIPTION
The bq2941x is a secondary overvoltage protection
IC for 2-, 3-, or 4-cell lithium-ion battery packs that
incorporates a high-accuracy precision overvoltage
detection circuit. It includes a programmable delay
circuit for overvoltage detection time.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2006, Texas Instruments Incorporated
bq29410, bq29411, bq29412
bq29413, bq29414, bq29415
www.ti.com
SLUS669D – AUGUST 2005 – REVISED OCTOBER 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
TA
PACKAGE (3)
V(PROTECT) (2)
MSOP (DCT)
SYMBOL
SSOP (PW)
bq29410DCT3R
4.35 V
bq29410DCTR
CJG
bq29410PW
bq29410PWG4
bq29410PWR
bq29410PWRG4
CJH
bq29411PW
bq29411PWG4
bq29411PWR
bq29411PWRG4
CJJ
bq29412PW
bq29412PWG4
bq29412PWR
bq29412PWRG4
CJk
bq29413PW
bq29413PWR
CJL
bq29414PW (4)
bq29414PWR (4)
CJM
bq29415PW (4)
bq29415PWR (4)
bq29410DCTT
bq29411DCT3R
4.40 V
bq29411DCTR
bq29411DCTT
bq29412DCT3R
–40°C to 110°C
4.45 V
bq29412DCTR
bq29412DCTT
bq29413DCTR
4.50 V
4.55 V
4.60 V
(1)
(2)
(3)
(4)
bq29413DCTT
bq29414DCTR (4)
bq29414DCTT (4)
bq29415DCTR (4)
bq29415DCTT (4)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
Contact your local Texas Instruments representative or sales office for alternative overvoltage threshold options.
The "R" suffix indicates tape-and-reel packaging.
Product Preview
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1) (2)
UNIT
Supply voltage range
Input voltage range
Output voltage range
VDD
–0.3 V to 28 V
VC1, VC2, VC3, VC4
–0.3 V to 28 V
VC1 TO VC2, VC2 TO VC3, VC3 TO VC4, VC4 TO GND
–0.3 V to 8 V
OUT
–0.3 V to 28 V
CD
–0.3 V to 28 V
Continuous total power dissipation
See Dissipation Rating Table
Storage temperature range, Tstg
–65°C to 150°C
Lead temperature (soldering, 10 s)
(1)
(2)
300°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground of this device except the differential voltage of VC1-VC2, VC2-VC3, VC3-VC4, and VC4-GND.
PACKAGE DISSIPATION RATINGS
2
PACKAGE
TA = 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
DCT
412 mW
3.3 mW/°C
264 mW
214 mW
PW
525 mW
4.2 mW/°C
336 mW
273 mW
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SLUS669D – AUGUST 2005 – REVISED OCTOBER 2006
RECOMMENDED OPERATING CONDITIONS
MIN
VDD
Supply voltage
NOM
MAX
4
25
VC1, VC2, VC3, VC4
0
VDD
VCn – VC (n=1), (n=1, 2, 3), VC4 – GND
0
5
UNIT
V
VI
Input voltage range
td(CD)
Delay time capacitance
RIN
Voltage-monitor filter resistance
100
1k
Ω
CIN
Voltage-monitor filter capacitance
0.01
0.1
µF
RVD
Supply-voltage filter resistance
CVD
Supply-voltage filter capacitance
TA
Operating ambient temperature range
0.22
V
µF
0
1
0.1
kΩ
µF
–40
110
°C
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, TA = 25°C (unless otherwise noted)
PARAMETER
V(OA)
Overvoltage detection
accuracy
TEST CONDITION
MIN
NOM MAX
TA = 25°C
25
35
TA = –20°C to 85°C
25
50
TA = –40°C to 110°C
V(PROTECT)
Overvoltage
detection voltage (1)
bq29410
4.35
bq29411
4.40
bq29412
4.45
bq29413
4.50
bq29414
4.55
bq29415
4.60
Vhys
IIN
Input current
V2, V3 , VC4 input ,VDD = VC1
VC1 = VC2 = VC3 = VC4 = 3.5 V (see Figure 1)
tD1
Overvoltage detection delay
time
VDD = VC1, CD = 0.22 µF
1
1.5
I(CD_dis)
CD GND clamp current
VDD = VC1, CD = 1 V
5
12
Supply current
V(OUT)
OUT pin drive voltage
V
300
VDD = VC1,
VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V
(see Figure 1)
2
VDD = VC1,
VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 2.3 V
(see Figure 1)
1.5
mV
0.3
µA
2
S
µA
3
µA
VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND =
V(PROTECT)Max, VDD = VC1, IOH = 0 mA
2.5
7
V
VC1 = VC2 = VC3 = VC4 = V(PROTECT)Max,
VDD = 4.3 V, TA = 0°C to 70°C, IOH = 40 µA
1.5
–1
mA
5
µA
IOH
High-level output current
OUT = 3 V,
VC1 = VC2 = VC3 = VC4 = 4.7 V
IOL
Low-level output current
OUT = 0.1 V, VDD = VC1,
VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V
(1)
mV
80
Overvoltage detection
hysteresis (1)
ICC
UNIT
2
2.5
Levels of the overvoltage detection and the hysteresis can be adjusted. For assistance, contact a Texas Instruments sales
representative.
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3
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bq29413, bq29414, bq29415
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SLUS669D – AUGUST 2005 – REVISED OCTOBER 2006
1 OUT
VC1
VC1 8
2 VDD
VC2
VC2 8
7
3 CD
VC3
VC3 6
4 VC4
GND
GND 5
Figure 1. ICC, IIN Measurement (DCT Package)
Terminal Functions
TERMINAL
4
DESCRIPTION
MSOP
(DCT)
TSSOP
(PW)
NAME
8
1
VC1
Sense voltage input for most positive cell
7
2
VC2
Sense voltage input for second most positive cell
6
3
VC3
Sense voltage input for third most positive cell
5
4
GND
Ground pin
4
5
VC4
Sense voltage input for least positive cell
3
6
CD
An external capacitor is connected to determine the programmable delay time
2
7
VDD
Power supply
1
8
OUT
Output
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SLUS669D – AUGUST 2005 – REVISED OCTOBER 2006
FUNCTIONAL BLOCK DIAGRAM
RVD
CVD
VDD
VC1
RIN
ICD = 0.2 A (TYP)
CIN
RIN
VC2
CIN
VC3
OUT
RIN
CIN
VC4
1.2 V (TYP)
RIN
CIN
GND
CD
C(DELAY)
OVERVOLTAGE PROTECTION
When one of the cell voltages exceeds V(PROTECT), an internal current source begins to charge the capacitor,
C(DELAY), connected to the CD pin. If the voltage at the CD pin, VCD, reaches 1.2 V, the OUT pin is activated and
transitions high. An externally connected NCH FET is activiated and blows the external fuse in the positive
battery rail; see the functional block diagram.
If all cell voltages fall below V(PROTECT) before the voltage at pin CD reaches 1.2 V, the delay time does not run
out. An internal switch clamps the CD pin to GND and discharges the capacitor, C(DELAY), and secures the full
delay time for the next occurring overvoltage event.
Once the pin OUT is activated, it transitions back from high to low after all battery cells reach V(PROTECT)– Vhys.
DELAY TIME CALCULATION
The delay time is calculated as follows:
t +
d
C
ƪ1.2 V
(DELAY)
C
I
+
(DELAY)
ƫ
CD
ƪtd
I
ƫ
CD
1.2 V
Where I(CD) = CD current source = 0.18 µA
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SLUS669D – AUGUST 2005 – REVISED OCTOBER 2006
V(PROTECT)
V(PROTECT) - Vhys
Cell Voltage
(VCn - VC(n-1),
VC4 - GND)
1.2 V
CD
tDELAY
OUT
td = (1.2 V x CDELAY)/ICD
Figure 2. Timing for Overvoltage Sensing
APPLICATION INFORMATION
BATTERY CONNECTIONS
The following diagrams show the DCT package device in different cell configurations.
1 OUT
VC1 8
1 OUT
VC1 8
2 VDD
VC2 8
7
2 VDD
7
VC2 8
3 CD
VC3 6
3 CD
2
VC3 6
4 VC4
GND 5
4 VC4
2
GND 5
Figure 3. 4-Series Cell Configuration
6
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Figure 4. 3-Series Cell Configuration
(Connect together VC1 and VC2)
bq29410, bq29411, bq29412
bq29413, bq29414, bq29415
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SLUS669D – AUGUST 2005 – REVISED OCTOBER 2006
APPLICATION INFORMATION (continued)
1 OUT
VC1 8
2 VDD
VC2 77
36 CD
VC3 6
4 VC4
GND 5
Figure 5. 2-Series Cell Configuration
CELL CONNECTIONS
To prevent incorrect output activation, the following connection sequences must be used.
4-Series Cell Configuration
• VC1(=VDD) → VC2 → VC3 → VC4 → GND or
• GND → VC4 → VC3 → VC2 → VC1(=VDD)
3-Series Cell Configuration
• VC1(=VC2=VDD) → VC3 → VC4 → GND or
• GND → VC4 → VC3 → VC1(=VC2=VDD)
2-Series Cell Configuration
• VC1(=VC2=VC3=VDD) → VC4 → GND or
• GND → VC4 → VC1(=VC2=VC3=VDD)
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7
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
BQ29410DCT3R
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU SNBI
Level-1-260C-UNLIM
BQ29410DCT3RE6
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU SNBI
Level-1-260C-UNLIM
BQ29410DCTR
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29410DCTRG4
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29410DCTT
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29410DCTTG4
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
BQ29410PW
ACTIVE
TSSOP
PW
8
150
TBD
CU NIPDAU
Level-1-220C-UNLIM
BQ29410PWR
ACTIVE
TSSOP
PW
8
2000
TBD
CU NIPDAU
Level-1-220C-UNLIM
BQ29410PWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29411DCT3R
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU SNBI
Level-1-260C-UNLIM
BQ29411DCT3RE6
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU SNBI
Level-1-260C-UNLIM
BQ29411DCTR
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29411DCTRG4
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29411DCTT
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29411DCTTG4
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29411PW
ACTIVE
TSSOP
PW
8
150
TBD
CU NIPDAU
Level-1-220C-UNLIM
TBD
CU NIPDAU
Level-1-220C-UNLIM
CU NIPDAU
Level-2-260C-1 YEAR
BQ29411PWR
ACTIVE
TSSOP
PW
8
2000
BQ29411PWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
BQ29412DCT3R
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU SNBI
Level-1-260C-UNLIM
BQ29412DCT3RE6
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU SNBI
Level-1-260C-UNLIM
BQ29412DCT3T
PREVIEW
BQ29412DCTR
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29412DCTRG4
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29412DCTT
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29412DCTTG4
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29412PW
ACTIVE
TSSOP
PW
8
150
TBD
CU NIPDAU
Level-1-220C-UNLIM
BQ29412PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
8
TBD
Addendum-Page 1
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MSL Peak Temp (3)
BQ29412PWR
ACTIVE
TSSOP
PW
8
2000
CU NIPDAU
Level-1-220C-UNLIM
BQ29412PWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29413DCTR
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29413DCTRG4
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29413DCTT
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29413DCTTG4
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29413PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29413PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29413PWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29413PWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29414DCTR
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29414DCTRG4
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29414DCTT
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29414DCTTG4
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29414PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29414PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29414PWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29414PWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29415DCTR
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29415DCTRG4
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29415DCTT
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29415DCTTG4
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ29415PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29415PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29415PWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
BQ29415PWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Addendum-Page 2
TBD
Lead/Ball Finish
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2007
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
8
0,13 M
5
0,15 NOM
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
1
0,25
4
0° – 8°
3,15
2,75
0,60
0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00
NOTES: A.
B.
C.
D.
4188781/C 09/02
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion
Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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